CN112187989A - Novel semiconductor magnetic suction type mobile phone radiator - Google Patents
Novel semiconductor magnetic suction type mobile phone radiator Download PDFInfo
- Publication number
- CN112187989A CN112187989A CN202011082764.1A CN202011082764A CN112187989A CN 112187989 A CN112187989 A CN 112187989A CN 202011082764 A CN202011082764 A CN 202011082764A CN 112187989 A CN112187989 A CN 112187989A
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- CN
- China
- Prior art keywords
- mobile phone
- heat dissipation
- plate
- lower side
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/21—Combinations with auxiliary equipment, e.g. with clocks or memoranda pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a novel semiconductor magnetic suction type mobile phone radiator, which comprises a radiating fan device, a radiating plate fixedly arranged on the lower side of the radiating fan device and a semiconductor refrigerating sheet positioned at the lower end of the radiating plate, wherein the radiating plate is fixedly arranged on the lower side of the radiating fan device; a mobile phone comprises a mobile phone body, a mobile phone cover and a novel semiconductor magnetic suction type mobile phone radiator, wherein the back part of the mobile phone body is provided with a heat conduction copper sheet; according to the invention, the magnetic attraction plate is connected with the heat conduction magnetic plate, so that the mobile phone radiator is ensured to be stably connected and not easy to fall off, the equipment is convenient to take and place, heat is concentrated in the aspect of heat dissipation through the heat conduction copper sheet and the heat conduction magnetic plate fixed by using the heat conduction glue, the efficiency is higher, and meanwhile, the situations of overhigh temperature at two sides of the mobile phone and low temperature in the middle of the mobile phone cannot occur because of the heat dissipation copper sheet. The invention has light weight and does not influence the hand feeling in long-term use.
Description
Technical Field
The invention relates to the field of mobile phones, in particular to a novel semiconductor magnetic suction type mobile phone radiator.
Background
With the updating of smart phones, the dominant frequency is higher and higher, the power consumption is higher and higher, and the heating value is higher and higher. The heat generation problem of the mobile phone cannot be ignored, the heat generation problem seriously influences the experience of users, and the hardware temperature is easily overhigh to burn out mobile phone components, so the heat dissipation design of the mobile phone becomes an important subject of the industry.
At present, the adsorption force of a sucker type radiator of the existing mobile phone radiator is not strong, the sucker type radiator can fall off due to shaking in operation, the back splint type radiator is easy to fall off due to looseness of a card when the back splint type radiator is buckled, and the power supply key is easy to touch due to tightness. The mobile phone radiator is placed in the middle of the back of a mobile phone for use, so that the situations of middle supercooling and two-side overheating are easily caused. The weight and volume of the mobile phone radiator affect the portability, for example, a water-cooled radiator needs additional equipment, or a radiator with a radiating copper plate with an overlarge volume has overlarge weight, which affects the portability and long-term usability of the radiator. The hand feeling of the mobile phone for heat dissipation is not stable, the refrigerating effect cannot be achieved when the temperature of a mobile phone radiator is too high, and when the temperature is too low, condensation can be formed on the screen of the mobile phone due to long-term refrigeration of the radiator and heating of the mobile phone, so that the hand feeling of operation is affected, and the mobile phone cannot feel comfortable after long-term use. Therefore, the technical problems of the above reaction make those skilled in the art urgently need to solve the problems.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a novel semiconductor magnetic suction type mobile phone radiator.
In order to solve the technical problems, the technical scheme provided by the invention is a novel semiconductor magnetic suction type mobile phone radiator: comprises a heat radiation fan device, a heat radiation plate fixedly arranged at the lower side of the heat radiation fan device and a semiconductor refrigeration sheet positioned at the lower end of the heat radiation plate;
the heat dissipation fan device comprises an outer shell and a heat dissipation fan arranged in the outer shell, the upper side and the lower side of the outer shell are through, a support frame is arranged on the lower side of the outer shell, and the heat dissipation fan is fixed on the support frame;
the radiating plate consists of a radiating base and upper radiating fins arranged on the radiating base, and the number of the radiating fins on the radiating base is not less than five; the upper ends of the uniformly arranged radiating fins are contacted with the lower side of the outer shell;
the semiconductor refrigeration piece is fixed on the lower side of the heat dissipation plate, and a magnet plate is fixedly arranged on the lower side of the semiconductor refrigeration piece;
the cooling fan device is characterized in that a power supply circuit board is arranged on the cooling fan device, an electricity inlet interface and an indicator lamp are arranged on the power supply circuit board, the power supply circuit board is connected with the semiconductor refrigeration piece through an electric wire, and the cooling fan is connected with the power supply circuit board through an electric wire.
As an improvement, the upper portion of the outer shell is provided with a protective cover, the outer side of the protective cover is provided with a plurality of fixing holes formed by bending, screws are arranged on the fixing holes, the screws sequentially penetrate through the fixing holes and the outer shell and then extend to positions between any two adjacent heat dissipation fins on the heat dissipation plate, and the lower portions of the screws are clamped between any two adjacent heat dissipation fins.
As an improvement, the power inlet interface is a type-c interface.
Compared with the prior art, the invention has the advantages that: according to the invention, the magnetic attraction plate is connected with the heat conduction magnetic plate, so that the mobile phone radiator is ensured to be stably connected and not easy to fall off, the equipment is convenient to take and place, heat is concentrated through the heat conduction copper sheet and the heat conduction magnetic plate fixed by using heat conduction glue in the aspect of heat dissipation, the heat dissipation treatment is more efficient because of the heat conduction copper sheet, and the situations of overhigh temperature at two sides of the mobile phone and low temperature in the middle of the mobile phone can be avoided. The invention has light weight and does not influence the hand feeling in long-term use.
Drawings
Fig. 1 is a first structural schematic diagram of a novel semiconductor magnetic-type mobile phone radiator of the present invention;
fig. 2 is a schematic structural diagram of a novel semiconductor magnetic type mobile phone radiator of the present invention;
fig. 3 is a third schematic structural diagram of a novel semiconductor magnetic type mobile phone radiator of the present invention;
FIG. 4 is a schematic structural view of a hot fan device of the semiconductor magnetic suction type heat sink for mobile phone of the present invention;
FIG. 5 is a schematic diagram of a structure of a novel semiconductor magnetic-type mobile phone heat sink according to the present invention;
FIG. 6 is a first schematic view of a novel semiconductor magnetic attraction type heat sink for a mobile phone according to the present invention;
FIG. 7 is a schematic diagram of a novel semiconductor magnetic attraction type heat sink for a mobile phone according to the present invention;
FIG. 8 is an enlarged partial view of circle A of FIG. 7;
as shown in the figure: 1. the cooling fan device comprises a cooling fan device, 2, a cooling plate, 3, a semiconductor refrigeration piece, 4, an external shell, 5, a cooling fan, 6, a support frame, 7, a cooling base, 8, a cooling fin plate, 9, a magnet plate, 10, a power supply circuit board, 11, an electricity inlet interface, 12, an indicator light, 13, a protective cover, 14, a fixing hole, 15, a screw, 16, a mobile phone body, 17, a mobile phone cover, 18, a heat conduction copper sheet, 19 and a heat conduction magnetic plate.
Detailed Description
The following describes a novel semiconductor magnetic attraction type heat sink for a mobile phone in further detail with reference to the accompanying drawings.
With reference to the accompanying drawings 1-8, a novel semiconductor magnetic suction type mobile phone radiator: comprises a heat radiation fan device 1, a heat radiation plate 2 fixedly arranged at the lower side of the heat radiation fan device 1 and a semiconductor refrigeration sheet 3 positioned at the lower end of the heat radiation plate 2;
the heat dissipation fan device 1 comprises an outer shell 4 and a heat dissipation fan 5 arranged in the outer shell 4, wherein the upper side and the lower side of the outer shell 4 are through, a support frame 6 is arranged on the lower side of the outer shell 4, and the heat dissipation fan 5 is fixed on the support frame 6;
the heat dissipation plate 2 is composed of a heat dissipation base 7 and upper heat dissipation fins 8 arranged on the heat dissipation base 7, and the number of the heat dissipation fins 8 on the heat dissipation base 7 is not less than five; the upper ends of the uniformly arranged heat dissipation fins 8 are in contact with the lower side of the outer shell 4;
the semiconductor refrigeration piece 3 is fixed on the lower side of the heat dissipation plate 2, and a magnet plate 9 is fixedly arranged on the lower side of the semiconductor refrigeration piece 3;
the cooling fan device is characterized in that a power supply circuit board 10 is arranged on the cooling fan device 1, an electricity inlet interface 11 and an indicator lamp 12 are arranged on the power supply circuit board 10, the power supply circuit board 10 is connected with the semiconductor refrigeration piece 3 through an electric wire, and the cooling fan 5 is connected with the power supply circuit board 10 through an electric wire.
The upper portion of outside casing 4 is equipped with safety cover 13, the outside of safety cover 13 is equipped with the fixed orifices 14 that a plurality of was buckled into, be equipped with screw 15 on the fixed orifices 14, screw 15 passes fixed orifices 14, outside casing 4 in proper order and extends to and is located between arbitrary two adjacent heat dissipation fin 8 on heating panel 2, the lower part card of screw 15 is between arbitrary two adjacent heat dissipation fin 8.
The power input interface 11 is a type-c interface.
A mobile phone comprises a mobile phone body 16, a mobile phone cover 17 and a novel semiconductor magnetic suction type mobile phone radiator, wherein a heat conduction copper sheet 18 is arranged on the back of the mobile phone body 16, the mobile phone cover 17 is sleeved on the mobile phone body 16, and the heat conduction copper sheet 18 is positioned between the mobile phone cover 17 and the mobile phone body 16;
a heat-conducting magnetic plate 19 is fixed on the mobile phone cover 17 through heat-conducting glue, and the heat-conducting magnetic plate 19 is connected with a magnet plate 9 on a novel semiconductor magnetic suction type mobile phone radiator; the heat conductive magnetic plate 19 and the heat conductive copper sheet 18 are disposed correspondingly with respect to the cell phone case 17.
When the mobile phone cooling device is implemented specifically, when a user uses the mobile phone cooling device, the heat-conducting copper sheet 18 needs to be placed between the mobile phone body 16 and the mobile phone sleeve 17, the heat-conducting magnetic plate 19 fixedly arranged on the mobile phone sleeve 17 is in magnetic attraction connection with the magnet plate 9 of the novel semiconductor magnetic attraction type mobile phone cooling device, after the connection is completed, the power can be supplied to the mobile phone cooling device through the power inlet interface 11 arranged on the power supply circuit board 10, so that the semiconductor refrigerating sheet 3 and the cooling fan 5 on the mobile phone cooling device start to work, the heat of the semiconductor refrigerating sheet is transmitted to the cooling plate 2, and after the primary heat dissipation of the cooling base 7 and the cooling fin plate 8, the cooling fan 5 is cooled again, so that the efficient mobile phone cooling effect is achieved, the mobile phone cooling device is used for a long time.
When the user stops using the mobile phone, the user needs to extract the power supply of the power inlet interface 11 on the power supply circuit board 10, and then the magnet plate 9 on the mobile phone radiator is separated from the heat conducting magnetic plate 19 on the mobile phone cover 17 through lateral sliding.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (3)
1. The utility model provides a novel formula cell-phone radiator is inhaled to semiconductor magnetism, its characterized in that: comprises a heat radiation fan device (1), a heat radiation plate (2) fixedly arranged at the lower side of the heat radiation fan device (1) and a semiconductor refrigeration sheet (3) positioned at the lower end of the heat radiation plate (2);
the heat dissipation fan device (1) comprises an external shell (4) and a heat dissipation fan (5) arranged in the external shell (4), wherein the upper side and the lower side of the external shell (4) are through, a support frame (6) is arranged on the lower side of the external shell (4), and the heat dissipation fan (5) is fixed on the support frame (6);
the heat dissipation plate (2) is composed of a heat dissipation base (7) and upper heat dissipation fins (8) arranged on the heat dissipation base (7), and the number of the heat dissipation fins (8) on the heat dissipation base (7) is not less than five; the upper ends of the uniformly arranged heat dissipation fins (8) are contacted with the lower side of the outer shell (4);
the semiconductor refrigeration piece (3) is fixed on the lower side of the heat dissipation plate (2), and a magnet plate (9) is fixedly arranged on the lower side of the semiconductor refrigeration piece (3);
be equipped with power supply circuit board (10) on radiator fan device (1), be equipped with into electric interface (11) and pilot lamp (12) on power supply circuit board (10), through connection of electric lines between power supply circuit board (10) and semiconductor refrigeration piece (3), through connection of electric lines between radiator fan (5) and power supply circuit board (10).
2. The novel semiconductor magnetic suction type mobile phone radiator according to claim 1, characterized in that: the upper portion of outside casing (4) is equipped with safety cover (13), the outside of safety cover (13) is equipped with fixed orifices (14) that a plurality of was buckled into, be equipped with screw (15) on fixed orifices (14), screw (15) pass fixed orifices (14), outside casing (4) in proper order and extend to behind to be located between arbitrary two adjacent heat dissipation fin (8) on heating panel (2), the lower part card of screw (15) is between arbitrary two adjacent heat dissipation fin (8).
3. The novel semiconductor magnetic suction type mobile phone radiator according to claim 1, characterized in that: the power input interface (11) is a type-c interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011082764.1A CN112187989A (en) | 2020-10-12 | 2020-10-12 | Novel semiconductor magnetic suction type mobile phone radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011082764.1A CN112187989A (en) | 2020-10-12 | 2020-10-12 | Novel semiconductor magnetic suction type mobile phone radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112187989A true CN112187989A (en) | 2021-01-05 |
Family
ID=73948146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011082764.1A Withdrawn CN112187989A (en) | 2020-10-12 | 2020-10-12 | Novel semiconductor magnetic suction type mobile phone radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112187989A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654222A (en) * | 2021-01-19 | 2021-04-13 | 深圳市科瑞尔特电子科技有限公司 | Mobile terminal heat dissipation device and mobile terminal heat dissipation assembly |
| CN114361994A (en) * | 2022-01-14 | 2022-04-15 | 江西依泰思防爆科技有限公司 | Novel explosion-proof distribution box based on electric automation |
-
2020
- 2020-10-12 CN CN202011082764.1A patent/CN112187989A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654222A (en) * | 2021-01-19 | 2021-04-13 | 深圳市科瑞尔特电子科技有限公司 | Mobile terminal heat dissipation device and mobile terminal heat dissipation assembly |
| CN114361994A (en) * | 2022-01-14 | 2022-04-15 | 江西依泰思防爆科技有限公司 | Novel explosion-proof distribution box based on electric automation |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210105 |
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| WW01 | Invention patent application withdrawn after publication |