WO2021168844A1 - 电子元件的电连接方法及其相关装置 - Google Patents

电子元件的电连接方法及其相关装置 Download PDF

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Publication number
WO2021168844A1
WO2021168844A1 PCT/CN2020/077302 CN2020077302W WO2021168844A1 WO 2021168844 A1 WO2021168844 A1 WO 2021168844A1 CN 2020077302 W CN2020077302 W CN 2020077302W WO 2021168844 A1 WO2021168844 A1 WO 2021168844A1
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Prior art keywords
electronic components
contact electrode
protective film
electrical connection
connection method
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PCT/CN2020/077302
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English (en)
French (fr)
Inventor
曹占锋
王久石
王珂
张国才
闫俊伟
刘英伟
黄海涛
袁广才
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/638,703 priority Critical patent/US20220406749A1/en
Priority to CN202080000204.9A priority patent/CN113711377A/zh
Priority to PCT/CN2020/077302 priority patent/WO2021168844A1/zh
Publication of WO2021168844A1 publication Critical patent/WO2021168844A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Definitions

  • the present disclosure relates to the field of display technology, in particular to an electrical connection method of electronic components and related devices.
  • Mini-Light Emitting Diode Mini-LED
  • the electronic components need to be bound to the drive backplane through a binding material. Because the contact electrodes on the drive backplane are easily oxidized, the contact electrodes and the binding The electrical contact of the specified material is poor. Therefore, the oxide on the surface of the contact electrode needs to be removed before the electronic component is bound to the contact electrode.
  • the electrical connection method of electronic components provided by the implementation of the present disclosure includes:
  • the driving backplane includes a plurality of contact electrodes
  • a plurality of electronic components are transferred to the positions of the corresponding contact electrodes, each of the electronic components is bound to the corresponding contact electrode, and each of the electronic components is connected to the corresponding contact electrode. Before completing the binding, the anti-oxidation protective film at each of the contact electrode positions is removed.
  • the forming an anti-oxidation protective film on the contact electrode includes:
  • the placing the drive backplane in an anti-oxidation protection solution includes:
  • the coating a binding material at a position of the anti-oxidation protective film corresponding to each of the contact electrodes includes:
  • the binding each of the electronic components with the corresponding contact electrode includes:
  • each of the electronic components is bound to the corresponding contact electrode.
  • the binding material is doped with a reactant for removing the anti-oxidation protective film
  • the binding each of the electronic components with the corresponding contact electrodes includes:
  • the reactant includes: rosin resin or isophthalic acid.
  • the oxidation protection film after the oxidation protection film is formed on the contact electrode, before the bonding material is coated at the position of the oxidation protection film corresponding to each of the contact electrodes During the set time, it also includes:
  • the driving backplane after forming the anti-oxidation protective film is placed in a reactant for removing the anti-oxidation protective film, and soaked for 60-120 seconds.
  • the reactant includes: isophthalic acid, alcohol or dilute acid.
  • an embodiment of the present disclosure also provides a backlight module, including a driving backplane, and electronic components on the driving backplane, and the electronic components are connected to the driving backplane using the above-mentioned electrical connection method.
  • the contact electrodes in the board are bound and connected;
  • the electronic component includes a micro light emitting diode;
  • the backlight module also includes an optical film layer on the light emitting side of the micro light emitting diode.
  • an embodiment of the present disclosure also provides a display panel, including: a driving backplane, and a plurality of electronic components on the driving backplane, the electronic components adopting the above-mentioned electrical connection method and the driving The contact electrodes in the backplane are bonded and connected; the electronic components include micro light emitting diodes.
  • an embodiment of the present disclosure also provides a display device, including: the above-mentioned backlight module and a liquid crystal display panel located on the light-emitting side of the backlight module; or, the above-mentioned display panel.
  • FIG. 1 is a flowchart of an electrical connection method of an electronic component provided by an embodiment of the disclosure
  • FIG. 2 is a schematic diagram of the structure of the driving backplane in the embodiment of the disclosure.
  • FIG. 3 is a schematic diagram of the structure of forming an anti-oxidation protective film in an embodiment of the disclosure
  • FIG. 5 is a schematic diagram of the structure of the driving backplane after transferring electronic components in an embodiment of the disclosure
  • FIG. 6 is a schematic diagram of the structure of the driving backplane after being bound with the electronic component in the embodiment of the disclosure.
  • embodiments of the present invention provide an electrical connection method for electronic components and related devices.
  • the nickel-gold process can remove the oxide on the surface of the contact electrode and add a layer of highly oxidation-resistant alloy material. For example, a 2 to 3 ⁇ m thick nickel-gold layer can be deposited to protect the contact electrode.
  • the nickel-gold process has the problem of insufficient process control accuracy, and it is inevitable that there are defects such as the peeling of the nickel-gold layer; and the nickel-gold process is a traditional electrochemical process and has a certain degree of pollution.
