CN113658986A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113658986A CN113658986A CN202110935972.XA CN202110935972A CN113658986A CN 113658986 A CN113658986 A CN 113658986A CN 202110935972 A CN202110935972 A CN 202110935972A CN 113658986 A CN113658986 A CN 113658986A
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 42
- 230000005540 biological transmission Effects 0.000 claims description 57
- 239000000853 adhesive Substances 0.000 claims description 54
- 230000001070 adhesive effect Effects 0.000 claims description 54
- 238000005538 encapsulation Methods 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000149 argon plasma sintering Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention provides a display panel and a display device, relates to the technical field of display, and improves the packaging effect and reliability of the display panel. The display panel includes: the display device comprises a display area and a non-display area, wherein the non-display area comprises a lower step area, the lower step area comprises a fan-shaped area and a binding area, the fan-shaped area is provided with fan-out wiring, and the binding area is provided with a negative power supply bonding pad; a cathode layer including a cathode connection part located at the lower step region; a negative power bus located in the lower step region; the lower step region also comprises a cathode contact region, and a negative power bus is connected with the cathode connecting part in the cathode contact region; the lower step area is provided with a negative power supply connecting part, the negative power supply connecting part and the fan-out wiring are arranged in different layers, and the negative power supply connecting part is electrically connected with a negative power supply bus and a negative power supply bonding pad; the negative power supply connection portion includes a plurality of first connection portions extending in a first direction and arranged in a second direction with a space between adjacent ones.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to a display panel and a display device.
[ background of the invention ]
In order to prevent the device in the display panel from being corroded by water and oxygen, the display panel is usually provided with packaging glue, and in the packaging process, the packaging glue is irradiated by laser to be melted and solidified so as to package the display panel.
Generally, the non-display area of the display panel includes a lower step area, as shown in fig. 1, fig. 1 is a partial cross-sectional view of the display panel in the prior art, and the lower step area is provided with negative power signal lines 1 ' and fan-out traces 2 ', and the fan-out traces 2 ' are arranged in different layers. In the prior art, based on the arrangement mode of the negative power supply signal line 1 ', a large-area overlap exists between the negative power supply signal line 1' and the fan-out routing 2 'in a local area, on one hand, a film layer formed by laminating the negative power supply signal line 1' and the fan-out routing 2 'is uneven, a large height difference exists between the area where the negative power supply signal line 1' is located and other areas, so that the height of the encapsulation adhesive 3 'covered on the negative power supply signal line is not uniform, and when the encapsulation adhesive 3' is melted and solidified, deformation and stress caused by thermal expansion and contraction of the encapsulation adhesive 3 'at different positions are different, so that the encapsulation adhesive 3' is easy to wrinkle at the position with large stress, and the encapsulation reliability is reduced; on the other hand, when the package adhesive 3 'is sintered by using laser, the reflection path of the laser in a local area is too short and is obviously different from the reflection paths of other areas due to the shielding of the negative power signal line 1', the sintering uniformity of the package adhesive 3 'is affected, and the package adhesive 3' is easy to crack under a high-temperature and high-humidity environment, so that the package failure is caused.
[ summary of the invention ]
In view of this, embodiments of the present invention provide a display panel and a display device, which improve a packaging effect of the display panel, and further improve the packaging reliability of the display panel.
In one aspect, an embodiment of the present invention provides a display panel, including:
the display device comprises a display area and a non-display area surrounding the display area, wherein the non-display area comprises a lower step area, the lower step area comprises a fan-shaped area and a binding area, the fan-shaped area and the binding area are arranged along a first direction, the fan-shaped area is provided with fan-out wiring, and the binding area is provided with at least one negative power supply pad;
a cathode layer extending from the display area to the non-display area, the cathode layer including a cathode connection part at the lower step area;
a negative power bus located in the lower step region;
the lower step region further includes a cathode contact region in which the negative power bus is electrically connected to the cathode connection portion;
the lower step area is also provided with a negative power supply connecting part, the negative power supply connecting part is arranged in a different layer with the fan-out wiring, one end of the negative power supply connecting part is electrically connected with the negative power supply bus, and the other end of the negative power supply connecting part is electrically connected with one negative power supply bonding pad;
the negative power supply connecting part comprises a plurality of first connecting parts extending along the first direction and arranged along the second direction, a space is reserved between every two adjacent first connecting parts, and the second direction is intersected with the first direction.
