M264646 八、新型說明： 【新型所屬之技術領域】 -種晶狀位與挾持工作台及其晶圓承载裝置，尤指 種應用於-晶圓之晶粒的擴張分離與該晶圓的角度旋 轉之晶圓定位與挾持工作台及其晶圓承載裝置。· 【先前技術】 、、:ί：所周知’半導體兀件在電子化的機具設備中扮演著 核=般的要角，已成為我國產業與經濟發展的重點項目， =其』目關的製程設備動定其生產的品質以及順暢與 ，曰。’ m張分離—晶圓之晶粒與定位該晶圓之角 晶圓工作台是黏晶機、覆晶機或整狀備等構裝設備 體產業發展的主要曰曰圓的規格應用則為目前半導 _ 的ί圓工作台’為8吋晶圓工作台，其係利用- != 齒輪機構，以對一"晶圓作角度的定 圓及一飼服馬達帶動一皮帶和螺桿，以對該晶 圓及其阳粒作升降與擴張分離的動作。 12吋1 Π 8吋晶圓工作台，若直接將其擴大應用為 8时曰ΘΘΛ 士 ，、由於12呼晶圓所需的行程與架構均較 為汽曰^ 將導致其整體重量大幅增加與佔用空間更 =以滿足製程環境的要求，且由於12时晶圓的 難以達到= 二下4的情形與承載剛性不足等問題， 掰乂硬則生產的品質需求以及順暢性。 用上可知’上述f知的晶圓工作台，在實際使 用上顯然具有不便與缺失存在，而有待加以改善。 M264646 緣是，本創作人有感上述缺失 究並配合學理之運用，終於提出—種^乃特潛心研 上述缺失之本創作。 11又汁σ理且有效改善 【新型内容】 〔創作目的〕 . 本創作之主要目的，在於提供一曰〜 作台及其晶圓承载裝置，栋苴曰日F疋位與挾持工 並能使該晶圓作水^ 張分離—晶圓之晶粒’ 角度，並配勒定位該等晶粒的方位於任意 需求，= =運動’以支援該等晶粒的後續製程 其佔用空間，以應用於尺寸較大的晶圓整體重里、和減小 〔創作特徵〕 為了達成上述目的，本創作主要係 位與挾持工作台及苴曰圓壯種日日0疋 作台包括-ΪΓ 該晶81定位與挟持工 载裝置台：晶圓承载裝置，^ 動模組以及一!二：擴張驅動模組、一角度定位驅 該平面定位平張裝置，該接合模板固定於 上； 口，遠擴張驅動模組固定於該接合模板 曰阊二r驅動模組固定於該接合模板上；以及該 :張/置包括-晶圓挾持單元和-迴轉與升 轉與升二曰圓/持早疋設於該迴轉與升降單元上’該迴 -迴轉於該接合模板上，該迴轉與升降單元包括 組驅動一升降齒輪組件；其中該擴張驅動模 動作；輪組件’進而帶動該晶圓挟持單元作升降 J 又定位驅動模組驅動該迴轉齒輪組件，進而帶 M264646 動該晶圓挾持單元作迴轉動作。 勒今：：忒擴張驅動模組和該角度定位驅動模組分別m =!降：輪組件和該迴轉齒輪組件，並進而帶動該晶圓 」曰：：曰升降動作和迴轉動作，使該晶圓挾持單元内的 轉^定被擴張分離’並能使該晶圓作水平迴 位平二的平粒的方位於任意角度，並配合該平面定 其承载剛性、減輕其整體重量 佔用工間，以應用於尺寸較大的晶圓。 另’該迴轉與升降單元包括 導τ頂端和該導螺桿的頂端抵接於 轉齒輪組件包括一固定環、一第一二 齒輪構件為圓環狀結構且設有外輪齒;、-端輪緣配合於該固㈣的 μ =動輪的- 輪軸固接於該第一齒輪構件，該角度亥= 動輪的另-端 第一齒輪構件的外輪齒。 驅動模組驅動該 另σ亥迴轉齒輪組件包括~固定環、筮 件、一第二齒輪構件和一第二 t衣一弟一齒輪構 ，反上，該第一卿牛為圓 環固定於該 齒’该弟二齒輪構件為圓環狀結構且:上且叹有外輪 滾動輪的-端輪緣配合於該固定枣：二外輪齒’該第二 輪構件的内環緣，該第二滾動輪的另緣和該第二齒 -齒輪構件，該擴張驅動模^輪軸固接於該第 齒。 亥弟二齒輪構件的外_ M264646 另，該升降齒輪組件包括一第 輪構件、—第三 u輪構件、—第二齒 桿，該第二音二軸承組件、-心軸和-導螺 件設有外輪：二亥第:::和内輪齒’該第三齒輪構 心軸的-端固定於該第三齒：：=-齒輪構件，該 接於該軸承組件内且設有内虫;紋，該内導的，-端樞 該心轴的内螺紋，該㈣桿的另螺接ί 1亥擴r動模組驅動該第二齒輪構件的外 :; 挾持早 另，该迴轉與升降單元包括一導引組 包括一線性導引套環和—導生 ^引組件 該第一齒於播彼仵及線性導引套環固定於 内該Μ桿的—端滑設於該線性導引套環 【實施方式/ 1抵接於該晶圓挾持單元。 術手步=創作為達成預定目的所採取之技 圖，相偉本創作Λ 下有關本創作之詳細說明與附 且具體之瞭解，然而所:了由此件冰入 用來對本創作加以限制式料供參考與說明用，並非 〔詳細說明〕 ρΐΐΓ第―®所示’本創作係—種晶岐位與挾持工 平：定位=載裝置’該晶圓定位與挾持工作台包括-千疋位千口1以及—晶圓承載裝置2，其中： f置1Τ疋位：台1 ’如第二圖所示，其包括-第-驅動 衣置11、—弟二驅動裝置12,-第-直線運動機構丄 M264646 ^和一第二直線運動機構丄4。該第一驅動裝置i丄可為 二伺服馬達，用以驅動該第—直線運動機構i 3。該第: =動農置1 2可為-伺服馬達’用以驅動該第二直線運動 機構1 4。該第一直線運動機構i 3的行進軌跡和該第二 直線運動機構1 4的行進軌跡相垂直，以構成-Χ γ方^ 的平面進給機構。 ° —晶圓承載裝置2，如第三圖和第四圖所示，其包括一 接合模板3、-擴張驅動模組4、—角度定位驅動模組5 以及一晶圓定位與擴張裝置6，其中： 接合核板3，如第二圖所示，其固定於該平面定位平 台1的第二直線運動機構i 4上，並藉由該第二驅動裂置 1 2驅動該第二直線運動機構丄4以帶動該接合模板3 作直線運動。 擴張驅動模組4，其固定於該接合模板3上。如第五 ^戶 斤示’並配合參閱第四圖所示，本實施例中，該擴張驅 動模組4包括-飼服馬達4 〇、—第一斜齒輪4工、一第 二斜齒輪4 2和-驅動齒輪4 3。該伺服馬達4 〇的一驅 動轴固接於該第一斜齒輪41，該第二斜齒輪42固接於 该驅動齒輪4 3，該第-斜齒輪4 2喷合於該第二斜會輪 4 2。該等斜齒輪亦可為媧輪等形式。 角度定位驅動模組5，其固定於該接合模板3上。本 實施例中，該角度定位驅動模組5如同該擴張驅動模組 4，亦即對應第五圖所示，並配合參閱第四圖所示，該角 度定位驅動模組5包括馬達5 Q、—第—斜齒輪5 1、-第二斜齒輪5 2和-驅動齒輪53，該舰馬達5 M264646 〇的-驅動軸固接於該第一斜齒輪5 2固接於該驅動齒輪5 3，該第 斜齒輪5 二斜f輪5 2。”斜絲亦可為蝸^彡1/合於該第 晶圓定位與擴張裝置6，如二 圓挾持單元7和一迴轉與升不其包括一晶 設於該迴轉與升降單元8、上=㈤該晶’持單元7 降單元8設於該接合模板3上，^；=示，該迴轉與升 度定位驅動模組5位於今、〇絲：擴張動模組4和該角 與升降單元8的周邊。 構，該晶圓挾持單元7内形成 間裒狀結 =係用以插取和固定—晶圓環9於=〇二= 内设有-晶圓（圖略）及贴附㈣ 内°亥曰曰 該晶圓係由複數晶粒所組成。如第：；所;膠：二:略)， 模組4用以帶動該晶圓挾持單 輯分離該等晶粒。該角度定位驅動二且動 晶0挾持单元7作迴轉動作，以調讀忒 合該平面定位平A ]的遥氣日w的角度，亚配 當的取出=運動，使該等晶粒能夠依序達到適 請參閱第八圖至第+二圖的-包括-迴轉納且二 Γ迴轉與升降單元8 桿82和—導引桿83。如第十導螺 V螺柃8 2的頂端和該導引桿8 3 ° 挾持單元7。 