CN113658986B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113658986B CN113658986B CN202110935972.XA CN202110935972A CN113658986B CN 113658986 B CN113658986 B CN 113658986B CN 202110935972 A CN202110935972 A CN 202110935972A CN 113658986 B CN113658986 B CN 113658986B
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- power supply
- display panel
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims description 58
- 238000005538 encapsulation Methods 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 13
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 7
- 229940126543 compound 14 Drugs 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention provides a display panel and a display device, relates to the technical field of display, and improves the packaging effect and reliability of the display panel. The display panel includes: the display area and the non-display area, the non-display area includes the lower step area, the lower step area includes sector area and binding area, the sector area has sector-out lines, the binding area has negative power supply pads; a cathode layer including a cathode connection portion located at the lower step region; a negative power bus located in the lower step region; the lower step area also comprises a cathode contact area, and a negative power bus is connected with the cathode connecting part in the cathode contact area; the lower step area is provided with a negative power supply connecting part which is arranged on the different layer of the fan-out wiring, and the negative power supply connecting part is electrically connected with a negative power supply bus and a negative power supply bonding pad; the negative power supply connection part comprises a plurality of first connection parts which extend along a first direction and are arranged along a second direction, and a space is reserved between two adjacent first connection parts.
Description
[ field of technology ]
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
[ background Art ]
In order to avoid corrosion of water and oxygen to devices in the display panel, the display panel is usually provided with packaging glue, and in the packaging process, the packaging glue is irradiated by laser to be melted and solidified so as to realize packaging of the display panel.
In general, the non-display area of the display panel includes a lower step area, as shown in fig. 1, fig. 1 is a partial cross-sectional view of a display panel in the prior art, and the lower step area is provided with a negative power signal line 1' and a fan-out trace 2', and the fan-out trace 2' is arranged in different layers. In the prior art, based on the arrangement mode of the negative power supply signal wire 1', the negative power supply signal wire 1' and the fan-out wire 2 'can overlap in a local area with a larger area, on one hand, uneven film layers formed by stacking the negative power supply signal wire 1' and the fan-out wire 2 'are caused, and a larger height difference exists between the area where the negative power supply signal wire 1' is located and other areas, so that the height of the covered packaging adhesive 3 'is uneven, and when the packaging adhesive 3' is melted and solidified, the deformation and stress caused by thermal expansion and shrinkage of the packaging adhesive 3 'at different positions are different, so that the packaging adhesive 3' is easy to generate wrinkles at the position with larger stress, and the packaging reliability is reduced; on the other hand, when the encapsulation adhesive 3' is sintered by using laser, the encapsulation adhesive 3' is shielded by the negative power signal line 1', the reflection path of the laser in a local area is too short, and is obviously different from the reflection paths of other areas, so that the sintering uniformity of the encapsulation adhesive 3' is affected, and the encapsulation adhesive 3' is easy to crack under the high-temperature and high-humidity environment, so that the encapsulation is invalid.
[ invention ]
In view of this, the embodiment of the invention provides a display panel and a display device, which improves the packaging effect of the display panel and further improves the packaging reliability of the display panel.
In one aspect, an embodiment of the present invention provides a display panel, including:
the display device comprises a display area and a non-display area surrounding the display area, wherein the non-display area comprises a lower step area, the lower step area comprises a sector area and a binding area, the sector area and the binding area are arranged along a first direction, the sector area is provided with a sector-out wiring, and the binding area is provided with at least one negative power supply pad;
a cathode layer extending from the display region to the non-display region, the cathode layer including a cathode connection portion at the lower step region;
a negative power bus located in the lower step region;
the lower step region further includes a cathode contact region in which the negative power bus is electrically connected with the cathode connection portion;
the lower step area is also provided with a negative power supply connecting part, the negative power supply connecting part is arranged in a different layer from the fan-out wiring, one end of the negative power supply connecting part is electrically connected with the negative power supply bus, and the other end of the negative power supply connecting part is electrically connected with one negative power supply bonding pad;
the negative power supply connection part comprises a plurality of first connection parts which extend along the first direction and are arranged along the second direction, a space is reserved between two adjacent first connection parts, and the second direction is intersected with the first direction.
