CN113664009B - Wafer cleaning device - Google Patents

Wafer cleaning device Download PDF

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Publication number
CN113664009B
CN113664009B CN202110914739.3A CN202110914739A CN113664009B CN 113664009 B CN113664009 B CN 113664009B CN 202110914739 A CN202110914739 A CN 202110914739A CN 113664009 B CN113664009 B CN 113664009B
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China
Prior art keywords
wafer
fixedly arranged
tunnel
sliding plate
wheel
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CN202110914739.3A
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Chinese (zh)
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CN113664009A (en
Inventor
李晨阳
管飞
邓宏远
邓二平
黄永章
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Huadian Yantai Power Semiconductor Technology Research Institute Co ltd
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Huadian Yantai Power Semiconductor Technology Research Institute Co ltd
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Priority to CN202110914739.3A priority Critical patent/CN113664009B/en
Publication of CN113664009A publication Critical patent/CN113664009A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention relates to the field of semiconductor material manufacturing, in particular to a wafer cleaning device which is different from the prior art in that the wafer cleaning device comprises a tunnel, wherein a wafer can be displaced from one end of the tunnel to the other end of the tunnel, and in the displacement process, the end surfaces of two sides of the wafer are sprayed by cleaning liquid, scrubbed by a scrubbing brush and blown by air flow to be dried. The invention adopts a vertical two-side cleaning mode, can effectively increase the cleaning contact area, improve the cleaning efficiency and maintain the product performance.

Description

Wafer cleaning device
Technical Field
The invention relates to the field of semiconductor material manufacturing, in particular to a wafer cleaning device.
Background
Wafer refers to a silicon wafer used in the fabrication of silicon semiconductor circuits, the starting material of which is silicon. After the high-purity polycrystalline silicon is dissolved, silicon crystal seed crystals are doped, and then the silicon crystal seed crystals are slowly pulled out, so that cylindrical monocrystalline silicon can be formed. After the silicon ingot is ground, polished and sliced, a silicon wafer, a so-called wafer, is formed. Wafers are widely used in the semiconductor industry due to their excellent crystallization characteristics and purity.
As the size of the chip is designed to be smaller and smaller, the number of interconnection layers is gradually increased, and therefore the size of the wafer is also increased, and if multi-layer wiring is to be implemented in the integrated circuit, the surface of the wafer needs to be flat, so the chemical mechanical polishing technology for planarization of the surface of the wafer becomes a main technology in the wafer manufacturing industry, but after the chemical mechanical polishing of the wafer, a large amount of particles, organic matters and metal ions remain on the surface of the wafer, and therefore the surface of the wafer needs to be scrubbed.
The existing wafer cleaning devices are various, wherein a conveyor belt is used as a transportation channel, and a turnover device is used for turning over a wafer so as to perform double-sided cleaning. The wafer cleaning mode is the traditional mechanical cleaning mode, namely the cleaning brush is used for directly cleaning the surface of the wafer, a large amount of particles, organic matters and metal ions on the surface of the wafer easily enter a brush sleeve of the cleaning brush to influence the cleaning quality of the subsequent wafer, and the cleaning brush is in direct contact with the surface of the wafer, so that the surface of the wafer is easily damaged, and the surface performance of a product is reduced; in addition, a spray head designed in a nozzle type is adopted in a wafer cleaning device, and the cleaning liquid is used for repeatedly flushing the wafer to clean and wet the surface of the wafer.
Therefore, most of the existing cleaning modes are planar cleaning, namely the front and the back of the wafer are cleaned respectively, so that the efficiency is low, the consumed time is long, the cleaning mode is single, residues are left in the cleaning, and the strong adsorption impurities of the wafer are difficult to remove.
Disclosure of Invention
In order to overcome the above drawbacks or defects of the prior art, the present invention provides a wafer cleaning apparatus, which comprises a tunnel, wherein a wafer can be moved from one end of the tunnel to the other end of the tunnel, and during the movement, the two side end surfaces of the wafer are sprayed with a cleaning solution, scrubbed by a scrubber, and blown by an air flow to be dried.
The invention adopts a vertical two-side cleaning mode, can effectively increase the cleaning contact area, improve the cleaning efficiency and maintain the product performance.
Drawings
FIG. 1 is a schematic structural view of example 1.
Fig. 2 is a schematic structural diagram and a partial enlarged view of fig. 1 after the tunnel is hidden.
