TWI607156B - Ceiling fan controller cooling structure - Google Patents

Description

Ceiling fan controller placement box heat dissipation structure

The invention relates to a heat dissipating structure, in particular to a disposing box used in a ceiling fan controller, so that a ceiling fan controller with a good heat dissipating effect can place a heat dissipating structure of the box.

With the rapid development of science and technology, people have higher requirements for the efficacy of various kinds of things. They are no longer required to be used as they used to be. With the humanized thinking mode, people are constantly studying how to make various kinds of transactions in life. It can be more efficient, more economical, and more secure. Therefore, the invention is constantly innovating, improving efficiency, saving more, and being safer. It has also become an ideal invention pursued by people.

With the progress of the times, the development of motor technology is becoming more and more mature, and various applications in related fields are becoming more and more wide. Ceiling fans are also one of various common applications. In recent years, the concept of environmental protection and energy conservation has gradually been paid attention to, and the market has appeared one after another. A variety of ceiling fans that emphasize energy saving, quietness and high performance.

In order to make the ceiling fan have the functions of energy saving, mute and high efficiency, the trend in recent years is to use a DC inverter motor to drive the ceiling fan. Generally, the DC inverter motor is driven by a control circuit, and the control circuit is used to convert the AC input power. It is a DC output power source to drive a DC inverter motor with a DC power supply. In addition, the control circuit can be further used to sense the position of the motor rotor, thereby controlling the switching of the power source according to the position of the motor rotor. Need to use the control circuit in this fan application.

In order to protect the control circuit, the control circuit is usually placed in a box and repaired. Conveniently, the box body is often disposed inside the hanging bell of the suspension system. The placing box is provided with a plurality of electronic components that generate heat when the ceiling fan is working, causing a large amount of heat energy to be generated, but the bell is a nearly sealed structure, the air The circulation is very poor, and the heat dissipation by air convection is very poor, which causes the electronic components to overheat and fail. Therefore, it needs a structure that can help the components to dissipate heat.

Nowadays, many 3C electrical appliances have a heat-dissipating structure, such as heat dissipation of the computer, heat dissipation of the game machine, heat dissipation of the refrigerator, heat dissipation of the air-conditioner, etc. Many electrical appliances require a heat sink, and various heat dissipation methods, such as using a fan. Water cooling, heat dissipating components, etc. It can be seen that today's devices attach great importance to the heat dissipation of electrical appliances, which not only prolongs the life of electrical appliances, but also adds safety to the use of electrical appliances. Mechanical overheating causes mechanical damage. Even in the news, news of electrical appliances exploding and injuring people due to overheating often occurs. Therefore, for the problem of overheating of the machine, it is necessary to improve the heat dissipation problem.

The structure of the placing box installed in the hanging bell of the ceiling fan is basically a box and a bell. The placing box is suspended in the bell, and the heat of the control box can only be relied on by the poor heat. Convergence needs to be strengthened to improve this point.

Therefore, in view of the problems existing in the above-mentioned conventional technical content, how to develop a more secure and more practical innovation structure is expected by the public, and the operators involved in this aspect should work together to develop more. Safer and more practical structure to solve this problem.

After working hard on the above objectives, the inventor further improved the structure of the controller placement box of the conventional ceiling fan, and designed a heat dissipation structure that can fit the controller of the ceiling fan, thereby improving the service life of the ceiling fan. So that it won't cause its interior due to overheating Damage to the components or circuits, causing the trouble that the machine can not operate normally, and there is no danger that the electrical appliance may be fired or even explode due to the overheating of the structure of the controller box of the ceiling fan. Therefore, the present invention can produce the disadvantages of overcoming the above-mentioned prior art.

The main object of the present invention is to provide a heat dissipation structure for a ceiling fan controller placement box, which directly contacts a heat-dissipating surface such as a ceiling or a wall surface, and heats the heat through a contact surface such as a ceiling or a wall surface. Go out.

A secondary object of the present invention is to provide a heat dissipation structure for a ceiling fan controller placement box that directly contacts the suspension system with the heat conduction element to dissipate heat from the suspension system.