  • the embodiment of the present disclosure provides an electrical connection method of an electronic component, as shown in FIG. 1, including:
  • a driving backplane 20 is provided; the driving backplane 20 includes a plurality of contact electrodes 201;
  • an anti-oxidation protective film 21 is formed on the contact electrode 201;
  • the above-mentioned electrical connection method for electronic components provided by the embodiments of the present disclosure can prevent the contact electrode from being oxidized for a long time by forming an anti-oxidation protective film on the contact electrode, and ensure a good connection between the contact electrode and the binding material.
  • the connection and can omit the nickel-gold process, simplify the process.
  • the above-mentioned electronic components provided by the embodiments of the present disclosure may be miniature light-emitting diodes, or electronic components with other electrode pins, which are not limited here.
  • the micro light emitting diode may include: a micro light emitting diode (Micro Light Emitting Diode, Micro LED) or a mini light emitting diode (mini Light Emitting Diode, mini-LED), etc.
  • a micro light emitting diode Micro Light Emitting Diode, Micro LED
  • mini light emitting diode mini Light Emitting Diode, mini-LED
  • the contact electrode 201 can be mainly made of copper material, and, in order to increase the adhesion of the contact electrode 201, the contact electrode 201 It may also include an adhesion layer, which may include materials such as molybdenum (Mo), titanium (Ti), molybdenum-titanium alloy (MoTi), or molybdenum-niobium alloy (MoNb), that is, the contact electrode 201 includes an adhesion layer and The laminated structure of the copper layer on the side of the adhesive layer away from the substrate of the drive backplane.
  • the driving backplane 20 may further include a driving circuit electrically connected to the contact electrode 201, and the driving circuit may control the electronic components to implement corresponding functions by applying a driving signal to the contact electrode 201.
  • the above-mentioned electronic component may generally include an epitaxial structure 231 and positive and negative electrodes 232.
  • the electronic component 23 is transferred to the corresponding contact electrode 201, and the positive and negative electrodes 232 and the corresponding contact electrode 201 need to be transferred. Point and touch.
  • the above-mentioned step S102 may include:
  • the above-mentioned anti-oxidation protection solution can be used to react with the oxide on the surface of the contact electrode, so that the oxide on the surface of the contact electrode can be removed to ensure a good connection between the contact electrode and the binding material.
  • An anti-oxidation protective film is formed to protect the contact electrode. As shown in FIG. 3, since the anti-oxidation protective film 21 is obtained by the reaction of an anti-oxidation protective solution and oxide, the anti-oxidation protective film 21 is only formed on the surface of the contact electrode 201 .
  • the drive backplane can be placed in a container with an anti-oxidation protection solution, and the equipment and process for making the anti-oxidation protection film are relatively simple, and the production cost is low.
  • the drive backplane By immersing the drive backplane in the anti-oxidation protection solution for 30 to 90 seconds, it can be formed The anti-oxidation protective film.
  • placing the driving backplane in the anti-oxidation protection solution includes:
  • the benzotriazole BTAH material can complex reaction with the oxide on the surface of the contact electrode.
  • copper Take copper as an example on the surface of the contact electrode. Since the oxidation of copper is related to factors such as temperature, ambient gas and humidity, the temperature of copper is relatively high. Under the conditions, the surface will be oxidized to form cuprous oxide, and the cuprous oxide will gradually oxidize to cuprous oxide in humid air. In the actual process of making contact electrodes, the temperature is relatively high, so cuprous oxide is formed on the surface of the contact electrodes. In the actual process, the humidity in the environment of the reaction chamber is controlled, and the cuprous oxide is hardly further caused. It is oxidized to copper oxide, so the main component of the surface of the contact electrode is cuprous oxide.
  • the benzotriazole BTAH material can undergo a complex reaction with Cu 2 O to form a Cu-BTA complex of Cu 2 O, thereby removing the oxide on the surface of the contact electrode, and the formed complex can be Play a protective effect on the contact electrode, the specific reaction formula is as follows:
  • H 2 O is generated after the complexation reaction, which can be washed with water and then dried to remove the generated water to prevent the generated water from adversely affecting the contact electrode.
  • the overall anti-oxidation protective film is slightly negatively charged, while the contact electrode containing Cu 2 O surface is positively charged, so the two pass static electricity. Adsorption, the anti-oxidation protective film can be adsorbed to the surface of the contact electrode.
  • anti-oxidation protective film in addition to benzotriazole BTAH, other materials can also be used to make the anti-oxidation protective film.
  • other ink materials can be used.
  • the material of the anti-oxidation protective film is not limited here.
  • the performance of the anti-oxidation protective film formed on the contact electrode is better, so that the contact electrode will not be oxidized for a long time (generally up to three months). Therefore, in the electronic component Before the bonding with the contact electrode is completed, sufficient operating time can be reserved for the coating process of the bonding material and the bonding process to increase the flexibility of mass production.
