CN113681736A - Silicon rod processing method - Google Patents
Silicon rod processing method Download PDFInfo
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- CN113681736A CN113681736A CN202110872549.XA CN202110872549A CN113681736A CN 113681736 A CN113681736 A CN 113681736A CN 202110872549 A CN202110872549 A CN 202110872549A CN 113681736 A CN113681736 A CN 113681736A
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- silicon rod
- diamond wire
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- slip
- cutting
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 199
- 239000010703 silicon Substances 0.000 title claims abstract description 199
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 198
- 238000003672 processing method Methods 0.000 title claims abstract description 21
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 126
- 239000010432 diamond Substances 0.000 claims abstract description 126
- 238000000034 method Methods 0.000 claims abstract description 43
- 230000000452 restraining effect Effects 0.000 claims abstract 2
- 238000003754 machining Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 53
- 238000005498 polishing Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The embodiment of the invention provides a silicon rod processing method, which comprises the following steps: processing a projection area of the diamond wire on the silicon rod along the diamond wire to form an anti-skidding structure, wherein the anti-skidding structure is used for restricting and limiting the diamond wire; and controlling the diamond wire to cut from the anti-skid structure part along a preset feeding direction so as to remove the flaw-piece. The anti-slip structure provided by the embodiment of the invention can play a role in restraining and limiting the flexible diamond wire, prevent the diamond wire from swinging on the surface of the silicon rod in the cutting process, enable the feeding motion of the diamond wire to be more stable, contribute to improving the consistency of the surface of the cut side surface of the silicon rod, reduce the processing extreme difference, save the subsequent polishing and grinding process, simplify the processing process, reduce the processing time and improve the processing efficiency.
Description
Technical Field
The invention relates to the technical field of silicon rod production, in particular to a silicon rod processing method.
Background
In the process of manufacturing a solar cell, generally, a silicon rod obtained by pulling a crystal is cut and peeled to form a quasi-square rod with a square section, and then the quasi-square rod obtained by cutting is polished to enable the surface quality to meet the precision requirement, and then the silicon wafer is sliced to obtain a silicon wafer.
At present, the head (shouldering position) and the tail (ending position) of the silicon rod are cut off at sites with unsatisfactory resistivity, and then a diamond wire net is used for cutting the silicon rod from the end face of the silicon rod by a cutter so as to remove the edge skin of the silicon rod in the circumferential direction and obtain the quasi-square rod required by the subsequent processing.
In the actual production process, when the diamond wire mesh is cut into a cutter, the diamond wire and the surface of the silicon rod are easy to slip, the cutting stability of the diamond wire is affected, and further the processing precision and quality of the silicon rod are affected, if the silicon rod processing surface with high quality is needed, the surface of the silicon rod needs to be further polished. Therefore, if the conventional silicon rod processing method needs to obtain a high-quality square rod, the processing procedure is complicated, the processing time is long, and the production efficiency is low.
Disclosure of Invention
The embodiment of the invention provides a silicon rod processing method, which aims to solve the problems that the existing silicon rod processing method is complicated in process, long in processing time and low in processing efficiency.
In order to solve the above problems, the present invention is realized by:
the embodiment of the invention provides a silicon rod processing method, which comprises the following steps:
processing a projection area of the diamond wire on the silicon rod along the diamond wire to form an anti-skidding structure, wherein the anti-skidding structure is used for restricting and limiting the diamond wire;
and controlling the diamond wire to cut from the anti-skid structure part along a preset feeding direction so as to remove the flaw-piece.