Another secondary object of the present invention is to provide a fixing member on the heat dissipation structure of the support frame and the placement box, and the fixing member is disposed above the placement box, and the fixing member can be fixed with the support frame to fix the placement box thereof. The heat dissipating component has more contact area on the fixture, and more heat can be conducted out through the hot contact.

In order to achieve the above-mentioned primary and secondary effects, the present invention provides a heat dissipation structure for a ceiling fan controller placement box, which includes a placement box, a circuit board, a heat dissipating component and a heat conducting component. The box has an accommodating space, and the surface of the placing box is provided with at least one heat dissipation hole communicating with the accommodating space, the circuit board has a control chip and an electronic component, and the circuit board is disposed in the accommodating space, and then The heat dissipating component is disposed on the circuit board, and the heat conducting component is disposed on the heat dissipating hole, and the heat conducting component is connected to the inner heat dissipating component, and the heat conducting component directly uses the heat conducting component to conductively place the placing box The heat of the inner heat dissipating component is radiated outwardly by direct contact with the external cryogenic object, and further utilizes a support frame, and the support frame is used to The placement box is fixed in one place, and the support frame portion is in direct contact with the heat dissipating component, and the support frame is directly contacted with the conduction mode for heat dissipation.

Furthermore, the present invention further provides a fixing member, which is provided with the fixing member disposed above the placing box, cooperates with the supporting frame, and is engaged with the supporting frame to make the placing box more stable on the supporting frame. Further, the fixing member is also an easy heat conducting device, and utilizes more contact area with the heat conducting member to more effectively conduct the thermal contact on the heat conducting member.

The invention has the advantages that the cooling fan controller can be placed to provide excellent heat dissipation.

10‧‧‧Support frame

20‧‧‧Place box

30‧‧‧ bell

310‧‧‧ accommodating slots

320‧‧‧Perforation

330‧‧‧ hanging cover

331‧‧‧ card hook

332‧‧‧Solution holes

333‧‧‧third convex

334‧‧‧ card slot

40‧‧‧ hanging pipe

50‧‧‧ hanging ball seat

60‧‧‧ hanging ball

110‧‧‧ support

111‧‧‧ card hooks

112‧‧‧second convex parts

120‧‧‧Support column

130‧‧‧Support

131‧‧‧ hanging ball slot

132‧‧‧support plate

133‧‧‧first convex piece

200‧‧‧Solution holes

210‧‧‧ box

220‧‧‧thermal element

230‧‧‧ Heat Dissipation Components

250‧‧‧ accommodating space

211‧‧‧ upper shell

2110‧‧‧ side mount

212‧‧‧ lower case

123‧‧‧ Notch structure

121‧‧‧Support

70‧‧‧Fixed parts

240‧‧‧ boards

810‧‧‧First locking hole

820‧‧‧Second locking hole

830‧‧‧ hanging ball mount

1 is a schematic exploded view of an embodiment of the present invention; a second schematic view showing a combined schematic view of an embodiment of the present invention; and a third schematic view showing a partial combined stereoscopic schematic view of the embodiment of the present invention; FIG. 4 is a partial exploded perspective view of the embodiment of the present invention; FIG. 4B is a partial exploded perspective view of the embodiment of the present invention; FIG. 5 is a schematic view of a combination of another embodiment of the present invention; FIG. 6 is a partial perspective schematic view of another embodiment of the present invention; FIG. A partial exploded perspective view of a second embodiment of the present invention; a seventh partial view of a second embodiment of the present invention; a seventh exploded view of a second embodiment of the present invention; Figure 7 is a schematic exploded view of a placement box according to another embodiment of the present invention; Figure 8A is a schematic structural view of another embodiment of the present invention; and Figure 8B is a structure of another embodiment of the present invention. Signal Two; FIG. 9 is a schematic exploded view of a further embodiment of the present invention; FIG. 11 is a schematic structural view of a further embodiment of the present invention; FIG. 11A is a schematic view showing a structural change of a further embodiment of the present invention; 11B is a structural change diagram 2 of a further embodiment of the present invention; and FIG. 11C is a schematic diagram 3 showing a structural change of a further embodiment of the present invention.