  • the above-mentioned step S103 may include:
  • tin paste is applied to the position of the anti-oxidation protective film.
  • the solder paste is used as the bonding material.
  • binding each electronic component with the corresponding contact electrode includes:
  • each electronic component is bound to the corresponding contact electrode.
  • a plurality of electronic components are transferred to the positions of the corresponding contact electrodes, the positive and negative electrodes 232 of the electronic components are brought into contact with the binding materials at the corresponding positions, and then the driving backplane is placed in the equipment of the reflow soldering process, After heating air or nitrogen to a sufficiently high temperature, blow it to the above-mentioned driving backplane, and the temperature reaches 217° or more, and the binding material can melt. After the binding material is cooled, the electronic component and the corresponding position can be realized. Bonding of binding materials. With the reflow soldering process, the temperature is easy to control, and the oxidation of the contact electrode can be avoided during the reflow soldering process, and the production cost is relatively low.
  • the drive backplane can also be optically inspected to detect whether the shape of the binding material meets the requirements.
  • the binding material is doped with a reactant for removing the anti-oxidation protective film
  • Bind each electronic component with the corresponding contact electrode including:
  • the binding material is mixed with a reactant for removing the anti-oxidation protective film, after the binding material is coated in the above step S103, the reactant starts to react with the anti-oxidation protective film.
  • the anti-oxidation protective film is partially removed.
  • the removal process of the anti-oxidation protective film described in the above embodiment is compatible with the bonding process of electronic components, and no additional equipment is required.
  • the above-mentioned reactant needs to have active groups to remove the anti-oxidation protective film.
  • the above-mentioned reactant may be a material containing carboxylic acid (RCOOH), and the specific reaction formula for removing the anti-oxidation protective film may be:
  • the anti-oxidation protective film is thin, and the boiling point and flash point of BTA are low, about 150-200 degrees, and the temperature of the reflow soldering process is about 250 degrees, the anti-oxidation protective film, reactants and reaction products can be completely removed .
  • the above-mentioned reactant may include: rosin resin or isophthalic acid. Both rosin resin and isophthalic acid are organic materials, and it is easier to mix with the binding material when organic materials are used as the above-mentioned reactants.
  • the bonding material generally includes flux, which can promote the bonding process between the light-emitting diode chip and the contact electrode by the bonding material, so the above-mentioned reactants can be incorporated into the flux; During the reflow soldering process, the flux will also volatilize.
  • the flux is a mixture usually made of rosin as the main component. It is an auxiliary material to ensure the smooth progress of the soldering process.
  • the main raw material is an organic solvent (commonly used are ethanol, propanol, butanol; acetone, toluene, isobutyl methyl, etc.) Ketones; ethyl acetate, butyl acetate), rosin resin and its derivatives, synthetic resin surfactants, organic acid activators, corrosion inhibitors, cosolvents, film-forming agents, etc., that is to say, the flux is a variety of solids
  • the ingredients are dissolved in various liquids to form a uniform and transparent mixed solution.
  • step S102 after step S102 and within a set time before step S103, it may further include:
  • the driving backplane after forming the anti-oxidation protective film is placed in a reactant for removing the anti-oxidation protective film, and soaked for 60 to 120 seconds.
  • the anti-oxidation protective film can protect the contact electrode and prevent the contact electrode from being oxidized. Remove the anti-oxidation protective film within the set time before coating the binding material. Because the contact electrode is exposed for a short time, the oxide film formed on the surface of the contact electrode is thinner. Coat the binding material on the contact electrode as soon as possible. It has little effect on the connection performance between the binding material and the contact electrode. In specific implementation, within 24 hours of removing the anti-oxidation protective film, coating the binding material on the contact electrode will not affect the connection performance between the binding material and the contact electrode.
  • the driving backplane after forming the anti-oxidation protective film is placed in the reactant and soaked for 60-120s to remove the anti-oxidation protective film.
  • the process equipment is simple and the cost is low.
  • the anti-oxidation protective film is soaked in the reactant for 60 to 120 seconds to ensure that the anti-oxidation protective film can be completely removed.
  • the above-mentioned reactant may include: isophthalic acid, alcohol, or dilute acid.
  • the anti-oxidation protective film can be easily removed by immersing the anti-oxidation protective film in an organic solvent (for example, isophthalic acid) or a dilute acid solution, and the process is simple and the cost is low.
  • the specific reaction formula for removing the anti-oxidation protective film can be:
  • an embodiment of the present invention also provides a backlight module, including: a driving backplane, a plurality of electronic components located on the driving backplane, the electronic components are in contact with the driving backplane using the above-mentioned electrical connection method Electrode binding connection;
  • the above-mentioned electronic components include miniature light-emitting diodes
  • the above-mentioned backlight module also includes an optical film layer on the light-emitting side of the miniature light-emitting diode.