Μ料抵接於該晶圓 如第八圖和第九圖所示’該迴轉齒 固定環8〇1、-第-歯輪構件…和-Π::; 10 M264646 該固定環801固定於該接合模板3上 8 〇1的外環緣為凸出的v字型。 疋 為圓環狀結構且設有外輪齒，該第 緣，該第一滾動鈐8 η qp /口疋王衣8 〇 1的外環 構件8 0 2^輪轴固接於該第一齒輪 m 第一齒輪構件802與該固定環801 ::=，運動。請配合參閱第三圖和第= 幹电件驅純組5的轉齒輪5 3驅動該迴轉齒 ，組件80之第—齒輪構件8〇= 晶圓挾持單元7作迴轉動作。 卜^進而讀该 一第如ί二】：f十圖所示’該迴轉齒輪組件8 0並包括 輪和—第二滾動輪8 0 5。該第二齒 二。7 4為圓％狀結構且具有齒輪部8 0 6和導引M264646 8. Description of the new type: [Technical field to which the new type belongs]-Seed crystal position and holding table and its wafer supporting device, especially for the expansion and separation of the crystal grain of the wafer and the angular rotation of the wafer Wafer positioning and holding table and its wafer carrying device. · [Prior technology], :: The well-known 'semiconductor element plays a core role in electronic equipment and equipment, and has become a key project for China's industrial and economic development. The equipment determines the quality and smoothness of its production, said. 'm-sheet separation—the die of the wafer and the positioning of the corner of the wafer. The wafer table is the main equipment for the development of industrial equipment such as die-bonding machines, flip-chip machines or rectification equipment. At present, the semi-conductor's round table is an 8-inch wafer table, which uses-! = Gear mechanism to make a circle with a wafer angle and a feeding motor to drive a belt and screw. Lifting and expanding and separating the wafer and its cations. 12 inch 1 Π 8 inch wafer table, if it is directly extended to 8 o'clock ΘΘΛ person, because the stroke and structure required for the 12-call wafer are relatively high ^ will lead to a substantial increase in its overall weight and occupation Space is more = to meet the requirements of the process environment, and due to the difficulty of reaching the wafer at 12 o'clock = the situation of two under four and the lack of rigidity in carrying, etc., the harder is the quality requirements and smoothness of production. It can be seen from the above that the wafer table known above f has obvious inconveniences and defects in practical use, and needs to be improved. The reason for this is that the author felt the above-mentioned shortcomings and cooperated with the application of theories, and finally came up with a kind of special research on the above-mentioned missing works. 11 Reasonable and effective improvement [New content] [Creation purpose]. The main purpose of this creation is to provide a production platform and its wafer carrying device. The wafer is separated by water-the wafer's angle of the wafer, and the orientation of the wafers is located at any demand, = = movement 'to support the subsequent processes of these wafers and their footprints for application Focusing on the larger wafer as a whole, and reducing it [Creation characteristics] In order to achieve the above purpose, the main system of this creation is the holding platform and the round and round seeding platform. The working platform includes -ΪΓ The crystal 81 positioning And holding work platform: wafer carrier, ^ moving module and one! Two: expansion drive module, an angle positioning drive the plane positioning and flattening device, the joint template is fixed on the top; The group is fixed on the bonding template, and the two r driving modules are fixed on the bonding template; and the: Zhang / set includes-wafer holding unit and-rotation and lifting rotation and lifting two round / holding early set on the On the swing and lift unit On the joining template, the rotary and lifting unit includes a group driving a lifting gear assembly; wherein the expansion driving mold moves; the wheel assembly further drives the wafer holding unit for lifting; and the positioning driving module drives the rotary gear assembly, and further M264646 rotates the wafer holding unit. Lejin :: 忒 Expansion drive module and the angular positioning drive module m =! Drop: wheel assembly and the rotary gear assembly, and then drive the wafer "said: said lifting and rotating action, so that the crystal The rotation of the round holding unit is expanded and separated, and the wafer can be placed horizontally and flat, and the square of the flat particles is located at an arbitrary angle, and cooperate with the plane to determine its bearing rigidity and reduce its overall weight. To apply to larger wafers. In addition, the slewing and lifting unit includes a leading end of the guide τ and a leading end of the lead screw abutting the rotating gear assembly including a fixed ring, a first two gear member having a ring-shaped structure and provided with outer gear teeth;-end flange The μ = fitted to the fixed wheel is fixed to the first gear member, and the angle is equal to the outer gear teeth of the first gear member at the other end of the movable wheel. The driving module drives the other sigma slewing gear assembly including a fixed ring, a piece, a second gear member, and a second gear and a gear mechanism. On the contrary, the first cow is fixed to the ring as a ring. The teeth of the second gear member is a ring-shaped structure and the upper end flange of the outer wheel rolling wheel is matched with the fixed date: the second outer gear tooth is the inner ring edge of the second wheel member, and the second rolling The other edge of the wheel and the second tooth-gear member are fixed to the first tooth by the expansion driving mold wheel shaft. The outer part of the Haidi second gear member _ M264646 In addition, the lifting gear assembly includes a first wheel member, a third u-wheel member, a second rack bar, the second tone two bearing assembly, a mandrel and a guide screw. Equipped with an outer wheel: two Haitian ::: and inner gear teeth-the-end of the third gear structure mandrel is fixed to the third gear: =-gear member, which is connected to the bearing assembly and is provided with an inner worm; The inner thread of the inner guide, -end pivots the internal thread of the mandrel, and the other screw of the stern rod is connected to the outside of the second gear member to drive the outside of the second gear member; The unit includes a guide group including a linear guide collar and a guide guide assembly, the first tooth of the guide pin and the linear guide collar are fixed to the inner end of the M rod, and the end is slid on the linear guide. The collar [Embodiment / 1] abuts on the wafer holding unit. Skilled hand step = the technique used by the creation to achieve the intended purpose. The detailed description and attached and specific understanding of this creation under Xiangwei's creation, but this: I used this piece of ice to limit the creation of this creation. The materials are for reference and explanation, but not [detailed explanation] ρΐΐΓ shown in the ―Production Department-Seed Crystal Position and Support Level: Positioning = Carrier Device 'This wafer positioning and support workbench includes-疋 位 千Port 1 and wafer carrier device 2, where: f is set to 1 bit position: platform 1 'as shown in the second figure, which includes-the first drive device 11, the second drive device 12, and the second linear motion Mechanism 丄 M264646 ^ and a second linear motion mechanism 丄 4. The first driving device i 丄 may be two servo motors for driving the first linear motion mechanism i 3. The first: = moving agricultural unit 1 2 may be a -servo motor 'for driving the second linear motion mechanism 1 4. The traveling trajectory of the first linear motion mechanism i 3 and the traveling trajectory of the second linear motion mechanism 14 are perpendicular to each other to form a plane feeding mechanism of − × γ square ^. ° —wafer carrier device 2, as shown in the third and fourth figures, which includes a bonding template 3, an expansion drive module 4, an angular positioning drive module 5, and a wafer positioning and expansion device 6, Wherein: the core plate 3 is engaged, as shown in the second figure, it is fixed on the second linear motion mechanism i 4 of the planar positioning platform 1, and the second linear motion mechanism is driven by the second driving split 1 2丄 4 drives the engaging template 3 to move linearly. The expansion driving module 4 is fixed on the joint template 3. As shown in the fifth figure with reference to the fourth figure, in this embodiment, the expansion driving module 4 includes a feeding motor 4 and a first helical gear 4 and a second helical gear 4 2 和 -driving gear 4 3. A driving shaft of the servo motor 40 is fixed to the first helical gear 41, the second helical gear 42 is fixed to the driving gear 43, and the first helical gear 42 is sprayed to the second helical gear 4 2. These helical gears can also be in the form of a caster. The angular positioning driving module 5 is fixed on the joint template 3. In this embodiment, the angular positioning driving module 5 is the same as the extended driving module 4, that is, corresponding to the fifth figure, and with reference to the fourth figure, the angular positioning driving module 5 includes a motor 5 Q, —The first helical gear 51, the second helical gear 52, and the drive gear 53, the drive shaft of the ship motor 5 M264646 is fixed to the first helical gear 5 2 is fixed to the drive gear 53, The first helical gear 5 and two helical f wheels 5 2. The oblique wire can also be a snail ^ 1 / combined with the first wafer positioning and expansion device 6, such as a two-circle holding unit 7 and a rotary and lifting device including a crystal provided on the rotary and lifting unit 8, upper =晶 The crystal 'holding unit 7 and the lowering unit 8 are arranged on the joint template 3, ^; =, the rotation and lift positioning driving module 5 is located at the current and the 0th wire: the expansion moving module 4 and the angle and lifting unit The periphery of the structure is formed in the wafer holding unit 7 to form an interstitial junction = for insertion and fixation—the wafer ring 9 is provided with a wafer (not shown in the figure) and attaching the wafer. The wafer is composed of a plurality of grains. As described in the following paragraphs: ;;; glue: two: omitted), the module 4 is used to drive the wafer to hold the wafers to separate the grains. The angular positioning Drive two and move the crystal 0 holding unit 7 to perform a turning motion to read the angle of the distant air w combined with the plane positioning plane A], and take out the subordinate == movement, so that these grains can sequentially reach the appropriate Please refer to the eighth to the second + two diagrams of-including-slewing and two Γ slewing and lifting unit 8 rod 82 and-guide rod 83. For example, the top of the tenth guide screw V screw 8 2 and the guide rod 8 3 ° holding unit 7. The material abuts on the wafer as shown in the eighth and ninth figures. 'The rotating tooth fixing ring 801,-the -th wheel member ... and -Π ::; 10 M264646 该The fixing ring 801 is fixed on the joint template 3 and the outer edge of the 〇1 is a convex V shape. 疋 is a ring-shaped structure and is provided with outer gear teeth. The first edge and the first rolling 钤 8 η qp /口 疋 王 衣 8 〇1 outer ring member 8 0 2 ^ axle fixed to the first gear m first gear member 802 and the fixed ring 801 :: =, please refer to the third figure and the third = The rotating gear 5 3 of the pure electric component driving pure group 5 drives the turning gear, and the first gear member 80 of the assembly 80 = the wafer holding unit 7 performs a turning action. Further reading the first one is as follows: f ten As shown in the figure, the rotary gear assembly 80 includes a wheel and a second rolling wheel 805. The second tooth 2. 74 is a circular-shaped structure and has a gear portion 806 and a guide.
第=該《導引部8 0 7的内環緣為凸出的v字型I 誃®定户Q η, \輪緣壬内凹的ν字型且配合於 Α绫‘1的外裱緣和該第二齒輪構件8 〇 4的内 ‘構二π;滾：輪8 ◦ 5的另一端輪軸固接於該第-齒 ^ 8 0 4 - ’隹第—歯輪構件8 〇 2與該第二齒輪構 件8 0 4传以進行相對迴轉運動。 第十一圖和第十二圖所示，該升降齒輪組件8 1包 括:亥弟-齒輪構件8 0 2、該第二齒輪構件8〇4、= V、一軸承組件812、-心轴8 13和 干82。如上所述，該第二齒輪構件8 0 4且有齒 輪4 8 0 6和導引部8 〇 7，該齒輪部8 古 和内輪齒。該第三齒輪構件8 口又 兩回 傳1干《 1投有外輪齒，該第三齒 M264646 1 1的外輪齒妨於該第二齒輪構件8 〇 ^^ 組件812包括—轴承814和-軸承座 ，該軸承814設於該軸承座815内，該軸承座 二定ί該第—齒輪構件8Q2。該心軸813的- :把：：亥弟二齒輪構件8 1 1内’該心軸8 1 3的另- ===承組件8 1 2的軸承8 1 4内且設有内螺 8 2的底端螺接於該心軸8 1 3的内螺紋， 2的頂端抵接於該晶圓挾持單元7。請配合參 3第四圖所示’該擴張驅動模組4的驅動齒輪4 二;:= 且件81之第二齒輪構件804的外 輪回進而f動该晶圓挾持單元7作升降動作。 =第十二圖和第十三圖所示，該迴轉與升降單元8包 導肢件δ4包括該第—齒輪構件 導引n線性¥引套㈣4 1和該導引桿8 3。該線性 :弓丨=841固定於該第一齒輪構件8〇2，該導引桿 $ 3的底端滑設於該線性導引套環8 4 i内，該導引桿8 L L 端抵接於該晶圓挾持單元7,使該晶圓挾持單元7 的升降動作獲得穩定的升降導引。 將設有晶圓的晶圓環9插置定位於晶圓挾持單元7 0後’擴張驅動模組4的驅動齒輪43驅動 ^ 單=的第二齒輪構件8〇4，第二齒輪構件 才 LL 802相對迴轉，並帶動第三齒輪 動導㈣^使心轴8 1 3依轴承組件8 1 2的導引以驅 =Μ干8 2 ’從而使晶圓挾持單元7作升降動作，進而 •'貼附於晶圓的膠膜並分離晶圓的晶粒。 12 M264646 位驅動模組5的驅動齒輪5 =輪構件8 0 2，第—齒輪構件8轉〇二= 相’並帶動晶圓挾持單元7作 垂直於平面定位平台1之Z軸為軸心的360 :: 轉運動。此外，本創柞曰同A / t υ度方疋 覺與電矜糸姑东斗Μ日日0疋與挾持工作台可搭配一視 機構13和第：直：:：：定位平台1之第-直線運動 / Β 〇矛弟一直線運動機構1 4的進給運動，以依痒定 位a曰圓之晶粒的取出位置。 角声=乍t圓定位與挾持工作台之擴張驅動模組4和 =:==:與升降單元8的周邊，迴轉 (圖略）用財m 1㈣置—頂針裝置 更為充分精巧。片的取出’使整體的空間運用 〔創作特點及優點〕 承載ίΠ過有定位與挟持工作台及其晶圓 該升降絲纟1分別驅動 44 - - ^ ^ 得輪、、且件，亚進而帶動該晶圓挾 曰升降動作和迴轉動作，使該晶圓挾持單元内的-晶粒能夠被擴張分離，並能使該晶圓作 的方位於360度内的任意角度，並配合該 =位平σ的平面進給運動，以支援該等晶粒的後續製 、：t用ίΓ提昇其承载剛性、減輕其整體重量、和減 ，、佔用空間，以應用於尺寸較大的晶圓。 2、該第-齒輪構件與該固定環進行相對迴轉運動， 13 M264646 該第-齒輪構件與㈣二齒輪構件進行相 迴轉與升降單元的導螺桿和㈣样分别轉運動，f 圓挾持單元作升降動作，並配合該平面定==曰曰 使該晶圓之晶粒能狗依序達到適當的取出位置運動’ a綜上所述，本創作完全符合新型專利宇請之 妨 爰依專利法提出申請，請詳查並請早日惠、准 便，以保障創作者之權益，若釣局之貴審 == 的稽疑，請不吝來函指示。 —妥貝有任何 ，，以上所述，僅為本創作之具體實施例之詳細說明 J式’亚非用以限制本創作及本創作之特徵，舉凡所屬 技術領域中具有通常知識者’沿依本創作之精神所做的等 效修飾或變化’皆應包含於本創作之專·圍中。 【圖式簡單說明】 第一圖係本創作晶圓定位與挾持工作台之立體圖。 第一圖係本創作平面定位平台和接合模板之立體圖。 第一圖係本創作晶圓承載裝置之立體圖。 第四圖係本創作晶圓承載裝置之俯視圖。 第五圖係本創作擴張驅動模組之立體圖。 第六圖係本創作晶圓定位與擴張裝置之立體圖。 第七圖係本創作晶圓挾持單元之立體圖。 第八圖係本創作迴轉與升降單元之俯視圖。 第九圖係第八圖之9 — 9剖面示意圖。 第十圖係第八圖之1〇-10剖面示意圖。 第十圖係本創作晶圓定位與擴張裝置之俯視圖。 14 M264646 2剖面示意圖。 3剖面示意圖。 第二驅動裝置 1 第二直線運動機構1 第十二圖係第十一圖之1 2 — 1 第十三圖係第十一圖之1 3 — 1 【主要元件符號說明】 〔本創作〕 平面定位平台 1 第一驅動裝置 11 第一直線運動機構1 3 4 晶圓承載裝置 2 接合模板 3 擴張驅動模組 4 伺服馬達 4 0 第一斜齒輪 4 1 第二斜齒輪 4 2 驅動齒輪 4 3 角度定位驅動模組 5 伺服馬達 5 0 第一斜齒輪 5 1 第二斜齒輪 5 2 驅動齒輪 5 3 晶圓定位與擴張裝置 6 晶圓挾持單元 7 插置空間 7 0 迴轉與升降單元 8 迴轉齒輪組件 8 0 固定環 8 0 1 第一齒輪構件 第二齒輪構件 齒輪部 8 0 2 8 0 4 8 0 6 第一滾動輪 第二滾動輪 導引部 8 0 3 8 0 5 8 0 7 15 M264646 升降齒輪組件 8 1 第三齒輪構件 8 11 軸承組件 8 1 2 心轴 8 13 軸承 8 1 4 軸承座 8 1 5 導螺桿 8 2 導引桿 8 3 . 導引組件 8 4 線性導引套環 8 4 1 晶圓環 9 16No. = The inner ring edge of the guide 8 0 7 is a convex V-shaped I 誃 ® fixed household Q η, \ The flange is concave ν-shaped and fits the outer mounting edge of Α 绫 '1 And the inner gear of the second gear member 8 〇 4; the roller: the wheel 8 ◦ 5 the other end of the axle is fixed to the -tooth ^ 8 0 4-'隹 第 — 歯 wheel member 8 〇2 and the The second gear member 8 0 4 transmits a relative turning motion. As shown in the eleventh and twelfth figures, the lifting gear assembly 8 1 includes: Haidi-gear member 8 0 2, the second gear member 804, = V, a bearing assembly 812, -mandrel 8 13 and stem 82. As described above, the second gear member 804 has a gear 4 806 and a guide portion 807, and the gear portion 8 and the inner gear teeth. The third gear member 8 has two transmissions of 1 dry transmission, and the outer gear teeth of the third gear M264646 1 can be used in the second gear member 8. The assembly 812 includes -bearing 814 and -bearing. The bearing 814 is provided in the bearing seat 815, and the bearing seat defines the first-gear member 8Q2. The mandrel 813-: handle :: Heidi second gear member 8 1 1 'The other of the mandrel 8 1 3-=== bearing assembly 8 1 2 in the bearing 8 1 4 and is provided with an internal screw 8 2 The bottom end is screwed to the internal thread of the mandrel 8 1 3, and the top end of 2 is abutted to the wafer holding unit 7. Please cooperate with the driving gear 4 2 of the expansion driving module 4 shown in the third figure in reference 3;: = and the outer gear of the second gear member 804 of the member 81 is rotated to further move the wafer holding unit 7 for lifting. = As shown in the twelfth and thirteenth drawings, the rotation and lifting unit 8 includes a guide member δ4 including the first gear member guide n linear ¥ guide sleeve ㈣ 41 and the guide rod 83. The linear: bow 841 is fixed to the first gear member 802, the bottom end of the guide rod $ 3 is slid in the linear guide collar 8 4 i, and the end of the guide rod 8 abuts In the wafer holding unit 7, the lifting operation of the wafer holding unit 7 can obtain stable lifting guidance. The wafer ring 9 provided with the wafer is inserted and positioned at the wafer holding unit 70, and the driving gear 43 of the expansion driving module 4 is driven. The second gear member 804 is only the second gear member LL. 802 relatively rotates, and drives the third gear to move the guide ^ to make the mandrel 8 1 3 drive according to the guide of the bearing assembly 8 1 2 = M dry 8 2 ', so that the wafer holding unit 7 performs a lifting action, and then •' Attach the adhesive film to the wafer and separate the die of the wafer. 12 M264646 driving gear 5 of the driving module 5 = wheel member 8 02, the first gear member 8 turns 02 = phase 'and drives the wafer holding unit 7 to be perpendicular to the Z axis of the planar positioning platform 1 as the axis 360 :: Turn movement. In addition, this innovation is the same as A / t 度 疋 疋 与 疋 疋 矜 糸 东 矜 糸 矜 糸 斗 斗 斗 斗 斗 疋 疋 疋 疋 疋 疋 挟 挟 挟 挟 挟 挟 挟 挟 挟 挟 挟 挟 挟 挟 挟 挟 机构 机构 机构 机构 机构 挟 机构 13 13 13 和 和 13: -Straight line motion / Β〇 The linear motion mechanism 14 feeds the movement of the spear to position the a-round crystal grain removal position according to the itch. Angular sound = round positioning and holding of the expansion drive module 4 of the worktable and =: ==: and the periphery of the lifting unit 8, the rotation (illustration omitted) is used to set up the thimble-the thimble device is more fully sophisticated. Take-out of the film 'makes the overall space use [creating features and advantages] carrying the positioning and holding worktable and its wafers. The lifting wire 1 drives 44--^ ^ to get the wheel, and pieces, which in turn drives The wafer moves up and down, so that the-crystal grains in the wafer holding unit can be expanded and separated, and the square of the wafer can be positioned at any angle within 360 degrees, and cooperate with the = level The plane feed motion of σ to support the subsequent production of these grains: t uses ΓΓ to increase its load-bearing rigidity, reduce its overall weight, and reduce space, taking up space for application to larger-sized wafers. 2. The first gear member and the fixed ring perform relative rotary motion. 13 M264646 The first gear member and second gear member perform phase rotation and the lead screw of the lifting unit and the sample rotation movement respectively, and the f-circle holding unit is used for lifting. Action, and coordinate with the plane to set == said that the die of the wafer can be sequentially moved to the appropriate take-out position 'a. In summary, this creation is fully in line with the new patent. Application, please check in detail and ask for benefits and convenience as soon as possible in order to protect the rights and interests of the creators. —Tupai has any, and the above is only a detailed description of the specific embodiment of this creation. J-style 'Asia-Africa is used to limit this creation and the characteristics of this creation. For example, those who have ordinary knowledge in the technical field belong to it. The equivalent modifications or changes made by the spirit of this creation should be included in the special field of this creation. [Brief description of the drawing] The first drawing is a perspective view of the wafer positioning and holding workbench of the original creation. The first figure is a perspective view of the original plane positioning platform and the joint template. The first figure is a perspective view of the original wafer carrier. The fourth figure is a top view of the original wafer carrier. The fifth picture is a perspective view of the expansion driving module of this creation. The sixth figure is a perspective view of the original wafer positioning and expansion device. The seventh figure is a perspective view of the wafer holding unit of the original creation. The eighth figure is a top view of the creative turning and lifting unit. The ninth figure is a schematic cross-sectional view taken from 9 to 9 of the eighth figure. The tenth figure is a schematic cross-sectional view taken along the line 10-10 of the eighth figure. The tenth figure is a top view of the original wafer positioning and expansion device. 14 M264646 2 Schematic cross section. 3 cross-section diagram. The second driving device 1 The second linear motion mechanism 1 The twelfth figure is the eleventh figure 1 2 — 1 The thirteenth figure is the eleventh figure 1 3 — 1 [Description of the main component symbols] [This creation] Plane Positioning platform 1 First drive device 11 First linear motion mechanism 1 3 4 Wafer carrier device 2 Joint template 3 Expansion drive module 4 Servo motor 4 0 First helical gear 4 1 Second helical gear 4 2 Drive gear 4 3 Angle positioning Drive module 5 Servo motor 5 0 First helical gear 5 1 Second helical gear 5 2 Drive gear 5 3 Wafer positioning and expansion device 6 Wafer holding unit 7 Insertion space 7 0 Swivel and lift unit 8 Slewing gear assembly 8 0 Fixing ring 8 0 1 First gear member Second gear member Gear portion 8 0 2 8 0 4 8 0 6 First rolling wheel second rolling wheel guide 8 0 3 8 0 5 8 0 7 15 M264646 Lifting gear assembly 8 1 Third gear member 8 11 Bearing assembly 8 1 2 Mandrel 8 13 Bearing 8 1 4 Bearing block 8 1 5 Lead screw 8 2 Guide rod 8 3. Guide assembly 8 4 Linear guide collar 8 4 1 Crystal Ring 9 16