CN113764311B - 转角平台机构 - Google Patents

转角平台机构 Download PDF

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CN113764311B
CN113764311B CN202111001004.8A CN202111001004A CN113764311B CN 113764311 B CN113764311 B CN 113764311B CN 202111001004 A CN202111001004 A CN 202111001004A CN 113764311 B CN113764311 B CN 113764311B
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supporting ring
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gear
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CN113764311A (zh
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刘明坤
梁吉来
姜博
王云峰
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Dalian Jiafeng Automation Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

转角平台机构,基板上安装支撑环,支撑环孔内通过卡架上下排布安装销栓和顶出轴,卡架中部与支撑环内壁之间设有弹簧;基板上位于支撑环的外侧安装大齿轮,销栓位置与大齿轮内缘的轮齿位置匹配;基板上位于大齿轮外侧安装切换气缸,切换气缸的活塞杆连接插轴,插轴与顶出轴位置相对应;大齿轮外缘安装同步带,同步带连接驱动电机;支撑环上通过升降螺母安装升降驱动齿轮,升降螺母内部螺纹连接螺杆,压板安装于螺杆上部,升降驱动齿轮与大齿轮啮合安装。本发明将平台机构的晶圆扩膜和转角结构进行融合,仅使用一套电机同步带驱动系统即可实现晶圆扩膜与转角的功能,降低了设备生产成本,同时缩小了平台机构所占空间,使设备结构更加紧凑。

Description

转角平台机构
技术领域
本发明涉及贴片设备领域。
背景技术
平台机构是贴片机等设备上常用的机构,是晶圆的承载固定与位置转换机构。生产过程中,平台机构可实现晶圆承载、晶圆固定、晶圆位置变换、晶圆扩膜等功能。平台机构主要包含X轴运动组件、Y轴运动组件、晶圆转角驱动系统、扩膜压板驱动系统。
现有的平台机构为实现晶圆扩膜与角度旋转功能,有两套电机皮带驱动系统,分别控制晶圆扩膜与角度旋转,两套电机皮带驱动系统,所占空间较大,成本较高。
发明内容
为了克服传统平台机构驱动电机多、占用空间大、成本高等问题,本发明提供了一种转角平台机构。
本发明为实现上述目的所采用的技术方案是:转角平台机构,基板17上安装支撑环14,支撑环14沿直径方向设有孔,孔内通过卡架13上下排布安装销栓12和顶出轴15,卡架13中部与支撑环14内壁之间设有弹簧11;基板17上位于支撑环14的外侧安装大齿轮9,销栓12位置与大齿轮9内缘的轮齿位置匹配;基板17上位于大齿轮9外侧安装切换气缸2,切换气缸2的活塞杆连接插轴8,插轴8与顶出轴15位置相对应;大齿轮9外缘安装同步带3,同步带3连接驱动电机1;支撑环14上通过升降螺母20安装升降驱动齿轮10,升降螺母20内部螺纹连接螺杆21,压板6安装于螺杆21上部,升降驱动齿轮10与大齿轮9啮合安装。
所述基板17上位于支撑环14的外侧均匀分布安装四个压轮部22,压轮部22内侧配合安装上挡圈23,上挡圈23下侧安装大齿轮9,大齿轮9通过四个压轮部22安装在基板17上。
所述升降螺母20通过升降螺母轴承19安装于支撑环14上。
所述螺杆21上端连接钢圈18,压板6安装于钢圈18上部。
所述支撑环14内缘安装用于与压板6配合完成晶圆扩膜的支撑圈7。
所述支撑环14下部通过支撑环轴承16安装于基板17上。
本发明的转角平台机构,将平台机构的晶圆扩膜和转角结构进行融合,仅使用一套电机同步带驱动系统即可实现晶圆扩膜与转角的功能,降低了设备生产成本,同时缩小了平台机构所占空间,使设备结构更加紧凑。
附图说明
图1是本发明贴片机平台机构俯视结构图。
图2是本发明转角平台机构俯视结构图。
图3是本发明转角平台机构的切换机构部分俯视结构图。
图4是本发明转角平台机构的切换机构部分主视剖面结构图。
图5是本发明转角平台机构的切换机构在转角功能状态的主视剖面结构图。
图6是本发明转角平台机构的切换机构在压板升降功能状态的主视剖面结构图。
图7是本发明转角平台机构的压板升降机构部分主视剖面结构图。
图8是本发明转角平台机构的大齿轮旋转部分主视剖面结构图。
图中:1、驱动电机,2、切换气缸,3、同步带,4、Y轴驱动组件,5、X轴驱动组件,6、压板,7、支撑圈,8、插轴,9、大齿轮,10、压板升降驱动齿轮,11、弹簧,12、销栓,13、卡架,14、支撑环,15、顶出轴,16、支撑环轴承,17、基板,18、钢圈,19、升降螺母轴承,20、升降螺母,21、螺杆,22、压轮部,23、上挡圈。
具体实施方式
本发明的转角平台机构如图1-8所示,转角平台的基板分别通过X轴驱动组件5和Y轴驱动组件4实现X向和Y向运动,支撑环14下部通过支撑环轴承16安装于基板17上,支撑环14沿直径方向设有孔,孔内通过卡架13上下排布安装销栓12和顶出轴15,卡架13中部与支撑环14内壁之间设有弹簧11;基板17上位于支撑环14的外侧均匀分布安装四个压轮部22,压轮部22内侧配合安装上挡圈23,上挡圈23下侧安装大齿轮9,通过四个压轮部22将大齿轮9安装在基板17上,并且位于支撑环14的外侧,销栓12位置与大齿轮9内缘的轮齿位置匹配;基板17上位于大齿轮9外侧安装切换气缸2,切换气缸2的活塞杆连接插轴8,插轴8与顶出轴15位置相对应;大齿轮9外缘安装同步带3,同步带3连接驱动电机1;支撑环14上通过升降螺母20安装升降驱动齿轮10,升降螺母20通过升降螺母轴承19安装于支撑环14上,升降螺母20内部螺纹连接螺杆21,螺杆21上端连接钢圈18,压板6安装于钢圈18上部,支支撑环14内缘安装用于与压板6配合完成晶圆扩膜的支撑圈7,升降驱动齿轮10与大齿轮9啮合安装。
驱动电机1和同步带3是机构的驱动部分,切换气缸2是转角和扩膜功能切换的执行元件,驱动电机1驱动大齿轮9转动,切换气缸2未动作时,插轴8收回,在弹簧11力作用下,销栓12顶出,卡住大齿轮9,大齿轮9带动支撑环14共同旋转,实现晶圆转角功能。切换气缸2动作时,插轴8将顶出轴15顶出,带动销栓12与大齿轮9分离,此时插轴8位于支撑环14的孔中,将支撑环14固定,大齿轮9仅驱动压板升降驱动齿轮10,升降螺母20转动,完成压板6的升降动作,支撑圈7位置固定,压板6下降时,即为晶圆扩膜操作。
工作步骤:
(1)、晶圆放置于平台后,切换气缸2动作,插轴8将顶出轴15顶出,销栓12、卡架13和顶出轴15为硬性连接,故此时销栓12也被顶出,与大齿轮9脱离,插轴8卡在支撑环14的孔中,支撑环14与基板17的相对位置固定,无法旋转。驱动电机1通过同步带3驱动大齿轮9旋转,与大齿轮9相啮合的压板升降驱动齿轮10带动升降螺母20旋转,驱动螺杆21向下运动,实现压板6下降,支撑圈7位置固定不变,实现晶圆扩膜动作。生产结束后,若想释放晶圆,驱动电机1反向旋转即可。
(2)、生产作业时,X轴驱动组件5和Y轴驱动组件4驱动平台机构将晶圆移动到生产作业所需位置,切换气缸2动作,插轴8收回,在弹簧11的弹力作用下,卡架13带动着销栓12回到原始位置,销栓12将大齿轮9卡住固定,支撑环14相对大齿轮9无法旋转。由于插轴8已从支撑环14的孔中退出,支撑环14相对基板17可自由旋转,驱动电机1通过同步带3驱动大齿轮9即可实现支撑环14的旋转,从而改变晶圆上的芯片角度,满足生产作业对芯片拾取角度的需求。
本发明实现了单套电机同步带可切换驱动晶圆转角和晶圆扩膜两个机构。切换便捷快速,节省成本,减小平台机构所占空间。非常适合使用在贴片机等需要对晶圆进行固定、扩膜、变换位置的设备上。例如高速高精度贴片机等。

Claims (6)

1.转角平台机构,其特征在于:基板(17)上安装支撑环(14),支撑环(14)沿直径方向设有孔,孔内通过卡架(13)上下排布安装销栓(12)和顶出轴(15),卡架(13)中部与支撑环(14)内壁之间设有弹簧(11);基板(17)上位于支撑环(14)的外侧安装大齿轮(9),销栓(12)位置与大齿轮(9)内缘的轮齿位置匹配;基板(17)上位于大齿轮(9)外侧安装切换气缸(2),切换气缸(2)的活塞杆连接插轴(8),插轴(8)与顶出轴(15)位置相对应;大齿轮(9)外缘安装同步带(3),同步带(3)连接驱动电机(1);支撑环(14)上通过升降螺母(20)安装升降驱动齿轮(10),升降螺母(20)内部螺纹连接螺杆(21),压板(6)安装于螺杆(21)上部,升降驱动齿轮(10)与大齿轮(9)啮合安装。
2.根据权利要求1所述的转角平台机构,其特征在于:所述基板(17)上位于支撑环(14)的外侧均匀分布安装四个压轮部(22),压轮部(22)内侧配合安装上挡圈(23),上挡圈(23)下侧安装大齿轮(9),大齿轮(9)通过四个压轮部(22)安装在基板(17)上。
3.根据权利要求1所述的转角平台机构,其特征在于:所述升降螺母(20)通过升降螺母轴承(19)安装于支撑环(14)上。
4.根据权利要求1所述的转角平台机构,其特征在于:所述螺杆(21)上端连接钢圈(18),压板(6)安装于钢圈(18)上部。
5.根据权利要求1所述的转角平台机构,其特征在于:所述支撑环(14)内缘安装用于与压板(6)配合完成晶圆扩膜的支撑圈(7)。
6.根据权利要求1所述的转角平台机构,其特征在于:所述支撑环(14)下部通过支撑环轴承(16)安装于基板(17)上。
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