CN111261623A - Novel LED light source - Google Patents
Novel LED light source Download PDFInfo
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- CN111261623A CN111261623A CN202010111431.0A CN202010111431A CN111261623A CN 111261623 A CN111261623 A CN 111261623A CN 202010111431 A CN202010111431 A CN 202010111431A CN 111261623 A CN111261623 A CN 111261623A
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- 239000003292 glue Substances 0.000 claims abstract description 44
- 239000000843 powder Substances 0.000 claims abstract description 17
- 238000005538 encapsulation Methods 0.000 claims abstract description 15
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000007711 solidification Methods 0.000 claims abstract description 3
- 230000008023 solidification Effects 0.000 claims abstract description 3
- 238000004806 packaging method and process Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
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- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 230000007774 longterm Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003086 colorant Substances 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
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- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a novel LED light source, which is characterized in that: this LED light source is the COB structure, contain the COB base plate, LED ruddiness chip, LED green glow chip, LED blue light chip, two not equidimension encapsulation box dams, encapsulation glue etc, wherein be provided with the inboard and the outside pad of placing the LED chip on the COB base plate, 4 or 6 electrode leg, the electrode leg is walked the line etc. encapsulation glue divide into transparent adhesive and adds phosphor powder glue, install the LED chip respectively on COB base plate pad and connect to the electrode leg, later pack two kinds of encapsulation glue respectively in the encapsulation box dam, obtain the LED light source after the solidification. According to the invention, the LED light source is packaged by two kinds of glue, the color temperature and the light color of the obtained LED light source can be adjusted at will, the problem of single color temperature of the existing LED light source is solved, and the multi-application performance of one light source with different and fixed scene changes is realized; meanwhile, the LED light source can correct and compensate the problems of color attenuation and color shift of the existing high-power LED light source in long-term use by adding the red and green chips of the LED.
Description
Technical Field
The invention belongs to the field of semiconductor illumination, and particularly relates to the field of novel LED light sources.
Background
As a new lighting product, compared with the conventional lighting, the LED has the advantages of excellent energy saving, environmental protection, long service life, low cost, and the like, and thus, has been extensively researched, developed, and utilized in recent years.
The existing LED lighting source is mainly prepared by exciting yellow fluorescent powder by an LED blue light (B) chip, the blue light chip generates red light (R) and green light (G) by exciting the yellow fluorescent powder, so that the red light and the green light are mixed with the rest blue light to obtain white light with a certain color temperature, and compared with the method for using R, G, B chips to emit light and mix colors, the method is simple and convenient and has lower cost.
Meanwhile, the structure of the existing LED lighting source is mainly SMD and COB, wherein the COB structure light source directly packages the LED chip on the heat conducting substrate, as shown in fig. 1, the product has good heat dissipation and longer service life, and the COB belongs to integrated packaging, can package a plurality of groups of LED chips on the same substrate, can obtain a high-power lighting product, and can meet the requirement for high-brightness lighting.
However, the color temperature of the conventional COB light source is fixed, and different application scenes need to develop lighting products with different color temperature sections respectively, so that the product variety is various. Or when the illuminated object in the same application scene changes, the original light source needs to be detached and the matched light source needs to be reinstalled, which consumes time and money.
Moreover, the service life of the existing LED lighting product does not effectively reach the theoretical service life, and certain color failure or color shift problem exists after long-term use, so that the color temperature of the LED light source is changed, and the lighting effect is influenced.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a novel LED light source, wherein the R, G and B chips of the LED are respectively packaged by two kinds of glue, the color temperature and the light color of the obtained LED light source can be adjusted at will, the problem of single color temperature of the existing LED light source is solved, and the multi-application performance of one light source with different and fixed scene changes is realized; meanwhile, the LED light source can correct and compensate the problems of color failure and color shift of the existing high-power LED light source in long-term use by adding the R and G chips of the LED.
The technical scheme of the invention is as follows: this LED light source is COB structure type, contain the COB base plate, LED red light (R) chip, LED green glow (G) chip, LED blue light (B) chip, two not equidimension encapsulation box dams, encapsulation glue etc, wherein be provided with the inboard and the outside pad of placing the LED chip on the COB base plate, 4 or 6 electrode leg, the electrode leg is walked line etc, encapsulation glue divide into transparent adhesive and adds phosphor powder glue, install the LED chip respectively on COB base plate pad and connect and switch on to the electrode leg, later fill two kinds of encapsulation glue respectively in the encapsulation box dam, obtain the LED light source after the solidification.
