CN1137013C - 改进的抛光垫及其抛光方法 - Google Patents
改进的抛光垫及其抛光方法 Download PDFInfo
- Publication number
- CN1137013C CN1137013C CNB008029342A CN00802934A CN1137013C CN 1137013 C CN1137013 C CN 1137013C CN B008029342 A CNB008029342 A CN B008029342A CN 00802934 A CN00802934 A CN 00802934A CN 1137013 C CN1137013 C CN 1137013C
- Authority
- CN
- China
- Prior art keywords
- polishing
- burnishing surface
- polishing layer
- pad
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
- B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
- B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11654799P | 1999-01-21 | 1999-01-21 | |
| US60/116,547 | 1999-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1336861A CN1336861A (zh) | 2002-02-20 |
| CN1137013C true CN1137013C (zh) | 2004-02-04 |
Family
ID=22367847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB008029342A Expired - Lifetime CN1137013C (zh) | 1999-01-21 | 2000-01-21 | 改进的抛光垫及其抛光方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6354915B1 (enExample) |
| EP (1) | EP1161322A4 (enExample) |
| JP (1) | JP2002535843A (enExample) |
| KR (1) | KR100585480B1 (enExample) |
| CN (1) | CN1137013C (enExample) |
| WO (1) | WO2000043159A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI488712B (zh) * | 2011-12-16 | 2015-06-21 | Toyo Tire & Rubber Co | Polishing pad and manufacturing method thereof |
Families Citing this family (93)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60109601T2 (de) * | 2000-05-27 | 2006-02-09 | Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington | Rillen-polierkissen zum chemisch-mechanischen planarisieren |
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| SE0003550L (sv) * | 2000-10-03 | 2002-04-04 | Pergo Ab | Förfarande för framställning av ytelement |
| US6688956B1 (en) | 2000-11-29 | 2004-02-10 | Psiloquest Inc. | Substrate polishing device and method |
| US7059946B1 (en) | 2000-11-29 | 2006-06-13 | Psiloquest Inc. | Compacted polishing pads for improved chemical mechanical polishing longevity |
| US6684704B1 (en) * | 2002-09-12 | 2004-02-03 | Psiloquest, Inc. | Measuring the surface properties of polishing pads using ultrasonic reflectance |
| US6706383B1 (en) | 2001-11-27 | 2004-03-16 | Psiloquest, Inc. | Polishing pad support that improves polishing performance and longevity |
| US20050266226A1 (en) * | 2000-11-29 | 2005-12-01 | Psiloquest | Chemical mechanical polishing pad and method for selective metal and barrier polishing |
| US6596388B1 (en) | 2000-11-29 | 2003-07-22 | Psiloquest | Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor |
| US6579604B2 (en) | 2000-11-29 | 2003-06-17 | Psiloquest Inc. | Method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
| US6846225B2 (en) * | 2000-11-29 | 2005-01-25 | Psiloquest, Inc. | Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor |
| US6764574B1 (en) | 2001-03-06 | 2004-07-20 | Psiloquest | Polishing pad composition and method of use |
| US6575823B1 (en) | 2001-03-06 | 2003-06-10 | Psiloquest Inc. | Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof |
| US6568997B2 (en) | 2001-04-05 | 2003-05-27 | Rodel Holdings, Inc. | CMP polishing composition for semiconductor devices containing organic polymer particles |
| KR100858392B1 (ko) * | 2001-04-25 | 2008-09-11 | 제이에스알 가부시끼가이샤 | 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법 |
| US6818301B2 (en) * | 2001-06-01 | 2004-11-16 | Psiloquest Inc. | Thermal management with filled polymeric polishing pads and applications therefor |
| JP4686912B2 (ja) * | 2001-06-15 | 2011-05-25 | 東レ株式会社 | 研磨パッド |
| JP2003100682A (ja) * | 2001-09-25 | 2003-04-04 | Jsr Corp | 半導体ウエハ用研磨パッド |
| US20030207661A1 (en) * | 2002-05-01 | 2003-11-06 | Alexander Tregub | Annealing of CMP polishing pads |
| US6811467B1 (en) | 2002-09-09 | 2004-11-02 | Seagate Technology Llc | Methods and apparatus for polishing glass substrates |
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| AU2003272674A1 (en) * | 2002-09-25 | 2004-04-19 | Ppg Industries Ohio, Inc. | Polishing pad for planarization |
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| US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
