CN113766726A - High-protection high-density circuit board structure for communication - Google Patents
High-protection high-density circuit board structure for communication Download PDFInfo
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- CN113766726A CN113766726A CN202110798014.2A CN202110798014A CN113766726A CN 113766726 A CN113766726 A CN 113766726A CN 202110798014 A CN202110798014 A CN 202110798014A CN 113766726 A CN113766726 A CN 113766726A
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- circuit board
- protection
- board main
- heat dissipation
- main part
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-protection high-density circuit board structure for communication, and relates to the technical field of circuit boards. Including the circuit board main part, the both sides outer wall of circuit board main part all is provided with the installed part, the top and the bottom of circuit board main part all are provided with protection machanism through the installed part, protection machanism's inside is provided with heat dissipation mechanism, the front of installed part is provided with stop gear. Through setting up the guard plate, make its effect installation through the installed part set up in the outside of circuit board main part, and laminate the setting through the outer wall of connecting bed course and circuit board main part, and then through the effect of connecting the fin, strengthen the connection hardness between guard plate and the connection pad layer, and through the setting of protection spring, the impact and the pressure that receive the guard plate cushion and subtract burden, and then protective nature and the security that effectively ensure the circuit board main part and use, prevent that it from receiving external shock and suffering the damage, influence follow-up normal work, and then promote its usability.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a high-protection high-density circuit board structure for communication.
Background
The circuit board has the name: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
Present circuit board for communication is mostly double-sided circuit board, because double-sided work, self work calorific capacity is big, and the unable fine heat that gives off of current double-sided circuit board, it is big to result in circuit board work to be influenced by the temperature, influence circuit board life, it is possible to cause unrepairable damage to the circuit board even, simultaneously current circuit board in use, its overall structure is comparatively simple, and the installation screw that will be used for the assembly is opened in the edge of circuit board body, it is comparatively inconvenient to install, influence the normal use work of circuit board self easily, and the usable floor area of circuit board body has been occupied, and then the stability of use work has been hindered goes on, and reduce its protectiveness, it is comparatively inconvenient to cause its use, for this reason, it solves above-mentioned problem with high protectiveness high density type circuit board structure to propose a communication.
Disclosure of Invention
The invention provides a high-protection high-density circuit board structure for communication, which has the advantages of good protection, high heat dissipation efficiency, convenience in installation and use and solves the problems that a common circuit board structure does not have the advantages of good protection, high heat dissipation efficiency, convenience in installation and use.
In order to realize the purposes of good protection, high heat dissipation efficiency, convenient installation and convenient use, the invention provides the following technical scheme: a high-protection high-density circuit board structure for communication comprises a circuit board main body, wherein installation parts are arranged on the outer walls of two sides of the circuit board main body, protection mechanisms are arranged at the top and the bottom of the circuit board main body through the installation parts, a heat dissipation mechanism is arranged inside the protection mechanisms, and a limiting mechanism is arranged on the front side of each installation part;
the outer wall of the circuit board main body is provided with a limiting frame, the inner wall of the limiting frame is provided with a limiting clamping groove, the inner wall of the limiting clamping groove is provided with an element main board, the top of the joint of the limiting frame is embedded with a pressing spring part, and the bottom of the pressing spring part is provided with a movable clamping block;
the inner wall of the heat dissipation mechanism is provided with a dust blocking net, and the inside of the heat dissipation mechanism is provided with a heat dissipation fan.
In a preferred embodiment of the present invention, the heat dissipation plate is disposed inside the mounting member, and the heat dissipation plate penetrates the mounting member and extends to the outside of the mounting member.
As a preferable technical solution of the present invention, the mounting member has a connecting groove formed on an outer side thereof, and a current connection port formed on an inner wall of the connecting groove, the current connection port penetrating through the inner wall of the connecting groove and extending to an inner side of the mounting member.
As a preferable technical scheme of the invention, the mounting piece is provided with a mounting groove on the inner side, the shape and size of the mounting groove are matched with those of the circuit board main body, and the circuit board main body is arranged on the inner side of the mounting piece in a sliding embedded clamping manner through the mounting groove.
As a preferable technical scheme of the invention, the front and the back of the mounting piece arranged on the two sides of the circuit board main body are both provided with mounting screw holes, and the mounting piece is movably connected with the limiting mechanism through the mounting screw holes.
As a preferred technical scheme of the invention, a protection plate is arranged at the top of the protection mechanism, the bottom of the protection plate is respectively provided with a different number of connecting fins and protection springs, the bottom of each protection spring is provided with a connecting cushion layer, and the protection mechanism is attached to the circuit board main body through the connecting cushion layer.
