CN113672063A

CN113672063A - Electronic device

Info

Publication number: CN113672063A
Application number: CN202110858162.9A
Authority: CN
Inventors: 李养余; 霍国亮; 王晓光
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-07-28
Filing date: 2021-07-28
Publication date: 2021-11-19

Abstract

The application provides an electronic device. Electronic equipment includes casing, heating element and fan, and the casing is equipped with first air inlet and thermovent, and first air inlet and thermovent all communicate the inboard and the outside of casing, and heating element and fan all are located the inboard of casing, and the fan is located between first air inlet and the thermovent, and the fan is used for transmitting the outside of casing through the thermovent with the heat that heating element produced. The electronic equipment provided by the application solves the technical problem that the heat dissipation performance of the existing electronic equipment is not good.

Description

Electronic device

Technical Field

The application relates to the technical field of electronic products, in particular to an electronic device.

Background

Electronic devices are becoming more and more popular with users due to their portability. However, the heat dissipation performance of the conventional electronic device is poor, so that the temperature of the shell is relatively high, and the use experience of a user is seriously influenced.

Disclosure of Invention

The application provides an electronic device to solve the technical problem that the heat dissipation performance of the existing electronic device is poor.

For solving above problem, this application provides an electronic equipment, electronic equipment includes casing, heating element and fan, the casing is equipped with first air inlet and thermovent, first air inlet with the thermovent all communicates the inboard and the outside of casing, heating element with the fan all is located the inboard of casing, the fan is located first air inlet with between the thermovent, the fan be used for with the heat warp that heating element produced the thermovent transmits extremely the outside of casing.

In this embodiment, through setting up fan, thermovent and first air inlet, the heat that makes the heating element during operation that is located the casing inboard can in time discharge the external world, reduces the temperature of casing, promotes user's use and experiences to, also can avoid the overheated performance that influences electronic equipment of heating element, even cause the damage to electronic equipment. Simultaneously, through locating the fan between first air inlet and thermovent, namely first air inlet and thermovent locate the both ends of fan respectively, increased the distance between first air inlet and the thermovent to can avoid getting into the inboard of casing from first air inlet again from thermovent exhaust hot gas, improve electronic equipment's radiating efficiency.

In one embodiment, the housing is further provided with a second air inlet, and the second air inlet is located on one side of the first air inlet, which is away from the heat dissipation port, and is communicated with the inner side and the outer side of the housing. In this embodiment, through setting up the second air inlet, the inboard speed that the low temperature gas among the external environment got into the casing has not only been increased, locate the position of keeping away from fan and thermovent with the second air inlet moreover, make the outside air that gets into from the second air inlet at the inboard flow path of casing lengthen, thereby increased the contact time of outside air and heating element, further reduce heating element's temperature, can improve electronic equipment's radiating efficiency greatly, further promote electronic equipment's heat dispersion.

In one embodiment, the housing includes a top surface, the top surface includes a palm rest area, the electronic device further includes a heat insulation member, the heat insulation member is located inside the housing and between the heat generating element and the palm rest area, and a projection of the heat insulation member on the top surface at least partially covers the palm rest area. In one embodiment, the projection of the thermal insulation element on the top surface completely covers the palm rest area. Through set up the heat insulating part between palm support district and heating element, can block that heating element work produces heat and transmit to palm support district, effectively reduce the temperature in palm support district, improve user's use and experience.

In one embodiment, the electronic device further comprises a keyboard mounted to the housing and exposed relative to the top surface, the thermal insulator further being positioned between the heat-generating element and the keyboard, a projection of the thermal insulator onto the top surface at least partially covering the keyboard. In one embodiment, the projection of the heat insulation piece on the top surface completely covers the palm rest area and the keyboard so as to prevent heat generated by the operation of the heating element from being transmitted to the palm rest area and the keyboard, and further improve the use experience of a user.

In one embodiment, the electronic device further includes a touch pad, the touch pad is mounted on the housing and exposed relative to the top surface, the heat insulator is further located between the heat generating element and the touch pad, and a projection of the heat insulator on the top surface at least partially covers the touch pad. In this embodiment, the heat insulating part can block the heating element from working to generate heat and transmit the heat to the palm support area and the touch pad, so that the temperature of the palm support area and the touch pad is effectively reduced, and the use experience of a user is further improved.

In one embodiment, a projection of the thermal shield on the top surface covers the top surface. In this embodiment, the heat insulating part covers whole top surface, blocks that heating element work produces heat and transmits to the top surface, effectively reduces the temperature of top surface, further improves user's use and experiences.