Fig. 3 is a schematic view and a partial enlarged view of fig. 2 from another view angle.
Fig. 4 is a schematic structural view of a part of the members in embodiment 1.
Fig. 5 is a front view of fig. 4.
Fig. 6 is a schematic structural view of the tunnel in embodiments 1 to 3.
Fig. 7 is a schematic view of the structure of fig. 6 from another view angle.
FIGS. 8 to 10 are schematic views showing the states of the wafer entering, cleaning and exiting from the apparatus of example 1.
Fig. 11 is a schematic structural diagram and a partially enlarged view of embodiment 2 after the tunnel is hidden.
Fig. 12 is a schematic structural diagram and a partial enlarged view of embodiment 3 after the tunnel is hidden.
Detailed Description
The following detailed description of the embodiments of the present invention will be made in conjunction with the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described are only a part of representative embodiments of the present invention, and not all embodiments. Those skilled in the art can easily understand the advantages of the present invention by using the examples, but other examples without inventive efforts are within the scope of the present invention.
Aiming at the problems of poor cleaning effect, low efficiency, residual edge pollutants and the like in the existing wafer cleaning technology, the invention provides three wafer cleaning devices with different implementation modes, which can effectively improve the cleaning efficiency and protect the product performance.
In embodiment 1, referring to fig. 1 to 10, a top plate 2 is fixedly arranged on a top surface of a tunnel 1, a slide plate cylinder 3 is fixedly arranged on a bottom surface of the tunnel, rubber pair rollers 4 are respectively rotatably arranged at left and right ends of a cylinder body of the top plate 2 and the slide plate cylinder 3, a gap between the rubber pair rollers 4 is smaller than or equal to the thickness of a wafer 100, gears 6 engaged with each other are respectively fixedly arranged on roller shafts 5 of the rubber pair rollers 4, a first driven pulley 7 is fixedly arranged on one of the roller shafts 5, a first driving pulley 11 is fixedly arranged on a motor shaft of a first motor 8 fixedly connected with the top plate 2 or the cylinder body of the slide plate cylinder 3, and a first belt 10 is wound on the first driven pulley 7 and the first driving pulley 11; two vertical plates 9 are fixedly arranged in the middle of a sliding plate 31 of the sliding plate cylinder 3, scrubbing brushes 16 are fixedly arranged at the top ends of the two vertical plates 9, and bristles of the two scrubbing brushes 16 can be respectively abutted against the end surfaces of two sides of the wafer 100; an upper wheel frame 12 and a second motor 18 are fixedly arranged in the middle of the top plate 2, a driving wheel 21 is rotatably arranged at the lower end of the upper wheel frame 12, a second driving belt wheel 13 is fixedly arranged at one end of a driving shaft of the driving wheel 21, a second driven belt wheel 14 is fixedly arranged on a motor shaft of the second motor 18, and a second belt 17 is wound on the second driving belt wheel 13 and the second driven belt wheel 14; the two ends of the sliding plate 31 are respectively provided with a support rod 15 in a rotating way, the upper end of the support rod 15 is provided with a support wheel 20 in a rotating way, the lower end of the support rod 15 is fixedly provided with an incomplete gear 19, the inner side of the middle part of the support rod 15 is connected with one end of a tension spring 27, the other end of the tension spring 27 is connected with the middle part of the sliding plate 31, the inner end surfaces of cylinder bodies 32 at the two ends of the sliding plate cylinder 3 are respectively fixedly provided with a cutting bar 28, a section of rack 29 with the number of teeth corresponding to that of the incomplete gear 19 is fixedly arranged on the cutting bar, the lower surface of the cutting bar 28 is in sliding fit with the upper surface of the sliding plate 31, and the rack 29 is meshed with the incomplete gear 19; the cleaning pipe 22 penetrates through the tunnel 1 and is fixedly connected with the top plate 2, the lower end of the cleaning pipe 22 is connected with two cleaning branch pipes 33, the lower ends of the cleaning branch pipes 33 are connected with the liquid spraying heads 23, and the two liquid spraying heads 23 respectively face to one side end face of the wafer 100; the right side of the top plate 2 is fixedly provided with an air nozzle 26, and the air nozzle 26 is connected with a high-pressure air pipe 30 penetrating through the tunnel 1. A limit plate 36 is fixedly arranged on the inner side of a hinged support 37 which is connected with the lower end of the support rod 15 in an adapting way, a baffle 35 is fixedly arranged on the outer side surface of the lower end close to the support rod 15, so that the support rod 15 cannot be overturned inwards infinitely, and under the action of the two tension springs 27, the wafer 100 is supported on a support wheel 20 at the upper end of the support rod 15 in a floating way and is pressed against the driving wheel 21 to form three-point positioning and flexible driving. The supporting wheel 20 and the driving wheel 21 include a cylinder abutting against the circumferential circular surface of the wafer 100 and a frustum body with two sides blocking and limiting the wafer 100, the length of the cylinder is less than or equal to the thickness of the wafer 100, and the diameter of the inner side of the frustum body is equal to the diameter of the cylinder. The bottom surface of the tunnel 1 is provided with a plurality of liquid leakage ports 34 and is connected with the liquid collecting tank 24, and the lowest part of the liquid collecting tank 24 is provided with a sewage draining port 25.
