CN110246885B - Display panel - Google Patents
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- CN110246885B CN110246885B CN201910579188.2A CN201910579188A CN110246885B CN 110246885 B CN110246885 B CN 110246885B CN 201910579188 A CN201910579188 A CN 201910579188A CN 110246885 B CN110246885 B CN 110246885B
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- 239000002184 metal Substances 0.000 claims abstract description 256
- 230000007704 transition Effects 0.000 claims abstract description 173
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000004806 packaging method and process Methods 0.000 claims abstract description 30
- 238000005538 encapsulation Methods 0.000 claims description 18
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims 1
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- 230000008018 melting Effects 0.000 description 4
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- 241001391944 Commicarpus scandens Species 0.000 description 2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention provides a display panel, which comprises a display area arranged on a first substrate and a packaging area surrounding the display area, wherein a power signal binding terminal area is also arranged on one side of the packaging area, which is far away from the display area; the packaging region comprises a first wiring region, a second wiring region and a wiring transition region from the display region to the direction of the power signal binding terminal region, and the wiring transition region is arranged between the first wiring region and the second wiring region; a first metal wiring layer disposed in the first wiring region; a first insulating layer provided on the first metal wiring layer and covering the first metal wiring layer, the first insulating layer extending from the first wiring region to the wiring transition region and the second wiring region; a second metal wiring layer disposed on the first insulating layer of the first wiring region, the wiring transition region, and the second wiring region; in the wiring transition area, a transition cushion layer is arranged below the second metal wiring layer, and the thickness of the transition cushion layer close to one side of the first wiring area is larger than that of the transition cushion layer close to one side of the second wiring area.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to a display panel.
[ background of the invention ]
An Organic Light-Emitting Diode (OLED) display panel is widely used in the display technology field because it has many advantages such as active Light emission, high contrast, no viewing angle limitation, and flexible display.
At present, in order to improve the anti-moisture property of each OLED device in the OLED display panel, an encapsulation adhesive (frit) is generally used to encapsulate the display panel. During specific manufacturing, the packaging adhesive needs to be arranged in the packaging adhesive arrangement area. When the film layer in the packaging adhesive setting area is complicated to set, an overlapping area exists between the multiple metal wiring layers, and an non-overlapping area also exists, and the metal wiring layer on the upper layer extends from the overlapping area with the metal wiring layer on the lower layer to an area which is not overlapped with the metal wiring layer on the lower layer, the metal wiring layer on the upper layer is easy to break due to the height difference, so that poor display is caused.
[ summary of the invention ]
In view of this, an embodiment of the present invention provides a display panel, including a first substrate, where the first substrate includes a display area and an encapsulation area surrounding the display area, and a power signal binding terminal area is further disposed on a side of the encapsulation area away from the display area; from the display area to the direction of the power signal binding terminal area, the packaging area comprises a first wiring area, a second wiring area and a wiring transition area, and the wiring transition area is arranged between the first wiring area and the second wiring area; a first metal wiring layer disposed in the first wiring region; a first insulating layer disposed on the first metal wiring layer and covering the first metal wiring layer, the first insulating layer extending from the first wiring region to the wiring transition region and the second wiring region; the second metal wiring layer is arranged on the first insulating layer of the first wiring region, the wiring transition region and the second wiring region; and a transition pad layer is arranged below the second metal wiring layer in the wiring transition area, and the thickness of the transition pad layer close to one side of the first wiring area is larger than that of the transition pad layer close to one side of the second wiring area.
Optionally, the thickness of the pad transition layer gradually decreases from a side close to the first wiring region to a side close to the second wiring region.
Optionally, on a side of the wiring transition region close to the second wiring region, an included angle between a side surface and a bottom surface of the transition pad layer is less than or equal to 70 degrees.
Optionally, the transition pad layer is disposed between the second metal wiring layer and the first insulating layer.
Optionally, a third metal wiring layer and a second insulating layer are further disposed between the first insulating layer and the second metal wiring layer; the third metal wiring layer is disposed on the first insulating layer of the first wiring region, the second insulating layer is disposed on the third metal wiring layer and covers the third metal wiring layer, and the second insulating layer extends from the first wiring region to the wiring transition region and the second wiring region.
Optionally, the transition pad layer is disposed between the second metal wiring layer and the second insulating layer; alternatively, the transition pad layer is disposed between the third metal wiring layer and the first insulating layer.
Optionally, the transition pad layer comprises a first transition pad layer and a second transition pad layer; the first transition pad layer is arranged between the second metal wiring layer and the second insulating layer; or, the first transition pad layer is arranged between the third metal wiring layer and the second insulating layer; the second transition pad layer is arranged between the third metal wiring layer and the second insulating layer; alternatively, the second buffer layer is disposed between the first metal wiring layer and the first insulating layer.