In the embodiment of the invention, in the process of cutting and peeling the silicon rod prepared by pulling crystal, an anti-slip structure is processed and formed along the projection area of the diamond wire on the silicon rod in advance, and the diamond wire is controlled to cut along the preset feeding direction from the anti-slip structure part to remove the flaw-piece when cutting the silicon rod. In this cutting process, anti-skidding structure can play the restraint limiting displacement to the diamond wire that has the flexibility, prevents the swing of cutting process diamond wire on the silicon rod surface for the feed motion of diamond wire is more stable, helps promoting the uniformity of the surperficial each department after the cutting of silicon rod side, can reduce the processing utmost point poor, saves follow-up polishing process of polishing, can simplify the manufacturing procedure, and it is long when reducing processing, promotes machining efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 shows a flow chart of a method for processing a silicon rod according to a first embodiment of the invention;
FIG. 2 is a schematic view of a non-slip structure according to an embodiment of the present invention;
FIG. 3 is a schematic view of a first anti-slip arrangement according to an embodiment of the invention;
FIG. 4 is a schematic view of a second slip prevention structure according to an embodiment of the present invention;
FIG. 5 is a schematic process view illustrating a method for processing a silicon rod according to an embodiment of the present invention;
FIG. 6 is an enlarged partial schematic view of the I position of FIG. 5 according to an embodiment of the present invention;
FIG. 7 is a schematic process diagram illustrating another method for processing a silicon rod according to an embodiment of the present invention;
FIG. 8 is an enlarged partial view of the position II of FIG. 7 in accordance with an embodiment of the present invention;
FIG. 9 is a schematic view of a third non-slip arrangement according to an embodiment of the present invention;
FIG. 10 is a schematic view of a fourth non-slip arrangement according to an embodiment of the present invention;
fig. 11 shows a flowchart of a silicon rod processing method according to a second embodiment of the present invention;
fig. 12 is a flowchart illustrating a silicon rod processing method according to a third embodiment of the present invention.
Description of reference numerals:
10-diamond wire, 20-silicon rod and 201-antiskid structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In various embodiments of the present invention, it should be understood that the sequence numbers of the following processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
Example one
Referring to fig. 1, a flowchart of a silicon rod processing method according to an embodiment of the present invention is shown, which may specifically include the following steps:
101, processing a projection area of the diamond wire on the silicon rod to form an anti-skidding structure, wherein the anti-skidding structure is used for restricting and limiting the diamond wire.
The silicon rod processing method provided by the embodiment of the invention can be used in the silicon rod processing process with a diamond wire as a cutting tool, the processed silicon rod can be a polycrystalline silicon rod prepared by using a primary polycrystalline silicon material, and can also be a single crystal silicon rod, and the embodiment of the invention does not limit the type of the silicon rod.
In the machining process, the feeding motion of the diamond wire on the surface of the silicon rod can be realized by utilizing the self winding and unwinding motion of the diamond wire and the relative motion between the diamond wire and the silicon rod, and then the cylindrical silicon rod is cut into a quasi-square rod with an approximately square section. It is understood that a quasi-square rod refers to a square with a nonstandard silicon rod cross section, and the four corners of the square can retain short arc transitions. In practical application, the cylindrical silicon rod can be cut into a cube with a cross section of other polygons according to the requirements of subsequent silicon rod slicing.
When the cutting device is used for cutting, the diamond wire 10 may be kept at a distance from the silicon rod 20, and the distance is used for accommodating the entering of the auxiliary cutting tool. The anti-slip structure 201 may be processed along a projected area on the silicon rod 20 along the diamond wire 10 using an auxiliary cutting tool. For example, the anti-slip groove shown in fig. 2 and 4 or the anti-slip platform shown in fig. 3 can be processed and formed in the projection area by non-contact laser processing or contact mechanical cutting and grinding. When laser processing is adopted, the power of the laser needs to be appropriate, the silicon rod crystals can be burned off due to the fact that the power of the laser is too large, the processing efficiency is low due to the fact that the power of the laser is too small, and the appropriate laser can be determined according to the silicon rod size, the processing cost and other factors. Similarly, the grinding plate needs to have a proper speed, too large the grinding plate may crack the silicon rod crystal, too small the grinding plate may cause low processing efficiency, and the proper grinding plate and the processing speed thereof may be determined according to the silicon rod size, the processing cost and other factors.
It should be noted that the anti-skid structure 201 may be a rectangular, arc, triangular, trough-shaped or stepped right-angle platform. Therefore, the anti-slip structure 201 includes at least two receiving spaces formed by intersecting surfaces, and the receiving spaces can restrict and limit the diamond wires to prevent slipping. It will be appreciated that for the anti-skid structure 201, at least two intersecting surfaces form an open opening, i.e., a receiving space, therebetween. The width and the depth of the opening of the accommodating space are 0.8 to 2.0 times of the diameter of the diamond wire. When the size of the accommodating space is more than or equal to 0.8 times of the diameter of the diamond wire, the situation that the diamond wire is difficult to restrain due to too narrow accommodating space can be avoided, and when the size of the accommodating space is less than or equal to 2.0 times of the diameter of the diamond wire, too much silicon rod material can be prevented from being removed to cause too much loss.