Further, an LED blue light chip is arranged on the inner side COB bonding pad, and an LED red light chip and an LED green light chip are arranged on the outer side COB bonding pad.
Further, an LED blue light chip is arranged on the COB bonding pad on the outer side, and an LED red light chip and an LED green light chip are arranged on the COB bonding pad on the inner side.
Furthermore, the number of each chip of the LED R and the LED G, B is more than or equal to 1.
Furthermore, the positive and negative electrodes of the LED R and G, B chips are respectively connected to the electrode pins through the electrode pin wires by the wire bonding or flip chip technology or the conductive paste, and the same chip can be connected in parallel or in series.
Furthermore, when the COB substrate is a 4-electrode welding foot, the R, G, B chips are connected by adopting a common cathode or a common anode; when the COB substrate is a 6-electrode leg, the R, G, B chip has positive and negative electrodes respectively connected to one of the electrode legs.
Further, the packaging box dam is arranged above the annular area of the electrode welding foot routing.
Furthermore, the fluorescent powder glue is sealed in the inner side dam where the LED blue light chip is located, and the transparent glue is sealed between the two dams where the LED red light chip and the LED green light chip are located.
Furthermore, the fluorescent powder glue is filled between two side dams where the LED blue light chips are located, and the transparent glue is filled in the inner side dam where the LED red light chips and the LED green light chips are located.
Furthermore, the packaging glue needs to wrap the LED chip and the bonding lead, and the transparent glue can be slightly higher than or cover the fluorescent powder glue.
Furthermore, the packaging glue is mainly silicon resin, silica gel or epoxy resin, wherein yellow or other fluorescent powder, anti-settling agent and other materials are added into the fluorescent powder glue.
Further, the R, G, B chips of the LED light source are driven to light separately.
Has the advantages that: the practical effects of the LED light source obtained by the technical method are as follows.
1) The color temperature of the LED light source is fixed or can be adjusted at will, and the multi-application characteristic of one light source is realized.
2) In the long-term use process, the color temperature of the light source can be corrected and compensated, so that the light source can work under the fixed color temperature, and the stability of the lighting effect is excellent.
3) R, G, B chip is controlled independently, and the drive precision is high.
4) The LED light source has simple structure, convenient preparation and convenient industrial production.
Drawings
Fig. 1 is a schematic view of a conventional LED COB light source.
FIG. 2 is a schematic diagram of a 4-electrode leg light source of an LED light source of the present invention.
FIG. 3 is a conducting diagram of the 4-electrode leg light source electrode of the LED light source of the present invention.
FIG. 4 is a schematic diagram of a 6-electrode leg light source of an LED light source of the present invention.
Fig. 5 is a schematic illustration of the R, G die inside the inner dam of the 4-electrode-leg light source of the present invention.
Reference numerals:
1-COB substrate; 2-electrode welding feet; 3-a box dam; 4-a pad; 5-packaging glue; 6-LED chip; 7-electrode leg wiring; 8-a conductive lead; 31-inboard box dam; 32-outer box dam; 41-inner side pad; 42-outer pad; 51-transparent packaging glue; 52-adding fluorescent powder glue; 61-LED red light chip; 62-LED green chip; 63-LED blue light chip.
Detailed Description
The present invention is further illustrated by the following figures and detailed description of specific embodiments thereof, it is to be understood that these embodiments are given by way of illustration only and not by way of limitation, and that various equivalent modifications of the invention will become apparent to those skilled in the art upon reading the present disclosure and are intended to fall within the scope of the appended claims.
Example 1
As shown in fig. 2, the LED light source is a COB common anode structure, the COB substrate 1 includes four electrode pads 2, one of which is connected to the anode and the other is connected to the cathode, an inner pad 41 and an outer pad 42 are further disposed on the substrate 1, electrode pad routing lines 7 are disposed on the periphery of the pads and respectively communicated with the electrode pads 2, a plurality of LED blue chips 63 are fixed on the pads 41 through die attach adhesives, a plurality of LED red and green chips are fixed on the pads 42, the anode and the cathode of the LED chips are conducted with the electrode pad routing lines 7 through conductive leads 8 or conductive materials, the specific connection manner is as shown in fig. 3, wherein the anodes of the LEDs R and G, B are conducted to the common anode of the pads, the cathodes of the same type of LED chips are respectively conducted to the cathode of one of the pads, and the conduction manners of the same type of LED chips can be implemented in parallel or in series.
After the electrodes of the LED chips are conducted, packaging dams are respectively arranged on the annular areas of the electrode welding foot wiring, and an inner side dam 31 and an outer side dam 32 are obtained. Then preparing transparent packaging glue 51 according to a certain proportion, or taking the single-component transparent glue 51; and adding yellow fluorescent powder, anti-settling agent and other substances into the transparent glue or other types of transparent glue, stirring and defoaming to obtain the fluorescent powder-added glue 52, dispensing and packaging the glue 52 at the position of the inner side dam 31, packaging the glue 51 between the dams 31 and 32 after hardening or packaging the dam 31, and hardening to obtain the required light source.
Example 2
As shown in fig. 4, and referring to embodiment 1, the LED light source structure is changed from a square shape to a hexagonal shape, and the number of electrode pads is increased to six, and in addition, it is different from embodiment 1 in that: and the positive electrode and the negative electrode of the LED chip of the same kind are respectively conducted to the positive electrode and the negative electrode of one welding leg, and the others are the same.
Example 3
As shown in fig. 5, and referring to embodiment 1, the difference from embodiment 1 is that: the plurality of groups of LED blue light chips 63 are fixed on the bonding pad 42 through die attach adhesives, and the plurality of groups of LED red light chips and green light chips are fixed on the bonding pad 41; glue 51 is dispensed and encapsulated at the inner box dam 31, and glue 52 is encapsulated between the box dams 31 and 32, all the other things being equal.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (12)
1. A novel LED light source is characterized in that: this LED light source is COB structure type, contain the COB base plate, LED red light (R) chip, LED green glow (G) chip, LED blue light (B) chip, two not equidimension encapsulation box dams, encapsulation glue etc, wherein be provided with the inboard and the outside pad of placing the LED chip on the COB base plate, 4 or 6 electrode leg, the electrode leg is walked line etc, encapsulation glue divide into transparent adhesive and adds phosphor powder glue, install the LED chip respectively on COB base plate pad and connect and switch on to the electrode leg, later fill two kinds of encapsulation glue respectively in the encapsulation box dam, obtain the LED light source after the solidification.
2. The novel LED light source of claim 1, wherein: the LED blue light chip is placed on the COB bonding pad on the inner side, and the LED red light chip and the LED green light chip are placed on the COB bonding pad on the outer side.
3. The novel LED light source of claim 1, wherein: the LED blue light chip is arranged on the COB bonding pad on the outer side, and the LED red light chip and the LED green light chip are arranged on the COB bonding pad on the inner side.
4. The novel LED light source of claim 1, wherein: the number of each chip of the LED R and the LED G, B is more than or equal to 1.
5. The novel LED light source as claimed in claims 1-3, wherein: the positive and negative electrodes of the LED R and G, B chips are respectively connected to the electrode welding pins through the lead bonding or flip chip technology or the conductive paste through the electrode welding pin routing, and the same chip can be connected in parallel or in series.
6. The novel LED light source as claimed in claims 1-3, wherein: when the COB substrate is a 4-electrode welding foot, the R, G, B chips are connected by adopting a common cathode or a common anode; when the COB substrate is a 6-electrode leg, the R, G, B chip has positive and negative electrodes respectively connected to one of the electrode legs.
7. The novel LED light source of claim 1, wherein: the package dam is disposed over the annular region of the electrode leg trace.
8. The novel LED light source of claim 2, wherein: the fluorescent powder glue is added and sealed in the inner side dam where the LED blue light chip is located, and the transparent glue is sealed between the two dams where the LED red light chip and the green light chip are located.
9. The novel LED light source as claimed in claim 3, wherein: the fluorescent powder glue is added to be sealed between the two side dams where the LED blue light chips are located, and the transparent glue is sealed in the inner side dam where the LED red light chips and the LED green light chips are located.
10. A novel LED light source as claimed in any preceding claim wherein: the packaging glue needs to wrap the LED chip and the bonding lead, and the transparent glue can be slightly higher than or cover the fluorescent powder glue.
11. A novel LED light source as claimed in any preceding claim wherein: the packaging glue is mainly silicon resin, silica gel or epoxy resin, wherein yellow or other fluorescent powder, anti-settling agent and other materials are added into the fluorescent powder glue.
12. A novel LED light source as claimed in any preceding claim wherein: the R, G, B chips of the LED light source are driven to light up separately.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010111431.0A CN111261623A (en) | 2020-02-24 | 2020-02-24 | Novel LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010111431.0A CN111261623A (en) | 2020-02-24 | 2020-02-24 | Novel LED light source |
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| Publication Number | Publication Date |
|---|---|
| CN111261623A true CN111261623A (en) | 2020-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010111431.0A Pending CN111261623A (en) | 2020-02-24 | 2020-02-24 | Novel LED light source |
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| CN (1) | CN111261623A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280271A (en) * | 2021-03-23 | 2021-08-20 | 湖州鸿浩光电科技有限公司 | Four-foot three-core K-value-adjustable natural light-imitating LED patch |
| CN113394203A (en) * | 2021-04-27 | 2021-09-14 | 福建天电光电有限公司 | Double-color-temperature light source packaging structure and manufacturing method thereof |
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|---|---|---|---|---|
| WO2012009919A1 (en) * | 2010-07-20 | 2012-01-26 | 上海亚明灯泡厂有限公司 | Led integrated packaging light source module |
| CN202205744U (en) * | 2011-08-16 | 2012-04-25 | 易美芯光（北京）科技有限公司 | Encapsulating structure capable of improving color rendering index and luminous flux of a COB white light source |
| CN203491257U (en) * | 2013-09-10 | 2014-03-19 | 中山市光圣半导体科技有限责任公司 | Novel COB (Chip On Board) light source with high color rendering index |
| CN204179079U (en) * | 2014-09-22 | 2015-02-25 | 广东科立盈光电技术有限公司 | A kind of multi-color LED light source based on COB encapsulation |
| CN204905249U (en) * | 2015-08-06 | 2015-12-23 | 永林电子有限公司 | High color rendering index's COB light source |
| CN107039411A (en) * | 2017-05-09 | 2017-08-11 | 易美芯光（北京）科技有限公司 | The white light LEDs COB encapsulated using CSP chips and blue LED flip chip structure and preparation method |
-
2020
- 2020-02-24 CN CN202010111431.0A patent/CN111261623A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012009919A1 (en) * | 2010-07-20 | 2012-01-26 | 上海亚明灯泡厂有限公司 | Led integrated packaging light source module |
| CN202205744U (en) * | 2011-08-16 | 2012-04-25 | 易美芯光（北京）科技有限公司 | Encapsulating structure capable of improving color rendering index and luminous flux of a COB white light source |
| CN203491257U (en) * | 2013-09-10 | 2014-03-19 | 中山市光圣半导体科技有限责任公司 | Novel COB (Chip On Board) light source with high color rendering index |
| CN204179079U (en) * | 2014-09-22 | 2015-02-25 | 广东科立盈光电技术有限公司 | A kind of multi-color LED light source based on COB encapsulation |
| CN204905249U (en) * | 2015-08-06 | 2015-12-23 | 永林电子有限公司 | High color rendering index's COB light source |
| CN107039411A (en) * | 2017-05-09 | 2017-08-11 | 易美芯光（北京）科技有限公司 | The white light LEDs COB encapsulated using CSP chips and blue LED flip chip structure and preparation method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280271A (en) * | 2021-03-23 | 2021-08-20 | 湖州鸿浩光电科技有限公司 | Four-foot three-core K-value-adjustable natural light-imitating LED patch |
| CN113394203A (en) * | 2021-04-27 | 2021-09-14 | 福建天电光电有限公司 | Double-color-temperature light source packaging structure and manufacturing method thereof |
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