CN113677519A - 叠层体 - Google Patents

叠层体 Download PDF

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Publication number
CN113677519A
CN113677519A CN202080027107.9A CN202080027107A CN113677519A CN 113677519 A CN113677519 A CN 113677519A CN 202080027107 A CN202080027107 A CN 202080027107A CN 113677519 A CN113677519 A CN 113677519A
Authority
CN
China
Prior art keywords
copper
laminate
laminate according
base material
resin base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080027107.9A
Other languages
English (en)
Chinese (zh)
Inventor
小畠直贵
佐藤牧子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN113677519A publication Critical patent/CN113677519A/zh
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00Polyvinylhalogenides
    • B32B2327/12Polyvinylhalogenides containing fluorine
    • B32B2327/18PTFE, i.e. polytetrafluoroethylene
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2371/00Polyethers, e.g. PEEK, i.e. polyether-etherketone; PEK, i.e. polyetherketone
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202080027107.9A 2019-05-09 2020-05-07 叠层体 Pending CN113677519A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019089122A JP7328671B2 (ja) 2019-05-09 2019-05-09 積層体
JP2019-089122 2019-05-09
PCT/JP2020/018582 WO2020226162A1 (ja) 2019-05-09 2020-05-07 積層体

Publications (1)

Publication Number Publication Date
CN113677519A true CN113677519A (zh) 2021-11-19

Family

ID=73044462

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080027107.9A Pending CN113677519A (zh) 2019-05-09 2020-05-07 叠层体

Country Status (5)

Country Link
JP (1) JP7328671B2 (ko)
KR (1) KR20220007038A (ko)
CN (1) CN113677519A (ko)
TW (1) TW202043034A (ko)
WO (1) WO2020226162A1 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101687390A (zh) * 2007-06-27 2010-03-31 富士胶片株式会社 具有金属表面粗糙化层的金属层叠层体及其制造方法
TW201352094A (zh) * 2012-05-10 2013-12-16 Hitachi Chemical Co Ltd 多層配線基板
US20140204546A1 (en) * 2013-01-19 2014-07-24 International Business Machines Corporation PCB stackup having high- and low-frequency conductive layers and having insulating layers of different material types
CN104943270A (zh) * 2014-03-31 2015-09-30 Jx日矿日石金属株式会社 附载体的铜箔、印刷布线板、层压体、电子机器及印刷布线板的制造方法
CN107923047A (zh) * 2015-07-29 2018-04-17 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板及印刷电路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144944A (ja) * 1996-09-12 1998-05-29 Canon Inc 光起電力素子
JP4528204B2 (ja) * 2005-05-31 2010-08-18 日立ビアメカニクス株式会社 プリント配線板の製造方法
JP2008173967A (ja) * 2006-12-18 2008-07-31 Taisei Plas Co Ltd 金属と樹脂の複合体とその製造方法
JP4965649B2 (ja) * 2007-04-06 2012-07-04 大成プラス株式会社 銅合金複合体とその製造方法
KR102245529B1 (ko) * 2016-03-30 2021-04-30 아사히 가세이 가부시키가이샤 셀룰로오스 미세 섬유층을 포함하는 수지 복합 필름

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101687390A (zh) * 2007-06-27 2010-03-31 富士胶片株式会社 具有金属表面粗糙化层的金属层叠层体及其制造方法
TW201352094A (zh) * 2012-05-10 2013-12-16 Hitachi Chemical Co Ltd 多層配線基板
US20140204546A1 (en) * 2013-01-19 2014-07-24 International Business Machines Corporation PCB stackup having high- and low-frequency conductive layers and having insulating layers of different material types
CN104943270A (zh) * 2014-03-31 2015-09-30 Jx日矿日石金属株式会社 附载体的铜箔、印刷布线板、层压体、电子机器及印刷布线板的制造方法
CN107923047A (zh) * 2015-07-29 2018-04-17 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板及印刷电路板

Also Published As

Publication number Publication date
JP7328671B2 (ja) 2023-08-17
KR20220007038A (ko) 2022-01-18
WO2020226162A1 (ja) 2020-11-12
TW202043034A (zh) 2020-12-01
JP2020183085A (ja) 2020-11-12

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