In one embodiment, the thermal insulation member is an aerogel thermal insulation layer or a thermal insulation film. Aerogels include, but are not limited to, silica aerogels, carbide aerogels, organic aerogels. The heat insulation part as the aerogel has a nano network structure, can effectively limit the transmission of heat, and meanwhile, the inside of the aerogel heat insulation layer is provided with nano micropores, so that the contribution of gas molecules to heat conduction can be inhibited, and the heat generated by the heating element is effectively prevented from being transmitted to the palm support area. The heat insulation piece as the heat insulation film material has smaller thickness, the thickness of the electronic equipment is not increased while the heat insulation effect is realized, and the light and thin of the electronic equipment is further realized.

In one embodiment, the electronic device further includes a heat sink located inside the housing and connected between the heat generating element and the fan. In this embodiment, through setting up the radiating piece to be connected radiating piece directness and heating element and fan, make the heat that heating element produced can directly transmit to the radiating piece, then transmit for the fan by the radiating piece, thereby fan work is with the heat from the thermovent exhaust external world, can dispel the heat to heating element more high-efficiently, increases electronic equipment's heat dispersion.

In one embodiment, the heat sink includes a body and a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals along an extending direction of the body. In this embodiment, the plurality of heat dissipation fins are disposed on the body of the heat dissipation member, so that the contact area between the heat dissipation member and the surrounding air can be increased, the heat exchange efficiency can be increased, and the heat dissipation performance can be improved.

In one embodiment, a heat dissipation area is provided on the inner side of the housing near the first air inlet, and the heat dissipation area is used for gas circulation. The heat dissipation area is arranged, so that the external air entering from the first air inlet has enough space to be diffused to other areas in the accommodating space and is in contact with the heating element, the heat dissipation of the heating element can be accelerated, and the heat dissipation performance of the electronic equipment is improved.

In one embodiment, the heat generating component includes one or more of a circuit board assembly, an audio enclosure assembly, and a battery. The heating element is used for enabling the electronic equipment to realize interaction and communication functions.

In one embodiment, the electronic device includes a display that is rotatably coupled to the housing such that the display can be opened and closed relative to the host.

In one embodiment, the housing includes an upper cover and a bottom cover, the upper cover and the bottom cover being secured to one another. The upper cover and the bottom cover can be fixedly connected through clamping, bonding, screw connection or other connection modes.

Synthesize the aforesaid, this application is through setting up fan, thermovent and first air inlet, makes the heat that the heating element during operation that is located the casing inboard produce in time discharge the external world, reduces the temperature of casing, promotes user's use and experiences to, also can avoid the overheated performance that influences electronic equipment of heating element, cause the damage to electronic equipment even. Simultaneously, through locating the fan between first air inlet and thermovent, namely first air inlet and thermovent locate the both ends of fan respectively, increased the distance between first air inlet and the thermovent to can avoid getting into the inboard of casing from first air inlet again from thermovent exhaust hot gas, improve electronic equipment's radiating efficiency.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a host computer in the electronic device shown in FIG. 1;

FIG. 3 is a schematic cross-sectional view of the host of FIG. 2 taken along line A-A;

FIG. 4 is a schematic cross-sectional view of the host shown in FIG. 2 taken along line B-B;

FIG. 5 is a schematic gas flow diagram of the interior of the mainframe of FIG. 2;

fig. 6 is a schematic cross-sectional view of a host of a second electronic device taken along a-a according to an embodiment of the present application;

fig. 7 is a schematic cross-sectional view of a host of a second electronic device taken along B-B according to an embodiment of the present application;

fig. 8 is a schematic cross-sectional view of a host of a third electronic device taken along a-a according to an embodiment of the present application;

fig. 9 is a schematic cross-sectional view of a host of a third electronic device taken along B-B according to an embodiment of the present application;

fig. 10 is a schematic cross-sectional view of a host of a fourth electronic device taken along B-B according to an embodiment of the present application.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure,

the embodiment of the application provides an electronic device 100. The electronic device 100 includes, but is not limited to, electronic products such as a noteBook computer (noteBook computer), a tablet computer (tablet personal computer), a laptop computer (laptop computer), a Personal Digital Assistant (PDA), or a wearable device (wearable device). The following description will be made with the electronic device 100 as a notebook computer.

For convenience of description, in the present application, a length direction of the electronic device 100 is defined as a first direction X, a width direction of the electronic device 100 is defined as a second direction Y, a thickness direction of the electronic device 100 is defined as a third direction Z, and the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

The electronic apparatus 100 includes a host 1, a display 2, and a rotation mechanism 3. The host 1 is used to execute information, and the display 2 is used to display the result of information processing executed by the host 1. The rotating mechanism 3 connects the host 1 and the display 2 to enable the display 2 to be turned over relative to the host 1, so that the display 2 can be opened or closed relative to the host 1, thereby enabling the electronic device 100 to be opened or closed. Illustratively, the rotating mechanism 3 is a rotating shaft. The edge of the display 2 is connected with the rotating mechanism 3, the edge of the host 1 is provided with a rotating groove matched with the rotating mechanism 3, and the rotating mechanism 3 is installed in the rotating groove and can rotate in the rotating groove, so that the display 2 can be opened or closed relative to the host 1.