Illustratively, in conjunction with the illustrations of fig. 5 and 6, the anti-slip structure 201 may be a three-surface formed anti-slip channel that includes a first dimension W and a second dimension H that are perpendicular to each other. When the first dimension W is perpendicular to the axis of the silicon rod and the second dimension H is perpendicular to the axis of the silicon rod, the anti-slip structure 201 may be an anti-slip groove illustrated in fig. 5, where the first dimension W is an opening width of the accommodating space corresponding to the anti-slip groove, and the second dimension H is an opening depth of the accommodating space corresponding to the anti-slip groove.
Illustratively, in combination with the schematic diagrams of fig. 7 and 8, the anti-slip structure 201 may be an anti-slip platform formed by two surfaces, and the anti-slip platform is in a right-angle step shape and has a horizontal plane and a vertical plane which are perpendicular to each other. The non-skid platform includes a first dimension W and a second dimension H that are perpendicular to each other. When the first dimension W is perpendicular to the axis of the silicon rod and the second dimension H is perpendicular to the axis of the silicon rod, the anti-slip structure 201 may be an anti-slip platform illustrated in fig. 7, where the first dimension W is an opening width of the accommodating space corresponding to the anti-slip platform, and the second dimension H is an opening depth of the accommodating space corresponding to the anti-slip platform.
In addition, as shown in fig. 4, when the anti-slip structure 201 is processed on the end surface of the silicon rod, the first dimension is still the opening width of the accommodating space corresponding to the anti-slip structure 201, and the second dimension is still the opening depth of the accommodating space corresponding to the anti-slip structure 201, which is not described herein again. As shown in fig. 9 and 10, the anti-slip structures 201, which are provided on the side surfaces of the silicon rod and have a triangular groove and an arc-shaped groove in cross section, are provided with an opening width W and an opening depth H, which are not described herein again.
No matter be the antiskid structure of antiskid groove or antiskid platform, can form the restraint limiting displacement to the buddha's warrior attendant line, the swing of restriction buddha's warrior attendant line income sword cutting initial stage. Particularly, when the diamond wire is contacted with the curved surface of the cylindrical silicon rod, the sliding deviation of the diamond wire along the curved surface can be effectively avoided.
And 102, controlling the diamond wire to cut from the anti-skid structure part along a preset feeding direction so as to remove the flaw-piece.
After the anti-slip structure is processed, the diamond wire and the silicon rod can be controlled to be close to each other. For example, the driving device can drive the diamond wire to move close to the silicon rod, or the driving device can drive the clamp to clamp the silicon rod to move close to the diamond wire, and the diamond wire is still in the retracting and releasing movement in the process of mutual approaching. The diamond wire can be cut along the preset feeding direction from the anti-skid structure part in a motion state so as to remove the edge skin. In practical application, the diamond wire winding and unwinding speed, namely the linear speed, can be 15m/s-30m/s, the moving speed, namely the cutting speed, of the diamond wire and the silicon rod approaching each other can be 5mm/min-60mm/min, and the linear speed and the cutting speed can be specifically determined according to factors such as different wire diameters and specifications of the silicon rod, so as to give consideration to both the processing quality and the processing efficiency. Illustratively, the cutting can be from the position of the antiskid groove, as shown in fig. 2, or from the position of the antiskid platform, as shown in fig. 3. Fig. 5 and 7 show schematic diagrams of processes for forming quasi-square rods after cutting, and the cutting process can cut and remove the edge skin part around the silicon rod.
In the embodiment of the invention, when the diamond wire is used for cutting the periphery of the silicon rod to remove the flaw-piece, the anti-slip structure can be processed and formed along the projection area of the diamond wire on the silicon rod in advance, the anti-slip structure is used for restricting and limiting the cutting movement of the diamond wire, the swing amplitude of the diamond wire in the initial stage of the cutter entering can be reduced, the feeding movement of the diamond wire is more stable, and the consistency of the surface of the silicon rod after the side surface cutting is improved. Through detecting and comparing the cut silicon rod side surfaces, the range difference between the two ends and the middle of the silicon rod side surface processed by the processing method without the anti-skid structure is 0.2mm-0.5mm, and the range difference between the two ends and the middle of the silicon rod side surface processed by the processing method is less than or equal to 0.2mm, so that the silicon rod processing method can reduce the range difference through the detection result of the silicon rod, is beneficial to saving the subsequent polishing and grinding processes, can simplify the processing processes, is long in processing time and improves the processing efficiency.
Example two
Referring to fig. 9, a flowchart of a silicon rod processing method according to a second embodiment of the present invention is shown, which may specifically include the following steps:
In the embodiment of the invention, the cylindrical silicon rod can be moved into the silicon rod cutting equipment by using a device such as a mechanical arm, and the silicon rod is clamped by using a clamp. When the silicon rod is clamped, the axis of the silicon rod can be in a horizontal plane by adopting a horizontal clamping mode, or the axis of the silicon rod can be in a vertical plane by adopting a vertical clamping mode. Specifically, a horizontal clamping scheme or a vertical clamping scheme can be selected according to the structural type of the cutting equipment and the requirements of the machining process, and the clamping mode is not particularly limited in the embodiment of the invention.
In the embodiment of the invention, no matter what clamping method is adopted for the silicon rod, no matter the cutting is started from the side surface or the end surface of the silicon rod, a certain tool setting distance is arranged between the diamond wire and the silicon rod before the diamond wire starts to cut, and the diamond wire can form a straight line-shaped projection with the width approximately equal to the diameter of the diamond wire on the side surface or the end surface of the silicon rod. For example, a diamond wire is suspended over a silicon rod, forming a projection on the surface of the silicon rod. When the diamond wire and the silicon rod are close to each other and contact, the diamond wire is overlapped with and closely attached to the position corresponding to the projection area, and the diamond wire can cut the silicon rod from the position.
And step 203, processing and forming an anti-slip structure on the side surface of the silicon rod.
In the embodiment of the invention, taking horizontal clamping of the silicon rod as an example, when the cutter is inserted from the side surface of the silicon rod for cutting, the projection area of the diamond wire on the side surface of the silicon rod can be determined as the cutting position. The projection of the diamond wire on the side surface is a straight line with the diameter nearly equal to that of the diamond wire, and the straight line is the cut-in position of the diamond wire on the side surface of the silicon rod. It can be understood that the anti-slip structure can be processed at the cutting-in position of the side surface of the silicon rod in a laser processing mode or a mechanical polishing mode, and when the anti-slip structure is a structure such as a notch or a groove on the side surface of the silicon rod close to two ends of the silicon rod, the position of the diamond wire at two ends of the silicon rod can be limited, so that slipping is prevented.
In one embodiment, in particular, the anti-slip structures penetrating through both ends of the silicon rod are machined on the side surface of the silicon rod in the direction parallel to the axis of the silicon rod.
With reference to the schematic diagrams of fig. 2 and 3, the anti-slip structure may be an anti-slip groove or an anti-slip platform, and may penetrate through end surfaces of two ends of the silicon rod. Therefore, the diamond wires can be completely restrained and limited from one end to the other end of the silicon rod, and synchronous feeding of all parts of the diamond wires in the silicon rod cutting process is facilitated to be guaranteed. It should be noted that, when the processing consumption of the anti-slip structure needs to be saved, the anti-slip structure may be a discontinuous through discontinuous structure disposed on the side surface of the silicon rod, for example, a discontinuous anti-slip groove.
And 204, controlling the diamond wire to cut from the anti-skid structure part along a preset feeding direction so as to remove the flaw-piece.
In the embodiment of the present invention, step 204 may refer to step 102, and is not described herein again to avoid repetition. When the diamond wire is cut by entering the cutter from the side of the silicon rod, the preset feeding direction is perpendicular to the axis L of the silicon rod 20, i.e., the Z direction illustrated in fig. 2 or 3. It can be understood that if one diamond wire is used for cutting, the quasi-square rod can be obtained by cutting the side surface of the silicon rod for four times, and if two parallel diamond wires are used for cutting, after the diamond wires and the silicon rod are cut for the first time, the diamond wires and the silicon rod are relatively rotated for 90 degrees to be cut for the second time, so that the quasi-square rod can be obtained. Therefore, the number of the diamond wires used and the arrangement thereof are not further limited in the embodiment of the present invention. Because the anti-skidding structure of processing in advance makes the sword of going into of buddha's warrior attendant line more steady reliable, consequently, the side quality of the silicon rod that obtains after the cutting is more excellent, then need not to continue to carry on follow-up polishing grinding treatment, can save the polishing process, simplifies the manufacturing procedure, and it is long to reduce processing, promotes machining efficiency.
In the embodiment of the invention, the silicon rod can be horizontally or vertically clamped by adopting the diamond wire to be cut by entering the diamond wire from the side surface of the silicon rod, when the diamond wire is used for cutting the periphery of the silicon rod to remove the edge skin, an anti-skid structure can be processed and formed along the projection area of the diamond wire on the silicon rod in advance, the anti-skid structure is used for restricting and limiting the cutting movement of the diamond wire, the swing amplitude of the diamond wire at the initial stage of entering the cutter can be reduced, the feeding movement of the diamond wire is more stable, and the consistency of the cut side surface of the silicon rod at all positions is favorably improved. Through detecting and comparing the cut silicon rod side surfaces, the range difference between the two ends and the middle of the silicon rod side surface processed by the processing method without the anti-skid structure is 0.2mm-0.5mm, and the range difference between the two ends and the middle of the silicon rod side surface processed by the processing method is less than or equal to 0.2mm, so that the silicon rod processing method can reduce the processing range difference through the detection result of the silicon rod, is beneficial to saving the subsequent polishing and grinding process, can simplify the processing process, is long in processing time, and improves the processing efficiency. It can be understood that, when the cutting is performed in the manner that the diamond wire is parallel to the axis of the silicon rod in the embodiment, the adjustment process of the included angle between the diamond wire and the axis of the silicon rod is not needed, which is also helpful for simplifying the cutting operation process and improving the processing efficiency.
EXAMPLE III
Referring to fig. 10, a flowchart of a silicon rod processing method according to a third embodiment of the present invention is shown, which may specifically include the following steps:
In the embodiment of the invention, the cylindrical silicon rod can be moved into the silicon rod cutting equipment by using a device such as a mechanical arm, and the silicon rod is clamped by using a clamp. When the silicon rod is clamped, the axis of the silicon rod can be in a horizontal plane by adopting a horizontal clamping mode, or the axis of the silicon rod can be in a vertical plane by adopting a vertical clamping mode. Specifically, a horizontal clamping scheme or a vertical clamping scheme can be selected according to the structural type of the cutting equipment and the requirements of the machining process, and the clamping mode is not particularly limited in the embodiment of the invention.
In the embodiment of the invention, no matter what clamping method is adopted for the silicon rod, no matter the cutting is started from the side surface or the end surface of the silicon rod, a certain tool setting distance is arranged between the diamond wire and the silicon rod before the diamond wire starts to cut, and the diamond wire can form a straight line-shaped projection with the width approximately equal to the diameter of the diamond wire on the side surface or the end surface of the silicon rod. For example, a diamond wire is suspended over a silicon rod, forming a projection on the surface of the silicon rod. When the diamond wire and the silicon rod are close to each other and contact, the diamond wire is overlapped with and closely attached to the position corresponding to the projection area, and the diamond wire can cut the silicon rod from the position.
Step 303, processing and forming an anti-slip structure on the side surface of the silicon rod, wherein the projection area is the projection of the diamond wire on the side surface of the silicon rod.
In the embodiment of the invention, taking horizontal clamping of the silicon rod as an example, when the silicon rod is cut by entering the cutter from the end surface of the silicon rod, the projection area of the diamond wire on the end surface of the silicon rod can be determined as the cutting position. The projection of the diamond wire on the end surface is a straight line with the diameter nearly equal to that of the diamond wire, and the straight line is the cut-in position of the diamond wire on the end surface of the silicon rod. It can be understood that the anti-slip structure can be processed at the cutting position of the end surface of the silicon rod in a laser processing mode or a mechanical polishing mode, and when the anti-slip structure is a structure such as a notch or a groove of the end surface of the silicon rod close to a circular contour edge, the position of the diamond wire on the edge of the end surface can be limited, so that slipping is prevented.
In one embodiment, in particular, an anti-slip structure is machined on the end face of the silicon rod in a direction perpendicular to the axis of the silicon rod, wherein the anti-slip structure penetrates through the side face of the silicon rod.
With reference to the schematic illustration of fig. 4, the anti-slip structure may be an anti-slip groove or an anti-slip platform, which may penetrate the side surface of the silicon rod. Therefore, the diamond wires can be completely restrained and limited in parallel to the end faces of the silicon rods, and synchronous feeding of all parts of the diamond wires in the silicon rod cutting process is facilitated to be guaranteed. It should be noted that, when the processing consumption of the anti-slip structure needs to be saved, the anti-slip structure may be a discontinuous through discontinuous structure disposed on the end surface of the silicon rod, for example, a discontinuous anti-slip groove.
And 304, controlling the diamond wire to cut from the anti-skid structure part along a preset feeding direction so as to remove the flaw-piece.
In the embodiment of the present invention, step 304 may refer to step 102 described above, and is not described herein again to avoid repetition.
When the diamond wire is cut from the end surface of the silicon rod by the cutter, the preset feeding direction is parallel to the axis L of the silicon rod 20, i.e., the Z direction shown in fig. 4. It can be understood that if adopt a diamond wire cutting, can obtain accurate square rod at the terminal surface cutting quartic of silicon rod, if adopt two parallel diamond wire cutting, after the first time cutting, carry out the cutting for the second time with diamond wire and silicon rod relative rotation 90 degrees and can obtain accurate square rod, if adopt four diamond wire cutting that are the groined type and arrange, once cut can obtain accurate square rod. Therefore, the number of the diamond wires used and the arrangement thereof are not further limited in the embodiment of the present invention. Because the anti-skidding structure of processing in advance makes the sword of going into of buddha's warrior attendant line more steady reliable, consequently, the side quality of the silicon rod that obtains after the cutting is more excellent, need not to continue to carry out follow-up polishing grinding treatment, can save the polishing process, simplifies the manufacturing procedure, and it is long to reduce processing, promotes machining efficiency.
In the embodiment of the invention, the silicon rod can be horizontally or vertically clamped by adopting a diamond wire to be cut by entering the diamond wire from the side surface of the silicon rod, when the diamond wire is used for cutting the periphery of the silicon rod to remove the edge skin, an anti-slip structure can be processed and formed along the projection area of the diamond wire on the silicon rod in advance, the cutting motion of the diamond wire is restrained and limited by the anti-slip structure, the swing amplitude of the diamond wire at the initial stage of entering the cutter can be reduced, the feeding motion of the diamond wire is more stable, the consistency of the cut surface of the side surface of the silicon rod is improved, the range of the diamond wire is reduced, the subsequent polishing and grinding process is saved, the processing process is simplified, the processing time is shortened, and the processing efficiency is improved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A method of processing a silicon rod, the method comprising:
processing a projection area of the diamond wire on the silicon rod along the diamond wire to form an anti-skidding structure, wherein the anti-skidding structure is used for restricting and limiting the diamond wire;
and controlling the diamond wire to cut from the anti-skid structure part along a preset feeding direction so as to remove the flaw-piece.
2. The method of processing a silicon rod according to claim 1, wherein the processing of the projected area of the silicon rod along the diamond wire to form an anti-slip structure further comprises:
and determining a projection area of the diamond wire on the silicon rod as a cut-in position.
3. The method of processing a silicon rod according to claim 2, wherein the processing of the projected area of the silicon rod along the diamond wire to form an anti-slip structure comprises:
and processing the side surface of the silicon rod to form an anti-skidding structure, wherein the projection area is the projection of the diamond wire on the side surface of the silicon rod.
4. The method of claim 3, wherein the machining of the anti-slip feature on the side of the silicon rod comprises:
and processing the side surface of the silicon rod along the direction parallel to the axis of the silicon rod to form an anti-skid structure penetrating through two ends of the silicon rod.
5. The method as recited in claim 3 or 4, characterized in that the predetermined feed direction is perpendicular to the axis of the silicon rod.
6. The method of processing a silicon rod according to claim 2, wherein the processing of the projected area of the silicon rod along the diamond wire to form an anti-slip structure comprises:
and processing the end surface of the silicon rod to form an anti-skidding structure, wherein the projection area is the projection of the diamond wire on the end surface of the silicon rod.
7. The method of claim 6, wherein machining an anti-slip feature on an end surface of the silicon rod comprises:
and processing and forming an anti-skid structure penetrating through the side surface of the silicon rod on the end surface of the silicon rod along the direction vertical to the axis of the silicon rod.
8. The method as recited in claim 6 or 7, characterized in that the predetermined feed direction is parallel to the axis of the silicon rod.
9. The method of processing a silicon rod according to claim 1, wherein the processing of the projected area of the silicon rod along the diamond wire to form an anti-slip structure further comprises:
and clamping the silicon rod at a processing position, wherein the axis of the silicon rod is in a horizontal plane or a vertical plane.
10. The silicon rod processing method according to claim 1, wherein the anti-slip structure comprises an accommodating space formed by at least two intersecting surfaces, and the accommodating space is used for restraining and limiting the diamond wire;
the width and the depth of the opening of the accommodating space are 0.8 to 2.0 times of the diameter of the diamond wire.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114523409A (en) * | 2022-02-08 | 2022-05-24 | 隆基绿能科技股份有限公司 | Clamping and centering method and silicon rod processing equipment |
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