As a preferred technical scheme of the invention, the unequal connecting fins and the protective springs are arranged at the bottom of the protective plate at equal distances, and the unequal connecting fins and the protective springs are attached to and connected with the top of the connecting cushion layer.
As a preferred technical scheme of the present invention, both sides of the limiting mechanism are provided with limiting parts, a limiting groove is formed in the limiting part, a limiting baffle is arranged in the limiting groove, and a fixing bolt is arranged in the limiting part in a penetrating manner.
As a preferable technical scheme of the invention, the shape and the size of the fixing bolt are matched with those of the mounting screw hole, and the fixing bolt is in threaded connection with the mounting screw hole.
As a preferred technical scheme of the invention, the number of the heat dissipation mechanisms and the protection mechanisms is two, the two heat dissipation mechanisms and the protection mechanisms are respectively arranged at the top and the bottom of the circuit board main body, and two sides of the two protection mechanisms are fixedly connected with the inner side of the mounting piece.
Compared with the prior art, the invention provides a high-protection high-density circuit board structure for communication, which has the following beneficial effects:
1. this high protectiveness high density type circuit board structure is used in communication, through setting up the guard plate, make its effect installation through the installed part set up in the outside of circuit board main part, and laminate the setting through the outer wall of connecting cushion layer and circuit board main part, and then the effect through connecting the fin, strengthen the connection hardness between guard plate and the connection cushion layer, and through the setting of protection spring, the impact and the pressure that receive the guard plate cushion and subtract the burden, and then protective and the security that effectively ensures circuit board main part and use, prevent that it from receiving outside impact and suffering the damage, influence follow-up normal work, and then promote its usability.
2. This high protectiveness high density type circuit board structure is used in communication, through setting up the heating panel, make it effectively carry out the heat conduction to the part that carries out the inside circuit board main part of installed part through the mounting groove installation and handle, and advance the heat dissipation through radiator fan to the heat that the circuit board main part used production and handle, simultaneously through the heat dissipation mechanism of two-sided setting, effectively strengthen the device's radiating efficiency, and keep off the dirt net through its inner wall setting, it enters into the device inside to avoid the dust through heat dissipation mechanism, cause the damage to the circuit board main part, and then slow down the hot pressure that the device used inside, effectively strengthen the device's durability, and improve its life.
3. This high protection nature high density type circuit board structure is used in communication, through setting up spacing draw-in groove, effectively make the component mainboard through the spacing inside of installing at spacing frame of its effect, and through the setting of activity fixture block, the joint of assembling of convenient spacing frame, and then the stability that the guarantee component mainboard used, simultaneously through the effect of mounting groove, make circuit board main part embedding joint set up the inside at the installed part, and carry out spacing blockking to it through limit baffle, avoid its roll-off, and then effective convenient the device's installation is used, save its installation time, reduce the installation cost and drop into, and improve its practicality.
4. This high protectiveness high density type circuit board structure is used in communication, install the component mainboard through setting up spacing frame, and through the inside of mounting part is advanced in the circuit board main part installation that the mounting groove will be assembled, the installation of convenient device, and then carry out heat conduction through the heating panel, and carry out the heat dissipation through the heat dissipation mechanism that sets up on the protection machanism to the use of circuit board main part and handle, the setting of heating panel simultaneously, effectively raise the use height of circuit board main part, avoid its two-sided heat dissipation mechanism's that sets up use not smooth, and through the effect of keeping off the dirt net, convenient device protects the device in the radiating, prevent the invasion of dust, effectively improve the device's practicality.
5. This high protectiveness high density type circuit board structure for communication, through setting up the current interface, make its use effective to the circuit board main part insert the power, and provide the power for radiator fan's use, the device dispersion position sets up simultaneously, it is convenient to maintain the change to internal element, and then maneuverability and practicality that hoisting device used, and through stop gear's use, the use installation of stable circuit board main part, the stability of guarantee its use, and then convenient user of service is to the operation use of the device, effectively improve the device's availability factor.
Drawings
Fig. 1 is a schematic structural diagram of a high-protection high-density circuit board structure for communication according to the present invention;
fig. 2 is an exploded view of a circuit board main body of a high-protection high-density circuit board structure for communication according to the present invention;
fig. 3 is an enlarged schematic structural diagram of a portion B in fig. 2 of a high-protective high-density circuit board structure for communication according to the present invention;
fig. 4 is a schematic diagram illustrating a connection between a mounting member and a protection mechanism of a high-protection high-density circuit board structure for communication according to the present invention;
fig. 5 is an enlarged schematic structural diagram of a portion a in fig. 1 of a high-protective high-density circuit board structure for communication according to the present invention;
fig. 6 is a front cross-sectional view of a high-protective high-density circuit board structure for communication according to the present invention.