In another aspect, an embodiment of the present invention provides a display device including the above display panel.
One of the above technical solutions has the following beneficial effects:
compared with the prior art, in the technical scheme provided by the embodiment of the invention, the negative power supply connecting parts electrically connected with one negative power supply pad are arranged in a scattered manner, so that the negative power supply connecting parts comprise a plurality of first connecting parts arranged at intervals, on one hand, the overlapping area of the negative power supply connecting parts and the fan-out wiring is scattered, namely, the height difference originally concentrated in one area is scattered to other areas, so that the surface of a film layer formed by stacking the negative power supply connecting parts and the fan-out wiring is relatively flat, the overall height uniformity of the covered packaging adhesive is ensured, and the deformation and stress caused by thermal expansion and contraction of the packaging adhesive in different areas can be ensured to be the same when the packaging adhesive is subjected to laser sintering. On the other hand, when the packaging adhesive is irradiated by laser, the area where the negative power supply connecting part is located is dispersed, so that the difference of the reflection path (too short) of the laser in the local area where the negative power supply connecting part is concentrated in a large area and the reflection path (too long) of the laser in the area where the negative power supply connecting part is not arranged can be avoided, the homogenization of the reflection path of the laser in the whole lower step area is improved, and the heating and melting degree of the packaging adhesive is uniform.
Therefore, by adopting the technical scheme, the negative power supply connecting parts electrically connected with one negative power supply bonding pad are arranged in a scattered manner, so that the overall height uniformity of the packaging adhesive in the lower step area and the uniformity of the reflection path of laser can be improved, the curing effect of the packaging adhesive can be improved, the packaging effect of the display panel can be improved, and the packaging reliability can be improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a partial cross-sectional view of a prior art display panel;
FIG. 2 is a top view of a display panel according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2;
FIG. 4 is a partial cross-sectional view of FIG. 2;
fig. 5 is a top view of a special-shaped display panel according to an embodiment of the present invention;
FIG. 6 is another enlarged partial view of FIG. 2;
fig. 7 is a schematic structural diagram of a first connection portion according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a first connecting portion according to an embodiment of the present invention;
fig. 9 is a schematic diagram of a film structure of a display panel according to an embodiment of the invention;
FIG. 10 is a schematic diagram of another film structure of a display panel according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of another film structure of a display panel according to an embodiment of the present invention;
fig. 12 is a schematic view of a film structure of a display panel according to an embodiment of the invention;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the invention.
[ detailed description ] of the invention
For a better understanding of the technical solution of the present invention, the following detailed description of the embodiments of the present invention refers to the accompanying drawings.
It should be understood that the described embodiments are merely some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that although the terms first and second may be used to describe the connection in embodiments of the present invention, these connections should not be limited to these terms. These terms are only used to distinguish the connecting portions from each other. For example, a first connection may also be referred to as a second connection, and similarly, a second connection may also be referred to as a first connection, without departing from the scope of embodiments of the present invention.
An embodiment of the present invention provides a display panel, as shown in fig. 2 to 4, fig. 2 is a top view of the display panel provided by the embodiment of the present invention, fig. 3 is a partial enlarged view of fig. 2, and fig. 4 is a partial cross-sectional view of fig. 2, where the display panel includes a display area 1 and a non-display area 2 surrounding the display area 1, the non-display area 2 includes a lower step area 3, the lower step area 3 includes a fan-shaped area 4 and a binding area 5, the fan-shaped area 4 and the binding area 5 are arranged along a first direction, the fan-shaped area 4 is provided with a fan-out line 6, and the binding area 5 is provided with at least one negative power supply pad 7.
