CN203367359U

CN203367359U - A light emitting diode apparatus

Info

Publication number: CN203367359U
Application number: CN 201320434667
Authority: CN
Inventors: 柴广跃; 刘�文
Original assignee: Shenzhen University
Current assignee: Shenzhen University
Priority date: 2013-07-19
Filing date: 2013-07-19
Publication date: 2013-12-25
Anticipated expiration: 2023-07-19

Abstract

The utility model discloses a light emitting diode apparatus comprising a substrate, an LED chip, a first phosphor layer, and a second phosphor layer. The LED chip is arranged on the substrate. The first phosphor layer covers the LED chip. The second phosphor layer is arranged on the external surface of the first phosphor layer to form a microstructure on the first phosphor layer. The thickness of the phosphor layer of the light emitting diode apparatus is enabled to be controllable, and the light emitting efficiency is raised.

Description

Light-emitting diode assembly

Technical field

The utility model relates to a kind of light-emitting diode assembly in field of photoelectric technology.

Background technology

Light-emitting diode (LED, Light Emitting Diode) is because the advantages such as energy-saving and environmental protection, life-span length are becoming the basis of semiconductor lighting, thereby causing people's extensive attention.

White light emitting diode normally utilizes blue-ray LED to excite gold-tinted fluorescent material and/or red light fluorescent powder to form white light, or utilizes purple LED to excite the three primary colors fluorescent powder synthesize white light.Therefore, the coating processes of fluorescent material is the committed step of manufacturing light-emitting diode assembly.

A kind of fluorescent powder coating technique commonly used is: fluorescent material and colloid are mixed by a certain percentage and be made into the powder slurry, then with the fine needle head, phosphor gel is applied to chip surface.There are the following problems for above-mentioned technique: the thickness of phosphor powder layer and shape are difficult to accurate control, cause the optical field distribution inequality; Moreover, in practical operation, no matter manually or machine operation, between the LED of same batch, fluorescent material all can have different in shape, causes the photochromic consistency of product poor, the repetition rate of product is also low.

The utility model content

The technical problem that the utility model mainly solves is to provide a kind ofly can accurately control the thickness of phosphor powder layer and the light-emitting diode assembly of shape.

For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of light-emitting diode assembly comprises substrate, LED chip, the first phosphor powder layer and the second phosphor powder layer; LED chip is arranged on substrate, and the first phosphor powder layer covers LED chip; The second phosphor powder layer is arranged at the outer surface of the first phosphor powder layer on the first phosphor powder layer, to form surface micro-structure.

The beneficial effects of the utility model are: compared with prior art, the utility model light-emitting diode assembly comprises the first phosphor powder layer be covered on LED chip and is covered in the first phosphor powder layer outward and form the second phosphor powder layer of surface micro-structure, the first phosphor powder layer can adopt the mode of film brush to obtain, thereby make the thickness of phosphor powder layer and precision accurately to control, the second phosphor powder layer forms surface micro-structure outside the first phosphor powder layer, can lower light that the Light-Emitting Diode device sends at inner reflectivity, improve the light extraction efficiency of light-emitting diode assembly.

The accompanying drawing explanation

Fig. 1 is the schematic flow sheet of this kind of fluorescent material painting method;

Fig. 2 is the first embodiment of step S70 in the painting method of fluorescent material shown in Fig. 1;

Fig. 3 is the second embodiment of step S70 in the painting method of fluorescent material shown in Fig. 1;

Fig. 4 is the schematic diagram of the substrate of the packaging LED chips applied in the painting method of fluorescent material shown in Fig. 1;

Fig. 5 is the schematic diagram of the mask plate applied in the painting method of fluorescent material shown in Fig. 1;

Fig. 6 is by the relatively-stationary schematic diagram of mask plate shown in packaging LED chips shown in Fig. 4 and Fig. 5;

Fig. 7 is the schematic diagram of the utility model light-emitting diode assembly;

Fig. 8 is the profile of light-emitting diode assembly shown in Fig. 7 from the A-A place.

Embodiment

Below in conjunction with drawings and Examples, the utility model is elaborated.

Please refer to Fig. 1, a kind of fluorescent material painting method comprises the steps:

S10, provide the substrate 10 of packaging LED chips 20.

Please in the lump with reference to Fig. 4, Fig. 4 has illustrated a kind of substrate 10 of packaging LED chips 20.In the present embodiment, substrate 10 is circular, has evenly encapsulated 4 LED chips 20 on it.In practical application, above-described embodiment should not form the restriction to the utility model fluorescent material painting method.LED chip can be selected blue-light LED chip, yellow light LED chip etc.

S20, provide the phosphor gel of mixed uniformly pasty state.