In the figure: 1. a circuit board main body; 101. a limiting frame; 102. a limiting clamping groove; 103. an element main board; 104. a pressing spring member; 105. a movable clamping block; 2. a mounting member; 201. a heat dissipation plate; 202. a connecting groove; 203. mounting grooves; 204. mounting a screw hole; 205. a current interface; 3. a heat dissipation mechanism; 301. a dust blocking net; 302. a heat radiation fan; 4. a protection mechanism; 401. a protection plate; 402. connecting the warped piece; 403. connecting the cushion layer; 404. a guard spring; 5. a limiting mechanism; 501. a limiting member; 502. fixing the bolt; 503. And a limiting baffle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the invention discloses a high-protection high-density circuit board structure for communication, which comprises a circuit board main body 1, wherein mounting pieces 2 are arranged on the outer walls of the two sides of the circuit board main body 1, protection mechanisms 4 are arranged at the top and the bottom of the circuit board main body 1 through the mounting pieces 2, a heat dissipation mechanism 3 is arranged inside the protection mechanism 4, a limiting mechanism 5 is arranged on the front surface of the mounting piece 2, a limiting frame 101 is arranged on the outer wall of the circuit board main body 1, a limiting clamping groove 102 is arranged on the inner wall of the limiting frame 101, an element main board 103 is arranged on the inner wall of the limiting clamping groove 102, a pressing spring piece 104 is embedded into the top of the connecting part of the limiting frame 101, a movable clamping block 105 is arranged at the bottom of the pressing spring piece 104, and a dust blocking net 301 is arranged on the inner wall of the heat dissipation mechanism 3, a heat radiation fan 302 is provided inside the heat radiation mechanism 3.
Specifically, the inside heating panel 201 that is provided with of installed part 2, heating panel 201 runs through the inside of setting at installed part 2 to extend to the outside of installed part 2, make the device pass through heating panel 201, make it effectively carry out the heat conduction to the part that carries out the inside circuit board main part 1 of installed part 2 through the installation of mounting groove 203 and handle, and then ensure the stability of device radiating effect.
Specifically, the connection groove 202 is formed in the outer side of the mounting part 2, the current interface 205 is formed in the inner wall of the connection groove 202, and the current interface 205 penetrates through the inner wall of the connection groove 202 and extends to the inner side of the mounting part 2, so that the device is connected with an external use system of the device through the connection groove 202, and a power supply is connected to the use of the circuit board main body 1 through the current interface 205, so that a power supply is provided for the use of the cooling fan 302, and the use of the device is facilitated.
Specifically, mounting groove 203 has been seted up to the inboard of installed part 2, the shape and size of mounting groove 203 and the shape and size of circuit board main part 1 match each other, and circuit board main part 1 slides through mounting groove 203 and imbeds the joint and sets up in the inboard of installed part 2 for the inside of installed part 2 is installed into with assembled circuit board main part 1 through mounting groove 203 to the device, makes things convenient for the installation of device, saves its installation time, reduces installation cost and drops into.
Specifically, installation screw hole 204 has all been seted up at the front and the back of installed part 2 that 1 both sides of circuit board set up, installed part 2 is through installation screw hole 204 and 5 swing joint of stop gear for installed part 2 is effective through the use of installation screw hole 204, and convenient stop gear 5's installation is dismantled, convenient its use.
Specifically, protection mechanism 4's top is provided with guard plate 401, the bottom of guard plate 401 is provided with the unequal connection fin 402 of quantity and protection spring 404 respectively, protection spring 404's bottom is provided with connection cushion 403, protection mechanism 4 sets up through connecting cushion 403 and the laminating of circuit board main part 1 for the device makes it effectively protect circuit board main part 1 through setting up guard plate 401, and laminates the setting through the outer wall of connection cushion 403 and circuit board main part 1, and then through the effect of connecting fin 402, strengthens the connection hardness between guard plate 401 and connection cushion 403, and through the setting of protection spring 404, cushions the burden reduction to the impact and the pressure that guard plate 401 received, and then effectively ensures the protectiveness and the security that circuit board main part 1 used.