In another aspect, an embodiment of the present invention provides a display device, including the display panel described above.
One of the above technical solutions has the following beneficial effects:
compared with the prior art, in the technical scheme provided by the embodiment of the invention, the negative power supply connecting parts electrically connected with the negative power supply bonding pad are arranged in a dispersing way and comprise the first connecting parts arranged at intervals, on one hand, the overlapped areas of the negative power supply connecting parts and the fan-out wiring are dispersed, namely, the height difference originally concentrated in one area is dispersed to other areas, so that the surface of the film layer formed by laminating the negative power supply connecting parts and the fan-out wiring is relatively flat, the integral height uniformity of the packaging adhesive covered on the film layer is ensured, and the deformation and the stress caused by the expansion and the contraction of the packaging adhesive in different areas can be ensured to be the same when the packaging adhesive is subjected to laser sintering. On the other hand, when the packaging adhesive is irradiated by laser, the area where the negative power supply connecting part is located is dispersed, so that the difference between the reflection path (too short) of the laser in a local area where the negative power supply connecting part is concentrated in a large area and the reflection path (too long) of the laser in an area where the negative power supply connecting part is not arranged can be avoided, the uniformity of the reflection path of the laser in the whole lower step area is improved, and the heating melting degree of the packaging adhesive is uniform.
Therefore, by adopting the technical scheme, the negative power supply connecting parts electrically connected with the negative power supply bonding pad are dispersedly arranged, so that the overall height uniformity of the packaging adhesive in the lower step area and the uniformity of the reflection path of laser can be improved, the curing effect of the packaging adhesive is improved, the packaging effect of the display panel is further improved, and the packaging reliability is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a partial cross-sectional view of a prior art display panel;
FIG. 2 is a top view of a display panel according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2;
FIG. 4 is a partial cross-sectional view of FIG. 2;
FIG. 5 is a top view of a special-shaped display panel according to an embodiment of the present invention;
FIG. 6 is another enlarged partial view of FIG. 2;
fig. 7 is a schematic structural diagram of a first connection portion according to an embodiment of the present invention;
fig. 8 is another structural diagram of the first connection portion according to the embodiment of the present invention;
fig. 9 is a schematic diagram of a film structure of a display panel according to an embodiment of the invention;
fig. 10 is a schematic view of another film structure of a display panel according to an embodiment of the invention;
FIG. 11 is a schematic diagram of another film structure of a display panel according to an embodiment of the present invention;
fig. 12 is a schematic view illustrating another film structure of a display panel according to an embodiment of the invention;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first and second may be used to describe the connection portions in the embodiments of the present invention, the connection portions should not be limited to these terms. These terms are only used to distinguish the connecting portions from each other. For example, the first connection portion may also be referred to as a second connection portion, and similarly, the second connection portion may also be referred to as a first connection portion, without departing from the scope of embodiments of the present invention.
An embodiment of the present invention provides a display panel, as shown in fig. 2 to 4, fig. 2 is a top view of the display panel provided in the embodiment of the present invention, fig. 3 is a partially enlarged view of fig. 2, and fig. 4 is a partially cross-sectional view of fig. 2, the display panel includes a display area 1 and a non-display area 2 surrounding the display area 1, the non-display area 2 includes a lower step area 3, the lower step area 3 includes a fan-shaped area 4 and a bonding area 5, the fan-shaped area 4 and the bonding area 5 are arranged along a first direction, the fan-shaped area 4 is provided with a fan-out trace 6, and the bonding area 5 is provided with at least one negative power pad 7.