  • the miniature light-emitting diode is bound and connected with the contact electrode in the driving backplane by the above-mentioned electrical connection method, so the connection performance of the miniature light-emitting diode and the contact electrode is better.
  • optical film layers such as diffuser sheets, prism sheets, etc. can also be provided. Therefore, the backlight module can provide the liquid crystal display panel with light with better uniformity.
  • an embodiment of the present invention also provides a display panel, including: a driving backplane, and a plurality of electronic components on the driving backplane. Electrode binding connection;
  • the above-mentioned electronic components include miniature light-emitting diodes.
  • the miniature light-emitting diode is bound and connected with the contact electrode in the driving backplane by the above-mentioned electrical connection method, so the connection performance of the miniature light-emitting diode and the contact electrode is better.
  • the addressing control and individual driving of each pixel can be realized, thereby realizing screen display.
  • the above-mentioned micro light emitting diode may be a mini LED, and the above-mentioned display panel may be applied to a large-size display screen or a display screen with a lower resolution requirement.
  • an embodiment of the present invention also provides a display device including the above-mentioned backlight module and a liquid crystal display panel located on the light-emitting side of the backlight module, that is, the display device may be a liquid crystal display device; or, the above-mentioned display device Including the above-mentioned display panel, that is, the display device may also be an LED display device.
  • the display device can be applied to any products or components with display functions such as mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, and navigators.
  • the implementation of the display device can refer to the implementation of the above-mentioned backlight module (or display panel), and the repetition will not be repeated.
  • the contact electrode by forming an anti-oxidation protective film on the contact electrode, the contact electrode can be prevented from being oxidized for a long time, ensuring that the contact electrode is bound to