Figure 11D is a schematic cross-sectional view of the eleventh C diagram.

In order to provide a better understanding and understanding of the structural features and efficacies of the present invention, the preferred embodiments and detailed descriptions are provided as follows:

The present invention relates to a heat dissipation structure of a ceiling fan controller placement box. In the illustration of the present invention, a combination structure of a placement box 20, a circuit board 240, a heat dissipation component 230 and a heat conduction component 220 is used. The receiving box 20 has an accommodating space 250, and the top surface of the placing box 20 is provided with at least one heat dissipation hole 200 that communicates with the accommodating space 250. The vent hole 200 is disposed on two sides of the top surface of the placing box 20 or The middle surface of the top surface of the placement box is preferably provided. The circuit board 240 has a control chip and an electronic component. The circuit board 240 is disposed in the accommodating space 250, and the heat dissipation component 230 is disposed on the circuit board 240. An insulating sheet (not shown) may be disposed between the heat dissipating component 230 and the circuit board 240, and the heat conducting component 220 is disposed in the heat dissipation hole 200, and the heat conducting component 220 is contacted and connected thereto. Above the heat dissipating component 230 inside the box 20, the heat transfer element 220 directly directly radiates heat from the heat dissipating component 230 in the placement box 20 by conduction.

In addition, the placement box 20 is disposed in the support frame 10, and the support frame 10 is forced to adhere to the low temperature support along with the placement of the placement box 20. The cover 10, the ceiling or the wall surface is in contact with the heat dissipating surface, so that the heat dissipating component 230 inside the placing box 20 can be used to contact the heat conducting component 220 to conduct heat to the outside. In addition, another structure is used to support the rack 10. The heat derived from the heat dissipating component 230 in the placement box 20 is thermally conductively conducted by the thermally conductive element 220 to the low temperature support frame 10 or other contacted cryogenic articles (eg, ceiling or wall). In addition, the heat dissipating component 230 of the present invention is a heat conductive material plate which is less than heat and is easy to conduct heat, and the heat conducting component 220 can be a soft heat conductive material, such as a thermal conductive rubber, which has the characteristics of plasticity and flexibility. With its plasticity, it is in close contact with the support frame 10 or other contacted cryogenic articles.

Please refer to the first figure. In this embodiment, the overall structure of the present invention is provided as a hanging pipe 40, a bell 30, a support frame 10, a drop ball seat 50, a drop ball 60 and a placement box 20. The support frame 10, the drop ball seat 50, the drop ball 60 and the hanging pipe 40 constitute a suspension system.

Referring to the second diagram, the third (A) (B) diagram, the fourth (A) (B) diagram and the (C) diagram, the support frame 10 of the present invention is connected by the two sides of a support member 130. One side of one of the support columns 120, the other side of each of the support columns 120 is outwardly extended and bent into two support seats 110. The support member 130 is provided with a drop ball slot 131, and further, the box 20 is placed thereon. There is a lifting ball 60. The lifting ball 60 is a downward semi-circular seat. The lifting ball 60 is disposed on the hanging ball seat 50. The hanging ball seat 50 is disposed on the hanging ball seat slot 131. The receiving box 20 is disposed in the supporting column 120 of the support frame 10, and the structure is disposed in the receiving slot 310 of the bell 30. The bottom of the receiving slot 310 has a through hole 320, and a hanging tube is used. 40, the perforation 320 of the bell 30 is inserted, and the hanging tube 40 is connected to the hole at the center of the hemisphere of the lobbing ball 60 through the sling ball slot 131 and the sling ball 130, and then the sling tube 40 is used. A ceiling fan is arranged at the end (not shown).

