CN113809220A - Packaging method of color light wafer and color light wafer thereof - Google Patents
Packaging method of color light wafer and color light wafer thereof Download PDFInfo
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- CN113809220A CN113809220A CN202110803020.2A CN202110803020A CN113809220A CN 113809220 A CN113809220 A CN 113809220A CN 202110803020 A CN202110803020 A CN 202110803020A CN 113809220 A CN113809220 A CN 113809220A
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- color light
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 41
- 239000000084 colloidal system Substances 0.000 claims abstract description 20
- 238000005507 spraying Methods 0.000 claims abstract description 20
- 235000012431 wafers Nutrition 0.000 claims description 95
- 239000003292 glue Substances 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 238000010410 dusting Methods 0.000 claims 3
- 229940098458 powder spray Drugs 0.000 claims 1
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a packaging method of a chromatic light wafer and a chromatic light wafer thereof, which comprises the steps of filling opaque colloids on four side surfaces of a wafer group respectively; wherein, the opaque colloid is solidified and molded to form an opaque layer on four sides of the wafer group; and performing powder spraying treatment on the wafer group and the opaque layer to cover a color mixing fluorescent powder layer, and obtaining the colored light wafer after the color mixing fluorescent powder layer is solidified and molded. Through filling the influence to photochromic after blue light refraction around the blue light wafer can be reduced to the opaque colloid of one deck all around at the blue light wafer, can realize the refraction and the no variegated of blue light wafer through opaque colloid for the colour purity of blue light wafer more is close the luminous colour purity of pure chromatic light wafer, avoids having the colour difference.
Description
Technical Field
The invention relates to the field of chips, in particular to a packaging method of a color light chip and the color light chip.
Background
Light-emitting diodes (LEDs) mainly rely on chips to emit light.
The wafer is one of the main raw materials of the LED, and is the light emitting component of the LED, and the quality of the wafer directly determines the performance of the LED. When the LED is packaged, the wafer materials are arranged on the wafer film in order.
The color light wafer has higher production cost, the price of the color light wafer with the same current is far higher than that of the blue light wafer, and partial color light wafers cannot be synchronous with a white light product in product design because the voltage of the color light wafers is lower or higher than that of the blue light wafers, so that the cost is higher; the pure colored light wafer can not be consistent with the white light voltage due to the voltage problem and can not be shared with a white light power supply in the use process; the main material of part of the monochromatic light chip is gallium arsenide which is toxic; the blue light chips used in the market excite the color light made by the fluorescent powder, and the difference between the whole luminous color and the color emitted by the pure color light wafer is too large because of too many variegates and few light spots.
Disclosure of Invention
In view of the problems described above, the present invention is proposed to provide a method for packaging a chromatic wafer and a chromatic wafer thereof, which overcome or at least partially solve the problems described above, including:
a packaging method of a color light wafer comprises the following steps:
filling opaque colloid on four sides of the wafer group; wherein, the opaque colloid is solidified and molded to form an opaque layer on four sides of the wafer group;
and performing powder spraying treatment on the wafer group and the opaque layer to cover a color mixing fluorescent powder layer, and obtaining the colored light wafer after the color mixing fluorescent powder layer is solidified and molded.
Further, the opaque colloid is opaque white wall glue.
Further, the opaque layer has a thickness lower than a thickness of the wafer set.
Further, the powder spraying treatment comprises the step of performing powder spraying treatment through a powder applying machine or performing powder spraying treatment through a powder spraying machine.
Further, the step of performing powder spraying treatment on the wafer group and the opaque layer to cover a toner phosphor layer includes:
and spraying fluorescent powder glue on the wafer group and the opaque layer to cover the color-mixing fluorescent powder layer formed by the fluorescent powder glue.
Further, the wafer group is a blue light wafer.
Further, the blue light wafer comprises at least three blue light wafers.
Furthermore, three blue light wafers are connected in series.
Further, the blue wafer is 3V.
A color light wafer comprises the color light wafer manufactured by the packaging method of any color light wafer.
The invention has the following advantages:
in the embodiment of the invention, the four side surfaces of the wafer group are respectively filled with opaque colloid by a packaging method of the colored light wafer; wherein, the opaque colloid is solidified and molded to form an opaque layer on four sides of the wafer group; and performing powder spraying treatment on the wafer group and the opaque layer to cover a color mixing fluorescent powder layer, and obtaining the colored light wafer after the color mixing fluorescent powder layer is solidified and molded. Through filling the influence to photochromic after blue light refraction around the blue light wafer can be reduced to the opaque colloid of one deck all around at the blue light wafer, can realize the refraction and the no variegated of blue light wafer through opaque colloid for the colour purity of blue light wafer more is close the luminous colour purity of pure chromatic light wafer, avoids having the colour difference.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a flowchart illustrating steps of a method for packaging a color light chip according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a color light wafer according to an embodiment of the present invention;
fig. 3 is another schematic structural diagram of a color light wafer according to an embodiment of the present invention.