  • the materials can be well connected, and the nickel-gold process can be omitted, and the process can be simplified.

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Abstract

一种电子元件的电连接方法及包括应用该电连接方法的电子元件的背光模组、显示面板和显示装置，该电连接方法包括：提供一驱动背板(20)；驱动背板包括多个接触电极(201)；在接触电极之上形成防氧化保护膜(21)；在防氧化保护膜对应于各接触电极的位置处涂覆绑定材料(22)；将多个电子元件(23)转移到对应的接触电极的位置处，将各电子元件与对应的接触电极进行绑定，并且，在将各电子元件与对应的接触电极完成绑定之前，去除各接触电极位置处的防氧化保护膜。通过在接触电极之上形成防氧化保护膜，可以使接触电极在很长时间内不被氧化，确保接触电极与绑定材料之间能够良好的连接，并且可以省去化镍金工艺，简化工艺。

Description

电子元件的电连接方法及其相关装置 技术领域
本公开涉及显示技术领域，尤指一种电子元件的电连接方法及其相关装置。
背景技术
随着电子技术的发展，通过电子元件可以实现多种功能，例如，通过微型发光二极管(Mini-Light Emitting Diode，Mini-LED)可以实现提供光源或显示的功能。
为了控制电子元件实现相应的功能，例如控制微型发光二极管发光，需要将电子元件通过绑定材料绑定到驱动背板上，由于驱动背板上的接触电极容易被氧化，会造成接触电极与绑定材料电气接触不良，因而，在将电子元件与接触电极进行绑定之前，需要去除接触电极表面的氧化物。
发明内容
本公开实施提供的电子元件的电连接方法，其中，包括：
提供一驱动背板；所述驱动背板包括多个接触电极；
在所述接触电极之上形成防氧化保护膜；
在所述防氧化保护膜对应于各所述接触电极的位置处涂覆绑定材料；
将多个电子元件转移到对应的所述接触电极的位置处，将各所述电子元件与对应的所述接触电极进行绑定，并且，在将各所述电子元件与对应的所述接触电极完成绑定之前，去除各所述接触电极位置处的所述防氧化保护膜。
可选地，在本公开实施例中，所述在所述接触电极之上形成防氧化保护膜，包括：
将所述驱动背板置于防氧化保护溶液中，并浸泡30～90s。
可选地，在本公开实施例中，所述将所述驱动背板置于防氧化保护溶液 中，包括：
将所述驱动背板置于苯并三氮唑的溶液中。
可选地，在本公开实施例中，所述在所述防氧化保护膜对应于各所述接触电极的位置处涂覆绑定材料，包括：
在所述防氧化保护膜的位置处涂覆锡膏。
可选地，在本公开实施例中，所述将各所述电子元件与对应的所述接触电极进行绑定，包括：
采用回流焊工艺，将各所述电子元件与对应的所述接触电极进行绑定。
可选地，在本公开实施例中，所述绑定材料中掺有用于去除所述防氧化保护膜的反应剂；
所述将各所述电子元件与对应的所述接触电极进行绑定，包括：
在将各所述电子元件与对应的所述接触电极进行绑定的过程中，将所述反应剂与所述防氧化保护膜的产物及多余的所述反应剂挥发。
可选地，在本公开实施例中，所述反应剂，包括：松香树脂或间苯二甲酸。
可选地，在本公开实施例中，所述在所述接触电极之上形成防氧化保护膜之后，在所述防氧化保护膜对应于各所述接触电极的位置处涂覆绑定材料之前的设定时间内，还包括：
将形成所述防氧化保护膜之后的所述驱动背板置于用于去除所述防氧化保护膜的反应剂中，并浸泡60～120s。
可选地，在本公开实施例中，所述反应剂，包括：间苯二甲酸、酒精或稀酸。
相应地，本公开实施例还提供了一种背光模组，包括：驱动背板，位于所述驱动背板之上的电子元件，所述电子元件采用如上述的电连接方法与所述驱动背板中的接触电极绑定连接；所述电子元件包括微型发光二极管；所述背光模组还包括位于所述微型发光二极管出光侧的光学膜层。
相应地，本公开实施例还提供了一种显示面板，包括：驱动背板，以及 位于所述驱动背板之上的多个电子元件，所述电子元件采用上述的电连接方法与所述驱动背板中的接触电极绑定连接；所述电子元件包括微型发光二极管。
相应地，本公开实施例还提供了一种显示装置，包括：上述背光模组以及位于背光模组的出光侧的液晶显示面板；或，上述显示面板。
附图说明
图1为本公开实施例提供的电子元件的电连接方法流程图；
图2为本公开实施例中驱动背板的结构示意图；
图3为本公开实施例中形成防氧化保护膜的结构示意图；
图4为本公开实施例中涂覆绑定材料的结构示意图；
图5为本公开实施例中转移电子元件后的驱动背板的结构示意图；
图6为本公开实施例中与电子元件绑定后的驱动背板的结构示意图。
具体实施方式
针对驱动背板上的接触电极容易被氧化，造成接触电极与绑定材料接触不良的问题，本发明实施例提供了一种电子元件的电连接方法及其相关装置。
下面结合附图，对本发明实施例提供的电子元件的电连接方法及其相关装置的具体实施方式进行详细地说明。附图中各膜层的厚度和形状不反映真实比例，目的只是示意说明本发明内容。
采用化镍金工艺，可以去除接触电极表面的氧化物，并增加一层高度抗氧化的合金材料，例如可以沉积2～3μm厚的镍金层，以保护接触电极，但，发明人发现，由于化镍金工艺存在工艺控制精度不足的问题，难免存在镍金层脱落等不良；并且，化镍金工艺属于传统电化学工艺，具有一定的污染性。