In this step, by fluorescent material and colloid and can select to add the mode of thickening powder fully to be mixed to get according to a certain percentage the phosphor gel of pasty state according to actual conditions.Thickening powder comprises silica flour, PPA(fluoropolymer additive) micro mist etc.After fully mixing, fluorescent material is evenly distributed in the pasty state phosphor gel.In this step, fluorescent material can be the fluorescent material of single kind, can be also the fluorescent material of two or more mixing.The mixing that is gold-tinted fluorescent material or gold-tinted fluorescent material and red light fluorescent powder such as the fluorescent material mixed in phosphor gel etc.

In practical application, fluorescent material, thickening powder and colloid three's proportioning and the mobility of colloid self, needed colour temperature determine.Generally, in phosphor gel, the weight ratio scope of fluorescent material, thickening powder and colloid is roughly 73:18:9～94:0:6.The routine of three's weight ratio selects 80:13:7 is arranged usually, 85:9:6, the multiple proportioning such as 91:3:6.Preferably, in order to obtain a kind of positive white light, the weight ratio of fluorescent material, thickening powder and colloid is chosen as 91:0:9.

S30, provide mask plate 30 and according to the designed mask hole 31 on mask plate 30 of the LED chip 20 on substrate 10.

Please in the lump with reference to Fig. 5, according to the shape of the shape designed mask plate of substrate.For example, the mask plate that square substrate is filled a prescription shape usually, circular substrate is joined circular mask plate etc. usually.The thickness of mask plate is greater than the Thickness Design of LED chip, and its concrete gauge is determined by the needed colour temperature of light-emitting diode assembly.

Further, according to number, position and the size designed mask hole 31 on mask plate 30 of LED chip 20 on substrate 10.The quantity of mask aperture 31 is generally consistent with the quantity of LED chip or be greater than the quantity of LED chip.For example, the substrate that the mask plate that a kind of mask aperture quantity is 10 can encapsulate 5 LED chips on substrate is combined and is carried out the fluorescent material coating, and the substrate that also can on substrate, encapsulate 10 LED chips is combined and is carried out the fluorescent material coating.The position of mask aperture 31 is corresponding with the position of LED chip.Because LED chip is Polyhedral illuminous body, therefore, the size of mask aperture 31 is greater than the size setting of LED chip, and the concrete size of mask aperture 31 is determined by the needed colour temperature of light-emitting diode assembly.Mask aperture 31 can be the shape identical with the LED profile, can be also the shape different from the LED profile.For example, LED chip is square, and mask aperture can be square or circular etc.In practical application, the shape of mask aperture 31 is retrained by the colour temperature of product.

In practical application, between step S10 and step S20, and dividing without sequencing between step S20 and step S30.

S40, at the interior spary release agent of the mask aperture 31 of mask plate 30.

In this step, the selection of release agent is the state of the art, in specification, this is not described in detail.

S50, by the substrate of packaging LED chips 20 10 fixing and compacting relative to mask plate 30, make mask plate 30 be positioned at the top of substrate 10, and LED chip 20 is exposed from mask aperture 31.

Please in the lump with reference to Fig. 6, substrate 10 and the stacked placement of mask plate 30 of packaging LED chips 20, in order to facilitate follow-up brush coating, be put in mask plate 30 below of substrate 10, the center of mask aperture 31 center and LED chip over against, and LED chip 20 is exposed in mask aperture 31.

When substrate 10 and the stacked placement of mask plate 30, for the phosphor gel that makes in subsequent step the brush system, can not infiltrate on other positions of substrate 10, generally adopt clamping fixture etc. by substrate 10 fixing and compacting relative to mask plate 30.

S60, insert the phosphor gel of pasty state in mask aperture 31 and by phosphor gel and brush flat.

The phosphor gel of making in step S20 is put into to the top of mask plate 30, with glue, brush flat, because the size of mask aperture 31 is greater than the size of LED chip 20, the thickness of mask plate 30 is greater than the LED core, 20 thickness, phosphor gel enters end face and the side that is filled in LED chip in mask aperture 31.After phosphor gel is inserted in mask aperture 31, the end face by glue brush etc. along mask plate 30 brushes flat phosphor gel, can access the unified fluorescent powder colloid layer of strict control gauge and shape.

S70, to the phosphor gel demoulding, curing.

The demoulding of phosphor gel, curing schedule are divided into two kinds of situations, after the first demoulding, solidify, or first curing and demolding.

Please, in the lump with reference to Fig. 2, Fig. 2 is the first execution mode flow chart that in the utility model fluorescent material painting method, the phosphor gel demoulding is solidified, and comprises the steps:

S71 takes off mask plate 30 on substrate 10;

S72, at the outer surface of phosphor gel sprayed with fluorescent powder end equably;

S73, by blue light or UV-irradiation phosphor gel or heating phosphor gel until it is fully curing.

The length of ultra-violet curing time is relevant with the colloid of employing, and a representative value in practical application is 30 seconds.Directly heating cure is that phosphor gel is placed in vacuum drying oven and carries out,, heating-up temperature is generally 150 degrees centigrade, and the heating duration is 1 hour.