Referring to fig. 2, fig. 2 is a schematic structural diagram of the host 1 in the electronic device 100 shown in fig. 1.

The host 1 includes a housing 10, a touch pad 40, and a keyboard 41, and both the touch pad 40 and the keyboard 41 are mounted on the housing 10. The housing 10 includes an upper cover 20 and a bottom cover 30, and the bottom cover 30 and the upper cover 20 are fixedly connected to each other and enclose to form a receiving space (not shown). Specifically, the upper cover 20 includes a top plate 21 and an extension plate 22, and the extension plate 22 is connected to a periphery of the top plate 21 and disposed around the top plate 21. Illustratively, the angle between the extension panel 22 and the top panel 21 is 90 degrees (allowing for some deviation).

The top plate 21 includes a first side edge 211, a second side edge 212, a third side edge 213, and a fourth side edge 214. The first side 211 and the second side 212 are disposed opposite to each other and extend along the first direction X, and the third side 213 and the fourth side 214 are disposed opposite to each other and extend along the second direction Y. The top panel 21 also includes a top surface 215, the top surface 215 including a palm rest area 23, a first mounting area 24, and a second mounting area 25. Two palm rest areas 23 are provided, and the two palm rest areas 23 are both located on one side of the top surface 215 close to the second side edge 212 and are arranged at intervals along the first direction X. When the user uses the electronic device 100, the left palm and the right palm are respectively supported on the two palm support areas 23.

The first mounting area 24 is located between the two palm rest areas 23, and is arranged side by side with the two palm rest areas 23 along the first direction X. The first mounting area 24 is used for mounting the touch pad 40. That is, the touch pad 40 is mounted to the first mounting region 24. At this time, the touch pad 40 is exposed with respect to the top surface 215. Illustratively, the touch surface of the touch pad 40 is flush with the top surface 215. In other embodiments, the touch surface of the touch pad 40 may be recessed relative to the top surface 215, i.e., recessed toward the inner side of the casing 10, or the touch surface of the touch pad 40 may be protruded relative to the top surface 215.

The second mounting region 25 and the first mounting region 24 are spaced apart and arranged side by side along the second direction Y, and the second mounting region 25 is located on a side of the top surface 215 close to the first side 211. The second mounting area 25 is used for mounting a keypad 41. That is, the keypad 41 is mounted to the second mounting area 25. At this time, the key caps of the keyboard 41 are exposed with respect to the top surface 215. Illustratively, the keyboard 41 is in a natural state (i.e., an un-pressed state), and the key caps of the keyboard 41 protrude relative to the top surface 215 to facilitate operation of the keyboard 41 by a user. In other embodiments, the key caps of the keyboard 41 may be flush with the top surface 215, or the key caps of the keyboard 41 may be recessed relative to the top surface 215, i.e., toward the inside of the housing 10.

It should be understood that the terms "top" and "bottom" used in the description of the embodiment of the present application to describe the host 1 are mainly set forth according to the orientation of the electronic device shown in fig. 2, the positive direction toward the Z axis is "top" and the negative direction toward the Z axis is "bottom", which do not form a limitation on the orientation of the host 1 in the practical application scenario.

Referring to fig. 3 and 4 together, fig. 3 is a schematic cross-sectional view of the host 1 shown in fig. 2 taken along a-a, and fig. 4 is a schematic cross-sectional view of the host 1 shown in fig. 2 taken along B-B. In the drawings of the application, the section along the line A-A means the section along the plane where the arrows at the two ends of the line A-A are located, and the section along the line B-B means the section along the plane where the arrows at the two ends of the line B-B are located. The same is to be understood in the light of the following description of the drawings.

The bottom cover 30 includes a bottom plate 31 and side plates 32 surrounding the bottom plate 31, and the side plates 32 include a first side plate 321, a second side plate 322, a third side plate 323, and a fourth side plate 324. The first side plate 321 and the second side plate 322 are disposed oppositely, and the length directions of the first side plate 321 and the second side plate 322 are both parallel to the first direction X. The third side plate 323 and the fourth side plate 324 are oppositely disposed and connected between the first side plate 321 and the second side plate 322. The length directions of the third and

fourth side plates

323 and 324 are both parallel to the second direction Y. Exemplarily, the included angle between the first side plate 321 and the bottom plate 31 is 90 degrees, and the included angles between the second side plate 322, the third side plate 323, and the fourth side plate 324 and the bottom plate 31 are all obtuse angles, which not only can increase the aesthetic property of the electronic device 100, but also is convenient for a user to take the electronic device 100 from a desktop, and improves the user experience.

