AU2014350940A1

AU2014350940A1 - Heat dissipating structure for control box of ceiling fan

Info

Publication number: AU2014350940A1
Application number: AU2014350940A
Authority: AU
Inventors: Fei-Tyh Chuang
Original assignee: JAGUAR PREC INDUSTRY CO Ltd
Current assignee: JAGUAR PRECISION INDUSTRY Co Ltd
Priority date: 2013-11-12
Filing date: 2014-07-08
Publication date: 2016-06-16
Anticipated expiration: 2034-07-08
Also published as: CN104632717B; TW201518612A; AU2014350940B2; MY178643A; TWI607156B; WO2015070511A1; CN104632717A

Abstract

Provided is a heat dissipation structure of a ceiling fan controller accommodation casing, particularly the accommodation casing of a ceiling fan controller. The accommodation casing is provided with a circuit board, a heat dissipation assembly and a heat conducting assembly therein; the circuit board is disposed in the accommodation casing, and the heat dissipation assembly is disposed on the circuit board. In addition, a heat dissipation hole is provided on one side of the accommodation casing; the heat conducting assembly is disposed at the heat dissipation hole, and is connected to the heat dissipation assembly; the heat of the heat dissipation assembly is dissipated out through the ceiling fan suspension system or through the ceiling by using the heat conducting assembly via a thermal contact conduction method.

Description

HEAT DISSIPATING STRUCTURE FOR CONTROL BOX OF CEILING FAN FIELD OF THE INVENTION

The present invention relates generally to a heat dissipating structure, and particularly to a heat dissipating structure for the control box of a ceiling fan for enabling superior heat dissipation.

BACKGROUND OF THE INVENTION

Technologies advance day by day. Instead of asking for basic functionality, people are becoming demanding on the performance of all things. According to the thinking model of friendliness, people continue to research how to handle all things in lives more efficiently, frugally, and safely. Thereby, new inventions are proposed to meet the goal.

As the time progresses, the development of motor technology has become mature. Various applications in the related fields have broadened increasingly. A ceiling fan is one of the general applications. In addition, in recent years, the concepts of environmental protection of energy conservation are emphasized gradually. Various kinds of power-saving, quiet, and high-performance ceiling fans are supplied in the marketplace.

In order to enable a ceiling fan to have power-saving, quiet, and high-performance efficacies, the trend in recent years is to adopt a direct-current (DC) variable-frequency motor to drive a ceiling fan. In general, a DC variable-frequency motor is driven by a control circuit, which is used for converting the alternate-current (AC) input power to the DC output power and thus using the DC power to drive the DC variable-frequency motor. In addition, the control circuit can be further used for sensing the position of the motor rotor. Then, according to the position of the motor rotor, the switching of power can be controlled. Thereby, the control circuit is required in the application of fans.

For protecting the control circuit, the control circuit is normally disposed in a box. Besides, considering the convenience in maintenance, this box is usually disposed inside a bell-shaped part of the suspension system. Inside the box, there are multiple heat-generating electronic devices as the ceiling fan operates and thus producing massive heat. Unfortunately, the bell-shaped part is a nearly sealed structure. Due to its bad air circulation, the heat dissipation using air convection is lousy. Then the electronic devices might fail by overheating. Thereby, a structure that can facilitate heat dissipation of the device is required.

Nowadays, there are many 3C products including heat dissipating structures. For example, appliances such as computers, game consoles, refrigerators, and air conditioners need heat dissipation components. There are many ways of heat dissipation, including using a fan, water cooling, and using a heat dissipation component. It is apparent that heat dissipation plays a central role in modern appliances. Good heat dissipation not only extends the lifetime of an appliance, it also guarantees the safety of using the products. It is usually heard today that machines are damaged owing to overheating. It is also reported frequently that people are hurt by explosion of appliances caused by overheating. Accordingly, to solve the overheating problem, heat dissipation should be much improved.

According to the prior art, a control box is suspended in a bell-shaped part of a ceiling fan. The heat dissipation of the control box can only depend on ineffective heat convection. Thereby, the drawback should be improved.

Due to the existing problem as described according to the prior art, it is highly expected to have a safer and more practical structure for solving the problem.

The present invention provides a heat dissipating structure for the control box of a ceiling fan. According to the present invention, the lifetime of the ceiling fan can be extended; no internal device or circuit will be damaged due to overheating; no mechanical problem caused by overheating will occur; and no fire or even explosion danger will happen because of overheating in the control box of the ceiling fan. Accordingly, the present invention can overcome the above drawbacks according to the prior art.