本公开实施例提供了一种电子元件的电连接方法，如图1所示，包括：
S101、参照图2，提供一驱动背板20；驱动背板20包括多个接触电极201；
S102、参照图3，在接触电极201之上形成防氧化保护膜21；
S103、参照图4，在防氧化保护膜21对应于各接触电极201的位置处涂覆绑定材料22；
S104、参照图5，将多个电子元件23转移到对应的接触电极201的位置处，将各电子元件23与对应的接触电极201进行绑定，并且，在将各电子元件23与对应的接触电极201完成绑定之前，去除各接触电极201位置处的防氧化保护膜21，得到图6所示的结构。
本公开实施例提供的上述电子元件的电连接方法，通过在接触电极之上形成防氧化保护膜，可以使接触电极在很长时间内不被氧化，确保接触电极与绑定材料之间能够良好的连接，并且可以省去化镍金工艺，简化工艺。具体地，本公开实施例提供的上述电子元件可以为微型发光二极管，也可以为其他电极引脚的电子元件，此处不做限定。具体地，微型发光二极管可以包括：微型发光二极管(Micro Light Emitting Diode，Micro LED)或迷你发光二极管(mini Light Emitting Diode，mini-LED)等。
参照图2，上述步骤S101中，由于铜(Cu)的导电性能较好，且成本较低，接触电极201可以主要采用铜材料制作，并且，为了增加接触电极201的粘合性，接触电极201还可以包括粘合层，粘合层可以包括钼(Mo)、钛(Ti)、钼钛合金(MoTi)或钼铌合金(MoNb)等材料，也就是说，接触电极201包括粘合层以及位于粘合层背离驱动背板的衬底一侧的铜层的叠层结构。在实际应用中，驱动背板20中还可以包括与接触电极201电连接的驱动电路，驱动电路可以通过向接触电极201施加驱动信号，来控制电子元件实现相应的功能。
参照图5，上述电子元件一般可以包括外延结构231及正负电极232，在上述步骤S104中，将电子元件23转移到对应的接触电极201处，需要将正负电极232与对应的接触电极201对位并接触。
具体地，本公开实施例提供的上述绑定方法中，上述步骤S102，可以包括：
将驱动背板置于防氧化保护溶液中，并浸泡30～90s。
为了使接触电极与绑定材料能够良好连接，上述防氧化保护溶液可以采用能够与接触电极表面的氧化物反应，因而可以去除接触电极表面的氧化物，确保接触电极与绑定材料能够连接良好，并形成防氧化保护膜对接触电极进行保护，如图3所示，由于防氧化保护膜21是防氧化保护溶液与氧化物反应得到的，因而防氧化保护膜21仅形成于接触电极201的表面。
在具体实施时，可以将驱动背板置于具有防氧化保护溶液的容器中即可，制作防氧化保护膜的设备和工艺较简单，制作成本低。通过将驱动背板在防氧化保护溶液中的浸泡30～90s，可以形成
Figure PCTCN2020077302-appb-000001
的防氧化保护膜。
更具体地，本公开实施例提供的上述绑定方法中，上述步骤S201中，将驱动背板置于防氧化保护溶液中，包括：
将驱动背板置于苯并三氮唑BTAH的溶液中。
具体地，苯并三氮唑BTAH的分子式为：C 6H 5N 3，结构式为：
Figure PCTCN2020077302-appb-000002
苯并三氮唑BTAH材料可以与接触电极表面的氧化物进行络合反应，以接触电极的表面为铜为例，由于铜的氧化与温度、环境气体及湿度等因素有关，铜在温度较高的条件下会表面会被氧化生成氧化亚铜，而氧化亚铜在潮湿空气中逐渐氧化为氧化铜。在制作接触电极的实际工艺中，温度较高，因此会使接触电极的表面形成氧化亚铜，而实际工艺过程中会对反应腔室环境中的湿度进行控制，几乎不会使氧化亚铜进一步被氧化为氧化铜，故接触电极的表面的主要成分为氧化亚铜。
具体地，苯并三氮唑BTAH材料可以与Cu 2O进行络合反应，形成Cu 2O的络合物Cu-BTA，从而起到了去除接触电极表面的氧化物，并且形成的络合 物可以对接触电极起到保护作用，具体反应式如下：
2BTAH+Cu 2O→2Cu-BTA+H 2O。
由上述反应式可以看出，络合反应后生成了H 2O，可以采用水洗处理后经干燥处理，将生成的水去除，防止生成的水对接触电极产生不良影响。
此外，由于BTAH类材料每个N原子有2个孤对电子，因此防氧化保护膜整体上略呈现负电性，而含有Cu 2O表面的接触电极则表现为正电性，因此二者通过静电吸附，可以将防氧化保护膜吸附到接触电极的表面。
在具体实施时，除苯并三氮唑BTAH外，也可以采用其他材料制作上述防氧化保护膜，例如可以采用其他油墨材料，此处不对防氧化保护膜的材料进行限定。
本公开实施例中，在接触电极之上形成的防氧化保护膜的性能较好，可以使接触电极在很长时间(一般可达到三个月)内都不会被氧化，因而，在电子元件与接触电极完成绑定之前，可以为绑定材料的涂覆工艺及绑定工艺留出足够的操作时间以增加量产灵活性。
在具体实施时，本公开实施例提供的上述绑定方法中，上述步骤S103，可以包括：
采用丝网印刷工艺或高精度打印工艺，在防氧化保护膜的位置处涂覆锡膏。也就是说，采用锡膏作为绑定材料。通过采用丝网印刷工艺或高精度打印工艺，可以将锡膏准确的涂覆于防氧化保护膜之上，避免材料浪费。
在实际应用中，本公开实施例提供的上述绑定方法中，上述步骤S104中，将各电子元件与对应的接触电极进行绑定，包括：
采用回流焊工艺，将各电子元件与对应的接触电极进行绑定。
