CN113711377A - 电子元件的电连接方法及其相关装置 - Google Patents

电子元件的电连接方法及其相关装置 Download PDF

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Publication number
CN113711377A
CN113711377A CN202080000204.9A CN202080000204A CN113711377A CN 113711377 A CN113711377 A CN 113711377A CN 202080000204 A CN202080000204 A CN 202080000204A CN 113711377 A CN113711377 A CN 113711377A
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China
Prior art keywords
oxidation
protective film
contact electrode
connection method
binding
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CN202080000204.9A
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English (en)
Inventor
曹占锋
王久石
王珂
张国才
闫俊伟
刘英伟
黄海涛
袁广才
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Publication of CN113711377A publication Critical patent/CN113711377A/zh
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Abstract

一种电子元件的电连接方法及包括应用该电连接方法的电子元件的背光模组、显示面板和显示装置，该电连接方法包括：提供一驱动背板(20)；驱动背板包括多个接触电极(201)；在接触电极之上形成防氧化保护膜(21)；在防氧化保护膜对应于各接触电极的位置处涂覆绑定材料(22)；将多个电子元件(23)转移到对应的接触电极的位置处，将各电子元件与对应的接触电极进行绑定，并且，在将各电子元件与对应的接触电极完成绑定之前，去除各接触电极位置处的防氧化保护膜。通过在接触电极之上形成防氧化保护膜，可以使接触电极在很长时间内不被氧化，确保接触电极与绑定材料之间能够良好的连接，并且可以省去化镍金工艺，简化工艺。

Description

PCT国内申请，说明书已公开。

Claims (12)

  1. PCT国内申请，权利要求书已公开。
CN202080000204.9A 2020-02-28 2020-02-28 电子元件的电连接方法及其相关装置 Pending CN113711377A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067654A (ja) * 2008-09-09 2010-03-25 Sony Corp 半導体装置の製造方法
CN102450112A (zh) * 2009-06-01 2012-05-09 住友电气工业株式会社 连接方法、连接结构和电子装置
CN106684234A (zh) * 2017-01-20 2017-05-17 深圳市润芯科技有限公司 Led晶片封装基板、其制备方法及led光源

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103582285A (zh) * 2012-07-31 2014-02-12 厦门中天启航电子科技有限公司 一种ito导电膜汇流电极及其制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067654A (ja) * 2008-09-09 2010-03-25 Sony Corp 半導体装置の製造方法
CN102450112A (zh) * 2009-06-01 2012-05-09 住友电气工业株式会社 连接方法、连接结构和电子装置
CN106684234A (zh) * 2017-01-20 2017-05-17 深圳市润芯科技有限公司 Led晶片封装基板、其制备方法及led光源

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