Optionally, the material of the transition pad layer is silicon nitride or silicon oxide.
Optionally, one side of the transition pad layer facing the second metal wiring layer is a smooth plane; or a convex structure and a concave structure are arranged on one side, facing the second metal wiring layer, of the transition cushion layer; or, one side of the transition pad layer facing the second metal wiring layer is set to be step-shaped.
Optionally, the package region further includes a reflective metal installation region, the reflective metal installation region is adjacent to the second wiring region, and a first reflective metal layer is disposed in the reflective metal installation region.
Optionally, a difference in height between the reflective metal arrangement region and the second wiring region is less than or equal to 7000 angstroms.
Optionally, the second metal wiring layer includes a power signal trace, and a stress removal hole is formed in the power signal trace; a filling layer is arranged in the stress removing hole; the filling layer belongs to the first metal layer; or, the filling layer belongs to the third metal layer; or the filling layer belongs to the transition cushion layer.
Optionally, a second reflective metal layer is further disposed between the first reflective metal layer and the second metal wiring layer, and the second reflective metal layer, the first reflective metal layer, and the second metal wiring layer are not overlapped.
Optionally, the display panel is an organic light emitting display panel, and the organic light emitting display panel further includes a second substrate; the second substrate is attached to the first substrate through a packaging layer arranged in the packaging area.
In the embodiment of the invention, the transition cushion layer is arranged below the second metal wiring layer positioned on the upper layer, and the structure of the transition cushion layer is that the thickness of one side close to the first wiring area is larger than that of one side close to the second wiring area, so that the first insulating layer forms a gentle slope at the step-shaped step difference between the first wiring area and the wiring transition area, the second metal wiring layer formed on the slope can form a continuous film surface, the conditions of second metal wiring layer fracture or uneven wiring and the like can not occur, the defect of poor wiring of the second metal wiring layer in a packaging area is avoided, and the quality of the display panel is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of a display panel according to an embodiment of the invention;
FIG. 2 is an enlarged view of area A of FIG. 1;
FIG. 3 is a schematic view of the cross-section along BB' in FIG. 2;
FIGS. 4-8 are schematic structural views of transition cushions in several different embodiments;
FIG. 9 is a diagram illustrating a display panel according to one embodiment of the present invention;
fig. 10 is a schematic view of a display panel according to a second embodiment of the present invention;
FIG. 12 is a schematic view of a display panel provided in another implementation form of the second embodiment;
fig. 13 is a schematic view of a display panel according to a third embodiment of the present invention;
FIG. 14 is a schematic diagram of a display panel according to one embodiment of the present disclosure;
FIG. 15 is a schematic diagram of a display panel according to another embodiment of the present invention;
FIG. 16 is a schematic diagram of a display panel according to yet another embodiment of the third embodiment;
fig. 17 is a schematic view along section CC' in fig. 16.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Example one
Fig. 1 is a schematic view of a display panel according to an embodiment of the present invention, and as shown in the drawing, a display panel 10 includes a first substrate 11, and the first substrate 11 includes a display area 12 and an encapsulation area 13 surrounding the display area 12. A power signal binding terminal region 14 is further provided on a side of the encapsulation region 13 away from the display region 12.
Fig. 2 is an enlarged schematic view of the area a in fig. 1, and fig. 3 is a schematic view of the cross section along BB' in fig. 2, as shown in the direction from the display area 12 to the power signal binding terminal area 14, the package area 13 includes a first wiring area 15, a second wiring area 17, and a wiring transition area 16, and the wiring transition area 16 is disposed between the first wiring area 15 and the second wiring area 17.
A first metal wiring layer 18 is provided in the first wiring region 15. Alternatively, the first metal wiring layer 18 may be a gate wiring layer including a plurality of gate wirings; alternatively, the first metal wiring layer 18 may be a source wiring layer including a plurality of source wirings. The first metal wiring layer 18 is not provided in the wiring transition region 16 and the second wiring region 17.
A first insulating layer 19 is provided on the first metal wiring layer 18, the first insulating layer 19 covering the first metal wiring layer 18 of the first wiring region 15, and the first insulating layer 19 also extends from the first wiring region 15 to the wiring transition region 16 and the second wiring region 17. Since the first metal wiring layer 18 is not provided in the wiring transition region 16 and the second wiring region 17, the first insulating layer 19 is not a flat film surface but has a height difference between the first wiring region 15 and the wiring transition region 16.