In present embodiment, the phosphor gel of brush outside LED chip adopted to the first demoulding curing mode again, be applicable to make by step S20 the situation of comparatively sticky fluorescent powder colloid.

Wherein, step S71 is the demoulding step that phosphor gel forms the first phosphor powder layer, S72 can adopt fluorescent powder is packed in sprayer to spray and form the second phosphor powder layer, and the second phosphor powder layer is coated on the first phosphor powder layer, and forms surface micro-structure on the first phosphor powder layer.Step S73 is cured the phosphor gel of the first phosphor powder layer, and in curing process, a part of fluorescent material in the second phosphor powder layer incorporates in the first phosphor powder layer, makes two phosphor powder layers have good combination.

The first phosphor powder layer made by step S60 and S71 has smooth surface, so the light that LED illuminating device sends has higher reflectivity in inside, has greatly limited light extraction efficiency.By form the second phosphor powder layer with surface micro-structure outside the first phosphor powder layer, can lower light that the Light-Emitting Diode device sends at inner reflectivity, improve the light extraction efficiency of light-emitting diode assembly.

Certainly step S72 is the Optimization Steps to the utility model painting method, if do not consider the light extraction efficiency problem, can omit this step fully.

Please, in the lump with reference to Fig. 3, Fig. 3 is the second execution mode flow chart that in the utility model fluorescent material painting method, the phosphor gel demoulding is solidified, and comprises the steps:

S71 ', by blue light or UV-irradiation phosphor gel until it is fully curing;

S72 ' takes off mask plate on substrate;

S73 ', at the outer surface of phosphor gel sprayed with fluorescent powder end equably.

In present embodiment, to brush, the phosphor gel outside LED chip adopts the mode of the demoulding again of first solidifying, and is applicable to make by step S20 the situation of the fluorescent powder colloid of comparatively thin (being that viscosity coefficient is lower).

When the viscosity coefficient of fluorescent powder colloid hangs down, the phosphor gel by the mask scrubbing brush outside LED chip more easily flows, and is not suitable for solidifying after the first demoulding, therefore needs first curing and demolding.Step S71 in the first execution mode that step S71 '～S73 ' and the phosphor gel demoulding are solidified～S73 there is no except precedence is different that other are different, therefore, and specific explanations no longer.

In present embodiment, fluorescent powder forms outer second phosphor powder layer that forms of phosphor gel of the first phosphor powder layer after being sprayed on and solidifying, the first phosphor powder layer and the second phosphor powder layer are interosculated, for the two is mutually combined, can further to light-emitting diode assembly, carry out regelate sprayed with fluorescent powder is last.

The composition of the second phosphor powder layer and fluorescent material in the first phosphor powder layer can be identical or part is identical, certainly can also be fully different.According to the real needs of use, allocated, concrete demand for example, is regulated colour temperature etc.

The light-emitting diode assembly made by aforementioned fluorescent material painting method please refer to Fig. 7 and Fig. 8.

This light-emitting diode assembly comprises substrate 10, LED chip 20, the first phosphor powder layer 40, the second phosphor powder layer 50.LED chip 20 is arranged on substrate 10, and it is the colloid layers that mix fluorescent material that the first phosphor powder layer 40 covers LED chip 20, the first phosphor powder layers 40, and the first phosphor powder layer 40 adopts mask plate 30 brushes to make.The second phosphor powder layer 50 is sprayed at the outer surface of the first phosphor powder layer 40 on the first phosphor powder layer 40, to form surface micro-structure.

In the first phosphor powder layer, the proportion of fluorescent material and colloid is 73:18:9～94:0:6.Preferably, in order to obtain a kind of positive white light, the weight ratio of fluorescent material, thickening powder and colloid is chosen as 91:0:9.

Formation, component and manufacturing process about light-emitting diode assembly, be described in detail in the embodiment of aforementioned fluorescent material painting method, repeats no more herein.

Compared with prior art, the utility model fluorescent material painting method provides the mask plate 30 in designed mask hole 31, by the relative fixing and compacting of the substrate 10 of mask plate 30 and packaging LED chips 20, LED chip 20 is exposed in mask aperture 31, then fill the fluorescent material of pasty state and phosphor gel is brushed flat in mask aperture 31, the phosphor powder layer that adopts above-mentioned painting method to make can accurately be controlled shape and the thickness of phosphor powder layer, can obtain uniform light field, make the light-emitting diode assembly of same batch have unified photochromic.

The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in scope of patent protection of the present utility model.

Claims

1. a light-emitting diode assembly, is characterized in that, described light-emitting diode assembly comprises substrate, LED chip, the first phosphor powder layer and the second phosphor powder layer; Described LED chip is arranged on described substrate, and described the first phosphor powder layer covers described LED chip; Described the second phosphor powder layer is arranged at the outer surface of described the first phosphor powder layer on described the first phosphor powder layer, to form surface micro-structure.