SUMMARY

An objective of the present invention is to provide a heat dissipating structure for the control box of a ceiling fan, which uses a thermally conductive component to contact heat dissipating surfaces such as ceilings or walls directly for dissipating heat through the contact surfaces.

Another objective of the present invention is to provide a heat dissipating structure for the control box of a ceiling fan, which uses a thermally conductive component to contact the suspension system directly for dissipating heat through the suspension system. A further objective of the present invention is to provide a fixing member to the support frame and the control box of the heat dissipating structure. The fixing member is disposed and fixed on the control box and matched to the support frame. By increasing contact area for heat dissipation on the fixing member, more heat can be dissipated by direct contact.

In order to achieve the objectives as described above, the present invention provides a heat dissipating structure for the control box of a ceiling fan, which comprises a control box, a circuit board, a heat dissipating component, and a thermally conductive component. The control box includes an accommodating space. It also includes one or more heat dissipating hole on its surface and communicating with the accommodating space. The circuit board includes control chips and electronic devices. The circuit board is disposed in the accommodating space. Then the heat dissipating component is disposed on the circuit board. In addition, the thermally conductive component is disposed in the heat dissipating hole and connected to the internal heat dissipating component. Then the thermally conductive component conducts the heat from the heat dissipating component inside the control box outwards by contacting external low-temperature objects directly. Furthermore, a support frame is adopted. The support frame fixes the control box to one place. A portion of the structure of the support frame contacts the heat dissipating component directly. By direct conduction using the support frame, the heat is dissipated.

Moreover, the present invention further provides a fixing member disposed on the control box and matched with the support frame. By wedging the fixing member to the support frame, the control box can be further secured to the support frame. Besides, the fixing member is a thermally conductive member. By using the fixing member to increase more contact area with the thermally conductive component, the heat in the thermally conductive components can be conducted outwards more effectively.

The advantage of the present invention is achieving superior heat dissipation for the control box of a ceiling fan.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 shows an exploded view according to an embodiment of the present invention;

Figure 2 shows an assembly view according to an embodiment of the present invention;

Figure 3A shows a first partial assembly stereoscopic view according to an embodiment of the present invention;

Figure 3B shows a second partial assembly stereoscopic view according to an embodiment of the present invention;

Figure 4A shows a first partial exploded stereoscopic view according to an embodiment of the present invention;

Figure 4B shows a second partial exploded stereoscopic view according to an embodiment of the present invention;

Figure 4C shows an exploded view of the control box according an embodiment of the present invention;

Figure 5 shows an assembly view according to another embodiment of the present invention;

Figure 6A shows a first partial assembly stereoscopic view according to another embodiment of the present invention;

Figure 6B shows a second partial assembly stereoscopic view according to another embodiment of the present invention;

Figure 7A shows a first partial exploded stereoscopic view according to another embodiment of the present invention;

Figure 7B shows a second partial exploded stereoscopic view according to another embodiment of the present invention;

Figure 7C shows an exploded view of the control box according another embodiment of the present invention;

Figure 8A shows a first structural schematic diagram according to still another embodiment of the present invention;

Figure 8B shows a second structural schematic diagram according to still another embodiment of the present invention;

Figure 9 shows an exploded view according to a further embodiment of the present invention;

Figure 10 shows a structural schematic diagram according to a further embodiment of the present invention;

Figure 11A shows a structural schematic diagram of a first variation according to a further embodiment of the present invention;

Figure 1 IB shows a structural schematic diagram of a second variation according to a further embodiment of the present invention;

Figure 11C shows a structural schematic diagram of a third variation according to a further embodiment of the present invention; and

Figure 1 ID shows an assembly cross-sectional view of Figure 11C.

DETAILED DESCRIPTION

In order to make the structure and characteristics as well as the effectiveness of the present invention to be further understood and recognized, the detailed description of the present invention is provided as follows along with embodiments and accompanying figures.

The present relates to a heat dissipating structure for the control box of a ceiling fan. According to the figures of the present invention, the heat dissipating structure mainly comprises a control box 20, a circuit board 240, a heat dissipating component 230, and a thermally conductive component 220. The control box 20 includes an accommodating space 250. It also includes one or more heat dissipating hole 200 on the top surface and communicating with the accommodating space 250. Preferably, the heat dissipating hole 200 is disposed on both sides or at the central position of the top surface of the control box 20. The circuit board 240 includes control chips and electronic devices, and is disposed in the accommodating space 250. Next, the heat dissipating component 230 is disposed on the circuit board 240. Depending the requirement, an insulating sheet (not shown in the figures) can be placed between the heat dissipating component 230 and the circuit board 240. In addition, the thermally conductive component 220 is disposed in the heat dissipating hole 200. The thermally conductive component 220 contacts the heat dissipating component 230 inside the control box 20. By direct conduction, the heat from the heat dissipating component 230 inside the control box 20 can be dissipated outwards.

Furthermore, the control box 20 is disposed inside the support frame 10, which will force the thermally conductive component 220 on the control box 20 to attach closely to the low-temperature support frame 10, the ceiling, or the wall. Thereby, the heat from the heat dissipating component 230 inside the control box 20 can be conducted outwards by contacting the thermally conductive component 220. In addition, by contacting the support frame 10, the heat from the heat dissipating component 230 inside the control box 20 can be conducted to the low-temperature support frame 10 or other low-temperature objects such as the ceiling or the wall. Moreover, the heat dissipating component 230 according to the present invention is a thermally conductive plate with low specific heat and capable of conducting heat easily. The thermally conductive component 220 can be a flexible thermally conductive material such as thermally conductive silica gel. By using the plasticity and flexibility of the material, the thermally conductive component 220 can attach closely to the support frame 10 or other contacted low-temperature objects.

Please refer to Figure 1. According to the present embodiment, the overall structure according to the present invention includes a hanging tube 40, a bell-shaped part 30, a support frame 10, a hanging-ball base 50, a hanging ball 60, and a control box 20. The support frame 10, the hanging-ball base 50, the hanging ball 60, and the hanging tube 40 form a suspension system.

Please refer to Figures 2, 3A, 3B, 4A, 4B, and 4C. The support frame 10 according to the present invention comprises a support member 130 with each of both sides connected to one end of a support pillar 120, respectively. The other ends of the support pillars 120 extend and bend outwards to form two support bases 110. The support member 130 includes a hanging-ball cavity 131. In addition, the hanging ball 60 is disposed below the control box 20. The hanging ball 60 is a hemispherical base. The hanging ball 60 is disposed to the hanging-ball base 50, which is further disposed to the hanging-ball base 131. The control box 20 is wedged into the support pillars 120 of the support frame 10. Then this structure is disposed in the accommodating space 310 of the bell-shaped part 30. The accommodating space 310 includes a hole 320 at the bottom. The hanging tube 40 passes through the hole 320 of the bell-shaped part 30. After the hanging tube 40 passes through the hanging-ball cavity 131 and the hanging-ball base 130, it is connected to the hole at the center of the hemispherical surface of the hanging ball 60. Then the other end of the hanging tube 40 is connected to a ceiling fan assembly (not shown in the figures).

The control box 20 is a box 210 formed by a top case 211 and a bottom case 212. The box 210 is a structure of inverted-T or rectangular solid and disposed on the support frame 10. The circuit board 240 is disposed in the box 210. The heat dissipating component 230 is disposed on the circuit board 240 and can be a heat dissipating plate, preferably a metal plate such as an aluminum or copper plate. Besides, the one or more heat dissipating hole 200 is disposed at the central position of the surface of the top case 211 and communicating with the accommodating space of the control box 20. Then the thermally conductive component 220 is disposed in the heat dissipating hole 200 and contacts the heat dissipating component 230 therein. Furthermore, two or more supporting members 121 are disposed on the two sides of respective support pillar 120. When the control box 20 is disposed inside the support pillars 120 of the support frame 10, the supporting members 121 will fix the control box 20 and force the thermally conductive component 220 on the control box 20 to contact the plane tightly.

According to the present invention, the thermally conductive component 220 contacts the heat dissipating component 230 directly. Then the heat in the heat dissipating component 230 will be conducted to the thermally conductive component 220. Afterwards, the heat in the thermally conductive component 220 will be conducted to the surrounding heat dissipating plane by direct contact as well.

Please refer to Figures 5, 6A, 6B, 7A, 7B, and 7C. According to the present embodiment, the structure is mainly disposed on a plane. The support frame 10 is connected to the support pillars 120 via both sides of the support member 130. The other ends of the support pillars 120 are bent and extended outwards to form two support bases 110 fixed to a plane. After the two support pillars 120 are combined with the support base 110, recess structures 123 are formed on the sides of the support pillars 120. A control box 20 is disposed on the support frame 10. As the control box 20 is disposed in the space between the two support pillars 120, the sides of the control box 20 will wedge into the recess structures 123. For example, if the box 210 is an inverted-T structure, the convex direction of the box 210 is placed on the support frame 10 and wedged into the recess structure 123. Thereby, the control box 210 is wedged and fixed. Furthermore, the heat dissipating component 230 is disposed on the circuit board 240 inside the box 210. The heat dissipating holes 200 are disposed on the on both sides of the surface of the top case 211 corresponding to the thermally conductive components 220, respectively. The thermally conductive components 220 are disposed in the heat dissipating holes 200. According to the present embodiment, thanks to the recess structures 123 on the support pillars 120, when the control box 20 is wedged, the thermally conductive components 220 on both sides contact partially with the support base 110 (or the suspension system) directly. Thereby, the heat can be dissipated through the contact between the support base 110 (or the suspension system) with the ambience.

According to the present invention, the thermally conductive component 220 is connected with the heat dissipating component 230. By taking advantage of the direct contact between the thermally conductive component 220 and the heat dissipating component 230, the heat in the heat dissipating component 230 will be conducted to the thermally conductive component 220. In turn, since the thermally conductive component 220 contacts the support frame 10 directly, the heat can be conducted outwards. Furthermore, because the control box 20 is disposed in the recess structures 123, when the support base 110 will combine and confine the control box 20 and thus securing the control box 20 on the support frame 10 and forcing the thermally conductive component 220 on the control box 20 to contact the support frame 10 (or the suspension system) tightly. Hence, the heat can be conducted to the support frame 10 and then to the ceiling, wall, and the fan body for dissipating heat more effectively.

Please refer to Figures 8A and 8B, which show another preferred embodiment of the present invention. Base on the previous two embodiments, the present embodiment further includes a fixing member 70 disposed on the control box 20 and matched to the support frame 10. The two ends of the fixing member 70 is wedged into the space within the support frame 10. The control box 20 can be fixed on the support frame 10 more securely. The fixing member 70 is also a thermally conductive structure. By adding the fixing member 70, there will be more contact area with the thermally conductive component 220. Thus, the heat can be conducted from the thermally conductive component 220 to the fixing member and then outwards more effectively.

Please refer to Figures 9 and 10 together. The difference between the present embodiment and the previous one is that, the suspension structure of the ceiling fan according to the present embodiment does not include the support frame 10. Instead, a hanging lid 330 and the bell-shaped part 30 are adopted for providing the suspension function of the support frame 10. A hang-ball fixing base 830 is disposed at the bottom of the bell-shaped part 30 for fixing the hanging ball 60. Then the hanging lid 330 is screwed and fixed to the ceiling. Besides, the control box 20 is still positioned using the support frame 10. The support member 130 of the support frame 10 is disposed using a support plate 132. The support bases 110 extend upwards and include a hook member 111. A hook base 331 is disposed on the hanging lid 330 and corresponding to the hook member 111. The hook base 331 forms an L-shaped plate extending downward from the hanging lid 330 and forms a wedge cavity 334. The hook member 111 is wedged into and positioned at the wedge cavity 334 for fixing the control box 20 inside the cell-shaped part 30. According to a preferred embodiment, the support plate 132 includes a first projecting member 133 on one or more sides. By working in coordination with the recess structure 123, the control box 20 can be supported and linked more stably. According to another embodiment, the ceiling fan assembly can be connected directly below the cell-shaped part 30. No hanging tube 40 or hanging ball 60 is required.

Please refer to Figure 11A together. The support base 110 includes a second projecting member 112 extending inwards from one or more side. When the control box 20 is wedged and fixed inside the support pillars 120, the second projecting member 112 can limit and position the control box 20 above.

Please refer to Figure 11B together. The hanging lid 330 includes a third projecting member 333 protruding downwards. The third projecting member 333 presses the control box 20 from the top. By working in coordination with the support base 110 and the support member 130, the control box 20 is confined and fixed between the support pillars 120.

Please refer to Figure 11C together, which is used for illustrating a variation of the assembly of the support frame 10 and the control box 20. A side fixing base 2110 protrudes from the edge of the top case 211 of the control box 20. The support frame 10 is omitted. Instead, the side fixing base 2110 on the control box is used directly for positioning. As shown in Figure 11D, the side fixing base can be embedded into the wedge cavity 334 of the hanging lid 330. Then the efficacy of suspending and positioning the control box 20 can achieved as well. In addition, the wedge cavity 334 can be disposed at an appropriate component, including the ceiling fan assembly. For example, when the control box 20 is not close to the ceiling, the control box 20 can be disposed below the ceiling fan assembly (including the motor base and the fan). Then the wedge cavity 334 can be disposed between below the ceiling fan assembly (including the motor base and the fan), so that the side fixing base 2110 (or the hook member 111 as described above) can wedge into and position. Alternatively, the side fixing base 2110, and in turn, the control box 20, can be fastened tight to the ceiling fan assembly using screws, so that the thermally conductive component 220 can contact the ceiling fan assembly and thus dissipating heat.