The casing 20 is composed of an upper casing 211 and a lower casing 212. The casing 210 has a convex or rectangular structure. The casing 210 is placed on the support frame 10, and the casing 210 is disposed. A circuit board 240 is provided with a heat dissipating component 230 on the circuit board 240. The heat dissipating component 230 is a heat dissipating board body, preferably a metal plate (such as an aluminum plate, a copper plate, etc.) and in the middle of the surface of the upper case 211. At least one heat dissipation hole 200 is disposed at the position, and the heat dissipation hole 200 is connected to the accommodating space 250 of the placement box 20, and the heat conduction element 220 is disposed on the heat dissipation hole 200, and contacts the heat dissipation element 230 connected to the inside, and further At least two support members 121 are disposed on the two sides of the support columns 120. When the placement boxes 20 are disposed in the support columns 120 of the support frame 10, the support members 121 are fixedly disposed. The heat conducting element 220 on the placement box 20 is forced into tight contact with the plane.

As described above, the present invention utilizes the direct contact relationship between the heat conducting component 220 and the heat dissipating component 230. The heat on the heat dissipating component 230 transmits heat to the heat conducting component 220 through the heat conduction mode, and then passes through the heat conducting component. 220 transfers heat to the surrounding heat sink surface in direct contact.

Referring to the fifth figure, the sixth (A) (B) figure, the seventh (A) (B) figure and the (C) figure, the embodiment is mainly disposed on a plane, and the support frame 10 is supported by the support member 130. The support legs 120 are respectively connected to the two sides of the support columns 120, and the other side edges of the support columns 120 are respectively bent outwardly to extend out of the two support bases 110. The support bases 110 are fixed on the plane, and the support columns 120 are combined and supported. After the seat 110, a notch structure 123 is formed on the side of the support column 120, and a placement box 20 is disposed on the support frame 10. When the placement box 20 is disposed in the space between the two support columns 120, the The side of the placing box 20 is embedded and clipped to the notch structure 123. For example, when the box body 210 has a convex-shaped structure, the convex end of the box body 210 is placed on the support frame 10, and the casing 210 is placed. Fitting it into the notch structure 123 in the direction of the convex end The placement box 20 is supported by the notch structure 123. Moreover, the heat dissipation component 230 is disposed on the circuit board 240 of the casing 210, and a pair of heat dissipation holes 200 corresponding to the position of the heat conduction component 220 are disposed on both sides of the surface of the upper casing 211, and the heat dissipation hole 200 is provided. The heat conducting component 220 is disposed on the support post 120. The heat conducting component 220 on both sides of the mounting box 20 is partially in direct contact with the support base 110 (or the suspension system) due to the recess structure 123 on the support post 120. Therefore, heat is also dissipated by the support base 110 (or the suspension system) in contact with the external environment.

As described above, the present invention utilizes the heat conducting component 220 to connect the heat dissipating component 230. With the direct contact relationship between the heat conducting component 220 and the heat dissipating component 230, the heat on the heat dissipating component 230 transmits heat to the heat conduction through heat conduction. Above the component 220, through the thermal conductive component 220, the support frame 10 has a direct contact relationship, and the heat is dispersed, and further, the mounting box 20 is disposed in the recess structure 123, so that the support base 110 is When the box 20 is placed, the box 20 is just snapped together to be more stable. The placing box 20 is disposed on the support frame 10, and the heat conducting component 220 on the box is placed on the support frame 10 (suspended) The system is made to make a close contact, and the heat is effectively transmitted to the support frame 10 to assist the heat dissipation through the ceiling, the wall surface and the ceiling fan body.

Please refer to the eighth (A) and (B) drawings, which are another preferred embodiment of the present invention. On the above two embodiments, a fixing member 70 is further disposed, and the fixing member 70 is disposed thereon. The top of the placing box 20 is matched with the support frame 10, and the two sides of the fixing member 70 are embedded between the two supporting frames 10 to be engaged with each other, and the placing box 20 is more stably fixed on the supporting frame 10 thereof. The fixing member 70 is also a structure that is easy to conduct heat, and the fixing member 70 is provided with more contact area with the heat conducting member 220, and the thermal contact of the heat conducting member 220 can be more effectively conducted to the fixing member 70, which is more effective. Conduct heat out.