The rubber pair rollers 4 are used for carrying and transporting the wafer and are symmetrically arranged about the plane of the wafer. The supporting wheel 20 and the driving wheel 21 are of a concave structure, so that the contact area between the fixed pulley and the wafer can be reduced, and the cleaning solution can be conveniently contacted with the surface of the wafer. The scrubber 16 is a long rod structure, and the length of the scrubber is at least larger than the radius of the wafer, so as to completely scrub the surface of the wafer. The liquid spraying heads 23 are inclined to the surface of the wafer, only the cleaning area is sprayed with cleaning liquid or ionic liquid, and the two spraying heads are completely identical and symmetrical about the two sides of the wafer. The showerhead 26 is mounted directly above the drying zone and the gas flow from the showerhead is parallel to the wafer surface for faster flow and evaporation of the cleaning solution. The traditional mechanical cleaning method is replaced, the damage to the surface of the wafer can be effectively reduced, and the surface performance of the wafer is kept. And the wafer to be cleaned is fixed into a three-dimensional two-side structure, so that the front side and the back side of the wafer to be cleaned can be cleaned simultaneously, the cleaning period can be effectively shortened, and the cleaning efficiency is improved.
In addition, in the embodiment of the present invention, the whole cleaning process line is that the wafer 100 is displaced from one end of the tunnel 1 to the other end, and during the displacement, the two side end surfaces of the wafer 100 are sprayed with the cleaning solution, scrubbed by the scrubber, and blown by the air flow to be dried. Then the wafer is loaded and transported to the wafer collecting area for stacking. The method comprises the following specific steps:
as shown in fig. 8, the wafer enters a cleaning area inside the device through a pair of rubber pair rollers which rotate oppositely on the left side; at this time, the sliding plate moves to a position close to the left side, the left supporting rod 15 is in a substantially horizontal state, the upper end of the left supporting wheel 20 is lower than the lower edge of the wafer, the lower edge of the wafer moves inward beyond the left supporting wheel 20, the wafer still continues to move inward by inertia after being separated from the rubber pair roller, at this time, a control device (not shown in the figure) controls the action of a sliding plate cylinder, the sliding plate 31 moves rightward and stops at the middle position, in the process that the sliding plate 31 moves rightward, the left supporting rod 15 turns inward under the action of a tension spring and an insert, the left supporting wheel 20 supports the circumferential circular surface of the wafer all the time, the wafer is forced to move inward continuously until the wafer abuts against the right supporting wheel 20 and does not move any more, as shown in fig. 9, at this time, the wafer is positioned by three points, and is clamped by two scrubbing brushes and is ready to be cleaned; at the moment, the control device controls the two liquid spraying heads to respectively spray cleaning liquid to the two sides of the wafer, and the second motor 18 drives the driving wheel 21 to rotate so as to drive the wafer to rotate for cleaning; after the cleaning is finished, the control device controls the air nozzle 26 to dry, meanwhile, the sliding plate 31 translates rightwards, under the action of the right-side inserting strip, the supporting rod 15 on the right side gradually becomes in a basically horizontal state, the supporting wheel 20 on the left side pushes the wafer rightwards, the right edge of the wafer enters the pair of rollers on the right side, the pair of rubber rollers which rotate relatively on the right side is used for taking the inside of the device out and transporting the wafer to a wafer collecting area, the cleaning process flow of a single wafer is finished, and the process is circulated and repeated.
Example 2, as shown in fig. 11, refer to other drawings.
The same as in example 1 is: a top plate 2 is fixedly arranged on the top surface of a tunnel 1, a sliding plate cylinder 3 is fixedly arranged on the bottom surface of the tunnel 1, rubber pair rollers 4 are respectively arranged at the left end and the right end of a cylinder body of the top plate 2 and the sliding plate cylinder 3 in a rotating mode, the gap between the rubber pair rollers 4 is smaller than or equal to the thickness of a wafer 100, gears 6 which are meshed with each other are respectively fixedly arranged on roll shafts 5 of the rubber pair rollers 4, a first driven belt wheel 7 is fixedly arranged on one roll shaft 5, a first driving belt wheel 11 is fixedly arranged on a motor shaft of a first motor 8 fixedly connected with the top plate 2 or the cylinder body of the sliding plate cylinder 3, and a first belt 10 is wound on the first driven belt wheel 7 and the first driving belt wheel 11; two vertical plates 9 are fixedly arranged in the middle of a sliding plate 31 of the sliding plate cylinder 3, scrubbing brushes 16 are fixedly arranged at the top ends of the two vertical plates 9, and bristles of the two scrubbing brushes 16 can be respectively abutted to the end faces of the two sides of the wafer 100; an upper wheel frame 12 and a second motor 18 are fixedly arranged in the middle of the top plate 2, a driving wheel 21 is rotatably arranged at the lower end of the upper wheel frame 12, a second driving belt wheel 13 is fixedly arranged at one end of a driving shaft of the driving wheel 21, a second driven belt wheel 14 is fixedly arranged on a motor shaft of the second motor 18, and a second belt 17 is wound on the second driving belt wheel 13 and the second driven belt wheel 14; the cleaning pipe 22 penetrates through the tunnel 1 and is fixedly connected with the top plate 2, the lower end of the cleaning pipe 22 is connected with two cleaning branch pipes 33, the lower ends of the cleaning branch pipes 33 are connected with the liquid spraying heads 23, and the two liquid spraying heads 23 respectively face to one side end face of the wafer 100; the right side of the top plate 2 is fixedly provided with an air nozzle 26, and the air nozzle 26 is connected with a high-pressure air pipe 30 penetrating through the tunnel 1.
The difference from example 1 is: the two ends of the sliding plate 31 are respectively fixedly provided with a rotary electromagnet 38, an output shaft 39 of the rotary electromagnet 38 is fixedly provided with a swinging plate 40, the upper end of the swinging plate 40 is fixedly connected with a spring 41, the upper end of the spring 41 is fixedly connected with a U-shaped frame 44, the U-shaped frame 44 is rotatably provided with a supporting wheel 20, and the swinging plate 40 can be switched between a position close to the horizontal position and a position which is turned inwards to 120-135 degrees under the driving of the output shaft 39 of the rotary electromagnet 38.
Compared with embodiment 1, the structure is simpler, but the function of embodiment 1 can be realized, and the using process is similar to that of the embodiment and is not described again.
Embodiment 3, as shown in fig. 12, refers to other drawings.
The same as in example 2 is: a top plate 2 is fixedly arranged on the top surface of the tunnel 1, a sliding plate cylinder 3 is fixedly arranged on the bottom surface of the tunnel 1, a rubber pair roller 4 is respectively arranged at the left end and the right end of a cylinder body of the top plate 2 and the sliding plate cylinder 3 in a rotating mode, the gap between the rubber pair rollers 4 is smaller than or equal to the thickness of the wafer 100, gears 6 which are mutually meshed are respectively fixedly arranged on roller shafts 5 of the rubber pair rollers 4, a first driven belt pulley 7 is fixedly arranged on one roller shaft 5, a first driving belt pulley 11 is fixedly arranged on a motor shaft of a first motor 8 fixedly connected with the top plate 2 or the cylinder body of the sliding plate cylinder 3, and a first belt 10 is wound on the first driven belt pulley 7 and the first driving belt pulley 11; the two ends of the sliding plate 31 are respectively fixedly provided with a rotary electromagnet 38, an output shaft 39 of the rotary electromagnet 38 is fixedly provided with a swinging plate 40, the upper end of the swinging plate 40 is fixedly connected with a spring 41, the upper end of the spring 41 is fixedly connected with a U-shaped frame 44, a supporting wheel 20 is arranged on the U-shaped frame 44, and the swinging plate 40 can be switched between a position close to the horizontal position and a position capable of being turned inwards to 120-135 degrees under the driving of the output shaft 39 of the rotary electromagnet 38; the cleaning pipe 22 penetrates through the tunnel 1 and is fixedly connected with the top plate 2, the lower end of the cleaning pipe 22 is connected with two cleaning branch pipes 33, the lower ends of the cleaning branch pipes 33 are connected with the liquid spraying heads 23, and the two liquid spraying heads 23 respectively face to one side end face of the wafer 100; the right side of the top plate 2 is fixedly provided with an air nozzle 26, and the air nozzle 26 is connected with a high-pressure air pipe 30 penetrating through the tunnel 1.