In other embodiments, the included angle between the first side plate 321 and the bottom plate 31 may also be an obtuse angle or an acute angle, or the included angle between the second side plate 322 and the bottom plate 31 may be 90 degrees or an acute angle, or the included angle between the third side plate 323 and the bottom plate 31 may be 90 degrees or an acute angle, or the included angle between the fourth side plate 324 and the bottom plate 31 may be 90 degrees or an acute angle, and the angle of the included angle between each side plate and the bottom plate 31 is not particularly limited in this application.

The upper cover 20 is covered on the bottom cover 30 along the third direction Z, the extension plate 22 and the side plate 32 are fixedly connected, and the bottom plate 31 and the top plate 21 are oppositely arranged at intervals to form an accommodating space C. In this embodiment, the extension plate 22 and the side plate 32 are clamped, and a gap a caused by installation tolerance is allowed between the extension plate 22 and the side plate 32. At this time, air outside the housing 10 may enter the accommodating space C (i.e., inside the housing 10) through the slit a.

The electronic device 100 further includes an auxiliary support 42, a touch module 43 and a keyboard support 44. The auxiliary bracket 42, the keyboard bracket 44 and the touch module 43 are all disposed in the accommodating space C. Auxiliary stand 42 fixed connection is in roof 21 for support palm holds in palm district 23, with the intensity that improves palm holds in the palm district 23, promotes user's use experience. The keyboard support 44 is fixedly attached to the top plate 21 for supporting the keyboard 41. The touch module 43 is electrically connected to the touch pad 40 to realize the touch function of the touch pad 40.

In addition, the electronic device further includes a heat generating element 50, and the heat generating element 50 is located in the accommodating space C. The heating element 50 includes a battery 51, a speaker assembly 52, and a circuit board assembly 53. The number of the speaker assemblies 52 is two, and the two speaker assemblies 52 are arranged at intervals along the first direction X. One of the speaker assemblies 52 is located near the third side 323, and the other speaker assembly 52 is located near the fourth side 324. The battery 51 is located between the two speaker assemblies 52 and is disposed opposite to the palm rest area 23 and the touch pad 40. The battery 51 is used for storing power and providing power to the electronic device 100. A cushion member 60 is further provided between the battery 51 and the bottom plate 31, and the battery 51 abuts against the cushion member 60. The cushioning member 60 may be gas permeable, or the cushioning member 60 may be provided with through holes so that gas can pass from one side of the cushioning member 60 to the other side through the through holes. The cushion member 60 protects the battery 51, and prevents the battery 51 from being damaged by collision between the battery 51 and the bottom plate 31. Illustratively, the cushion 60 is foam. In other embodiments, the buffer 60 may be another component made of a buffer material.

The circuit board assembly 53 includes a first main board 531, a second main board 532, and a heat generating source 533. The first main board 531 and the second main board 532 are arranged at intervals along the second direction Y and are respectively located on two opposite sides of the battery 51. Wherein the first main board 531 is located between the battery 51 and the first side board 321, and the first main board 531 is disposed opposite to the keyboard 41. The second main board 532 is located between the battery 51 and the second side board 322, and the second main board 532 is disposed opposite to the palm rest area 23.

The heat generating source 533 is plural, and a part of the heat generating source 533 is mounted on the surface of the first main board 531, and a part of the heat generating source 533 is mounted on the surface 533 of the second main board 532. The heat source 533 may be a CPU, a hard disk, a display card, a network card, etc. Illustratively, two heat-generating sources 533 are mounted on the top surface of the first motherboard 531, two heat-generating sources 533 are mounted on the bottom surface of the first motherboard 531, two heat-generating sources 533 are mounted on the top surface of the second motherboard 532, and one heat-generating source 533 is mounted on the bottom surface of the second motherboard 532. Note that, in the embodiment of the present application, the number of the heat generation sources 533 mounted on each surface of the first main board 531 and the second main board 532 is not particularly limited.