Specifically, the unequal connection fin 402 of quantity and the equal distance setting of protection spring 404 are in the bottom of guard plate 401, the unequal bottom of connecting fin 402 of quantity and protection spring 404 all is connected with the top laminating of connecting cushion layer 403 for protection machanism 4 is through the connection fin 402 and the protection spring 404 that its equidistance set up, and effective dispersed impact force guarantees the stability of its protection use.
Specifically, the both sides of stop gear 5 all are provided with locating part 501, the spacing groove has been seted up to the inside of locating part 501, and the inside of spacing groove is provided with limit baffle 503, the inside of locating part 501 is run through and is provided with fixing bolt 502 for circuit board main part 1 carries out the back of installing, carries out spacing the blockking to it through limit baffle 503, and fixes it through fixing bolt 502, avoids its roll-off, and then the stability of guarantee circuit board main part 1 use.
Specifically, the shape and size of the fixing bolt 502 are matched with the shape and size of the installation screw hole 204, and the fixing bolt 502 is in threaded connection with the installation screw hole 204, so that the limiting mechanism 5 is in threaded connection with the installation screw hole 204 through the fixing bolt 502, the installation and the disassembly are convenient, the circuit board main body 1 is convenient to maintain and replace, and the use is convenient.
Specifically, the quantity of heat dissipation mechanism 3 and protection machanism 4 is two, and two heat dissipation mechanisms 3 and protection machanism 4 equally divide and do not set up in the top and the bottom of circuit board main part 1, and two protection machanism 4's both sides all with the inboard fixed connection of installed part 2 for the device effectively protects and dispels the heat to circuit board main part 1 of two-sided use, ensures its protection and the comprehensive of use, promotes the device's practicality.
The working principle and the using process of the invention are as follows: when in use, the element main board 103 is effectively limited and arranged inside the limiting frame 101 through the action of the limiting clamping groove 102, the movable clamping block 105 is arranged to facilitate the assembling and clamping of the limiting frame 101, so as to ensure the stability of the use of the element main board 103, meanwhile, the circuit board main body 1 is embedded and clamped inside the mounting part 2 through the action of the mounting groove 203 and is limited and blocked through the limiting baffle 503 to avoid the sliding out, and further, the heat dissipation plate 201 is used for effectively conducting heat conduction treatment on the part of the circuit board main body 1 arranged inside the mounting part 2 through the mounting groove 203, heat generated by the circuit board main body 1 is conducted through the heat dissipation fan 302, meanwhile, the heat dissipation efficiency of the device is effectively enhanced through the heat dissipation mechanism 3 arranged on the two sides, and the dust blocking net 301 arranged on the inner wall of the device is used, the dust is prevented from entering the device through the heat dissipation mechanism 3 to damage the circuit board main body 1, and the thermal pressure used in the device is reduced, on the other hand, the protection plate 401 is arranged outside the circuit board main body 1 through the action of the mounting part 2 and is attached to the outer wall of the circuit board main body 1 through the connecting cushion layer 403, the connection hardness between the protection plate 401 and the connecting cushion layer 403 is enhanced through the action of the connecting fin 402, the impact and the pressure on the protection plate 401 are buffered and relieved through the arrangement of the protection spring 404, and the protection performance and the safety of the circuit board main body 1 are effectively guaranteed, finally, the circuit board main body 1 is effectively connected with a power supply through the current interface 205, and the power supply is provided for the use of the heat dissipation fan 302, so that the device is operated and used, the operation of the device is completed as described above.
To sum up, this high protectiveness high density type circuit board structure for communication installs component mainboard 103 through setting up spacing frame 101, and install the inside of assembled circuit board main part 1 into installed part 2 through mounting groove 203, facilitate the installation of device, and then conduct heat through heating panel 201, and carry out the heat dissipation through the use of the heat dissipation mechanism 3 that sets up on the protection machanism 4 to circuit board main part 1 and handle the heat dissipation, the setting of heating panel 201 simultaneously, effectively raise the use height of circuit board main part 1, avoid its two-sided setting to set up the use of heat dissipation mechanism 3 not smooth, and through the effect that keeps off dirt net 301, convenient device protects the device at radiating while, prevent the invasion of dust, effectively improve the device's practicality.