The display panel further includes: a cathode layer 8, the cathode layer 8 extending from the display area 1 to the non-display area 2, the cathode layer 8 including a cathode connection 9 at the lower step area 3; negative power supply bus 10, negative power supply bus 10 is located in lower step region 3. The lower step region 3 further includes a cathode contact region 11, in which cathode contact region 11 a negative power supply bus 10 is electrically connected to the cathode connection portion 9; the lower step area 3 is further provided with a negative power supply connecting portion 12, the negative power supply connecting portion 12 and the fan-out wiring 6 are arranged in a different layer, one end of the negative power supply connecting portion 12 is electrically connected with the negative power supply bus 10, and the other end of the negative power supply connecting portion 12 is electrically connected with one negative power supply pad 7.
The negative power supply connection portion 12 includes a plurality of first connection portions 13 extending in a first direction and arranged in a second direction, an interval is provided between two adjacent first connection portions 13, and the second direction intersects with the first direction.
Note that, in the cathode contact region 11, the negative power supply bus line 10 is electrically connected to the cathode connection portion 9 through a metal wiring provided on the same layer as the anode, that is, the negative power supply bus line 10 transmits a cathode power supply signal (PVEE) to the cathode layer 8 through the cathode contact region 11.
Compared with the prior art, in the display panel provided by the embodiment of the invention, the negative power supply connection parts 12 electrically connected with one negative power supply pad 7 are dispersedly arranged to include the first connection parts 13 arranged at intervals, on one hand, the overlapping areas of the negative power supply connection parts 12 and the fan-out wiring 6 can be dispersed, namely, the height difference originally concentrated in one area is dispersed to other areas, so that the surface of the film layer formed by laminating the negative power supply connection parts 12 and the fan-out wiring 6 is relatively flat, the overall height of the encapsulation adhesive 14 covered on the film layer tends to be uniform, and when the encapsulation adhesive 14 is subjected to laser sintering, the same deformation and stress caused by the expansion and contraction of the encapsulation adhesive 14 in different areas can be ensured. On the other hand, when the package adhesive 14 is irradiated with the laser, by dispersing the region where the negative power supply connection portion 12 is located, it is possible to prevent the reflection path (too short) of the laser in a local region where the negative power supply connection portion 12 is concentrated in a large area from being different from the reflection path (too long) of the laser in a region where the negative power supply connection portion 12 is not located, thereby improving the uniformity of the reflection path of the laser in the entire lower step region 3 when the package adhesive is melted, and making the degree of melting of the package adhesive 14 uniform.
It can be seen that, with the display panel, the negative power supply connecting parts 12 electrically connected with one negative power supply pad 7 are dispersedly arranged, so that the overall height uniformity of the packaging adhesive 14 in the lower step area 3 and the uniformity of the reflection path of the laser can be improved, the curing effect of the packaging adhesive 14 is improved, the packaging effect of the display panel is further improved, and the packaging reliability is improved.
In addition, it should be noted that the display panel shown in fig. 2 is a display panel with a conventional shape, and the structure of the negative power connection portion provided in the embodiment of the present invention can also be applied to other specially-shaped display panels, for example, the wearable display panel shown in fig. 5, such as a watch, and fig. 5 is a top view of the specially-shaped display panel provided in the embodiment of the present invention.
Optionally, the negative power supply connection portion 12 includes a plurality of first connection portions 13 to increase the transmission channel width of the cathode power supply signal, thereby reducing the loss of the cathode power supply signal in the transmission process and reducing the difference between the cathode power supply signals received by the cathode layers 8 in different areas. Based on this, referring again to fig. 3, the negative power supply connection part 12 further includes a second connection part 15 extending in the second direction. One end of the first connection portion 13 close to the display region 1 is electrically connected to the negative power supply bus 10, one end of the first connection portion 13 far from the display region 1 is electrically connected to the second connection portion 15, and the second connection portion 15 is also electrically connected to one negative power supply pad 7. Through setting up second connecting portion 15, can realize a plurality of first connecting portion 13 and the stable electricity of negative power supply pad 7 and be connected, can also reduce the loss of cathode power signal transmission in first connecting portion 13, improve the signal homogeneity of cathode layer 8, and then improve display panel's display performance.