In the present embodiment, the casing 10 is provided with the first air inlet 61 and the heat dissipation port 62, and both the first air inlet 61 and the heat dissipation port 62 communicate the inside and the outside of the casing 10. Specifically, the first air inlet 61 and the heat dissipation port 62 are both disposed in the bottom cover 30. The first air inlet 61 is disposed on the bottom plate 31, and the heat dissipating outlet 62 is disposed on the first side plate 321. At this time, the gas outside the housing 10 may enter the inside of the housing 10 through the first gas inlet 61 and the above-mentioned gap a, and the gas inside the housing 10 may be transmitted to the outside of the housing 10 through the heat dissipation port 62. It should be noted that the inner side of the casing 10 described in the embodiments of the present application is the above-described accommodating space C, and the outer side of the casing 10 is the external environment. In other embodiments, the first air inlet 61 or the heat sink 62 may be disposed at other positions of the housing 10, which is not particularly limited in this application.

Further, the electronic device further comprises a fan 63. The fan 63 is located in the accommodating space C and between the first air inlet 61 and the heat dissipating port 62, and the fan 63 is used for transmitting heat generated by the heat generating element 50 to the outside of the housing 10 through the heat dissipating port 62. Specifically, the fan 63 has an air inlet 631 and an air outlet 632, the air inlet 631 and the air outlet 632 are disposed opposite to each other, and the air outlet 632 faces the heat dissipation opening 62 and is communicated with the heat dissipation opening 62. The fan 63 is connected to the heat source 533 located on the surface of the first main board 531, so that heat generated by the heat source 533 connected to the fan 63 can be directly transmitted to the fan 63, and then discharged to the external environment through the air outlet 632 and the heat dissipation port 62, which is beneficial to improving the heat dissipation efficiency of the electronic device 100 and enhancing the heat dissipation performance of the electronic device 100.

It should be understood that the fan 63 is located between the first air inlet 61 and the heat dissipation opening 62, which means that the projection of the fan 63 on the bottom cover 30 is located between the first air inlet 61 and the heat dissipation opening 62, i.e. the projection of the fan 63 on the bottom cover 30 covers neither the first air inlet 61 nor the heat dissipation opening 62. At this time, the first air inlet 61 and the heat outlet 62 are offset from the fan 63 in the second direction Y. In other words, in the second direction Y, the distance between the first air inlet 61 and the heat dissipation opening 62 is equal to or greater than the size of the fan 63 in the second direction Y, so as to ensure that the distance between the first air inlet 61 and the heat dissipation opening 62 is large enough, when the air in the accommodating space C enters the external environment from the heat dissipation opening 62, the air cannot directly enter the accommodating space C from the first air inlet 61, the effective heat dissipation of the fan 63 on the host 1 is ensured, and the heat dissipation performance of the host 1 is improved.

When the main unit 1 operates, the temperature of the air in the accommodating space C is raised by the heat generated by the operation of the heating element 50, and the air in the accommodating space C enters the inside of the fan 63 from the air inlet 631 of the fan 63, then is transmitted to the heat dissipating port 62 through the air outlet 632, and is discharged out of the electronic device 100 from the heat dissipating port 62, so as to form a negative pressure in the accommodating space C. When negative pressure is formed in the accommodating space C, the low-temperature gas of the external environment enters the accommodating space C from the first air inlet 61, heat exchange is generated with the heating element 50, the temperature of the heating element 50 is reduced, the external air absorbs heat to form hot gas, and then the hot gas is discharged through the fan 63 and the heat dissipation port 62, so that the heat generated by the working of the heating element 50 is taken out of the outside, gas circulation is formed in the accommodating space C, the heat dissipation effect is realized on the heating element 50, the effective heat dissipation of the host 1 is realized, and the heat dissipation performance of the electronic device 100 is improved.

In addition, when the fan 63 operates to generate negative pressure in the accommodating space C, the low-temperature air of the external environment can enter the accommodating space C from the gap a between the upper cover 20 and the bottom cover 30, so as to increase the speed at which the low-temperature air of the external environment enters the accommodating space C, enhance the air circulation in the accommodating space C, and improve the heat dissipation performance of the electronic device 100.

In this embodiment, by providing the fan 63, the heat dissipation opening 62 and the first air inlet 61, heat generated by the heating element 50 located in the accommodating space C during operation can be timely discharged to the outside, so as to prevent the heating element 50 from being overheated to affect its performance, and further damage the electronic device 100. In addition, when the temperature of the heating element 50 in the accommodating space C is decreased, the temperature of the top plate 21 is also decreased, so that the temperatures of the palm rest area 23, the touch pad 40 and the keyboard 41 are decreased, and the user experience can be improved.

A heat dissipation area D is disposed in the accommodating space C near the first air inlet 61, the heat dissipation area D is not provided with the heating element 50, and the heat dissipation area D is used for air circulation, so that the outside air entering from the first air inlet 61 has enough space to diffuse to other areas in the accommodating space C and contact with the heating element 50, thereby accelerating heat dissipation of the heating element 50 and increasing heat dissipation performance of the electronic device 100.