| US6852982B1 (en) * | 2003-07-14 | 2005-02-08 | Fei Company | Magnetic lens |
| US20050055885A1 (en) * | 2003-09-15 | 2005-03-17 | Psiloquest | Polishing pad for chemical mechanical polishing |
| US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
| US7654885B2 (en) * | 2003-10-03 | 2010-02-02 | Applied Materials, Inc. | Multi-layer polishing pad |
| CN1301184C (zh) * | 2003-12-16 | 2007-02-21 | 汪开庆 | 加工半导体用兰宝石晶体基片的光学研磨机及其加工方法 |
| EP1561541B1 (en) * | 2004-02-05 | 2008-04-30 | JSR Corporation | Chemical mechanical polishing pad and polishing process |
| KR100545795B1 (ko) * | 2004-02-17 | 2006-01-24 | 에스케이씨 주식회사 | 연마 패드의 기재 패드와 이를 이용한 다층 패드 |
| US7059936B2 (en) * | 2004-03-23 | 2006-06-13 | Cabot Microelectronics Corporation | Low surface energy CMP pad |
| US7198549B2 (en) * | 2004-06-16 | 2007-04-03 | Cabot Microelectronics Corporation | Continuous contour polishing of a multi-material surface |
| US20060046064A1 (en) * | 2004-08-25 | 2006-03-02 | Dwaine Halberg | Method of improving removal rate of pads |
| US20060099891A1 (en) * | 2004-11-09 | 2006-05-11 | Peter Renteln | Method of chemical mechanical polishing, and a pad provided therefore |
| JP4475404B2 (ja) * | 2004-10-14 | 2010-06-09 | Jsr株式会社 | 研磨パッド |
| US20060154579A1 (en) * | 2005-01-12 | 2006-07-13 | Psiloquest | Thermoplastic chemical mechanical polishing pad and method of manufacture |
| JP5250934B2 (ja) * | 2005-01-31 | 2013-07-31 | 東レ株式会社 | 改善された研磨パッドの製造方法 |
| KR20060099398A (ko) * | 2005-03-08 | 2006-09-19 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 수계 연마 패드 및 제조 방법 |
| KR100909605B1 (ko) | 2005-03-08 | 2009-07-27 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| KR100949560B1 (ko) | 2005-05-17 | 2010-03-25 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| KR100709392B1 (ko) * | 2005-07-20 | 2007-04-20 | 에스케이씨 주식회사 | 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드 |
| JP4884725B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4898172B2 (ja) * | 2005-09-08 | 2012-03-14 | 日本ミクロコーティング株式会社 | 研磨パッド及びその製造方法並びに研磨方法 |
| TW200720017A (en) * | 2005-09-19 | 2007-06-01 | Rohm & Haas Elect Mat | Water-based polishing pads having improved adhesion properties and methods of manufacture |
| JP5031236B2 (ja) | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
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| CN100425405C (zh) * | 2006-08-03 | 2008-10-15 | 南京航空航天大学 | 冷冻纳米磨料抛光垫及其制备方法 |
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| US6022268A (en) * | 1998-04-03 | 2000-02-08 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| JP2001518852A (ja) * | 1997-04-04 | 2001-10-16 | ローデル ホールディングス インコーポレイテッド | 改良研磨パッド及びこれに関連する方法 |
| KR20010006518A (ko) * | 1997-04-18 | 2001-01-26 | 매튜 네빌 | 반도체 기판용 연마 패드 |
| US5928070A (en) * | 1997-05-30 | 1999-07-27 | Minnesota Mining & Manufacturing Company | Abrasive article comprising mullite |
| GB2334205B (en) * | 1998-02-12 | 2001-11-28 | Shinetsu Handotai Kk | Polishing method for semiconductor wafer and polishing pad used therein |
| US6095902A (en) * | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
-
2000
- 2000-01-21 JP JP2000594606A patent/JP2002535843A/ja active Pending
- 2000-01-21 WO PCT/US2000/001495 patent/WO2000043159A1/en not_active Ceased
- 2000-01-21 EP EP00906976A patent/EP1161322A4/en not_active Withdrawn
- 2000-01-21 US US09/488,414 patent/US6354915B1/en not_active Expired - Lifetime
- 2000-01-21 KR KR1020017009180A patent/KR100585480B1/ko not_active Expired - Lifetime
- 2000-01-21 CN CNB008029342A patent/CN1137013C/zh not_active Expired - Lifetime
-
2002
- 2002-02-08 US US10/071,668 patent/US6500053B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI488712B (zh) * | 2011-12-16 | 2015-06-21 | Toyo Tire & Rubber Co | Polishing pad and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US6500053B2 (en) | 2002-12-31 |
| JP2002535843A (ja) | 2002-10-22 |
| CN1336861A (zh) | 2002-02-20 |
| KR20010101623A (ko) | 2001-11-14 |
| US20020098782A1 (en) | 2002-07-25 |
| EP1161322A1 (en) | 2001-12-12 |
| EP1161322A4 (en) | 2003-09-24 |
| KR100585480B1 (ko) | 2006-06-02 |
| WO2000043159A1 (en) | 2000-07-27 |
| US6354915B1 (en) | 2002-03-12 |
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