The difference from example 2 is: two vertical plates 9 are fixedly arranged in the middle of a sliding plate 31 of the sliding plate cylinder 3, miniature speed reducing motors 42 are fixedly arranged at the top ends of the two vertical plates 9 respectively, motor shaft gaps of the miniature speed reducing motors 42 penetrate through the vertical plates 9 and then are fixedly connected with scrubbing brushes 16, bristles of the two scrubbing brushes 16 can abut against the end surfaces of the two sides of the wafer 100 respectively, and the rotation directions of the two miniature speed reducing motors 42 are the same or opposite; the middle part of the top plate 2 is fixedly provided with an upper wheel frame 12, and the lower end of the upper wheel frame 12 is rotatably provided with a pressing wheel 43.
The embodiment adopts a mode of rotating the scrubbing brush. When the two miniature speed reducing motors 42 rotate in the same direction, the wafer rotates in a differential mode relative to the scrubbing brush under the action of the supporting wheels and the pressing wheels, so that the scrubbing brush can be cleaned comprehensively without dead angles. When the rotation directions of the two miniature speed reducing motors 42 are opposite and the rotation speeds are the same, the friction forces generated by the two scrubbing brushes on the wafer respectively counteract each other, so that the wafer is still in a relatively static state and can be cleaned comprehensively. If the two scrubbing brushes are opposite in rotation direction and different in speed, the wafer can rotate in a differential speed mode relative to the scrubbing brushes, so that the wafer can be cleaned comprehensively without dead angles.
It should be understood that the present invention is not limited to the above embodiments, and any changes and modifications that can be easily made by those skilled in the art within the technical scope of the present invention are included in the present invention.

Claims (6)

1. The wafer cleaning device is characterized by comprising a tunnel (1), wherein a top plate (2) is fixedly arranged on the top surface of the tunnel (1), a sliding plate cylinder (3) is fixedly arranged on the bottom surface of the tunnel (1), rubber rollers (4) are respectively arranged at the left end and the right end of a cylinder body of the top plate (2) and the sliding plate cylinder (3) in a rotating mode, a gap between the rubber rollers (4) is smaller than or equal to the thickness of a wafer (100), gears (6) which are meshed with each other are respectively fixedly arranged on roller shafts (5) of the rubber rollers (4), a first driven pulley (7) is fixedly arranged on one roller shaft (5), a first driving pulley (11) is fixedly arranged on a motor shaft of a first motor (8) fixedly connected with the cylinder body of the top plate (2) or the sliding plate cylinder (3), and a first belt (10) is wound on the first driven pulley (7) and the first driving pulley (11); two vertical plates (9) are fixedly arranged in the middle of a sliding plate (31) of the sliding plate cylinder (3), scrubbing brushes (16) are fixedly arranged at the top ends of the two vertical plates (9), and bristles of the two scrubbing brushes (16) can be respectively abutted against the end surfaces of two sides of the wafer (100); an upper wheel frame (12) and a second motor (18) are fixedly arranged in the middle of the top plate (2), a driving wheel (21) is rotatably arranged at the lower end of the upper wheel frame (12), a second driving belt wheel (13) is fixedly arranged at one end of a driving shaft of the driving wheel (21), a second driven belt wheel (14) is fixedly arranged on a motor shaft of the second motor (18), and a second belt (17) is wound on the second driving belt wheel (13) and the second driven belt wheel (14); the two ends of a sliding plate (31) are respectively provided with a support rod (15) in a rotating manner, the upper end of the support rod (15) is provided with a support wheel (20) in a rotating manner, the lower end of the support rod (15) is fixedly provided with an incomplete gear (19), the inner side of the middle part of the support rod (15) is connected with one end of a tension spring (27), the other end of the tension spring (27) is connected with the middle part of the sliding plate (31), the inner end surfaces of cylinder bodies (32) at the two ends of a sliding plate cylinder (3) are respectively and fixedly provided with an inserting strip (28), a section of rack (29) with the number of teeth corresponding to that of the incomplete gear (19) is fixedly arranged on the inserting strip, the lower surface of the inserting strip (28) is in sliding fit with the upper surface of the sliding plate (31), and the rack (29) is meshed with the incomplete gear (19); the cleaning pipe (22) penetrates through the tunnel (1) and is fixedly connected with the top plate (2), the lower end of the cleaning pipe (22) is connected with two cleaning branch pipes (33), the lower end of each cleaning branch pipe (33) is connected with the liquid spraying head (23), and the two liquid spraying heads (23) face to one side end face of the wafer (100) respectively; the right side of the top plate (2) is fixedly provided with an air nozzle (26), and the air nozzle (26) is connected with a high-pressure air pipe (30) penetrating through the tunnel (1).