The display panel further includes: a cathode layer 8, the cathode layer 8 extending from the display area 1 to the non-display area 2, the cathode layer 8 including a cathode connection 9 located in the lower step area 3; negative power bus 10. Negative power bus 10 is located in lower step area 3. The lower step region 3 further includes a cathode contact region 11, in which cathode contact region 11 a negative power bus 10 is electrically connected to the cathode connection 9; the lower step area 3 is further provided with a negative power supply connecting part 12, the negative power supply connecting part 12 and the fanout wire 6 are arranged in different layers, one end of the negative power supply connecting part 12 is electrically connected with the negative power supply bus 10, and the other end of the negative power supply connecting part 12 is electrically connected with one negative power supply bonding pad 7.
The negative power supply connection portion 12 includes a plurality of first connection portions 13 extending in a first direction and arranged in a second direction, and two adjacent first connection portions 13 have a space therebetween, and the second direction intersects the first direction.
In the cathode contact 11, the negative power bus 10 is electrically connected to the cathode connection 9 via a metal track provided in the same layer as the anode, i.e., the negative power bus 10 transmits a cathode power signal (PVEE) to the cathode layer 8 via the cathode contact 11.
Compared with the prior art, in the display panel provided by the embodiment of the invention, the negative power supply connection parts 12 electrically connected with one negative power supply pad 7 are arranged in a scattered manner so as to comprise a plurality of first connection parts 13 arranged at intervals, on one hand, the overlapping area of the negative power supply connection parts 12 and the fan-out wires 6 can be scattered, namely, the height difference originally concentrated in one area is scattered to other areas, so that the surface of a film layer formed by stacking the negative power supply connection parts 12 and the fan-out wires 6 is relatively flat, the overall height of the covered packaging adhesive 14 tends to be uniform, and the deformation and stress caused by the thermal expansion and the shrinkage of the packaging adhesive 14 in different areas can be ensured to be the same when the packaging adhesive 14 is subjected to laser sintering. On the other hand, when the encapsulating compound 14 is irradiated with the laser light, by dispersing the areas where the negative power supply connection portions 12 are located, it is possible to prevent the reflection paths (too short) of the laser light in the local areas where the negative power supply connection portions 12 are concentrated in a large area from being different from the reflection paths (too long) of the laser light in the areas where the negative power supply connection portions 12 are not provided, and thereby to improve the uniformity of the reflection paths of the laser light in the entire lower step area 3 when the encapsulating compound is melted, and to make the degree of heat melting of the encapsulating compound 14 uniform.
Therefore, by adopting the display panel, the negative power supply connection parts 12 electrically connected with one negative power supply pad 7 are arranged in a dispersed manner, so that the overall height uniformity of the encapsulation adhesive 14 in the lower step area 3 and the uniformity of the reflection path of laser can be improved, the curing effect of the encapsulation adhesive 14 can be improved, the encapsulation effect of the display panel can be further improved, and the encapsulation reliability can be improved.
In addition, it should be noted that, the display panel shown in fig. 2 is a display panel with a conventional shape, and the structure of the negative power connection portion provided by the embodiment of the invention may also be applied to other special-shaped display panels, such as a wearable display panel as shown in fig. 5, for example, a watch, and fig. 5 is a top view of the special-shaped display panel provided by the embodiment of the invention.
Optionally, the negative power supply connection portion 12 includes a plurality of first connection portions 13 to increase the width of the transmission channel of the cathode power supply signal, thereby reducing the loss of the cathode power supply signal in the transmission process and reducing the difference of the cathode power supply signals received by the cathode layers 8 in different areas. Based on this, referring again to fig. 3, the negative power supply connection portion 12 further includes a second connection portion 15 extending in the second direction. One end of the first connecting portion 13, which is close to the display area 1, is electrically connected to the negative power bus 10, one end of the first connecting portion 13, which is far away from the display area 1, is electrically connected to the second connecting portion 15, and the second connecting portion 15 is also electrically connected to one negative power pad 7. By arranging the second connection parts 15, stable electric connection between the first connection parts 13 and the negative power supply pads 7 can be realized, loss of transmission of cathode power supply signals in the first connection parts 13 can be reduced, signal uniformity of the cathode layer 8 is improved, and display performance of the display panel is further improved.