A second metal wiring layer 20 is provided on the first insulating layer 19 of the first wiring region 15, the wiring transition region 16, and the second wiring region 17. Since first insulating layer 19 disposed below second metal wiring layer 20 is not a flat film surface, second metal wiring layer 20 disposed above first insulating layer 19 is also not a flat film surface, and has a height difference between first wiring region 15 and wiring transition region 16.
In the wiring transition region 16, a pad layer 21 is provided under the second metal wiring layer 20, and the thickness of the pad layer 21 on the side close to the first wiring region 15 is larger than that on the side close to the second wiring region 17.
In the prior art, when the metal wiring layer on the upper layer extends from the overlapping region with the metal wiring layer on the lower layer to the non-overlapping region with the metal wiring layer on the lower layer, because the height difference exists and is a step-shaped step difference, the metal wiring layer on the upper layer is easy to break, thereby causing poor display. In the embodiment of the invention, the transition cushion layer is arranged below the second metal wiring layer positioned on the upper layer, and the structure of the transition cushion layer is that the thickness of one side close to the first wiring area is larger than that of one side close to the second wiring area, so that a gentle slope is formed at the step-shaped step difference between the first wiring area and the wiring transition area on the first insulating layer, the second metal wiring layer formed on the slope can form a continuous film surface, the conditions of second metal wiring layer fracture or uneven film thickness and the like cannot occur, the defect of poor wiring of the second metal wiring layer in a packaging area is avoided, and the quality of the display panel is improved.
Alternatively, on the side of the wiring transition region 16 close to the second wiring region 17, the included angle between the side surface and the bottom surface of the transition pad layer 21 is equal to or less than 70 degrees. The included angle between the side surface and the bottom surface of the transition pad layer 21 is less than or equal to 70 degrees, so that the included angle between the second metal wiring layer 20 formed on the transition pad layer in the wiring transition region 16 and the plane of the first substrate 11 is also less than or equal to 70 degrees, the angle range of less than or equal to 70 degrees can further reduce the risk of second metal wiring layer 20 fracture or uneven film thickness, and the angle range of less than or equal to 70 degrees is easy to control the forming process of the transition pad layer 21.
Alternatively, as shown in fig. 3, the thickness of the buffer layer 21 is gradually reduced from the side near the first wiring region 15 to the side near the second wiring region 17. The slope formed by the shape of the buffer layer 21 is gentle and continuous, and the wiring quality of the second metal wiring layer 20 located thereon can be improved. The present invention is not so limited and in other embodiments the transition pad layer may have other configurations. As shown in fig. 4, in one embodiment, there is a step difference between a first portion 211 of the pad transition layer 21 adjacent to the first wiring region and a second portion 212 adjacent to the second wiring region, but the step difference is much smaller than that of the first insulating layer, and does not affect the wiring quality of the second metal wiring layer. The transition pad layer may have a structure different from that shown in fig. 3 and 4, and as long as the thickness of the transition pad layer near the first wiring region is greater than that near the second wiring region, the step difference of the first insulating layer may be reduced by the transition pad layer, thereby improving the wiring quality of the second metal wiring layer.
Alternatively, as shown in fig. 3, the side of the transition pad layer 21 facing the second metal wiring layer 20 is a smooth plane. The present invention is not so limited and in other embodiments the transition pad layer may have other configurations. As shown in fig. 5 to 8, in other embodiments, the side of the transition pad layer 21 facing the second metal wiring layer is provided with a convex-concave structure, and the convex-concave structure may be saw-toothed, as shown in fig. 5; it may also be wavy, as shown in FIG. 6; or wedge shape, as shown in fig. 7; or the side of the buffer layer 21 facing the second metal wiring layer is provided in a step shape as shown in fig. 8. The convex concave structure can increase the roughness of one side of the transition cushion layer facing the second metal wiring layer, increase the contact surface of the transition cushion layer 21 and the second metal wiring layer, increase the film forming contact strength of the second metal wiring layer on the transition cushion layer, prevent the second metal wiring layer from being peeled off easily, and further improve the wiring quality of the second metal wiring layer.