In the drawings: 1. a chip set; 2. an opaque layer; 3. a color-adjusting fluorescent powder layer; 4. and a carrier plate.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a flow chart of steps of a method for packaging a color light wafer and a schematic structural diagram of a color light wafer according to an embodiment of the present invention are shown;
a method of packaging a color light die, the method comprising:
step S1, filling opaque colloid on four sides of the wafer group 1; wherein, the opaque colloid is solidified and molded to form an opaque layer 2 on four sides of the wafer group 1;
step S2, performing powder spraying treatment on the wafer group 1 and the opaque layer 2 to cover a color mixing phosphor layer 3, and obtaining a color light wafer after the color mixing phosphor layer 3 is solidified and molded.
In the embodiment of the invention, the four sides of the wafer group 1 are respectively filled with opaque colloid by a packaging method of a color light wafer; wherein, the opaque colloid is solidified and molded to form an opaque layer 2 on four sides of the wafer group 1; and performing powder spraying treatment on the wafer group 1 and the opaque layer 2 to cover a color mixing fluorescent powder layer 3, and obtaining a colored light wafer after the color mixing fluorescent powder layer 3 is solidified and molded. Through filling the influence to photochromic after blue light refraction around the blue light wafer can be reduced to the opaque colloid of one deck all around at the blue light wafer, can realize the refraction and the no variegated of blue light wafer through opaque colloid for the colour purity of blue light wafer more is close the luminous colour purity of pure chromatic light wafer, avoids having the colour difference.
Next, a method for packaging a color light wafer in the present exemplary embodiment will be further described.
In an embodiment of the present invention, the opaque colloid is opaque white wall glue; the influence on the light color after the blue light around the blue light wafer is refracted is reduced by filling a layer of opaque white wall glue around the wafer group 1, and no refraction and no mixed color can be realized through the opaque white wall glue.
In an embodiment of the present invention, the opaque layer 2 has a thickness lower than that of the wafer assembly 1; a thickness difference exists between the opaque layer 2 and the wafer group 1, so that the height of the opaque layer 2 does not exceed the height of the body of the wafer group 1, specifically, the thickness difference is greater than 0 and less than or equal to 300 micrometers; namely the thickness difference is more than 0 and less than or equal to 300 mu m.
In an embodiment of the present invention, the powder spraying treatment includes performing powder spraying treatment by a powder sprayer or performing powder spraying treatment by a powder sprayer; the powder spraying treatment can be realized by a powder applying machine and a powder spraying machine.
In an embodiment of the present invention, the step of performing powder spraying process on the wafer assembly 1 and the opaque layer 2 to cover a toner phosphor layer 3 includes: coating a color-mixing phosphor layer 3 formed of a phosphor paste on the wafer group 1 and the opaque layer 2 by spraying the phosphor paste; the fluorescent powder is solidified and formed by glue with glue layer actually being color-mixing fluorescent powder; so that the light emitting color of the wafer can meet the color of the required pure color light.
In an embodiment of the present invention, the chip set 1 is a blue chip; the blue light wafer at least comprises three blue light wafers; three blue light chips are connected in series; the voltage of the blue light wafer is 3V; at present, voltages of monochrome red light wafers or monochrome yellow light wafers circulating on the market are generally 2V and cannot reach 3V, and the voltages cannot be consistent with those of other light wafers when high-voltage products are manufactured, specifically, when 9V products are needed, the high-voltage products can be realized only by connecting three blue light wafers in series, but the high-voltage products cannot be realized by using the monochrome red light wafers or the monochrome yellow light wafers.
In an embodiment of the present invention, the chipset 1 is disposed on the carrier 4.