It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a communication is with high protectiveness high density type circuit board structure, includes circuit board main part (1), its characterized in that: mounting pieces (2) are arranged on the outer walls of two sides of the circuit board main body (1), protective mechanisms (4) are arranged at the top and the bottom of the circuit board main body (1) through the mounting pieces (2), a heat dissipation mechanism (3) is arranged inside the protective mechanisms (4), and a limiting mechanism (5) is arranged on the front side of each mounting piece (2);
a limiting frame (101) is arranged on the outer wall of the circuit board main body (1), a limiting clamping groove (102) is formed in the inner wall of the limiting frame (101), an element main board (103) is arranged on the inner wall of the limiting clamping groove (102), a pressing spring piece (104) is embedded into the top of the joint of the limiting frame (101), and a movable clamping block (105) is arranged at the bottom of the pressing spring piece (104);
the inner wall of the heat dissipation mechanism (3) is provided with a dust blocking net (301), and the inside of the heat dissipation mechanism (3) is provided with a heat dissipation fan (302).
2. The high-protection high-density circuit board structure for communication according to claim 1, wherein: the mounting piece (2) is internally provided with a heat dissipation plate (201), and the heat dissipation plate (201) penetrates through the mounting piece (2) and extends to the outside of the mounting piece (2).
3. The high-protection high-density circuit board structure for communication according to claim 1, wherein: the connecting groove (202) has been seted up in the outside of installed part (2), current interface (205) has been seted up to the inner wall of connecting groove (202), current interface (205) run through the inner wall of connecting groove (202) and extend to the inboard of installed part (2).
4. The high-protection high-density circuit board structure for communication according to claim 1, wherein: mounting groove (203) have been seted up to the inboard of installed part (2), the shape size of mounting groove (203) matches each other with the shape size of circuit board main part (1), and circuit board main part (1) slides through mounting groove (203) and imbeds the joint and sets up the inboard at installed part (2).
5. The high-protection high-density circuit board structure for communication according to claim 1, wherein: installation screw hole (204) have all been seted up to the front and the back of installed part (2) that circuit board main part (1) both sides set up, installed part (2) are through installation screw hole (204) and stop gear (5) swing joint.
6. The high-protection high-density circuit board structure for communication according to claim 1, wherein: the top of protection machanism (4) is provided with guard plate (401), the bottom of guard plate (401) is provided with the unequal connection fin of quantity (402) and protection spring (404) respectively, the bottom of protection spring (404) is provided with connection bed course (403), protection machanism (4) are through connecting bed course (403) and circuit board main part (1) laminating setting.
7. The high-protection high-density circuit board structure for communication according to claim 6, wherein: unequal connection fin (402) of quantity and protection spring (404) are equidistant to be set up in the bottom of guard plate (401), unequal connection fin (402) of quantity and protection spring (404)'s bottom all is connected with the top laminating of connecting cushion layer (403).
8. The high-protection high-density circuit board structure for communication according to claim 1, wherein: both sides of stop gear (5) all are provided with locating part (501), the spacing groove has been seted up to the inside of locating part (501), and the inside of spacing groove is provided with limit baffle (503), the inside of locating part (501) is run through and is provided with fixing bolt (502).
9. The high-protection high-density circuit board structure for communication according to claim 8, wherein: the shape and size of the fixing bolt (502) are matched with those of the mounting screw hole (204), and the fixing bolt (502) is in threaded connection with the mounting screw hole (204).
10. The high-protection high-density circuit board structure for communication according to claim 1, wherein: the quantity of heat dissipation mechanism (3) and protection machanism (4) is two, and just two heat dissipation mechanism (3) and protection machanism (4) are equallyd divide and are set up respectively in the top and the bottom of circuit board main part (1), and the both sides of two protection machanism (4) all with the inboard fixed connection of installed part (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110798014.2A CN113766726B (en) | 2021-07-15 | 2021-07-15 | High protection nature high density type circuit board structure for communication |
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|---|---|---|---|
| CN202110798014.2A CN113766726B (en) | 2021-07-15 | 2021-07-15 | High protection nature high density type circuit board structure for communication |
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| CN113766726A true CN113766726A (en) | 2021-12-07 |
| CN113766726B CN113766726B (en) | 2023-02-07 |
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| CN211792215U (en) * | 2020-02-13 | 2020-10-27 | 陈聪霖 | Electronic circuit board capable of preventing hand pricking |
| CN212628573U (en) * | 2020-08-04 | 2021-02-26 | 深圳市海宇达电子科技有限公司 | Multilayer circuit board convenient to install and provided with protection structure |
| CN213244787U (en) * | 2020-11-11 | 2021-05-18 | 深圳市裕达盛实业有限公司 | Low-impedance multilayer printed circuit protection board |
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| CN113766726B (en) | 2023-02-07 |
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