Alternatively, as shown in fig. 3, a buffer layer 21 is provided between second metal wiring layer 20 and first insulating layer 19. The invention is not so limited and in other embodiments the transition pad layer may be disposed in other locations. As shown in fig. 9, in one embodiment, a transition pad layer 21 is disposed between first metal wiring layer 18 and first insulating layer 19. The pad transition layer 21 is disposed near the first metal wiring layer 18 of the first wiring region 15, and the thickness of the pad transition layer 21 near the first metal wiring layer 18 of the first wiring region 15 is greater than the thickness near the second wiring region 17. Because the first wiring region 15 is provided with the first metal wiring layer 18 in the packaging region, the first metal wiring layer 18 is not provided in the wiring transition region 16 and the second wiring region 17, the height difference between the wiring transition region 16, the second wiring region 17 and the first wiring region 15 is caused by the first metal wiring layer 18, the transition pad layer 21 is arranged close to the first metal wiring layer 18 of the first wiring region 15 in the wiring transition region 16, the step-shaped step difference caused by the first metal wiring layer 18 is changed into a gentle slope, the gentle slope can be formed when the first insulating layer 19 is formed on the slope of the transition pad layer 21, and further the second metal wiring layer 20 is formed on the first insulating layer 19 to form a continuous and gentle film surface, the conditions of fracture of the second metal wiring layer 20 or uneven film thickness and the like can not occur, and the defect of poor wiring of the second metal wiring layer 20 in the packaging region can be avoided, the quality of the display panel is improved.
Alternatively, in the structure shown in fig. 9, the side of the transition pad layer 21 facing the second metal wiring layer 20 may be a smooth plane, or a convex-concave structure may be provided. One side of the transition pad layer 21 facing the second metal wiring layer 20 is provided with a convex-concave structure, which can enlarge the contact surface with the first insulating layer 19, so that the film-forming contact strength of the first insulating layer 19 on the transition pad layer 21 is increased, and the transition pad layer is not easy to strip.
The material of the transition pad layer 21 is an insulating material, optionally, the material of the transition pad layer 21 is silicon nitride or silicon oxide, and the compactness and the film-forming property of the silicon nitride or the silicon oxide are good, and are good materials of the formed transition pad layer.
Alternatively, as shown in fig. 3 and 9, an underlying insulating layer 22 is further provided between the first substrate 11 and the first metal wiring layer 18, the underlying insulating layer 22 being used to insulate a metal layer located below the underlying insulating layer 22 from the first metal wiring layer 18, or the underlying insulating layer 22 being used to improve the wiring contact strength of the first metal wiring layer 18 located thereon.
Alternatively, as shown in fig. 1, the display panel may be a circular display panel, but the present invention is not limited thereto, and the display panel provided by the present invention may also be a rectangular display panel, or a special-shaped display panel.
Optionally, the display panel provided in the embodiment of the present invention is an organic light emitting display panel, and the organic light emitting display panel further includes a second substrate, the second substrate is disposed above the first substrate, and the second substrate and the first substrate are attached to each other through an encapsulation layer disposed in the encapsulation region.
In the first embodiment of the present invention, the transition pad layer is disposed below the second metal wiring layer located on the upper layer, and the transition pad layer is configured such that the thickness of the side close to the first wiring region is greater than the thickness of the side close to the second wiring region, so that a gentle slope is formed in the step-shaped step difference between the first wiring region and the wiring transition region on the first insulating layer, and the second metal wiring layer formed on the slope can form a continuous film surface, which does not cause the second metal wiring layer to break or the film layer has uneven thickness, thereby avoiding the defect of poor wiring in the encapsulation region of the second metal wiring layer, and improving the quality of the display panel.
Example two
Fig. 10 is a schematic view of a display panel according to a second embodiment of the present invention, and as shown in the figure, the display panel 40 includes a first substrate 31, the first substrate 31 includes a display area and a package area surrounding the display area, and a power signal binding terminal area is further disposed on a side of the package area away from the display area. The encapsulation region includes a first wiring region 35, a second wiring region 37, and a wiring transition region 36 from the display region toward the power signal binding terminal region, the wiring transition region 36 being disposed between the first wiring region 35 and the second wiring region 37.
A first metal wiring layer 38 is provided in the first wiring region 35, and the first metal wiring layer 38 is not provided in the wiring transition region 36 and the second wiring region 37. A first insulating layer 39 is provided on the first metal wiring layer 38, the first insulating layer 39 covering the first metal wiring layer 38 of the first wiring region 35, and the first insulating layer 39 also extends from the first wiring region 35 to the wiring transition region 36 and the second wiring region 37. Since the first metal wiring layer 38 is not provided in the wiring transition region 36 and the second wiring region 37, the first insulating layer 39 is not a flat film surface, but a step-like step difference is formed in the first wiring region 35 and the wiring transition region 36.
A third metal wiring layer 42 is provided on the first insulating layer 39, and the third metal wiring layer 42 is not provided in the wiring transition region 36 and the second wiring region 37. A second insulating layer 43 is provided on the third metal wiring layer 42, the second insulating layer 43 covers the third metal wiring layer 42 of the first wiring region 35, and the second insulating layer 43 also extends from the first wiring region 35 to the wiring transition region 36 and the second wiring region 37. Also, since the third metal wiring layer 42 is not provided in the wiring transition region 36 and the second wiring region 37, the second insulating layer 43 formed on the third metal wiring layer 42 is not a flat film surface, and has a step-like level difference in the first wiring region 35 and the wiring transition region 36.
The second metal wiring layer 30 is provided on the second insulating layer 43 of the first wiring region 35, the wiring transition region 36, and the second wiring region 37. The second metal wiring layer 30 also has a level difference between the first wiring region 35 and the wiring transition region 36 and the second wiring region 37.
In the wiring transition region 36, a pad transition layer 41 is disposed under the second metal wiring layer 30, and the thickness of the pad transition layer 41 on the side close to the first wiring region 35 is greater than that on the side close to the second wiring region 37. Specifically, the transition pad layer 41 is formed between the second metal wiring layer 30 and the second insulating layer 43, as shown in fig. 10, by providing the transition pad layer 41, a gentle slope is formed on the step-like step difference between the first wiring region 35 and the second insulating layer 43 of the wiring transition region 36, and when the second metal wiring layer 30 on the second insulating layer 43 is formed, a gentle film surface can be formed according to the shape of the gentle slope, so that the second metal wiring layer 30 is not broken or the thickness of the film is not uneven, the defect of poor wiring in the package region of the second metal wiring layer 30 is avoided, and the quality of the display panel is improved.
In addition, as shown in fig. 10, since the first metal wiring layer 38 is provided only in the first wiring region 35, the first insulating layer 39 formed thereon has a level difference between the first wiring region 35 and the wiring transition region 36. The third metal wiring layer 42 on the first insulating layer 39 is also provided only in the first wiring region 35, and the second insulating layer 43 formed thereon is further increased in level difference between the first wiring region 35 and the wiring transition region 36, so that the film formation coverage is deteriorated and the edge region of the third metal wiring layer 42 may not be covered. The edge region of the third metal wiring layer 42 can be covered by providing the buffer layer 41, and a short circuit between the third metal wiring layer 42 and the second metal wiring layer 30 is avoided. The transition pad layer 41 is made of an insulating material, optionally, the transition pad layer 41 is made of silicon nitride or silicon oxide, and the compactness and the film-forming property of the silicon nitride or the silicon oxide are good, so that the formed transition pad layer is a good material.
Fig. 11 is a schematic view of a display panel according to another embodiment of the second embodiment. The difference from the structure shown in fig. 10 is that a buffer layer 41 is provided between the third metal wiring layer 42 and the second insulating layer 43.
The first metal wiring layer 38 is provided only in the first wiring region 35, and the first insulating layer 39 formed thereon has a level difference between the first wiring region 35 and the wiring transition region 36. After the third metal wiring layer 42 is formed, a transition pad layer 41 adjacent to the third metal wiring layer 42 is formed in the wiring transition region 36 on the upper layer of the third metal wiring layer 42, the transition pad layer 41 forms a gentle slope between the film level differences of the first wiring region 35 and the wiring transition region 36, and the second insulating layer 43 and the second metal wiring layer 30 on the transition pad layer can form a gentle and continuous film surface according to the gentle slope of the lower film layer during film formation, so that the second insulating layer 43 can be ensured to have good coverage on the third metal wiring layer 42, and the second metal wiring layer 30 can be ensured not to be broken or have uneven film thickness and other defects. Optionally, the transition pad layer may also be disposed between the first metal wiring layer and the first insulating layer, and the effect of ensuring that the insulating film layer on the upper layer has good coverage and the second metal wiring layer does not break or has uneven film thickness is also achieved.
Referring to fig. 12, which is a schematic view of a display panel according to still another embodiment of the second embodiment, as shown in the figure, the transition pad layer includes a first transition pad layer 411 and a second transition pad layer 412. First buffer layer 411 is disposed between second metal wiring layer 30 and second insulating layer 43, and second buffer layer 412 is disposed between third metal wiring layer 42 and first insulating layer 39. In the second embodiment, the difference in height between the first wiring region 35 and the wiring transition region 36 is caused by the two metal wiring layers, that is, the first metal wiring layer 38 and the third metal wiring layer 42 which are only disposed in the first wiring region 35, and the two transition pad layers are disposed to form a gentle slope at the level difference between the first metal wiring layer 38 and the third metal wiring layer 42, so that advantages such as optimizing the film formation coverage of the insulating film layer disposed thereon, reducing the level difference between the film layers, and optimizing the film formation quality of the second metal wiring layer can be achieved. Optionally, a second transition pad layer may be further disposed between the first metal wiring layer and the first insulating layer, and the first transition pad layer may be disposed between the third metal wiring layer and the second insulating layer, with the same effect.
Alternatively, the side of pad transition layer 41 facing second metal wiring layer 20 in fig. 10 and 11, and the side of first pad transition layer 411 and second pad transition layer 412 facing second metal wiring layer 20 in fig. 12 may be smooth planes, and may also be provided with a convex-concave structure. The specific structure may refer to fig. 5 to fig. 8 and corresponding descriptions in the first embodiment, and details are not repeated here. One side of the transition cushion layer facing the second metal wiring layer is provided with a protruding concave structure, so that the contact surface between the transition cushion layer and the upper film layer can be enlarged, the film forming strength of the upper film layer is increased, and the transition cushion layer is not easy to strip.
Alternatively, as shown in fig. 10, 11 and 12, on the side of the wiring transition region 36 close to the second wiring region 37, an included angle between the side surface and the bottom surface of the transition pad layer 41, the first transition pad layer 411 or the second transition pad layer 412 is equal to or less than 70 degrees. The angle range can ensure that the included angle of the second metal wiring layer 30 formed on the second metal wiring layer in the wiring transition region 36 and the plane of the first substrate 31 is also less than or equal to 70 degrees, the angle range of less than or equal to 70 degrees can further reduce the risk of second metal wiring layer 30 fracture or uneven film thickness, and the angle range of less than or equal to 70 degrees is easy to control the formation process of the transition pad layer.
Alternatively, as shown in fig. 10, 11 and 12, an underlying insulating layer 32 is further provided between the first substrate 31 and the first metal wiring layer 38, the underlying insulating layer 32 is used to insulate a metal layer located below the underlying insulating layer 32 from the first metal wiring layer 38, or the underlying insulating layer 32 is used to improve the wiring contact strength of the first metal wiring layer 38 located thereon.
Optionally, the display panel provided in the embodiment of the present invention is an organic light emitting display panel, and the organic light emitting display panel further includes a second substrate, the second substrate is disposed above the first substrate, and the second substrate and the first substrate are attached to each other through an encapsulation layer disposed in the encapsulation region.
EXAMPLE III
Referring to fig. 13, which is a schematic view of a display panel according to a third embodiment of the present invention, and the differences between the third embodiment and the first embodiment and the second embodiment are not repeated, preferably, as shown in fig. 13, in the third embodiment, a display panel 50 includes a first substrate 51, the first substrate 51 includes a display area 52 and an encapsulation area 53 surrounding the display area 52, and a power signal binding terminal area 54 is further disposed on a side of the encapsulation area 53 away from the display area 52. In the direction from the display area 52 to the power signal binding terminal area 54, the package area 53 includes a first wiring area 55, a second wiring area 57, and a wiring transition area 56, and the wiring transition area 56 is disposed between the first wiring area 55 and the second wiring area 57. A reflective metal layout region 59 is provided in the package region 53 adjacent to the wiring transition region 56 and the second wiring region 57, and a first reflective metal layer 592 is provided in the reflective metal layout region 59. The first reflective metal layer 592 reflects energy of a laser beam when the package adhesive (frit) is heated and melted by the laser beam, thereby improving efficiency of melting the package adhesive.
In the structure shown in fig. 13, the first wiring region 55, the wiring transition region 56, and the second wiring region 57 are adjacent in the longitudinal direction, i.e., the direction from the display region 52 to the power signal binding terminal region 54, and the reflective metal providing region 59 and the wiring transition region 56, and the second wiring region 57 are adjacent in the lateral direction, but the present invention is not limited thereto. A second metal wiring layer 591 is provided on the first wiring region 55, the wiring transition region 56, and the second wiring region 57.
The height difference between the reflective metal providing region 59 and the wiring transition region 56 and the second wiring region 591 is not more than 7000 angstroms. Referring to fig. 14, which is a schematic diagram of a display panel according to three embodiments of the present invention, in fig. 14, a first reflective metal layer 592 disposed in the reflective metal disposing region 59 belongs to a first metal wiring layer, and a first insulating layer 69 covering the reflective metal disposing region 59, the wiring transition region 56, and the second wiring region 57 is disposed on the first metal layer. The second metal wiring layer 591 is arranged on the upper layer of the first insulating layer 69, the height difference between the reflective metal setting area 59 and the wiring transition area 56 as well as the height difference between the first metal wiring layer 591 and the second metal wiring layer 591 is the film thickness difference between the first metal wiring layer 591 and the second metal wiring layer 591, the height difference between the reflective metal setting area 59 and the wiring transition area 56 as well as the second wiring area 57 which all belong to the packaging area 53 can be ensured to be smaller, when the packaging glue (frat) is arranged on the packaging area 53, the thickness of the packaging glue in each area can be ensured to be more uniform, and the packaging defect that the packaging glue fails due to the uneven thickness can not occur. Of course, the first reflective metal layer 592 may also belong to a second metal wiring layer or a third metal wiring layer, so long as the difference between the thicknesses and heights of the layers in the reflective metal setting region 59, the wiring transition region 56, and the second wiring region 591 is less than or equal to 7000 angstroms, the packaging effect of the display panel can be ensured.
Referring to fig. 15, which is a schematic view of a display panel according to another embodiment of the present invention, the first reflective metal layer 592 is further multiplexed as a ground signal line, and the second metal wiring layer includes a power signal trace 591. The display panel 50 provides a ground signal to the first reflective metal layer 592 multiplexed as a ground signal line, and provides a power signal to the power signal trace 591, and because signals on the two signal lines are different, in order to avoid signal interference, a certain distance is required to be spaced between the first reflective metal layer 592 and the power signal trace 591, and the second reflective metal layer 593 is disposed in the spacing distance.
Around the display area 52, a first reflective metal layer 592 and a power signal trace 591 are disposed in the package area 53, and the first reflective metal layer 592 and the power signal trace 591 may function to reflect laser light when the package glue is melted. However, since the first reflective metal layer 592 and the power signal trace 591 are spaced by a certain distance, in the distance, the first reflective metal layer 592 or the power signal trace 591 is not disposed, and if no metal layer reflects laser light, the melting rate of the package glue is different from that in the area of the first reflective metal layer 592 or the power signal trace 591, thereby affecting the final package effect. In the above specific embodiment, the second reflective metal layer 593 is disposed in the space between the first reflective metal layer 592 and the power signal trace 591, and the second reflective metal layer 593 may play a role of reflecting laser light, thereby ensuring that the packaging effect of the whole packaging area is consistent and stable. The second reflective metal layer 593 may not overlap with the first reflective metal layer 592 and the power signal trace 591, thereby ensuring that no crosstalk occurs in signals. The second reflective metal layer 593 may be formed by a metal film layer different from the first reflective metal layer 592 and the power signal trace 591.
Referring to fig. 16 and 17, fig. 16 is a schematic view of a display panel according to a third embodiment of the present invention, and fig. 17 is a schematic view along section CC' of fig. 16. As shown, the second metal wiring layer 591 includes a stress relief hole 70 disposed therein. When the second metal wiring layer 591 is used as a power signal wiring line, a power signal is provided for the whole display panel, the line width of the power signal wiring line is large, and in order to avoid the film layer from being broken, a stress relief hole 70 for relieving stress needs to be arranged in the second metal wiring layer 591, the stress relief hole 70 is formed by etching a part of the metal layer in the second metal wiring layer 591, so that the thickness of the region where the stress relief hole 70 is arranged in the second metal wiring layer 591 is different from that of other regions of the second metal wiring layer 591, and the stress relief hole 70 does not have the second metal wiring layer 591 to reflect laser for melting the packaging adhesive. In yet another embodiment of the third embodiment, a filling layer 71 is disposed in the stress relief hole 70, and the filling layer 71 can improve the thickness uniformity of the stress relief hole 70 region and other regions of the second metal wiring layer 591. The filling layer 71 may belong to the first metal wiring layer, or to the third metal wiring layer, or to the transition pad layer described in the first embodiment or the second embodiment. When the filling layer 71 belongs to the first metal wiring layer or the third metal wiring layer, the filling layer 71 can also serve as a reflective metal to reflect laser for melting the packaging adhesive, so that the packaging effect is improved.
Alternatively, as shown in fig. 14 and 17, an underlying insulating layer 62 is further provided between the first substrate 51 and the first reflective metal layer 592, and the underlying insulating layer 62 serves to insulate a metal layer underlying the underlying insulating layer 62 from the first reflective metal layer 592, or the underlying insulating layer 62 serves to improve wiring contact strength of the first reflective metal layer 592.
Optionally, the display panel provided in the embodiment of the present invention is an organic light emitting display panel, and the organic light emitting display panel further includes a second substrate, the second substrate is disposed above the first substrate, and the second substrate and the first substrate are attached to each other through an encapsulation layer disposed in the encapsulation region.