Optionally, referring to fig. 3 again, the lower step area 3 is provided with an encapsulation adhesive 14, and in order to further improve the uniformity of the overall height of the encapsulation adhesive 14 in the lower step area 3 and the uniformity of the reflection path of the laser, the second connection portion 15 and the encapsulation adhesive 14 may not be overlapped in a direction perpendicular to the plane of the display panel. Illustratively, the orthographic projection of the second connecting portion 15 on the plane of the display panel is located on one side of the orthographic projection of the packaging adhesive 14 on the plane of the display panel, which faces the binding region 5.
Optionally, a driver chip is bound in the binding region 5, the driver chip includes at least two negative power supply pads 7 arranged along the second direction, and the driver chip provides a cathode power supply signal to the negative power supply bus 10 through the negative power supply pads 7. Illustratively, as shown in fig. 6, fig. 6 is another partial enlarged view of fig. 2, the driving chip 16 includes two negative power supply pads 7, and the two negative power supply pads 7 are respectively located on two sides of the driving chip 16 in the second direction.
When the driving chip 16 includes at least two negative power supply pads 7, the number of the negative power supply connection portions 12, the negative power supply bus 10, and the cathode connection portions 9 electrically connected to the negative power supply pads 7 is at least two, so that the negative power supply signal provided by the driving chip 16 can be transmitted to the cathode layer 8 through a plurality of transmission paths, thereby reducing the attenuation difference of the negative power supply signal received by different regions of the cathode layer 8.
Alternatively, as shown in fig. 7 and 8, fig. 7 is a schematic structural diagram of a first connection portion provided in the embodiment of the present invention, and fig. 8 is another schematic structural diagram of the first connection portion provided in the embodiment of the present invention, where the sector area 4 includes a first fan-out area 17 and a second fan-out area 18, an extending direction of the fan-out trace 6 located in the first fan-out area 17 intersects with the first direction or the second direction, and an extending direction of the fan-out trace 6 located in the second fan-out area 18 is parallel to the first direction or the second direction. The area of the first connection portion 13 located at the first fan-out region 17 is smaller than the area of the first connection portion 13 located at the second fan-out region 18 per unit area.
Based on the current arrangement mode of the fan-out traces 6 in the lower step area 3, the fan-out traces 6 in the first fan-out area 17 extend obliquely and are centralized along the direction towards the second fan-out area 18, the trace distribution density is high, and the fan-out traces 6 in the second fan-out area 18 extend vertically or transversely, and the trace distribution density is low. The area of the first connecting portion 13 in the first fan-out region 17 is set to be small, the area of the first connecting portion 13 in the second fan-out region 18 is set to be large, the reflection degree of the first connecting portion 13 and the fan-out wiring 6 in the first fan-out region 17 to laser can be enabled to be the same as the reflection degree of the first connecting portion 13 and the fan-out wiring 6 in the second fan-out region 18 to laser, when the packaging adhesive 14 is sintered by laser, the reflection path homogenization of the laser in the whole lower step region 3 can be guaranteed, and the uniform heating of the packaging adhesive 14 in the lower step region 3 is guaranteed.
Optionally, referring to fig. 7 again, for the first fan-out region 17 and the second fan-out region 18 arranged along the first direction, the width of at least one first connection portion 13 in the first fan-out region 17 is smaller than the width in the second fan-out region 18. By adjusting the widths of the first connecting portion 13 in the first fan-out region 17 and the second fan-out region 18, the area of the portion, located in the first fan-out region 17, of the first connecting portion 13 can be smaller than the area of the portion, located in the second fan-out region 18, of the first connecting portion 13 and the fan-out trace 6 in the two regions are balanced in overall reflection degree of laser, and uniform heating of the packaging adhesive 14 in the lower step region 3 is guaranteed.
In addition, in order to further improve the uniformity of the reflection path of the laser light in the whole lower step area 3, the width of each first connection portion 13 in the first fan-out area 17 may be smaller than that in the second fan-out area 18.
Alternatively, referring to fig. 8 again, for the first and second fan-out regions 17 and 18 arranged in the second direction, the width of the first connection 13 in the second fan-out region 18 is greater than the width of the first connection 13 in the first fan-out region 17. By adjusting the widths of the first connecting portions 13 in the first fan-out region 17 and the second fan-out region 18, the total area of the first connecting portions 13 in the first fan-out region 17 can be smaller than the total area of the first connecting portions 13 in the second fan-out region 18, the overall reflection degree of the first connecting portions 13 and the fan-out traces 6 on laser in the two regions is balanced, and the uniform heating of the packaging adhesive 14 in the lower step region 3 is ensured.
Referring to fig. 8 again, along the direction from the first fan-out region 17 to the second fan-out region 18, if the distribution density of the fan-out traces 6 decreases, the widths of the plurality of first connecting portions 13 may increase.
It should be noted that, in an actual manufacturing process of the display panel, in order to improve uniformity of film layer etching at an edge of the display panel, some virtual fan-out traces are further disposed in the lower step region 3, and the portion of the virtual fan-out traces is not used for driving the sub-pixels to emit light, which may be specifically referred to as virtual fan-out traces 61 disposed in a suspended manner in fig. 7 and 8. When the lower step area 3 is provided with the virtual fan-out trace 61, the first connection portion 13 may also overlap with the virtual fan-out trace 61.
Optionally, the display region 1 is provided with a gate line, a data line and a reference voltage signal line, wherein the gate line is used for transmitting a scanning signal to the pixel circuit, the data line is used for transmitting a data signal to the pixel circuit, and the reference voltage signal line is used for transmitting a reference voltage signal to the pixel circuit.
One end of the fan-out trace 6 is electrically connected to the data line, and the other end of the fan-out trace 6 is electrically connected to the driver chip 16. The negative power supply connecting part 12 and the data line are arranged on the same layer; the fan-out wiring 6 includes a first transmission wiring and a second transmission wiring, wherein the first transmission wiring and the gate line are disposed on the same layer, and the second transmission wiring and the reference voltage signal line are disposed on the same layer. That is to say, as shown in fig. 9, fig. 9 is a schematic diagram of a film structure of a display panel according to an embodiment of the present invention, in which the second transmission trace 19 is located on a side of the first transmission trace 20 facing the light emitting surface, and the first connection portion 13 is located on a side of the second transmission trace 19 facing the light emitting surface. In this arrangement, the negative power connection portion 12 and the data line are formed by the same process, the first transmission line 20 and the gate line are formed by the same process, the second transmission line 19 and the reference voltage signal line are formed by the same process, and the negative power connection portion 12, the first transmission line 20 and the second transmission line 19 do not need to use an additional patterning process, so that the manufacturing process is simplified, and the manufacturing cost is reduced.
Optionally, the lower step region 3 is further provided with a pad metal 21 and a package glue 14, please refer to fig. 9 again, and the package glue 14 and the pad metal 21 are arranged in different layers and have an overlap. The area where the package adhesive 14 is located includes a first area 22, the package adhesive 14 overlaps the first connection portion 13 in the first area 22, and the first connection portion 13 located in the first area 22 is reused as the pad metal 21.
When the packaging adhesive 14 is overlapped with the first connecting portion 13 in the first region 22, the first connecting portion 13 in the first region 22 is reused as the cushion metal 21, the cushion metal 21 does not need to be additionally arranged, the manufacturing cost is reduced, moreover, when the packaging adhesive 14 is sintered, the laser is reflected by the first connecting portion 13 which is closer to the packaging adhesive 14, the loss of laser energy can be reduced, and the curing effect of the packaging adhesive 14 is improved.
Further, the first connection portion 13 and the first transmission trace 20 do not overlap, and/or the first connection portion 13 and the second transmission trace 19 do not overlap, and/or the first transmission trace 20 and the second transmission trace 19 do not overlap. For example, referring to fig. 8 again, in the first region 22, the first connection portion 13 does not overlap with the second transmission trace 19, and the first transmission trace 20 and the second transmission trace 19 do not overlap.
Exemplarily, as shown in fig. 10, fig. 10 is a schematic diagram of another film layer structure of a display panel according to an embodiment of the present invention, in which the first transmission trace 20 and the second transmission trace 19 are not overlapped, and the first connection portion 13 is overlapped with both the first transmission trace 20 and the second transmission trace 19. When the first transmission trace 20 and the second transmission trace 19 are not overlapped, the surface of the film layer formed by stacking the first transmission trace 20 and the second transmission trace 19 is relatively flat, and after the first connection portion 13 and the packaging adhesive 14 are formed on the film layer, the fluctuation of the packaging adhesive 14 can be ensured to be relatively small, and the height difference of the packaging adhesive 14 in different areas is reduced.
Or, as shown in fig. 11, fig. 11 is a schematic view of another film layer structure of the display panel provided in the embodiment of the invention, on the premise that the first transmission trace 20 and the second transmission trace 19 are not overlapped, the first connection portion 13, the first transmission trace 20, and the second transmission trace 19 are also further not overlapped, that is, the first connection portion 13, the first transmission trace 20, and the second transmission trace 19 are not overlapped with each other, at this time, the first connection portion 13, the first transmission trace 20, and the second transmission trace 19 are respectively located in different areas, so that the height difference between the different areas of the film layers formed by stacking the three layers can be reduced to a greater extent, and the surface of the encapsulation adhesive 14 is made to be more flat.
Further, as shown in fig. 12, fig. 12 is a schematic diagram of another film layer structure of the display panel according to the embodiment of the present invention, the area where the package adhesive 14 is located includes a second area 23, the package adhesive 14 and the first connection portion 13 are not overlapped in the second area 23, the first transmission trace 20 and the second transmission trace 19 are overlapped, and the second transmission trace 19 located in the second area 23 is reused as the pad metal 21.
Compared with the first transmission line 20, the second transmission line 19 is closer to the packaging adhesive 14, when the packaging adhesive 14 is irradiated by laser, the second transmission line 19 which is closer to the packaging adhesive 14 is used for reflecting the laser, the laser reflection path is shorter, the loss is smaller, therefore, the first transmission line 20 and the second transmission line 19 are overlapped in the second area 23, and the second transmission line 19 is used as a reflective metal, so that the curing effect of the laser on the packaging adhesive 14 can be improved.
Fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention, where fig. 13 is a schematic structural diagram of the display device, and the display device includes the display panel 100. The specific structure of the display panel 100 has been described in detail in the above embodiments, and is not described herein again. Of course, the display device shown in fig. 13 is only a schematic illustration, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, or a television.
Since the display device provided by the embodiment of the invention comprises the display panel 100, by adopting the display device and performing the dispersed design on the negative power supply connecting parts 12 in the display panel 100, when the packaging adhesive 14 in the lower step area 3 is subjected to laser sintering, the sintering uniformity of the packaging adhesive 14 is improved, the packaging effect is optimized, and the packaging reliability of the display device is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (11)
1. A display panel, comprising:
the display device comprises a display area and a non-display area surrounding the display area, wherein the non-display area comprises a lower step area, the lower step area comprises a fan-shaped area and a binding area, the fan-shaped area and the binding area are arranged along a first direction, the fan-shaped area is provided with fan-out wiring, and the binding area is provided with at least one negative power supply pad;
a cathode layer extending from the display area to the non-display area, the cathode layer including a cathode connection part at the lower step area;
a negative power bus located in the lower step region;
the lower step region further includes a cathode contact region in which the negative power bus is electrically connected to the cathode connection portion;
the lower step area is also provided with a negative power supply connecting part, the negative power supply connecting part is arranged in a different layer with the fan-out wiring, one end of the negative power supply connecting part is electrically connected with the negative power supply bus, and the other end of the negative power supply connecting part is electrically connected with one negative power supply bonding pad;
the negative power supply connecting part comprises a plurality of first connecting parts extending along the first direction and arranged along a second direction, a space is reserved between every two adjacent first connecting parts, and the second direction is intersected with the first direction;
the fan-shaped area comprises a first fan-out area and a second fan-out area, the extending direction of the fan-out routing located in the first fan-out area is crossed with the first direction or the second direction, and the extending direction of the fan-out routing located in the second fan-out area is parallel with the first direction or the second direction;
in a unit area, an area of the first connection portion located in the first fan-out region is smaller than an area of the first connection portion located in the second fan-out region.
2. The display panel according to claim 1,
the negative power supply connection portion further includes a second connection portion extending in the second direction;
one end of the first connecting portion, which is close to the display area, is electrically connected with the negative power supply bus, one end of the first connecting portion, which is far away from the display area, is electrically connected with the second connecting portion, and the second connecting portion is also electrically connected with one negative power supply bonding pad.
3. The display panel according to claim 2, wherein the lower step area is further provided with an encapsulation adhesive;
in a direction perpendicular to a plane of the display panel, the second connection portion and the encapsulation adhesive do not overlap.
4. The display panel according to claim 1,
and a driving chip is bound in the binding region, the driving chip comprises at least two negative power supply bonding pads arranged along a second direction, and the driving chip provides a cathode power supply signal for the negative power supply bus through the negative power supply bonding pads.
5. The display panel of claim 1, wherein for the first and second fan-out regions arranged in the first direction, a width of at least one of the first connections is smaller in the first fan-out region than in the second fan-out region.
6. The display panel of claim 1, wherein for the first and second fan-out regions arranged in the second direction, a width of the first connection portion within the second fan-out region is greater than a width of the first connection portion within the first fan-out region.
7. The display panel according to claim 1, wherein the display area is provided with a gate line, a data line and a reference voltage signal line, one end of the fan-out trace is electrically connected to the data line, and the other end of the fan-out trace is electrically connected to a driving chip;
the negative power supply connecting part and the data line are arranged on the same layer;
the fan-out wires comprise a first transmission wire and a second transmission wire, wherein the first transmission wire and the grid line are arranged on the same layer, and the second transmission wire and the reference voltage signal line are arranged on the same layer.
8. The display panel according to claim 7, wherein the lower step region is further provided with a pad metal and an encapsulation adhesive, and the encapsulation adhesive is arranged in a different layer from the pad metal and overlaps with the pad metal;
the area where the packaging glue is located comprises a first area, the packaging glue and the first connecting portion are overlapped in the first area, and the first connecting portion located in the first area is reused as the cushion metal.
9. The display panel according to claim 8, wherein the first connection portion does not overlap with the first transmission trace, and/or the first connection portion does not overlap with the second transmission trace, and/or the first transmission trace does not overlap with the second transmission trace.
10. The display panel according to claim 7, wherein the lower step region is further provided with a pad metal, the region where the packaging adhesive is located includes a second region, the packaging adhesive and the first connection portion are not overlapped in the second region, the first transmission traces are overlapped with the second transmission traces, and the second transmission traces located in the second region are reused as the pad metal.
11. A display device comprising the display panel according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110935972.XA CN113658986B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110935972.XA CN113658986B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
| CN201910565963.9A CN110164949B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
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| CN201910565963.9A Active CN110164949B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
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| CN113658986B (en) * | 2019-06-27 | 2024-03-22 | 武汉天马微电子有限公司 | Display panel and display device |
| CN110599955B (en) * | 2019-09-19 | 2021-02-09 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN110568683B (en) * | 2019-09-23 | 2022-06-28 | 上海中航光电子有限公司 | Array substrate, display device and test method thereof |
| CN110993817B (en) * | 2019-11-26 | 2020-12-25 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
| CN111653603B (en) * | 2020-06-18 | 2023-08-29 | 京东方科技集团股份有限公司 | Display substrate and display device |
| US20230087701A1 (en) * | 2021-02-20 | 2023-03-23 | Boe Technology Group Co., Ltd. | Display panel, method for manufacturing the same and display device |
| CN114419996B (en) * | 2022-01-21 | 2023-07-25 | 武汉华星光电技术有限公司 | Display panel |
| CN115241255A (en) * | 2022-07-29 | 2022-10-25 | 京东方科技集团股份有限公司 | Display panel and display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113658985B (en) | 2023-10-31 |
| CN113658985A (en) | 2021-11-16 |
| CN110164949A (en) | 2019-08-23 |
| CN110164949B (en) | 2021-09-07 |
| CN113658986B (en) | 2024-03-22 |
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