Please refer to the ninth and tenth drawings together. The difference between this embodiment and the previous embodiment lies in the hang The suspension structure of the fan does not utilize the support frame 10 to support the frame, but the suspended cover 330 and the bell 30 are used to perform the suspension function of the support frame 10, and the bottom of the bell 30 is provided with a lifting ball holder. The 830 fixed the ball 60 and then the cover 330 is locked to the ceiling. In addition, the mounting box 20 is also positioned by the support frame 10, and the support member 130 of the support frame 10 is disposed by a support plate 132, and a hook member 111 is further disposed on the support bases 110. The hook cover 330 is provided with a latching seat 331 corresponding to the latching member 111. The latching bracket 331 is an L-shaped plate member extending downward from the hanging cover 330. The latching bracket 331 forms a latching slot 334. The hook member 111 can be embedded and positioned in the card slot 334 to fix the placement box 20 in the bell 30. In a preferred embodiment, the support plate 132 is disposed on at least one side of the first protruding member 133, and the receiving frame 20 can be more stably supported and coupled to the receiving structure. In other embodiments, the lower side of the bell 30 can be directly connected to the ceiling fan without the hanging tube 40 and the drop ball 60.

As shown in FIG. 11A, the second protrusion 112 is extended inwardly on at least one side of the support base 110. When the placement box 20 is embedded in the support post 120, the second protrusion is The piece 112 is positioned to grip the placement box 20 above.

Please refer to FIG. 11B together, the hanging cover 330 is provided with a third protruding member 333 protruding downward, and the third protruding member 333 presses the placing box 20 from above, and cooperates with the supporting seat 110 The support member 130 fixes the placement box 20 within the support columns 120.

Please refer to FIG. 11C for a modification of the combination of the support frame 10 and the placing box 20, that is, a side fixing bracket 2110 is directly protruded from the side of the upper casing 211 of the placing box 20, Therefore, the placement box 20 itself can be suspended and positioned without the need of the support frame 10 (ie, the support frame 10 is omitted), and the side mount 2110 on the placement box 20 is directly used for positioning, such as As shown in FIG. 11D, the side mount 2110 can The card fitting groove 334 embedded in the hanging cover 330 can also achieve the effect of suspending and positioning the placing box 20. Furthermore, the card slot 334 can be disposed at a suitable component, including a ceiling fan. For example, when the placement box 20 is not near the ceiling, the placement box 20 is disposed below the ceiling fan (including the motor base and the ceiling fan). At this time, the card slot 334 can be disposed under the ceiling fan (motor seat or ceiling fan) for the embedded setting position of the side mount 2110 (or the hook member 111). Of course, the placement box 20 The side mount 2110 can also be locked to the ceiling fan by screws so that the heat conducting element 220 can be in contact with the ceiling fan to dissipate heat.

Further, as shown in the tenth to eleventh C, the hanging cover 330 is provided with a plurality of second locking holes 820, and the first lock corresponding to the second locking holes 820 is disposed on the hanging clock 30. The fixing hole 810 can simultaneously lock the first locking hole 810 and the second locking hole 820 by a screw (not shown), so that the hanging cover 330 is combined with the hanging clock 30.

In the foregoing embodiment, the heat dissipating component 230 and the heat conducting component 220 can be integrated, that is, the heat dissipating component 230 directly protrudes from the placing box 20 (the upper casing 211) by a heat conducting component (integrally formed/not The heat-conducting element 220 is protruded from the heat-dissipating hole 200, and the heat-conducting element 220 is also bent to provide a contact plane. In this case, the heat-dissipating hole 200 can be provided. For a slot structure or other configuration, such a structure directly extends outward from the accommodating space 250 to the outside of the heat dissipation hole 200, and the heat transfer is more uniform due to the integrated structure, and is convenient to manufacture.