具体地，将多个电子元件转移到对应的接触电极的位置处，使电子元件的正负电极232与对应位置处的绑定材料接触，然后将驱动背板置于回流焊工艺的设备中，通过将空气或氮气加热到足够高的温度后，吹向上述驱动背板，温度到达217°以上，绑定材料就可以融化，待绑定材料冷却后，即可实现电子元件与对应位置处的绑定材料的粘结。采用回流焊工艺，温度易于控 制，且回流焊工艺过程中可以避免接触电极氧化，制作成本也比较低。
此外，在上述回流焊工艺之后，还可以对驱动背板进行光学检测，以检测绑定材料的形貌是否符合要求。
在实际应用中，本公开实施例提供的上述绑定方法中，可以采用不同的方式去除防氧化保护膜。
在本公开的一些实施例中，绑定材料中掺有用于去除防氧化保护膜的反应剂；
将各电子元件与对应的接触电极进行绑定，包括：
在将各电子元件与对应的接触电极进行绑定的过程中，将反应剂与所述防氧化保护膜的产物及多余的反应剂挥发。
由于绑定材料中掺有用于去除防氧化保护膜的反应剂，因而，在上述步骤S103中涂覆绑定材料之后，反应剂就开始与防氧化保护膜发生反应。参照图5，在上述步骤S104中，将电子元件23转移到对应的接触电极201的位置处时，防氧化保护膜被部分去除，在电子元件23与对应的接触电极201进行绑定的过程中，由于回流焊工艺中需要加热，会加速反应剂与防氧化保护膜的反应，并且挥发反应的产物及多余的反应剂。上述实施例中所述的防氧化保护膜的去除过程，与电子元件的绑定工艺兼容，不需要增加任何其他设备。
具体地，上述反应剂中需要具有活性基团，以便去除防氧化保护膜，例如上述反应剂可以为含羧酸(RCOOH)的材料，去除防氧化保护膜的具体反应式可为：
Cu-BTA+nRCOOH→Cu+(RCOOH)n-BTA；
由于防氧化保护膜较薄，且BTA的沸点和闪点较低，约为150～200度，而回流焊工艺的温度约250度，因而防氧化保护膜、反应剂及反应的产物能够完全去除。
具体地，本公开实施例提供的上述绑定方法中，上述反应剂，可以包括：松香树脂或间苯二甲酸。松香树脂和间苯二甲酸均为有机材料，采用有机材料作为上述反应剂更容易与绑定材料进行混合。
在具体实施时，绑定材料中一般会包括助焊剂，助焊剂可以促进绑定材料将发光二极管芯片与接触电极之间的焊接过程，因此可以将上述反应剂掺入到助焊剂中；而在回流焊工艺过程中，助焊剂也会随之挥发。
具体地，助焊剂是一种通常是以松香为主要成分的混合物，是保证焊接过程顺利进行的辅助材料，主要原料为有机溶剂(常用的有乙醇、丙醇、丁醇；丙酮、甲苯异丁基甲酮；醋酸乙酯,醋酸丁酯)，松香树脂及其衍生物、合成树脂表面活性剂、有机酸活化剂、防腐蚀剂，助溶剂、成膜剂等，也就是说，助焊剂是各种固体成分溶解在各种液体中形成的均匀透明的混合溶液。
在本公开的另一些实施例中，在步骤S102之后，在步骤S103之前的设定时间内，还可以包括：
将形成防氧化保护膜之后的驱动背板置于用于去除防氧化保护膜的反应剂中，并浸泡60～120s。
在形成防氧化保护膜之后，防氧化保护膜可以对接触电极起到保护作用，防止接触电极被氧化。在涂覆绑定材料之前的设定时间内去除防氧化保护膜，由于接触电极暴露的时间较短，在接触电极表面形成的氧化膜较薄，尽快在接触电极之上涂覆绑定材料，对绑定材料与接触电极之间的连接性能影响较小。在具体实施时，在去除防氧化保护膜的24小时内，在接触电极之上涂覆绑定材料，就不会影响绑定材料与接触电极之间的连接性能。
在具体实施时，将形成防氧化保护膜之后的驱动背板置于反应剂中，并浸泡60～120s就能去除防氧化保护膜，工艺设备简单，成本较低。将防氧化保护膜在反应剂中浸泡60～120s，能够保证防氧化保护膜能够完全去除。
具体地，本公开实施例提供的上述绑定方法中，上述反应剂，可以包括：间苯二甲酸、酒精或稀酸。将防氧化保护膜浸泡于有机溶剂(例如间苯二甲酸)或稀酸溶液中，可以较容易地将防氧化保护膜去除，工艺简单，成本低。
以稀硫酸为例，去除防氧化保护膜的具体反应式可为：
Cu-BTA+H 2SO 4→CuSO 4+BTA+H 2。
从上述反应式可以看出，去除防氧化保护膜后不会在接触电极之上形成 其他物质，能够将防氧化保护膜完全去除。
基于同一发明构思，本发明实施例还提供了一种背光模组，包括：驱动背板，位于驱动背板之上的多个电子元件，电子元件采用上述电连接方法与驱动背板中的接触电极绑定连接；
上述电子元件包括微型发光二极管；
上述背光模组还包括位于微型发光二极管出光侧的光学膜层。
本公开实施例中的上述背光模组中，微型发光二极管采用上述电连接方法与驱动背板中的接触电极绑定连接，因而微型发光二极管与接触电极的连接性能较好。可选地，在微型发光二极管的出光方向上，还可以设置扩散片、棱镜片等光学膜层，因而，背光模组可以为液晶显示面板提供均匀性较好的光线。
基于同一发明构思，本发明实施例还提供了一种显示面板，包括：驱动背板，以及位于驱动背板之上的多个电子元件，电子元件采用上述电连接方法与驱动背板中的接触电极绑定连接；
上述电子元件包括微型发光二极管。
本公开实施例中的上述显示面板中，微型发光二极管采用上述电连接方法与驱动背板中的接触电极绑定连接，因而微型发光二极管与接触电极的连接性能较好。
通过上述驱动背板对微型发光二极管进行驱动，可以实现每一个像素点的定址控制和单独驱动，从而实现画面显示。
具体地，上述微型发光二极管可以为mini LED，上述显示面板可以应用到大尺寸显示屏或分辨率要求较低的显示屏中。