2. The wafer cleaning device is characterized by comprising a tunnel (1), wherein a top plate (2) is fixedly arranged on the top surface of the tunnel (1), a sliding plate cylinder (3) is fixedly arranged on the bottom surface of the tunnel (1), rubber rollers (4) are respectively arranged at the left end and the right end of a cylinder body of the top plate (2) and the sliding plate cylinder (3) in a rotating mode, a gap between the rubber rollers (4) is smaller than or equal to the thickness of a wafer (100), gears (6) which are meshed with each other are respectively fixedly arranged on roller shafts (5) of the rubber rollers (4), a first driven pulley (7) is fixedly arranged on one roller shaft (5), a first driving pulley (11) is fixedly arranged on a motor shaft of a first motor (8) fixedly connected with the cylinder body of the top plate (2) or the sliding plate cylinder (3), and a first belt (10) is wound on the first driven pulley (7) and the first driving pulley (11); two vertical plates (9) are fixedly arranged in the middle of a sliding plate (31) of the sliding plate cylinder (3), scrubbing brushes (16) are fixedly arranged at the top ends of the two vertical plates (9), and bristles of the two scrubbing brushes (16) can be respectively abutted against the end surfaces of two sides of the wafer (100); an upper wheel frame (12) and a second motor (18) are fixedly arranged in the middle of the top plate (2), a driving wheel (21) is rotatably arranged at the lower end of the upper wheel frame (12), a second driving belt wheel (13) is fixedly arranged at one end of a driving shaft of the driving wheel (21), a second driven belt wheel (14) is fixedly arranged on a motor shaft of the second motor (18), and a second belt (17) is wound on the second driving belt wheel (13) and the second driven belt wheel (14); the two ends of the sliding plate (31) are respectively fixedly provided with a rotary electromagnet (38), an output shaft (39) of the rotary electromagnet (38) is fixedly provided with a swinging plate (40), the upper end of the swinging plate (40) is fixedly connected with a spring (41), the upper end of the spring (41) is fixedly connected with a U-shaped frame (44), a supporting wheel (20) is arranged on the U-shaped frame (44), and the swinging plate (40) can be switched between a position close to the horizontal position and a position capable of being turned inwards to 120-135 degrees under the driving of the output shaft (39) of the rotary electromagnet (38); the cleaning pipe (22) penetrates through the tunnel (1) and is fixedly connected with the top plate (2), the lower end of the cleaning pipe (22) is connected with two cleaning branch pipes (33), the lower end of each cleaning branch pipe (33) is connected with the liquid spraying head (23), and the two liquid spraying heads (23) face to one side end face of the wafer (100) respectively; the right side of the top plate (2) is fixedly provided with an air nozzle (26), and the air nozzle (26) is connected with a high-pressure air pipe (30) penetrating through the tunnel (1).
3. The wafer cleaning device is characterized by comprising a tunnel (1), wherein a top plate (2) is fixedly arranged on the top surface of the tunnel (1), a sliding plate cylinder (3) is fixedly arranged on the bottom surface of the tunnel (1), rubber rollers (4) are respectively arranged at the left end and the right end of a cylinder body of the top plate (2) and the sliding plate cylinder (3) in a rotating mode, a gap between the rubber rollers (4) is smaller than or equal to the thickness of a wafer (100), gears (6) which are meshed with each other are respectively fixedly arranged on roller shafts (5) of the rubber rollers (4), a first driven pulley (7) is fixedly arranged on one roller shaft (5), a first driving pulley (11) is fixedly arranged on a motor shaft of a first motor (8) fixedly connected with the cylinder body of the top plate (2) or the sliding plate cylinder (3), and a first belt (10) is wound on the first driven pulley (7) and the first driving pulley (11); the middle part of a sliding plate (31) of a sliding plate cylinder (3) is fixedly provided with two vertical plates (9), the top ends of the two vertical plates (9) are respectively and fixedly provided with a miniature speed reducing motor (42), a motor shaft clearance of the miniature speed reducing motor (42) penetrates through the vertical plates (9) and then is fixedly connected with scrubbing brushes (16), the bristles of the two scrubbing brushes (16) can be respectively abutted against the end surfaces of the two sides of a wafer (100), and the rotation directions of the two miniature speed reducing motors (42) are the same or opposite; an upper wheel frame (12) is fixedly arranged in the middle of the top plate (2), and a pressing wheel (43) is rotatably arranged at the lower end of the upper wheel frame (12); the two ends of the sliding plate (31) are fixedly provided with rotary electromagnets (38) respectively, an output shaft (39) of each rotary electromagnet (38) is fixedly provided with a swinging plate (40), the upper end of each swinging plate (40) is fixedly connected with a spring (41), the upper end of each spring (41) is fixedly connected with a U-shaped frame (44), a supporting wheel (20) is arranged on each U-shaped frame (44), and the swinging plates (40) can be switched between a position close to the horizontal position and a position turned inwards to 120-135 degrees under the driving of the output shafts (39) of the rotary electromagnets (38); the cleaning pipe (22) penetrates through the tunnel (1) and is fixedly connected with the top plate (2), the lower end of the cleaning pipe (22) is connected with two cleaning branch pipes (33), the lower ends of the cleaning branch pipes (33) are connected with the liquid spraying heads (23), and the two liquid spraying heads (23) face the end face of one side of the wafer (100) respectively; the right side of the top plate (2) is fixedly provided with an air nozzle (26), and the air nozzle (26) is connected with a high-pressure air pipe (30) penetrating through the tunnel (1).
4. The wafer cleaning device as claimed in claim 1, wherein a limit plate (36) is fixed on the inner side of a hinge seat (37) connected with the lower end of the stay bar (15), and a baffle (35) is fixed on the outer side surface of the lower end close to the stay bar (15) so that the stay bar (15) cannot be infinitely turned inwards, and under the action of the two tension springs (27), the wafer (100) is floatingly supported on a support wheel (20) at the upper end of the stay bar (15) and presses against the driving wheel (21) to form three-point positioning and flexible driving.
5. A wafer cleaning apparatus according to any one of claims 1 to 3, wherein the support wheel (20), the pressing wheel (43) and/or the driving wheel (21) comprise a cylinder abutting against the circumferential surface of the wafer (100) and a frustum body for stopping and limiting the wafer (100) at two sides, the length of the cylinder is less than or equal to the thickness of the wafer (100), and the diameter of the inner side of the frustum body is equal to the diameter of the cylinder.
6. A wafer cleaning apparatus according to any one of claims 1 to 3, wherein the bottom surface of the tunnel (1) is provided with a plurality of drain openings (34) and is connected to the sump (24), and a drain outlet (25) is provided at the lowest part of the sump (24).
CN202110914739.3A 2021-08-10 2021-08-10 Wafer cleaning device Active CN113664009B (en)

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CN114562874B (en) * 2022-03-02 2023-07-04 浙江光特科技有限公司 Be used for wafer to wash back drying device
CN114569764B (en) * 2022-04-06 2024-05-31 吉林大学 Suspension disinfection device for metal surgical instrument
CN115463892B (en) * 2022-09-16 2023-06-20 上海申和投资有限公司 Piece She Shijing round cleaning machine
CN117276142B (en) * 2023-11-15 2024-02-09 拓思精工科技(苏州)有限公司 Double-sided brushing device for wafer processing

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JPH1126419A (en) * 1997-06-27 1999-01-29 Yamaha Corp Wafer-cleaning apparatus and wafer polishing system
US6523553B1 (en) * 1999-03-30 2003-02-25 Applied Materials, Inc. Wafer edge cleaning method and apparatus
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CN112992733B (en) * 2021-02-08 2022-03-11 江苏亚电科技有限公司 A brushing device for wafer processing

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