Moreover, as shown in Figures 10 to 11C, the hanging lid 330 includes a plurality of second screw holes 820; the bell-shaped part 30 includes a plurality of first screw holes 810 corresponding to the plurality of second screw holes 820. The first and second screw holes 810, 820 can be screwed and fixed by screws (not shown in the figures) and thereby combining the hanging lid 330 and the bell-shaped part 30. The heat dissipating component 230 and the thermally conductive component 220 according to the previous embodiments can be integrated. In other words, the heat dissipating component 230 protrudes from the control box 20 (the top case 211) to form a thermally conductive component (integral design, not shown in the figure) instead of requiring another thermally conductive component 220. Namely, the thermally conductive component 220 protrudes from the heat dissipating hole 200 and bends to provide a contact plane. Then the heat dissipating hole 200 can be a slot or another form. This structure extends from the internal accommodating space 250 towards the outside of the heat dissipating hole 200. Thanks to the integral structure, the heat dissipation can be more uniform and the fabrication is more convenient.

Accordingly, the present invention conforms to the legal requirements owing to its novelty, nonobviousness, and utility. However, the foregoing description is only embodiments of the present invention, not used to limit the scope and range of the present invention. Those equivalent changes or modifications made according to the shape, structure, feature, or spirit described in the claims of the present invention are included in the appended claims of the present invention.

Claims

1. A heat dissipating structure for the control box of a ceiling fan, comprising: a control box, having an accommodating space, and including one or more heat dissipating hole on the surface and communicating with said accommodating space; a circuit board, disposed inside said accommodating space; a heat dissipating component, disposed on said circuit board; and a thermally conductive component, disposed in said heat dissipating hole, and contacting said heat dissipating component.

2. The heat dissipating structure for the control box of a ceiling fan of claim 1, wherein said thermally conductive component is a flexible thermally conductive material or a thermally conductive silica gel.

3. The heat dissipating structure for the control box of a ceiling fan of claim 1, wherein said heat dissipating component and said thermally conductive component are formed integrally; said thermally conductive component protrudes from said heat dissipating hole; and said heat dissipating hole is disposed on both sides or at the center of the top surface of said control box.

4. The heat dissipating structure for the control box of a ceiling fan of claim 1, and further comprises a support frame for supporting and fixing said control box, wherein said support frame includes: a support member; two or more support pillars, connected to both edges of said support member; and two or more support bases, formed by extending and bending the top ends of said support pillars.

5. The heat dissipating structure for the control box of a ceiling fan of claim 4, and further comprises a suspension system, wherein said suspension system uses said support frame to dispose a hanging-ball base; a hanging ball is fixed to said support frame using said hanging-ball base; and said hanging ball is connected to a hanging tube.

6. The heat dissipating structure for the control box of a ceiling fan of claim 4, and further comprises a suspension system, wherein said suspension system uses a hanging lid to screw and fix to the ceiling; a bell-shaped part is screwed and fixed to said hanging tube; a hanging ball is fixed to a hang-ball fixing base at the bottom of said bell-shaped part; and said hanging ball is connected to a hanging tube.

7. The heat dissipating structure for the control box of a ceiling fan of claim 5, wherein said support frame further includes a recess structure one the edge and located between said support pillar and said support base; said recess structure supports and fixes said control box for forcing said thermally conductive component to contact said suspension system; and said support pillars include one or more support members for fixing said control box on the edge.

8. The heat dissipating structure for the control box of a ceiling fan of claim 6, and further comprising a first projective member at said support member, a second projecting member on the inner side of said support base, a third projecting member on said hanging lid, and a fixing member on said control box for contacting said thermally conductive component.

9. The heat dissipating structure for the control box of a ceiling fan of claim 1, wherein one or more side fixing base is disposed at the location extending from the edge of said control box.

10. The heat dissipating structure for the control box of a ceiling fan of claim 9, wherein said control box is disposed below a ceiling fan assembly and said ceiling fan assembly includes a wedge cavity for said side fixing base to wedge into and position.