In this embodiment, the housing 10 is further provided with a second air inlet 65, the second air inlet 65 is disposed on the second side plate 322, and the second air inlet 65 penetrates through the second side plate 322 and is communicated with the accommodating space C. When the fan 63 is operated, the air in the accommodating space C is discharged from the heat dissipating port 62, and a negative pressure is formed in the accommodating space C, so that the low-temperature air in the external environment can enter the accommodating space C from the first air inlet 61 and the second air inlet 65 at the same time. The external air introduced into the receiving space C from the first air inlet 61 is diffused into the receiving space C by the bottom plate 31, exchanges heat with the heating element 50 located in the receiving space C, and is discharged from the heat discharge port 62 by the fan 63. The external air introduced from the second air inlet 65 passes through the battery 51 and other heat generating elements 50 from the second side plate 322, exchanges heat with the heat generating elements 50, is diffused toward the fan 63, and is discharged to the outside from the heat discharging port 62 through the fan 63.

In this embodiment, the second air inlet 65 is disposed to increase the speed of the low-temperature gas in the external environment entering the accommodating space C, and the second air inlet 65 is disposed at a position away from the fan 63 and the heat dissipation opening 62, so that the flow path of the external air entering from the second air inlet 65 in the accommodating space C is lengthened, thereby increasing the contact time between the external air and the heating element 50, further reducing the temperature of the heating element 50, greatly improving the heat dissipation efficiency of the electronic device 100, and improving the heat dissipation performance of the electronic device 100.

In addition, the electronic device 100 further includes a heat sink 64, and the heat sink 64 is located in the accommodating space C and connected between the heat generating element 50 and the fan 63. In this embodiment, by providing the heat dissipation member 64 and directly connecting the heat dissipation member 64 with the heating element 50 and the fan 63, the heat generated by the heating element 50 can be directly transmitted to the heat dissipation member 64 and then transmitted to the fan 63 by the heat dissipation member 64, and the fan 63 operates to discharge the heat from the heat dissipation opening 62 to the outside, so that the heating element 50 can be more efficiently dissipated, and the heat dissipation performance of the electronic device 100 is improved.

Specifically, the heat dissipating member 64 includes a body 641 and a plurality of heat dissipating fins 642, and the heat dissipating fins 642 are connected to the body 641 and perpendicular to the body 641. A plurality of heat dissipation fins 642 are disposed at intervals along the extending direction of the body 641. The surface of the body 641 opposite to the heat dissipating fins 642 is connected to the heat generating element 50, and one heat dissipating fin 642 near the fan 63 is connected to the fan 63.

In this embodiment, by providing a plurality of heat dissipation fins 642 on the body 641 of the heat dissipation member 64, the contact area between the heat dissipation member 64 and the surrounding air can be increased, and the heat exchange efficiency can be increased. Meanwhile, the heat dissipation fins 642 are disposed opposite to the first air inlets 61, which is more favorable for the contact between the external air entering from the first air inlets 61 and the heat dissipation fins 642, so that the heat exchange between the heat dissipation member 64 and the external air entering the accommodating space C occurs, and the temperature of the heat dissipation member 64 is reduced. After the temperature of the heat dissipation member 64 is reduced, the heat generated by the heat generating element 50 in contact with the heat dissipation member 64 can be more efficiently exchanged with the heat dissipation member 64, so that the temperature of the heat generating element 50 in contact with the heat dissipation member 64 is further reduced, and the heat dissipation performance of the electronic device 100 is improved.

The electronic apparatus 100 further includes a heat insulator 70, and the heat insulator 70 is disposed in the housing space C, and the heat insulator 70 is located between the top plate 21 and the heat generating element 50. Specifically, the heat insulation member 70 is located between the palm rest area 23 and the heating element 50, between the touch pad 40 and the heating element 50, and between the keyboard 41 and the heating element 50. The heat insulation piece 70 is adhered to the surface of the auxiliary support 42 facing away from the top plate 21, the surface of the keyboard support 44 facing away from the top plate 21 and the surface of the touch module 43 facing away from the top plate 21. In this embodiment, the projection of the heat insulating member 70 on the top surface 215 completely covers the palm rest area 23, the first mounting area 24 and the second mounting area 25, and the heat insulating member 70 can prevent the heat generated by the operation of the heating element 50 from being transmitted to the palm rest area 23, the first mounting area 24 and the second mounting area 25, thereby effectively reducing the temperature of the palm rest area 23, the touch pad 40 and the keyboard 41, and improving the use experience of the user. In other embodiments, the projection of the thermal shield 70 on the top surface 215 may also partially cover the palm rest area 23, the first mounting area 24, and the second mounting area 25. The term "projection" as used herein refers to an orthographic projection, i.e., the projection of the thermal shield 70 onto the top surface 215 in the third direction Z.

In one embodiment, the thermal insulation member 70 is an aerogel thermal insulation layer, which is made of aerogel. Aerogels include, but are not limited to, silica aerogels, carbide aerogels, organic aerogels. In this embodiment, the heat insulation member 70 is made of silica aerogel. Silica aerogel has nanometer network structure, can effectively restrict thermal transmission, and simultaneously, silica aerogel is inside to have nanometer micropore, can restrain the gaseous molecule to the heat-conducting contribution to effectively prevent the heat transmission that heating element 50 produced to palm holds in the palm and holds in the palm support district 23, first installing zone 24 and second installing zone 25. In addition, the thermal insulator 70, which is an aerogel, has an advantage of low density, and does not increase the mass of the electronic device 100 while performing a thermal insulation function, thereby contributing to the thinning of the electronic device 100. In other embodiments, the thermal insulation member 70 may be made of a thermal insulation film. The heat insulating film is a thin film having a heat insulating effect, and the heat insulating material 70 as the heat insulating film has a smaller thickness, and does not increase the thickness of the electronic device 100 while achieving the heat insulating effect, thereby further achieving the lightness and thinness of the electronic device 100.

Referring to fig. 5, fig. 5 is a schematic view illustrating a gas flow direction inside the main body 1 shown in fig. 2.

When the fan 63 works, the air in the accommodating space C enters the fan 63 from the air inlet 631 of the fan 63, and then is discharged to the external environment through the heat dissipating port 62, so that a negative pressure is formed in the accommodating space C. When negative pressure is formed in the accommodating space C, the external air enters the accommodating space C from the first air inlet 61, the second air inlet 65 and the gap a between the upper cover 20 and the bottom cover 30, and contacts the surface of the heating element 50 in the accommodating space C, heat exchange occurs, the temperature of the heating element 50 is reduced, and the external air in the accommodating space C becomes hot air. The hot air flows toward the fan 63 by the fan 63, enters the fan 63 from the air inlet 631, and is exhausted from the air outlet 632 of the fan 63 through the heat dissipating port 62 to the outside, so as to carry the heat of the heating element 50 out of the outside. When the hot air is exhausted to the outside, a negative pressure is formed in the accommodating space C, the external air enters the accommodating space C through the first air inlet 61, the second air inlet 65 and the gap a between the upper cover 20 and the bottom cover 30, and continuously exchanges heat with the heating element 50, and the external air becomes hot air and is exhausted to the outside through the fan 63 and the heat-dissipating outlet 62. So form gas circulation, fan 63 continuously works, and the heat that constantly will generate heat element 50 passes through thermovent 62 and discharges the external world to make electronic equipment 100 keep heat balance when working for a long time, reduce electronic equipment 100's temperature, promote user's use and experience.

Referring to fig. 6 and fig. 7, fig. 6 is a schematic cross-sectional structure diagram of a host 1 of a second electronic device taken along a-a according to an embodiment of the present disclosure, and fig. 7 is a schematic cross-sectional structure diagram of the second electronic device taken along a-B according to the embodiment of the present disclosure.

The main body 1 of the present embodiment is different from the main body 1 of the previous embodiment in that the heat insulating member 70 is located between the palm rest area 23 and the heating element 50. Specifically, the heat insulating member 70 is adhered to the surface of the auxiliary support 42 facing away from the palm rest area 23. The projection of the thermal shield 70 on the top surface 215 at least partially covers the palm rest area 23. In this embodiment, the projection of the thermal shield 70 on the top surface 215 completely covers the palm rest area 23. The heat insulation member 70 can prevent the heat generated by the heating element 50 from being transmitted to the palm rest area 23, thereby effectively reducing the temperature of the palm rest area 23 and improving the use experience of the user. In other embodiments, the projection of the thermal shield 70 on the top surface 215 may also partially cover the palm rest area 23. The term "projection" as used herein refers to an orthographic projection, i.e., the projection of the thermal shield 70 onto the top surface 215 in the third direction Z.

Referring to fig. 8 and 9, fig. 8 is a schematic cross-sectional structure diagram of a host 1 of a third electronic device provided in the embodiment of the present application, which is taken along a line a-a, and fig. 9 is a schematic cross-sectional structure diagram of the host 1 of the third electronic device provided in the embodiment of the present application, which is taken along a line B-B.