Optionally, referring to fig. 3 again, the lower step area 3 is provided with the encapsulation adhesive 14, so that the second connection portion 15 and the encapsulation adhesive 14 may not overlap in a direction perpendicular to the plane of the display panel in order to further improve the uniformity of the overall height of the encapsulation adhesive 14 in the lower step area 3 and the uniformity of the reflection path of the laser. The orthographic projection of the second connection portion 15 on the plane of the display panel is located on the side of the orthographic projection of the encapsulation compound 14 on the plane of the display panel facing the binding area 5.
Optionally, the binding area 5 is bound with a driver chip comprising at least two negative power supply pads 7 arranged in the second direction, the driver chip providing a negative power supply signal to the negative power supply bus 10 via the negative power supply pads 7. As illustrated in fig. 6, fig. 6 is another partial enlarged view of fig. 2, and the driving chip 16 includes two negative power pads 7, and the two negative power pads 7 are respectively located at two sides of the driving chip 16 in the second direction.
When the driving chip 16 includes at least two negative power pads 7, correspondingly, the number of the negative power connection parts 12, the negative power bus 10 and the cathode connection parts 9 electrically connected with the negative power pads 7 is also at least two, so that the negative power signals provided by the driving chip 16 can be transmitted to the cathode layer 8 through a plurality of transmission paths, and the attenuation degree difference of the negative power signals received by different areas of the cathode layer 8 is reduced.
Alternatively, as shown in fig. 7 and fig. 8, fig. 7 is a schematic structural diagram of a first connection portion provided in an embodiment of the present invention, and fig. 8 is another schematic structural diagram of a first connection portion provided in an embodiment of the present invention, where the fan-shaped area 4 includes a first fan-out area 17 and a second fan-out area 18, an extending direction of the fan-out trace 6 located in the first fan-out area 17 intersects with the first direction or the second direction, and an extending direction of the fan-out trace 6 located in the second fan-out area 18 is parallel with the first direction or the second direction. The area of the first connection portion 13 located in the first fan-out area 17 is smaller than the area of the first connection portion 13 located in the second fan-out area 18 per unit area.
Based on the current arrangement mode of the fan-out wires 6 in the lower step area 3, the fan-out wires 6 in the first fan-out area 17 extend obliquely and are centralized along the direction towards the second fan-out area 18, the distribution density of wires is larger, and the fan-out wires 6 in the second fan-out area 18 extend vertically or transversely, and the distribution density of wires is smaller. The area of the first connecting portion 13 in the first fan-out area 17 is set smaller, and the area of the first connecting portion 13 in the second fan-out area 18 is set larger, so that the reflection degree of the first connecting portion 13 and the fan-out wire 6 in the first fan-out area 17 to laser is the same as the reflection degree of the first connecting portion 13 and the fan-out wire 6 in the second fan-out area 18, when the laser is used for sintering the packaging adhesive 14, the uniformity of the reflection path of the laser in the whole lower step area 3 can be ensured, and the uniformity of the heating of the packaging adhesive 14 in the lower step area 3 is further ensured.
Alternatively, referring again to fig. 7, for the first and second fanout areas 17 and 18 arranged in the first direction, the at least one first connection portion 13 has a smaller width at the first fanout area 17 than at the second fanout area 18. By adjusting the width of the first connection portion 13 in the first fan-out area 17 and the second fan-out area 18, the area of the first connection portion 13 at the first fan-out area 17 is smaller than that at the second fan-out area 18, the overall reflection degree of the first connection portion 13 and the fan-out wires 6 on the laser in the two areas is balanced, and the uniformity of heating of the encapsulation adhesive 14 in the lower step area 3 is ensured.
In addition, to further improve the uniformity of the reflection path of the laser light in the entire lower step region 3, the width of each first connection portion 13 in the first fan-out region 17 may be smaller than that in the second fan-out region 18.