In an embodiment of the present invention, the present invention further includes a color light chip, which includes the color light chip manufactured by the packaging method of any one of the color light chips; the consistency of the color light and the white light voltage is realized, the color is closer to the color emitted by a pure color light wafer, and a certain protection effect is exerted on the human body or the environment.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The present invention provides a method for packaging a color light wafer and a color light wafer thereof, which are introduced in detail above, wherein a specific example is applied to illustrate the principle and the implementation of the present invention, and the description of the above embodiment is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A method for packaging a color light wafer, comprising:
filling opaque colloid on four sides of the wafer group; wherein, the opaque colloid is solidified and molded to form an opaque layer on four sides of the wafer group;
and performing powder spraying treatment on the wafer group and the opaque layer to cover a color mixing fluorescent powder layer, and obtaining the colored light wafer after the color mixing fluorescent powder layer is solidified and molded.
2. The method of claim 1, wherein the opaque gel is opaque white wall glue.
3. The method of claim 1, wherein the opaque layer has a thickness that is less than a thickness of the group of wafers.
4. The method according to claim 1, wherein the dusting treatment comprises a dusting treatment by a duster or a dusting treatment by a duster.
5. The method of claim 1, wherein said step of applying a powder spray over said set of wafers and said opaque layer to cover a layer of tinted phosphor comprises:
and spraying fluorescent powder glue on the wafer group and the opaque layer to cover the color-mixing fluorescent powder layer formed by the fluorescent powder glue.
6. The method of claim 1, wherein the wafer set is a blue wafer.
7. The method of claim 6, wherein the Blu-ray wafer comprises at least three.
8. The method of claim 7, wherein three of the blue wafers are connected in series.
9. The method of claim 6, wherein the blue wafer has a voltage of 3V.
10. A color light chip, comprising the color light chip manufactured by the packaging method of the color light chip as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110803020.2A CN113809220A (en) | 2021-07-15 | 2021-07-15 | Packaging method of color light wafer and color light wafer thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110803020.2A CN113809220A (en) | 2021-07-15 | 2021-07-15 | Packaging method of color light wafer and color light wafer thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113809220A true CN113809220A (en) | 2021-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110803020.2A Pending CN113809220A (en) | 2021-07-15 | 2021-07-15 | Packaging method of color light wafer and color light wafer thereof |
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| Country | Link |
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| CN (1) | CN113809220A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101847681A (en) * | 2009-12-21 | 2010-09-29 | 深圳市成光兴实业发展有限公司 | White light LED fluorescent powder film layer manufactured by adopting spraying process and manufacture method |
| CN101949521A (en) * | 2010-08-24 | 2011-01-19 | 广州南科集成电子有限公司 | LED integrated light source board and manufacturing method thereof |
| CN102931328A (en) * | 2012-11-28 | 2013-02-13 | 北京半导体照明科技促进中心 | Manufacturing method of LED (Light-Emitting Diode) packaging body |
| CN104916763A (en) * | 2015-05-29 | 2015-09-16 | 广州市鸿利光电股份有限公司 | Packaging method for chip scale packaging LED |
| CN105590994A (en) * | 2014-10-22 | 2016-05-18 | 泉州市金太阳照明科技有限公司 | LED light source substrate and manufacturing method thereof |
| CN107731996A (en) * | 2017-09-28 | 2018-02-23 | 惠州市华瑞光源科技有限公司 | Led lamp bead and preparation method thereof |
| US20200365788A1 (en) * | 2017-12-22 | 2020-11-19 | Dura-Chip (Nantong) Limited | Wafer-level chip-scale packaging structure and method of preparing same |
-
2021
- 2021-07-15 CN CN202110803020.2A patent/CN113809220A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101847681A (en) * | 2009-12-21 | 2010-09-29 | 深圳市成光兴实业发展有限公司 | White light LED fluorescent powder film layer manufactured by adopting spraying process and manufacture method |
| CN101949521A (en) * | 2010-08-24 | 2011-01-19 | 广州南科集成电子有限公司 | LED integrated light source board and manufacturing method thereof |
| CN102931328A (en) * | 2012-11-28 | 2013-02-13 | 北京半导体照明科技促进中心 | Manufacturing method of LED (Light-Emitting Diode) packaging body |
| CN105590994A (en) * | 2014-10-22 | 2016-05-18 | 泉州市金太阳照明科技有限公司 | LED light source substrate and manufacturing method thereof |
| CN104916763A (en) * | 2015-05-29 | 2015-09-16 | 广州市鸿利光电股份有限公司 | Packaging method for chip scale packaging LED |
| CN107731996A (en) * | 2017-09-28 | 2018-02-23 | 惠州市华瑞光源科技有限公司 | Led lamp bead and preparation method thereof |
| US20200365788A1 (en) * | 2017-12-22 | 2020-11-19 | Dura-Chip (Nantong) Limited | Wafer-level chip-scale packaging structure and method of preparing same |
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