The host 1 of the present embodiment is different from the host 1 of the first embodiment in that the heat insulation member 70 is located between the palm rest area 23 and the heating element 50 and between the touch pad 40 and the heating element 50, and the projection of the heat insulation member 70 on the top surface 215 at least partially covers the palm rest area 23 and the first installation area 24. Specifically, the heat insulating member 70 is adhered to the surface of the auxiliary bracket 42 and the touch module 43 facing away from the top plate 21. In this embodiment, the projection of the thermal shield 70 on the top surface 215 completely covers the palm rest area 23 and the first mounting area 24. The heat insulation member 70 can prevent the heat generated by the operation of the heating element 50 from being transmitted to the palm rest area 23 and the first installation area 24, thereby effectively reducing the temperature of the palm rest area 23 and the touch pad 40 and improving the use experience of the user. In other embodiments, the projection of the thermal shield 70 on the top surface 215 may also partially cover the palm rest area 23 and the first mounting area 24. The term "projection" as used herein refers to an orthographic projection, i.e., the projection of the thermal shield 70 onto the top surface 215 in the third direction Z.

Referring to fig. 10, fig. 10 is a schematic cross-sectional view of a host 1 of a fourth electronic device taken along a line B-B according to an embodiment of the present application.

The main unit 1 of the present embodiment is different from the main unit 1 of the first embodiment in that the heat insulating member 70 is located between the top plate 21 and the heat generating element 50, and the heat insulating member 70 covers the top surface 215 along a projection on the top surface 215. The heat insulation member 70 is adhered to the surface of the auxiliary support 42, the keyboard support 44 and the touch module 43 facing away from the top plate 21. An edge of the heat insulator 70 abuts the extension plate 22, and the heat insulator 70 partitions the housing space C into a heat insulating region C1 and a heat dissipating region C2. Wherein the heat insulating member 70, the top plate 21 and the extension plate 22 enclose a heat insulating region C1, and the bottom cover 30, the extension plate 22 and the heat insulating member 70 enclose a heat dissipating region C2. The heat generating element 50 is located in the heat dissipation area C2. In this embodiment, the heat insulating member 70 completely covers the top surface 215 and separates the heat insulating region C1 and the heat dissipating region C2 into two independent and non-communicating spaces, which can effectively prevent the heat generated by the operation of the heating element 50 of the heat dissipating region C2 from being transmitted to the heat insulating region C1, thereby preventing the heat from being transmitted to the top plate 21, further enhancing the heat insulating performance of the heat insulating member 70, reducing the temperature of the top plate 21, and improving the user experience.

The above embodiments and embodiments of the present application are only examples and embodiments, and the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: casing, heating element and fan, the casing is equipped with first air inlet and thermovent, first air inlet with the thermovent all communicates the inboard and the outside of casing, heating element with the fan all is located the inboard of casing, the fan is located first air inlet with between the thermovent, the fan be used for with the heat warp that heating element produced the thermovent transmits extremely the outside of casing.

2. The electronic device of claim 1, wherein the housing is further provided with a second air inlet, and the second air inlet is located on a side of the first air inlet facing away from the heat dissipation port and communicates an inner side and an outer side of the housing.

3. The electronic device of claim 1 or 2, wherein the housing comprises a top surface, the top surface comprising a palm rest area, the electronic device further comprising a thermal insulation member located inside the housing and between the heat generating element and the palm rest area, a projection of the thermal insulation member on the top surface at least partially covering the palm rest area.

4. The electronic device of claim 3, further comprising a keyboard mounted to the housing and exposed relative to the top surface, the thermal insulator further positioned between the heat-generating element and the keyboard, a projection of the thermal insulator on the top surface at least partially covering the keyboard.

5. The electronic device of claim 3, further comprising a touch pad mounted to the housing and exposed relative to the top surface, the thermal shield being further positioned between the heat generating element and the touch pad, a projection of the thermal shield on the top surface at least partially covering the touch pad.

6. The electronic device of claim 3, wherein a projection of the thermal shield on the top surface covers the top surface.

7. The electronic device according to any one of claims 4 to 6, wherein the heat insulator is an aerogel heat insulating layer or a heat insulating film.

8. The electronic device of claim 1, further comprising a heat sink located inside the housing and connected between the heat generating element and the fan.

9. The electronic device of claim 8, wherein the heat sink includes a body and a plurality of heat fins spaced apart along an extension direction of the body.

10. The electronic device of claim 1, wherein a heat dissipation area is provided on an inner side of the housing near the first air inlet, and the heat dissipation area is used for gas circulation.

11. The electronic device of claim 1, wherein the heat generating component comprises one or more of a circuit board assembly, an audio box assembly, and a battery.

12. The electronic device of claim 1, wherein the electronic device comprises a display, and wherein the display is rotatably coupled to the housing.

13. The electronic device of claim 1, wherein the housing comprises an upper cover and a bottom cover, the upper cover and the bottom cover being secured to one another.