基于同一发明构思，本发明实施例还提供了一种显示装置，包括上述背光模组以及位于背光模组的出光侧的液晶显示面板，即该显示装置可以为液晶显示装置；或，上述显示装置包括上述显示面板，即该显示装置也可以为LED显示装置。该显示装置可以应用于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。由于该 显示装置解决问题的原理与上述背光模组(或显示面板)相似，因此该显示装置的实施可以参见上述背光模组(或显示面板)的实施，重复之处不再赘述。
本公开实施例提供的上述电子元件的电连接方法及其相关装置中，通过在接触电极之上形成防氧化保护膜，可以使接触电极在很长时间内不被氧化，确保接触电极与绑定材料之间能够良好的连接，并且可以省去化镍金工艺，简化工艺。
尽管已描述了本公开的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本公开范围的所有变更和修改。
显然，本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开实施例的精神和范围。这样，倘若本公开实施例的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (12)

  1. 一种电子元件的电连接方法，其中，包括：
    提供一驱动背板；所述驱动背板包括多个接触电极；
    在所述接触电极之上形成防氧化保护膜；
    在所述防氧化保护膜对应于各所述接触电极的位置处涂覆绑定材料；
    将多个电子元件转移到对应的所述接触电极的位置处，将各所述电子元件与对应的所述接触电极进行绑定，并且，在将各所述电子元件与对应的所述接触电极完成绑定之前，去除各所述接触电极位置处的所述防氧化保护膜。
  2. 如权利要求1所述的电连接方法，其中，所述在所述接触电极之上形成防氧化保护膜，包括：
    将所述驱动背板置于防氧化保护溶液中，并浸泡30～90s。
  3. 如权利要求2所述的电连接方法，其中，所述将所述驱动背板置于防氧化保护溶液中，包括：
    将所述驱动背板置于苯并三氮唑的溶液中。
  4. 如权利要求1所述的电连接方法，其中，所述在所述防氧化保护膜对应于各所述接触电极的位置处涂覆绑定材料，包括：
    在所述防氧化保护膜的位置处涂覆锡膏。
  5. 如权利要求4所述的电连接方法，其中，所述将各所述电子元件与对应的所述接触电极进行绑定，包括：
    采用回流焊工艺，将各所述电子元件与对应的所述接触电极进行绑定。
  6. 如权利要求1所述的电连接方法，其中，所述绑定材料中掺有用于去除所述防氧化保护膜的反应剂；
    所述将各所述电子元件与对应的所述接触电极进行绑定，包括：
    在将各所述电子元件与对应的所述接触电极进行绑定的过程中，将所述反应剂与所述防氧化保护膜的产物及多余的所述反应剂挥发。
  7. 如权利要求6所述的电连接方法，其中，所述反应剂，包括：松香树 脂或间苯二甲酸。
  8. 如权利要求1所述的电连接方法，其中，所述在所述接触电极之上形成防氧化保护膜之后，在所述防氧化保护膜对应于各所述接触电极的位置处涂覆绑定材料之前的设定时间内，还包括：
    将形成所述防氧化保护膜之后的所述驱动背板置于用于去除所述防氧化保护膜的反应剂中，并浸泡60～120s。
  9. 如权利要求8所述的电连接方法，其中，所述反应剂，包括：间苯二甲酸、酒精或稀酸。
  10. 一种背光模组，其中，包括：驱动背板，位于所述驱动背板之上的多个电子元件，所述电子元件采用如权利要求1～9任一项所述的电连接方法与所述驱动背板中的接触电极绑定连接；
    所述电子元件包括微型发光二极管；
    所述背光模组还包括位于所述微型发光二极管出光侧的光学膜层。
  11. 一种显示面板，其中，包括：驱动背板，以及位于所述驱动背板之上的多个电子元件，所述电子元件采用如权利要求1～9任一项所述的电连接方法与所述驱动背板中的接触电极绑定连接；
    所述电子元件包括微型发光二极管。
  12. 一种显示装置，其中，包括：如权利要求10所述的背光模组以及位于所述背光模组的出光侧的液晶显示面板；或，如权利要求11所述的显示面板。
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JP2010067654A (ja) * 2008-09-09 2010-03-25 Sony Corp 半導体装置の製造方法
CN103582285A (zh) * 2012-07-31 2014-02-12 厦门中天启航电子科技有限公司 一种ito导电膜汇流电极及其制作方法
CN106684234A (zh) * 2017-01-20 2017-05-17 深圳市润芯科技有限公司 Led晶片封装基板、其制备方法及led光源

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JP2010067654A (ja) * 2008-09-09 2010-03-25 Sony Corp 半導体装置の製造方法
CN103582285A (zh) * 2012-07-31 2014-02-12 厦门中天启航电子科技有限公司 一种ito导电膜汇流电极及其制作方法
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