Alternatively, referring again to fig. 8, for the first and second fan-out areas 17 and 18 arranged in the second direction, the width of the first connection part 13 in the second fan-out area 18 is greater than the width of the first connection part 13 in the first fan-out area 17. By adjusting the widths of the first connection portions 13 in the first fan-out area 17 and the second fan-out area 18, the total area of the first connection portions 13 in the first fan-out area 17 can be smaller than the total area of the first connection portions 13 in the second fan-out area 18, the total reflection degree of the first connection portions 13 and the fan-out wires 6 on laser in the two areas is balanced, and the uniform heating of the encapsulation cement 14 in the lower step area 3 is ensured.
Referring to fig. 8 again, along the direction of the first fan-out area 17 toward the second fan-out area 18, if the distribution density of the fan-out traces 6 decreases, the widths of the first connection portions 13 may increase.
It should be noted that, in the actual manufacturing process of the display panel, in order to improve the uniformity of the etching of the film layer at the edge of the display panel, some virtual fan-out wires are further disposed in the lower step area 3, and the part of virtual fan-out wires are not used to drive the sub-pixels to emit light, which can be seen in the virtual fan-out wires 61 in fig. 7 and 8. When the lower step area 3 is provided with the dummy fanout trace 61, the first connection portion 13 may also overlap the dummy fanout trace 61.
Optionally, the display area 1 is provided with a gate line, a data line and a reference voltage signal line, wherein the gate line is used for transmitting a scanning signal to the pixel circuit, the data line is used for transmitting a data signal to the pixel circuit, and the reference voltage signal line is used for transmitting a reference voltage signal to the pixel circuit.
One end of the fan-out wire 6 is electrically connected with the data wire, and the other end of the fan-out wire 6 is electrically connected with the driving chip 16. The negative power supply connection part 12 and the data line are arranged on the same layer; the fanout wire 6 includes a first transmission wire and a second transmission wire, wherein the first transmission wire is arranged in the same layer as the gate wire, and the second transmission wire is arranged in the same layer as the reference voltage signal wire. That is, as shown in fig. 9, fig. 9 is a schematic diagram of a film structure of a display panel according to an embodiment of the present invention, the second transmission trace 19 is located at a side of the first transmission trace 20 facing the light emitting surface, and the first connection portion 13 is located at a side of the second transmission trace 19 facing the light emitting surface. In this arrangement, the negative power supply connection portion 12 and the data line are formed by the same process, the first transmission trace 20 and the gate line are formed by the same process, the second transmission trace 19 and the reference voltage signal line are formed by the same process, and no additional patterning process is required for the negative power supply connection portion 12, the first transmission trace 20 and the second transmission trace 19, so that the manufacturing process is simplified and the manufacturing cost is reduced.
Optionally, the lower step area 3 is further provided with a cushion metal 21 and an encapsulation glue 14, please refer again to fig. 9, the encapsulation glue 14 being provided in a different layer from the cushion metal 21 and overlapping. The area where the encapsulation compound 14 is located includes a first area 22, where the encapsulation compound 14 overlaps the first connection portion 13 in the first area 22, and the first connection portion 13 located in the first area 22 is multiplexed into the pad metal 21.
When the encapsulation glue 14 overlaps the first connection portion 13 in the first area 22, the first connection portion 13 in the first area 22 is multiplexed into the cushion metal 21, so that not only is the cushion metal 21 not required to be additionally arranged, and the manufacturing cost is reduced, but also when the encapsulation glue 14 is sintered, the laser is reflected by the first connection portion 13 which is closer to the encapsulation glue 14, so that the loss of laser energy can be reduced, and the curing effect of the encapsulation glue 14 is improved.
Further, the first connection portion 13 and the first transmission line 20 do not overlap, and/or the first connection portion 13 and the second transmission line 19 do not overlap, and/or the first transmission line 20 and the second transmission line 19 do not overlap. For example, referring again to fig. 8, in the first region 22, the first connection portion 13 and the second transmission trace 19 do not overlap, and the first transmission trace 20 and the second transmission trace 19 do not overlap.
As shown in fig. 10, fig. 10 is a schematic diagram of another film structure of the display panel according to the embodiment of the present invention, where the first transmission line 20 and the second transmission line 19 do not overlap, and the first connection portion 13 overlaps both the first transmission line 20 and the second transmission line 19. When the first transmission line 20 and the second transmission line 19 do not overlap, the surface of the film layer formed by stacking the first transmission line 20 and the second transmission line 19 is relatively flat, and after the first connection portion 13 and the encapsulation glue 14 are formed on the film layer, the encapsulation glue 14 can be ensured to have smaller undulation, and the height difference of the encapsulation glue 14 in different areas can be reduced.
Or, as shown in fig. 11, fig. 11 is a schematic diagram of a film structure of a display panel provided in an embodiment of the present invention, on the premise that the first transmission line 20 and the second transmission line 19 do not overlap, the first connection portion 13 may not overlap with the first transmission line 20 and the second transmission line 19, that is, the first connection portion 13, the first transmission line 20 and the second transmission line 19 do not overlap with each other, and at this time, the first connection portion 13, the first transmission line 20 and the second transmission line 19 are respectively located in different areas, so that a height difference between film layers formed by stacking the three layers in different areas can be reduced to a greater extent, and the surface of the encapsulation glue 14 is flatter.
Further, as shown in fig. 12, fig. 12 is a schematic diagram of a film structure of a display panel according to an embodiment of the present invention, a region where the encapsulation compound 14 is located includes a second region 23, the encapsulation compound 14 and the first connection portion 13 do not overlap in the second region 23, the first transmission trace 20 overlaps the second transmission trace 19, and the second transmission trace 19 located in the second region 23 is multiplexed into the pad metal 21.
Compared with the first transmission line 20, when the second transmission line 19 is closer to the encapsulation glue 14 and the laser irradiates the encapsulation glue 14, the second transmission line 19 closer to the encapsulation glue 14 is used for reflecting the laser, and the laser reflection path is shorter, so that the loss is smaller, therefore, the curing effect of the laser on the encapsulation glue 14 can be improved by overlapping the first transmission line 20 and the second transmission line 19 in the second area 23 and using the second transmission line 19 as reflective metal.
The embodiment of the invention further provides a display device, as shown in fig. 13, fig. 13 is a schematic structural diagram of the display device according to the embodiment of the invention, where the display device includes the display panel 100. The specific structure of the display panel 100 is described in detail in the above embodiments, and will not be described here again. Of course, the display device shown in fig. 13 is only a schematic illustration, and the display device may be any electronic apparatus having a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, or a television.
Because the display device provided by the embodiment of the invention comprises the display panel 100, by adopting the display device, the packaging glue 14 in the lower step area 3 is sintered by the dispersion design of the negative power supply connection part 12 in the display panel 100, so that the sintering uniformity of the packaging glue 14 is improved, the packaging effect is optimized, and the packaging reliability of the display device is improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the invention.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (11)
1. A display panel, comprising:
the display device comprises a display area and a non-display area surrounding the display area, wherein the non-display area comprises a lower step area, the lower step area comprises a sector area and a binding area, the sector area and the binding area are arranged along a first direction, the sector area is provided with a sector-out wiring, and the binding area is provided with at least one negative power supply pad;
a cathode layer extending from the display region to the non-display region, the cathode layer including a cathode connection portion at the lower step region;
a negative power bus located in the lower step region;
the lower step region further includes a cathode contact region in which the negative power bus is electrically connected with the cathode connection portion;
the lower step area is also provided with a negative power supply connecting part, the negative power supply connecting part is arranged in a different layer from the fan-out wiring, one end of the negative power supply connecting part is electrically connected with the negative power supply bus, and the other end of the negative power supply connecting part is electrically connected with one negative power supply bonding pad;
the negative power supply connection part comprises a plurality of first connection parts which extend along the first direction and are arranged along the second direction, a space is reserved between two adjacent first connection parts, and the second direction is intersected with the first direction;
the fan-shaped area comprises a first fan-out area and a second fan-out area, the extending direction of the fan-out wire positioned in the first fan-out area is intersected with the first direction or the second direction, and the extending direction of the fan-out wire positioned in the second fan-out area is parallel to the first direction or the second direction;
the area of the first connection part in the first fan-out area is smaller than the area of the first connection part in the second fan-out area in unit area.
2. The display panel of claim 1, wherein the display panel comprises,
the negative power supply connection part further comprises a second connection part extending along the second direction;
one end of the first connecting part, which is close to the display area, is electrically connected with the negative power bus, one end of the first connecting part, which is far away from the display area, is electrically connected with the second connecting part, and the second connecting part is also electrically connected with one negative power pad.
3. The display panel of claim 2, wherein the lower step area is further provided with an encapsulation glue;
in the direction perpendicular to the plane of the display panel, the second connection part and the encapsulation adhesive do not overlap.
4. The display panel of claim 1, wherein the display panel comprises,
the binding area is bound with a driving chip, the driving chip comprises at least two negative power supply pads arranged along a second direction, and the driving chip provides a cathode power supply signal for the negative power supply bus through the negative power supply pads.
5. The display panel of claim 1, wherein for the first and second fan-out regions arranged along the first direction, at least one of the first connection portions has a smaller width at the first fan-out region than at the second fan-out region.
6. The display panel of claim 1, wherein for the first and second fan-out regions arranged in the second direction, a width of the first connection portion within the second fan-out region is greater than a width of the first connection portion within the first fan-out region.
7. The display panel according to claim 1, wherein the display area is provided with a gate line, a data line and a reference voltage signal line, one end of the fan-out wiring is electrically connected with the data line, and the other end of the fan-out wiring is electrically connected with the driving chip;
the negative power supply connection part and the data line are arranged on the same layer;
the fan-out wiring comprises a first transmission wiring and a second transmission wiring, wherein the first transmission wiring and the grid line are arranged on the same layer, and the second transmission wiring and the reference voltage signal line are arranged on the same layer.
8. The display panel of claim 7, wherein the downstep area is further provided with a cushion metal and an encapsulation glue, the encapsulation glue being disposed in a different layer from the cushion metal and overlapping;
the packaging glue is arranged in the first area, the packaging glue and the first connecting part are overlapped in the first area, and the first connecting part positioned in the first area is multiplexed into the cushion metal.
9. The display panel according to claim 8, wherein the first connection portion and the first transmission line do not overlap, and/or the first connection portion and the second transmission line do not overlap, and/or the first transmission line and the second transmission line do not overlap.
10. The display panel according to claim 7, wherein the lower step region is further provided with a pad metal and a packaging adhesive, the packaging adhesive is located in a second region including a region where the packaging adhesive and the first connection portion do not overlap, and the first transmission trace overlaps the second transmission trace in the second region, and the second transmission trace located in the second region is multiplexed to the pad metal.
11. A display device comprising the display panel according to any one of claims 1 to 10.
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| CN202110935972.XA CN113658986B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
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| CN202110935972.XA CN113658986B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
| CN201910565963.9A CN110164949B (en) | 2019-06-27 | 2019-06-27 | Display panel and display device |
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| CN113658986B (en) * | 2019-06-27 | 2024-03-22 | 武汉天马微电子有限公司 | Display panel and display device |
| CN110599955B (en) * | 2019-09-19 | 2021-02-09 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN110568683B (en) * | 2019-09-23 | 2022-06-28 | 上海中航光电子有限公司 | Array substrate, display device and test method thereof |
| CN110993817B (en) * | 2019-11-26 | 2020-12-25 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
| CN111653603B (en) * | 2020-06-18 | 2023-08-29 | 京东方科技集团股份有限公司 | Display substrate and display device |
| US20230087701A1 (en) * | 2021-02-20 | 2023-03-23 | Boe Technology Group Co., Ltd. | Display panel, method for manufacturing the same and display device |
| CN114419996B (en) * | 2022-01-21 | 2023-07-25 | 武汉华星光电技术有限公司 | Display panel |
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Also Published As
| Publication number | Publication date |
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| CN113658986A (en) | 2021-11-16 |
| CN113658985B (en) | 2023-10-31 |
| CN113658985A (en) | 2021-11-16 |
| CN110164949A (en) | 2019-08-23 |
| CN110164949B (en) | 2021-09-07 |
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