According to the display panel provided by the third embodiment of the invention, on the basis of the first embodiment or the second embodiment, the wiring design of the packaging area is further optimized, and the packaging effect is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (14)
1. The display panel is characterized by comprising a first substrate, wherein the first substrate comprises a display area and an encapsulation area surrounding the display area, and a power signal binding terminal area is further arranged on one side, far away from the display area, of the encapsulation area;
from the display area to the direction of the power signal binding terminal area, the packaging area comprises a first wiring area, a second wiring area and a wiring transition area, and the wiring transition area is arranged between the first wiring area and the second wiring area;
a first metal wiring layer disposed in the first wiring region;
a first insulating layer disposed on the first metal wiring layer and covering the first metal wiring layer, the first insulating layer extending from the first wiring region to the wiring transition region and the second wiring region;
the second metal wiring layer is arranged on the first insulating layer of the first wiring region, the wiring transition region and the second wiring region;
in the wiring transition region, a transition pad layer is arranged below the second metal wiring layer, and the thickness of the transition pad layer close to the first wiring region is larger than that of the transition pad layer close to the second wiring region;
wherein the content of the first and second substances,
the transition pad layer is arranged between the second metal wiring layer and the first insulating layer;
one side of the transition cushion layer facing the second metal wiring layer and the first insulating layer form a gentle slope at a section difference between the first wiring area and the wiring transition area;
alternatively, the first and second electrodes may be,
the transition pad layer is arranged between the first metal wiring layer and the first insulating layer, and the transition pad layer is arranged close to the first metal wiring layer of the first wiring area;
one side of the transition cushion layer facing the second metal wiring layer and one side of the first metal wiring layer facing the second metal wiring layer form a gentle slope.
2. The display panel of claim 1, wherein the buffer layer has a thickness gradually decreasing from a side near the first wiring region to a side near the second wiring region.
3. The display panel according to claim 1, wherein an angle between a side surface and a bottom surface of the buffer layer is 70 degrees or less on a side of the wiring transition region close to the second wiring region.
4. The display panel according to claim 1, wherein a third metal wiring layer and a second insulating layer are further provided between the first insulating layer and the second metal wiring layer;
the third metal wiring layer is disposed on the first insulating layer of the first wiring region, the second insulating layer is disposed on the third metal wiring layer and covers the third metal wiring layer, and the second insulating layer extends from the first wiring region to the wiring transition region and the second wiring region.
5. The display panel according to claim 4, wherein the buffer layer is provided between the second metal wiring layer and the second insulating layer; alternatively, the transition pad layer is disposed between the third metal wiring layer and the first insulating layer.
6. The display panel of claim 4, wherein the transition pad layer comprises a first transition pad layer and a second transition pad layer;
the first transition pad layer is arranged between the second metal wiring layer and the second insulating layer; or, the first transition pad layer is arranged between the third metal wiring layer and the second insulating layer;
the second transition pad layer is arranged between the third metal wiring layer and the second insulating layer; alternatively, the second buffer layer is disposed between the first metal wiring layer and the first insulating layer.
7. The display panel of claim 1, wherein the material of the buffer layer is silicon nitride or silicon oxide.
8. The display panel according to claim 1, wherein a side of the buffer layer facing the second metal wiring layer is a smooth plane; or a convex structure and a concave structure are arranged on one side, facing the second metal wiring layer, of the transition cushion layer; or, one side of the transition pad layer facing the second metal wiring layer is set to be step-shaped.
9. The display panel according to claim 1, wherein the encapsulation area further includes a reflective metal disposition area, the reflective metal disposition area being disposed adjacent to the second wiring area, and a first reflective metal layer being disposed in the reflective metal disposition area.
10. The display panel according to claim 9, wherein a difference in film layer height between the reflective metal providing region and the second wiring region is 7000 a or less.
11. The display panel of claim 4, wherein the second metal routing layer comprises power signal traces with stress relief holes disposed therein; a filling layer is arranged in the stress removing hole;
the filling layer belongs to the first metal wiring layer; or, the filling layer belongs to the third metal wiring layer; or the filling layer belongs to the transition cushion layer.
12. The display panel according to claim 9, wherein a second reflective metal layer is further provided between the first reflective metal layer and the second metal wiring layer, and the second reflective metal layer does not overlap with the first reflective metal layer and the second metal wiring layer.
13. The display panel according to claim 1, wherein the display panel is an organic light emitting display panel further comprising a second substrate; the second substrate is attached to the first substrate through a packaging layer arranged in the packaging area.
14. A display device comprising the display panel according to any one of claims 1 to 13.
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Effective date of registration: 20211109 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: WUHAN TIANMA MICROELECTRONICS Co.,Ltd. Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 201201 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |