CN2310388Y - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
- Publication number
- CN2310388Y CN2310388Y CN97238703U CN97238703U CN2310388Y CN 2310388 Y CN2310388 Y CN 2310388Y CN 97238703 U CN97238703 U CN 97238703U CN 97238703 U CN97238703 U CN 97238703U CN 2310388 Y CN2310388 Y CN 2310388Y
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- resin layer
- resin bed
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model relates to a light emitting diode which is characterized in that an inner resin bed (3) is covered on a light emitting wafer (1), a middle resin bed (4) which is mixed with fluorescent powder is covered on the inner resin bed (3), and an outer resin bed (5) is covered on the middle resin bed (4) with the fluorescent powder. The light emitting diode can send out the white light or the light in any other color. The light emission is uniform, and the light emitting angle is larger. The disadvantage that the materials and the manufacturing methods are different because of the different colors in the prior art is overcome. The utility model is suitable for diodes in different types.
Description
The utility model relates to a kind of light-emitting diode.
Generally be used in computer at present on the market, the light-emitting diode on Communication Equipment or the small household appliances (hereinafter to be referred as LED), sent wide all be red, yellow or blue and white light seldom arranged.This is because the manufacturing process of white light LEDs is comparatively complicated, and white light is photochromic wayward.For example have the people that the reddish yellow blue three color light is contained in the LED element simultaneously, when simultaneously luminous, the stack of three coloured light has then that white light occurs but its white light is inhomogeneous, and the electric current of the blue three kinds of LED of reddish yellow has nothing in common with each other, and therefore causes white light wayward.Product (the Japanese patent application publication No.: special flat 7-99345) that has Japanese Ri Ya chemical company to be released in addition, as shown in Figure 1, common light-emitting diode is by first electrode suppor 2 that has the V-type groove, the second corresponding electrode suppor 21, luminescent wafer 1 in the V-type groove, and with the outer resin bed 5 of whole LED encapsulation, the manufacture method of day inferior product is a colored yellow fluorescent material on the wafer of the LED of blue light-emitting, synthesizes white light by blue and yellow.Its shortcoming is that the thickness of fluorescent material is wayward, causes white light inhomogeneous.If fluorescent material is too thick, then color is yellow partially; If fluorescent material is too thin, then color is blue partially.Because the distribution of fluorescent material on every side of crystal grain is more, when the white light that causes this product to send is incident upon on the white paper, can find that the outer shroud of the luminous point that throws has the yellow ring of light of a circle again, more because so, the crevice projection angle of this LED is greatly impossible.
In view of this, the purpose of this utility model provide a kind of luminous evenly and lighting angle bigger, make simple light-emitting diode.
The technical solution of the utility model is to be coated with inner resin layer on luminescent wafer, is coated with the middle resin layer that is mixed with fluorescent material on inner resin layer, resin bed outside being coated with on the fluorescent material middle resin layer.
Technique scheme all is suitable for the light-emitting diode with electrode suppor or pedestal.
Be detail knowledge structure of the present utility model, be illustrated below by structure and the method for making of different embodiment of the present utility model.
Fig. 1 is the made light-emitting diode structure schematic diagram of Ri Ya chemical company in the prior art;
Fig. 2 is the structural representation of the utility model embodiment 1;
Fig. 3 is the structural representation of the utility model embodiment 2;
Fig. 4 is the structural representation of the utility model embodiment 3;
Fig. 5 is the structural representation of the utility model embodiment 4;
Fig. 6 is the structural representation of the utility model embodiment 5;
Fig. 7 is the structural representation of the utility model embodiment 6.
Embodiment 1-4 is the improvement based on the light-emitting diode with electrode suppor; Embodiment 5-6 has the improvement of the light-emitting diode of electrode base for the basis.
With reference to figure 2, be the structural representation of embodiment 1 of the present utility model.At first in the V-type groove of first electrode suppor 2, place luminescent wafer 1, and accomplish fluently lead; In the V-type groove, inject resin, form inner resin layer 3.The height of inner resin layer preferably slightly is higher than the height of luminescent wafer 1.After inner resin layer 3 has been done, coat the middle resin layer 4 that is mixed with the fluorescent material that can change wavelength again.Middle resin layer is a thin film.After fluorescent material middle resin layer 4 is done, with outer resin bed 5 whole LED is packaged into the finished product of LED of round shaped grain shape again.
As shown in Figure 3, be the structural representation of the utility model embodiment 2.Its manufacturing process is similar to embodiment 1 with structure.Be not both adds last layer filter 7 on the fluorescent material middle resin layer before with outer resin bed encapsulation, this filter 7 can for example filter the light filtering of not wanting with ultraviolet light, can reduce the influence of ultraviolet to human body, also has equal light action simultaneously.
Fig. 4 is the structural representation of the utility model embodiment 3.Its structure is different with preceding two embodiment is that wherein fluorescent material middle resin layer 4 is an arc shape.During making, the outer resin bed 5 of encapsulation at first encapsulates earlier half resin (handstand encapsulating), wait done after, go up the fluorescent material middle resin layer again, at last with second half resin-encapsulated.In the application's embodiment, outer resin bed 5 and inner resin layer 3 are commaterial.
Fig. 5 is a kind of variation of embodiment 3, promptly coats layer of fluorescent powder middle resin layer 4 on the surface of ready-made LED, again resin bed 5 outside its outer package.The encapsulated layer of ready-made LED promptly is an inner resin layer 3.
Fig. 6 is the utility model embodiment based on another kind of light-emitting diode, and the volume of the more top related bulb type of the encapsulation of surface adhesion type will come for a short time, but uses also relatively extensively.At first in the concave groove of pedestal 6, place luminescent wafer 1, go up inner resin layer 3 then, after waiting to have done, go up the fluorescent material middle resin layer again, go up outer resin bed 5 at last again, can make embodiment 5.
Fig. 7 is the further improvement of embodiment among Fig. 6, promptly fluorescent material middle resin layer 4 and outside add last layer filter 7 between the resin bed 5.
If the luminescent wafer 1 in the utility model, adopt ultraviolet light wafer (can make the ultraviolet wavelength of 360--380nm as the GaN material), come fluorescent material in the excitated fluorescent powder middle resin layer 4 with ultraviolet light, this fluorescent material can be arbitrary color, so that obtain the LED goods of various glow colors.
The light-emitting diode that the utility model provides has luminous even, and lighting angle is bigger, makes simple advantage, and dissimilar diodes all is suitable for.
Claims (3)
1. light-emitting diode, comprise V-type groove that electrode suppor (2) or pedestal (6) are provided with and the luminescent wafer (1) that in the V-type groove, is provided with, it is characterized in that on luminescent wafer (1), being coated with inner resin layer (3), on inner resin layer (3), be coated with the middle resin layer (4) that is mixed with fluorescent material, resin bed (5) outside on fluorescent material middle resin layer (4), being coated with.
2. light-emitting diode according to claim 1 is characterized in that fluorescent material middle resin layer (4) is an arc.
3. light-emitting diode according to claim 1, it is characterized in that fluorescent material middle resin layer (4) and outside also accompany filter layer (7) between the resin bed (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN97238703U CN2310388Y (en) | 1997-08-14 | 1997-08-14 | Light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN97238703U CN2310388Y (en) | 1997-08-14 | 1997-08-14 | Light emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2310388Y true CN2310388Y (en) | 1999-03-10 |
Family
ID=33948951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97238703U Expired - Fee Related CN2310388Y (en) | 1997-08-14 | 1997-08-14 | Light emitting diode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2310388Y (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100359705C (en) * | 2004-03-30 | 2008-01-02 | 深圳市蓝科电子有限公司 | Method of mfg. white light LED |
CN100414725C (en) * | 2004-04-23 | 2008-08-27 | 斯坦雷电气株式会社 | Semiconductor light emitting device |
US7498734B2 (en) | 2003-06-18 | 2009-03-03 | Toyoda Gosei Co., Ltd. | Light emitting device with wavelength converted by phosphor |
CN101752492A (en) * | 2002-12-20 | 2010-06-23 | 丰田合成株式会社 | Luminescent body and optical device including the same |
CN105185894A (en) * | 2014-06-05 | 2015-12-23 | 昆山科技大学 | Light-emitting device and filtering method thereof |
CN106252475A (en) * | 2016-09-21 | 2016-12-21 | 深圳市兆驰节能照明股份有限公司 | CSP light source and manufacture method thereof |
-
1997
- 1997-08-14 CN CN97238703U patent/CN2310388Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101752492A (en) * | 2002-12-20 | 2010-06-23 | 丰田合成株式会社 | Luminescent body and optical device including the same |
US7498734B2 (en) | 2003-06-18 | 2009-03-03 | Toyoda Gosei Co., Ltd. | Light emitting device with wavelength converted by phosphor |
CN100359705C (en) * | 2004-03-30 | 2008-01-02 | 深圳市蓝科电子有限公司 | Method of mfg. white light LED |
CN100414725C (en) * | 2004-04-23 | 2008-08-27 | 斯坦雷电气株式会社 | Semiconductor light emitting device |
CN105185894A (en) * | 2014-06-05 | 2015-12-23 | 昆山科技大学 | Light-emitting device and filtering method thereof |
CN106252475A (en) * | 2016-09-21 | 2016-12-21 | 深圳市兆驰节能照明股份有限公司 | CSP light source and manufacture method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7319293B2 (en) | Light bulb having wide angle light dispersion using crystalline material | |
CN101320775B (en) | Encapsulation of silicon substrate LED | |
CN102543980A (en) | Light emitting diode packaging structure and manufacturing method thereof | |
CN101740705A (en) | Warm white LED and preparation method thereof | |
CN102856473B (en) | Packaging adjustment method of LED (light-emitting diode) light source | |
CN2310925Y (en) | Structure of light emitting diode | |
CN2310388Y (en) | Light emitting diode | |
CN109713112A (en) | White-light LED chip, lamp bead and White-light LED chip, lamp bead preparation method | |
CN101355132B (en) | encapsulation method of white light LED for improving facula | |
CN101887940A (en) | LED encapsulating structure and method thereof | |
CN105042363B (en) | A kind of four primary LED light source | |
CN102074623A (en) | Colored LED (Light-Emitting Diode) and manufacturing method thereof | |
CN201916757U (en) | Light emitting diode (LED) light source | |
CN102052578A (en) | Light-emitting device | |
CN2681354Y (en) | A highly effective white light LED structure | |
CN106981482A (en) | A kind of LED dimmed light sources and preparation method thereof | |
CN2729907Y (en) | Improved structure of white light LED | |
CN202549924U (en) | Novel light-emitting diode (LED) device | |
CN201666469U (en) | LED module packaging structure | |
CN113497012A (en) | Solar-like spectrum packaging structure and preparation method thereof | |
CN217903117U (en) | LED filament lamp | |
CN1198078C (en) | Mixed integrated efficient full-colour LED lamp | |
CN217641381U (en) | LED lamp bead capable of emitting light in segmented mode | |
CN1220279C (en) | Purple red light-emitting diode | |
CN201568811U (en) | White light LED backlight |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: QUAN XING TECHNOLOGY DEVELOPMENT CO., LTD. Free format text: FORMER NAME OR ADDRESS: CHEN XING |
|
CP03 | Change of name, title or address |
Address after: County Road nine Taiwan jhubei City, Hsinchu County Road 80 3 floor Patentee after: Quanxing Development Science and Technology Co., Ltd. Address before: 5 floor, No. 83 charity street, Hsinchu, Taiwan Patentee before: Chen Xing |
|
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |