CN210435923U - Crystal material homogenization burnishing device - Google Patents
Crystal material homogenization burnishing device Download PDFInfo
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- CN210435923U CN210435923U CN201921349656.9U CN201921349656U CN210435923U CN 210435923 U CN210435923 U CN 210435923U CN 201921349656 U CN201921349656 U CN 201921349656U CN 210435923 U CN210435923 U CN 210435923U
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Abstract
The utility model discloses a crystal material homogenization burnishing device, include: the polishing device comprises a feeding unit, a clamping unit, a polishing unit and a control unit; the feeding unit is used for driving the workpiece to move on the surface of the polishing unit along a set motion track and feeding back the relevant information of the motion track to the control unit in real time; the clamping unit is used for clamping a workpiece, enabling the workpiece to rotate in the movement process and providing a certain loading force for the workpiece; the polishing unit is used for polishing the workpiece moving on the surface of the polishing unit; the control unit is used for controlling the motion track of the feeding unit and controlling the loading force of the clamping unit. In this way, the utility model discloses can guarantee the homogeneity of work piece clearance, improve the geometric accuracy and the surface quality of work piece.
Description
Technical Field
The utility model relates to an ultra-precision polishing technical field especially relates to a crystal material homogenization burnishing device.
Background
In the polishing process, along with the rotation of the polishing disc and the rotation of the workpiece, the abrasive particles on the polishing disc form a complex motion track on the surface of the workpiece, and the processing precision is improved. However, in the case of only the rotation of the polishing disk and the rotation of the workpiece itself, the movement trace formed by the abrasive particles on the surface of the workpiece tends to be regular and periodic, and during a long-term machining process, damage or defects on the surface of the polishing disk repeatedly act on the surface of the workpiece, thereby causing the quality and accuracy of the surface of the workpiece to be reduced. Therefore, it is necessary to move the workpiece along a specific trajectory by a mechanical structure during the polishing process.
In the conventional polishing process, a method of feeding along the radial direction of a polishing disc in a reciprocating manner or driving a workpiece to revolve by using a planetary gear mechanism is mostly adopted, and the method can form a complex workpiece motion track and is beneficial to improving the processing precision. However, the track generated by the method is single and cannot be changed randomly. Meanwhile, in the process of the workpiece moving on the surface of the polishing disc, the linear velocity of the polishing disc at the position is changed, so that the removal rate is changed, the processing state of the workpiece is unstable, and the processing precision is reduced. According to the Preston equation γ of KPv, in order to maintain the removal rate γ constant under the condition that the Preston coefficient K is constant, it is necessary that the load P be changed in accordance with the change in the polishing rate v.
Chinese utility model patent application publication No. CN 108188865A discloses a laser crystal polishing device, uses drive arrangement drive work piece to be close to or keep away from the direction removal of polishing dish vertical axis to change the position of work piece on the polishing dish, both can carry out the rough polishing to the crystal, can carry out the finish polishing again. However, the device can only realize the reciprocating motion of the workpiece along a straight line, cannot realize a more complex motion mode, and has limited improvement on the processing precision of the crystal material.
Chinese utility model patent application publication No. CN 107803723A discloses a grinding and polishing device, through planet wheel mechanism, this grinding and polishing instrument except around polishing shaft revolution, still has a rotation around self axis gyration, and the device can provide polishing pressure simultaneously, can effectively improve the machining precision. However, the planetary wheel mechanism is fixed in structure and cannot be changed at will in the later period. And the compound motion of revolution around the polishing shaft and rotation around the axis of the polishing shaft has periodicity, and the track complexity is limited. The polishing pressure of the device needs to be changed by adjusting the compression amount of the spring, which is inconvenient in actual processing.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem of main solution provides a crystal material homogenization burnishing device to solve the above-mentioned defect that current burnishing device exists.
In order to solve the technical problem, the utility model discloses a technical scheme be: there is provided a crystalline material homogenization polishing device, comprising: the polishing device comprises a feeding unit, a clamping unit, a polishing unit and a control unit, wherein the control unit is used for controlling the feeding unit to drive a workpiece to move on the polishing unit according to a set motion track so as to polish the surface of the workpiece, the feeding unit can send relevant information of the motion track to the control unit in real time, the control unit calculates loading force required by the workpiece in the polishing process according to the relevant information, and controls the clamping unit to adjust the loading force of the workpiece.
In a preferred embodiment of the present invention, the feeding unit and the polishing unit are disposed in parallel on the vibration isolation platform, and the clamping unit is connected to the feeding unit.
In a preferred embodiment of the present invention, the polishing unit includes: the polishing device comprises an air static pressure rotary table and a polishing disc, wherein the air static pressure rotary table is fixed on a vibration isolation platform, and the polishing disc is installed on the air static pressure rotary table.
In a preferred embodiment of the present invention, the feeding unit includes: the vibration isolation platform comprises a swing arm, a telescopic arm and a support, wherein the support is fixed on the vibration isolation platform, the swing arm is installed on the support and rotates on the support, and the telescopic arm is installed on the swing arm and can horizontally move front and back along the swing arm.
In the utility model discloses a preferred embodiment, the front end arc end below of swing arm is fixed with the circular grating, be fixed with horizontal grating on the lateral wall of flexible arm, still install the angle sensor who is used for acquireing circular grating rotation angle on the support, still install the position sensor who is used for acquireing horizontal grating displacement volume on the lateral wall of flexible arm.
In a preferred embodiment of the present invention, the holding unit includes: the device comprises a shifting fork, a speed regulating motor, a driving wheel, a limiting wheel and a pressurizing device, wherein the pressurizing device is fixed on the shifting fork and used for providing loading force for a workpiece positioned in the shifting fork; the limiting wheels are distributed below the circumferential surface of the shifting fork at intervals and matched with the driving wheel to clamp and limit the workpiece in the shifting fork, the speed regulating motor is used for driving the driving wheel to rotate, and the driving wheel is used for driving the workpiece to rotate.
The utility model has the advantages that: the utility model discloses a feeding unit drives the work piece and moves on polishing unit along complicated orbit, and the motion process is steady, and rate of motion is invariable, and the orbit can be set for according to work piece orbit equation, uses the centre gripping unit to provide the loading power to the work piece simultaneously, and the control unit can change the size of loading power in real time to guarantee the homogeneity of work piece clearance, improve the geometric accuracy and the surface quality of work piece.
Drawings
Fig. 1 is a schematic perspective view of the device of the present invention;
fig. 2 is a front view of the device of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 1;
fig. 4 is a top view of the device of the present invention in an initial position;
FIG. 5 is a schematic view of a workpiece moving along a sinusoidal path;
FIG. 6 is a graph showing the relationship between linear velocity and angular velocity of a polishing disk;
FIG. 7 is a graph of loading force as a function of polishing pad speed;
FIG. 8 is a graph of loading force versus time as the workpiece moves along a sinusoidal path;
the parts in the drawings are numbered as follows: 1. the device comprises a feeding unit, 11, a swing arm, 12, a telescopic arm, 13, a support, 14, a circular grating, 15, a horizontal grating, 16, an angle sensor, 17 and a position sensor; 2. the device comprises a clamping unit, a shifting fork, a speed regulating motor, a driving wheel, a limiting wheel, a pressure device and a pressure device, wherein the clamping unit comprises 21, a shifting fork, 22, a speed regulating motor, 23, a driving wheel, 24, the limiting wheel and 25; 3. a polishing unit 31, a gas static pressure turntable 32 and a polishing disc; 4. vibration isolation platform.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Referring to fig. 1 to 3, an embodiment of the present invention includes:
a crystalline material homogenizing polishing apparatus comprising: the polishing device comprises a feeding unit 1, a clamping unit 2, a polishing unit 3 and a control unit, wherein the control unit is used for controlling the feeding unit 1 to drive a workpiece to move on the surface of the polishing unit 3 according to a set motion track so as to polish the surface of the workpiece, the feeding unit 1 can send relevant information of the motion track to the control unit in real time, the control unit calculates loading force required by the workpiece in the polishing process according to the relevant information, and controls the clamping unit 2 to adjust the loading force of the workpiece.
The feeding unit 1 and the polishing unit 3 are arranged on the vibration isolation platform 4 in parallel, and one end of the clamping unit 2 is fixedly connected with one end of the feeding unit 1.
Further, the polishing unit 3 includes: the polishing machine comprises an air static pressure rotary table 31 and a polishing disc 32, wherein the air static pressure rotary table 31 is fixed on the vibration isolation platform 4, and the polishing disc 32 is installed on the air static pressure rotary table 31 and rotates coaxially with the air static pressure rotary table 31.
The feeding unit 1 includes: swing arm 11, flexible arm 12 and support 13, support 13 is fixed on vibration isolation platform 4, swing arm 11 is installed on support 13 and with support 13 coaxial rotation, flexible arm 12 is installed swing arm 11 is last and can be along swing arm 11 front and back horizontal migration, swing arm 11's front end circular arc end below is fixed with circular grating 14, be fixed with horizontal grating 15 on flexible arm 12's the lateral wall, still install the angle sensor 16 that is used for acquireing circular grating 14 rotation angle on support 13, still install the position sensor 17 that is used for acquireing horizontal grating 15 displacement volume on flexible arm 12's the lateral wall.
The clamping unit 2 includes: the device comprises a shifting fork 21, a speed regulating motor 22, a driving wheel 23, a limiting wheel 24 and a pressurizing device 25, wherein the pressurizing device 25 is fixed on the shifting fork 21 and used for providing loading force for a workpiece positioned in the shifting fork 21; the limiting wheels 24 are distributed below the circumferential surface of the shifting fork 21 at intervals and matched with the driving wheel 23 to clamp and limit the workpiece in the shifting fork 21, the speed regulating motor 22 is used for driving the driving wheel 23 to rotate, and the driving wheel 23 is used for driving the workpiece to rotate.
The use method of the crystal material homogenization polishing device comprises the following steps:
s1, swing arm 11 and telescopic arm 12 jointly drive workpiece circle center O3Moving to an initial position;
s2, setting the angular speed omega of the polishing disk 321Angular velocity ω of the workpiece3(ii) a Inputting a workpiece motion trajectory equation into a control unit, and setting a workpiece running speed s3(ii) a Calculating the motion track of the feeding unit 1 by the control unit;
s3, starting the polishing unit 3, the feeding unit 1 and the clamping unit 2, wherein the feeding unit 1 drives the workpiece to move on the polishing disc 32 along the motion track calculated in the step S2, meanwhile, the position sensor 17 reads the numerical value of the horizontal grating 15 fixedly arranged on the telescopic arm 12 in real time to acquire the horizontal displacement information of the telescopic arm 12, the angle sensor 16 reads the numerical value of the circular grating 14 fixedly arranged on the swing arm 11 in real time to acquire the rotation angle information of the swing arm 11 and respectively feeds back the relevant information to the control unit, and the control unit acquires the rotation angle information of the swing arm 11 according to the horizontal displacement information and the rotation angleDegree information calculates the center O of the workpiece3To obtain the actual position of the center O of the workpiece3And the circle center O of the polishing disk1And calculating the loading force on the workpiece according to the distance;
s4, the control unit feeds back the calculated loading force to the gripping unit 2, and the pressurizing device 25 in the gripping unit 2 changes the magnitude of the loading force in real time according to the feedback result.
Wherein, the feeding unit 1 drives the workpiece to move on the polishing disk 32 of the polishing unit according to the motion track calculated in the step S2, and the control unit controls the running speed S of the workpiece3Is constant.
Further, the removal rate of the workpiece is subject to Preston equation γ KPv, where γ is the removal rate, K is the Preston coefficient, P is the loading pressure, v is the polishing disc linear velocity, and the control unit calculates the loading force according to the equation:
wherein r is3Is the radius of the workpiece, omega1For the angular velocity of the polishing disk, l (t) is the center O of the workpiece at time t3To the circle center O of the polishing disk1The distance of (c).
With continuing reference to fig. 4 to 8, the method for using a crystal material homogenization polishing device of the present invention specifically comprises the following steps:
in the plane of the polishing disk 32, the center O of the polishing disk 32 is defined1Establishing a rectangular coordinate system for the origin; in the plane of the upper surface of the support 13, the center O of the upper surface of the support 13 is2Establishing a polar coordinate system for an origin; x of rectangular coordinate system1X of axis and polar coordinate system2The axial directions are the same;
the swing arm 11 and the telescopic arm 12 move to the initial position, and the center O of the workpiece is at the moment3The coordinate in the rectangular coordinate system is (-l)00), the coordinate in the polar coordinate system is (r)0,0)；
Setting angular velocity omega of polishing disk1And angular velocity ω of the workpiece3；
Mixing O with3Equation of motion trajectory
An input control unit;
set up O3Rate of operation s3；
By
Can solve out O3The polar coordinate equation r of the motion track is r (theta);
according to
The control unit calculates time O3Rectangular coordinates (x (t), y (t));
then, the time O at t is calculated from r (θ)3And the angular velocity ω of the swing arm 11 at time t2(t) and speed v of the telescopic arm 122(t)；
Starting the gas static pressure rotary table 32;
starting the speed regulating motor 22, the pressurizing device 25 and the feeding unit 1;
the feeding unit 1 moves according to the parameters, and simultaneously drives the workpiece to move along the input track, and the polishing disc 32 starts to process the workpiece;
the control unit calculates O in real time3And O1The distance between
From the linear velocity v of any point on the polishing disc 321And angular velocity omega1Relation v of1＝ω1R；
To obtain O3Linear velocity v of polishing disk3＝ω1l(t)；
By Preston equation γ KPv3Wherein gamma is the removal rate, K is the Preston coefficient, P is the loading pressure, and the loading force at the moment t is obtained
Wherein r is3Is the workpiece radius;
the pressurizing device 25 changes the magnitude of the loading force in real time according to the calculation result;
the position sensor 17 and the angle sensor 16 read the value r '(t) of the horizontal grating 15 and the value θ' (t) of the circular grating 14 in real time, respectively, to obtain the time O at t3The actual position (r '(t), θ' (t));
and (r '(t), theta' (t)) and (r (t), theta (t)) are compared, and when the error is greater than an allowable value, the control unit compensates, so that the accurate running track of the workpiece is ensured.
To sum up, the utility model discloses a swing arm and flexible arm linkage drive the work piece along complicated orbit at polishing dish surface motion, and the motion process is steady, and the rate of motion is invariable, and the orbit can be set for by people, uses pressure device to provide the loading power to the work piece simultaneously, and the control unit can be according to the different real-time size that changes the loading power of the polishing dish linear velocity of work piece position to guarantee the homogeneity of work piece clearance, improve the geometric accuracy and the surface quality of work piece.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the products of the present invention are usually placed when used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element to which the term refers must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (6)
1. A crystalline material homogenization polishing apparatus, comprising: the polishing device comprises a feeding unit, a clamping unit, a polishing unit and a control unit;
the feeding unit is used for driving the workpiece to move on the polishing unit along a set motion track and feeding back the relevant information of the motion track to the control unit in real time;
the clamping unit is used for clamping a workpiece, enabling the workpiece to rotate in the movement process and providing loading force for the workpiece;
the polishing unit is used for polishing the workpiece;
the control unit is used for controlling the motion track of the feeding unit and controlling the loading force of the clamping unit.
2. The crystalline material homogenization polishing device of claim 1 wherein the feed unit and the polishing unit are arranged in parallel, and the holding unit is connected to the feed unit.
3. The crystalline material homogenization polishing apparatus as claimed in claim 2, wherein the polishing unit comprises: the polishing disc is arranged on the gas static pressure rotary table.
4. The crystalline material homogenization polishing apparatus as recited in claim 2 wherein the feed unit comprises: the vibration isolation platform comprises a swing arm, a telescopic arm and a support, wherein the support is fixed on the vibration isolation platform, the swing arm is installed on the support and rotates on the support, and the telescopic arm is installed on the swing arm and can horizontally move front and back along the swing arm.
5. The crystal material homogenization polishing device according to claim 4, wherein a circular grating is fixed below the front end arc end of the swing arm, a horizontal grating is fixed on the side wall of the telescopic arm, an angle sensor for acquiring the rotation angle of the circular grating is further installed on the support, and a position sensor for acquiring the displacement of the horizontal grating is further installed on the side wall of the telescopic arm.
6. The crystalline material homogenization polishing apparatus as claimed in claim 2, wherein the holding unit comprises: the device comprises a shifting fork, a speed regulating motor, a driving wheel, a limiting wheel and a pressurizing device, wherein the pressurizing device is fixed on the shifting fork and used for providing loading force for a workpiece positioned in the shifting fork; the limiting wheels are distributed below the circumferential surface of the shifting fork at intervals, the limiting wheels are matched with the driving wheel to clamp and limit the workpiece in the shifting fork, the speed regulating motor is used for driving the driving wheel to rotate, and the driving wheel is used for driving the workpiece to rotate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921349656.9U CN210435923U (en) | 2019-08-20 | 2019-08-20 | Crystal material homogenization burnishing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921349656.9U CN210435923U (en) | 2019-08-20 | 2019-08-20 | Crystal material homogenization burnishing device |
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| CN210435923U true CN210435923U (en) | 2020-05-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110315421A (en) * | 2019-08-20 | 2019-10-11 | 江苏集萃精凯高端装备技术有限公司 | A kind of crystalline material homogenization burnishing device and application method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110315421A (en) * | 2019-08-20 | 2019-10-11 | 江苏集萃精凯高端装备技术有限公司 | A kind of crystalline material homogenization burnishing device and application method |
| CN110315421B (en) * | 2019-08-20 | 2023-12-26 | 江苏集萃精凯高端装备技术有限公司 | Crystal material homogenizing and polishing device and application method |
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