Therefore, the present invention is a novelty, progressive and available for industrial use. It should be in accordance with the patent application requirements of the Chinese Patent Law. It is undoubtedly the invention patent application, and the Prayer Council will grant the patent as soon as possible. .

However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, so that the shapes, structures, features, and spirits described in the claims of the present invention are equally changed. Modifications are intended to be included in the scope of the patent application of the present invention.

30‧‧‧ bell

40‧‧‧Connecting column

110‧‧‧ support

120‧‧‧Support column

220‧‧‧thermal element

210‧‧‧ box

200‧‧‧Solution holes

310‧‧‧ accommodating slots

Claims (11)

A heat dissipation structure of a ceiling fan controller, comprising: a placing box having an accommodating space, wherein the surface of the placing box is provided with at least one heat dissipation hole communicating with the accommodating space; and a circuit board is disposed In the accommodating space, a heat dissipating component is disposed on the circuit board; a heat conducting component is disposed at the heat dissipating hole, and the heat conducting component is in contact with the heat dissipating component; and a support frame is supported and fixed The mounting box includes: a supporting member; at least two supporting columns connected to the two sides of the supporting member; and at least two supporting seats, the top edges of the supporting columns are bent and extended, and the supporting base is used for The heat-insulating component is fixed to an outer surface of the heat-dissipating component of the heat-dissipating hole, and is fixed to the heat-dissipating component of the heat-dissipating hole The placing box, the supporting bases and the heat conducting elements are in close contact with each other. The heat dissipation structure of the ceiling fan controller placement box according to claim 1, wherein the heat conduction component is a soft heat conductive material or a thermal conductive silicone. The heat dissipation structure of the ceiling fan controller according to the first aspect of the invention, wherein the heat dissipation component is integrally formed with the heat conduction component, the heat conduction component protrudes from the heat dissipation hole, and the heat dissipation hole is disposed in the placement The two sides of the top surface of the box or the top surface of the placement box. The heat dissipation structure of the ceiling fan controller according to the first aspect of the invention, wherein the side of the support frame is provided with a notch structure, the notch structure is located between the support column and the support base, and the placement is The box is embedded in the notch structure. The heat dissipation structure of the ceiling fan controller placement box according to claim 1, wherein a first protrusion is further disposed on at least one side of the support plate. The heat dissipation structure of the ceiling fan controller placement box of claim 1, wherein a second protrusion is disposed on the inner side of the support seat, and the second protrusion is used to fix the top of the placement box. The heat dissipation structure of the ceiling fan controller placement box according to the first aspect of the invention, wherein a fixing member is further disposed, the fixing member is disposed above the placement box, and two sides of the fixing member are embedded in the Two support frames. A heat dissipation structure of a ceiling fan controller, comprising: a placing box having an accommodating space, wherein the surface of the placing box is provided with at least one heat dissipation hole communicating with the accommodating space; and a circuit board is disposed In the accommodating space, a heat dissipating component is disposed on the circuit board; a heat conducting component is disposed at the heat dissipating hole, and the heat conducting component is in contact with the heat dissipating component; and a support frame is supported and fixed The support frame includes: a support member; at least two support columns connected to the two sides of the support frame; and at least two support seats, the top edges of the support columns are bent and extended, the support base a heat-insulating member that is fixed to an outer surface of the support frame, and the heat-dissipating member protruding from the heat dissipation hole is fixed with the low-temperature object to fix the heat-receiving member The cassette is placed, and the low temperature object and the heat conducting element are in close contact with each other. The heat dissipation structure of the ceiling fan controller according to the eighth aspect of the invention, wherein the heat dissipating component is integrally formed with the heat conducting component, the heat conducting component protrudes from the heat dissipation hole, and the heat dissipation hole is disposed in the placement The two sides of the top surface of the box or the top surface of the placement box. The heat dissipation structure of the ceiling fan controller placement box according to claim 8, wherein the heat conduction element is a soft heat conductive material or a thermal conductive rubber. Such as the ceiling fan controller placement box described in claim 8 The thermal structure further includes at least two support members respectively disposed on the two support columns.