CN113630973A - Method for manufacturing precision circuit - Google Patents
Method for manufacturing precision circuit Download PDFInfo
- Publication number
- CN113630973A CN113630973A CN202111065979.7A CN202111065979A CN113630973A CN 113630973 A CN113630973 A CN 113630973A CN 202111065979 A CN202111065979 A CN 202111065979A CN 113630973 A CN113630973 A CN 113630973A
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- CN
- China
- Prior art keywords
- bearing plate
- circuit
- thickness
- manufacturing
- precision circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 238000007731 hot pressing Methods 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims abstract description 14
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 13
- 238000003786 synthesis reaction Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 239000011810 insulating material Substances 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 23
- 239000002356 single layer Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 2
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000003486 chemical etching Methods 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 23
- 229920001155 polypropylene Polymers 0.000 description 7
- 230000003064 anti-oxidating effect Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920006342 thermoplastic vulcanizate Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for manufacturing a precision circuit, which comprises the following steps: the method comprises the following steps: preparing a bearing plate; step two: coating an anti-electroplating removable film with the thickness of 10-30um on the bearing plate on the first step; step three: forming a circuit pattern on the bearing plate after the second step by using laser direct-etching equipment or an exposure development process according to pattern data; step four: copper plating the whole bearing plate subjected to the third step to the required thickness of the product circuit; step five: removing all the residual film-removing agents for the removable film coated on the bearing plate in the step two; step six: carrying out hot pressing synthesis on the bearing plate subjected to the fifth step and an electrical insulating material such as TPI, PP or BT; step seven: and tearing off the bearing plate after the sixth step to finish the manufacture of the precise circuit. The problem of adhesive force between the circuit and the bearing plate by an addition method is effectively solved, a chemical etching process is not needed, the precise circuit manufacturing process is simplified, and the device is energy-saving and environment-friendly.
Description
Technical Field
The invention relates to the technical field of precision circuit manufacturing, in particular to a method for manufacturing a precision circuit.
Background
With the rapid development of electronic information technology, the printed circuit board industry is rapidly developed, and the requirement of printing precise circuits on the bearing plate is brought forward. The bearing plate is mainly used in the manufacturing process of the precise circuit, the bearing plate can be divided into a metal bearing plate and a non-metal bearing plate, and the technical requirements for manufacturing the precise circuit are higher and higher.
When the high-density interconnected and intercommunicated precision circuits are produced, the existing process line and the existing bearing plate often have the problem of non-adhesion, and the processing process is repeated for many times, so that a large amount of resources are wasted, and the waste of raw materials is caused.
Disclosure of Invention
The invention mainly aims to provide a method for manufacturing a precise circuit, which aims to solve the technical problems of complicated precise circuit manufacturing process and weak attachment of a circuit and a bearing plate by an addition method in the existing process flow.
In order to solve the above technical problems, the present invention provides a method for manufacturing a precision circuit, including the steps of:
the method comprises the following steps: preparing a bearing plate;
step two: coating an anti-electroplating removable film with the thickness of 10-30um on the bearing plate on the first step;
step three: forming a circuit pattern on the bearing plate after the second step by using laser direct-etching equipment or an exposure development process according to pattern data;
step four: copper plating the whole bearing plate subjected to the third step to the required thickness of the product circuit;
step five: removing all the residual film-removing agents for the removable film coated on the bearing plate in the step two;
step six: carrying out hot pressing synthesis on the bearing plate subjected to the fifth step and an electrical insulating material such as TPI, PP or BT;
step seven: and tearing off the bearing plate after the sixth step to finish the manufacture of the precise circuit.
Preferably, the carrier plate is made of stainless steel, copper foil or nonmetal.
Preferably, the thickness of the carrier plate is greater than 0.08 mm.
Preferably, the carrier plate is subjected to an oxidation resistance treatment before the fourth step.
Preferably, the thickness of the whole copper plating plate in the fourth step is more than 5 um.
Preferably, the temperature used for the hot-pressing synthesis of the bearing plate and the electrical insulating material such as TPI, PP or BT in the sixth step is 300-.
Preferably, the precise circuit in the seventh step can be arranged in a single-layer, double-layer or multi-layer precise circuit fabrication.
The embodiment of the invention has the beneficial effects that: according to the method for manufacturing the precise circuit, the bearing plate is coated with the removable film, then the circuit is etched by laser equipment, the whole plate is plated with copper, the coated removable film is removed, the coated removable film is thermally pressed with electrical insulating materials such as TPI (thermoplastic vulcanizate), PP (propene Polymer) or BT (BT), and finally the bearing plate is torn off to finish the precise circuit manufacturing, so that the problem of adhesive force between the circuit and the bearing plate in an additive method is effectively solved, a chemical etching process is not needed, the precise circuit manufacturing process is simplified, and the method is energy-saving and environment-friendly.
Drawings
FIG. 1 is a flow chart of a method of manufacturing a precision circuit according to the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
Example 1
A method of manufacturing a precision circuit comprising the steps of:
the method comprises the following steps: preparing a bearing plate;
step two: coating an anti-electroplating removable film with the thickness of 10um on the metal bearing plate on which the step one is finished;
step three: forming a circuit pattern on the metal bearing plate after the second step by using laser direct-etching equipment or an exposure development process according to pattern data;
step four: copper plating the whole metal bearing plate subjected to the third step to a certain thickness;
step four: copper plating the whole metal bearing plate subjected to the third step to the required thickness of the product circuit;
step five: removing all the residual film remover for the removable film coated on the metal bearing plate in the step two;
step six: carrying out hot pressing on the metal bearing plate subjected to the fifth step and the TPI;
step seven: tearing off the metal bearing plate after the sixth step to complete the manufacture of the precise circuit
The metal bearing plate is made of stainless steel.
The thickness of the metal bearing plate is 0.08 mm.
Before the fourth step, the metal bearing plate is subjected to anti-oxidation treatment.
In the fourth step, the thickness of the whole copper plating plate is 5 um.
And in the sixth step, the temperature for carrying out hot-pressing synthesis on the metal bearing plate and the TPI is 300 ℃, and the hot-pressing synthesis time is 30 min.
The precision circuit in the seventh step can be arranged into a single-layer precision circuit manufacturing.
Example 2
The method comprises the following steps: preparing a metal bearing plate;
step two: coating an anti-electroplating removable film with the thickness of 30um on the metal bearing plate on which the step one is finished;
step three: forming a circuit pattern on the metal bearing plate after the second step by using laser direct-etching equipment or an exposure development process according to pattern data;
step four: copper plating the whole metal bearing plate subjected to the third step to the required thickness of the product circuit;
step five: removing all the residual film remover for the removable film coated on the metal bearing plate in the step two;
step six: hot-pressing the metal bearing plate subjected to the fifth step with PP;
step seven: and tearing off the metal bearing plate after the sixth step to finish the manufacture of the precise circuit.
The metal bearing plate is made of a copper foil material.
The thickness of the metal bearing plate is 0.10 mm.
Before the fourth step, the metal bearing plate is subjected to anti-oxidation treatment.
In the fourth step, the thickness of the whole copper plating plate is 6 um.
And in the sixth step, the temperature for carrying out hot-pressing synthesis on the metal bearing plate and the PP is 300 ℃, and the hot-pressing synthesis time is 30 min.
The precision circuit in the seventh step can be arranged into a single-layer precision circuit manufacturing.
Example 3
The method comprises the following steps: preparing a nonmetal bearing plate;
step two: coating an anti-electroplating removable film with the thickness of 10um on the nonmetal bearing plate on which the first step is finished;
step three: forming a circuit pattern on the nonmetal bearing plate after the second step by using an exposure and development process according to pattern data;
step four: copper plating the whole nonmetal bearing plate subjected to the third step to the required thickness of the product circuit;
step five: removing all the residual removable film coated on the nonmetal bearing plate in the second step by using a film remover;
step six: the nonmetal bearing plate after the fifth step is subjected to hot pressing and synthesis with BT;
step seven: and tearing off the nonmetal bearing plate after the sixth step to finish the manufacture of the precise circuit.
The thickness of the non-metal bearing plate is 0.10mm
Before the fourth step, the nonmetal bearing plate is subjected to antioxidation treatment.
In the fourth step, the thickness of the whole copper plating plate is 5 um.
And in the sixth step, the temperature for carrying out hot-pressing synthesis on the nonmetal bearing plate and the BT is 350 ℃, and the hot-pressing synthesis time is 60 min.
The precision circuit in the seventh step can be arranged into a single-layer precision circuit manufacturing.
Example 4
The method comprises the following steps: preparing a nonmetal bearing plate;
step two: coating an anti-electroplating removable film with the thickness of 10um on the nonmetal bearing plate on which the first step is finished;
step three: forming a circuit pattern on the nonmetal bearing plate after the second step by using an exposure and development process according to pattern data;
step four: copper plating the whole nonmetal bearing plate subjected to the third step to the required thickness of the product circuit;
step five: removing all the residual removable film coated on the nonmetal bearing plate in the second step by using a film remover;
step six: carrying out hot pressing on the nonmetal bearing plate subjected to the fifth step and the TPI;
step seven: tearing off the nonmetal bearing plate after the step six to finish the manufacture of the precise circuit
The thickness of the non-metal bearing plate is 0.08 mm.
Before the fourth step, the nonmetal bearing plate is subjected to antioxidation treatment.
In the fourth step, the thickness of the whole copper plating plate is 6 um.
And in the sixth step, the temperature for carrying out hot-pressing synthesis on the nonmetal bearing plate and the TPI is 400 ℃, and the hot-pressing synthesis time is 150 min.
The precision circuit in the seventh step can be arranged into a single-layer precision circuit manufacturing.
The experimental data of four groups of examples are compared to obtain; the coating-removing film is coated on the bearing plate, the circuit is etched by laser equipment, the entire bearing plate is plated with copper, the coated removing film is removed, the coating-removing film is thermally pressed and synthesized with TPI, PP or BT and other electric insulating materials, and finally the bearing plate is torn off to complete the manufacture of the precise circuit, so that the problem of the adhesive force of the circuit and the bearing plate in an additive method is effectively solved, a chemical etching process is not needed, the manufacturing process of the precise circuit is simplified, and the device is energy-saving and environment-friendly.
The above description is only a part of or preferred embodiments of the present invention, and neither the text nor the drawings should be construed as limiting the scope of the present invention, and all equivalent structural changes, which are made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (7)
1. A method of manufacturing a precision circuit, comprising the steps of:
the method comprises the following steps: preparing a bearing plate;
step two: coating an anti-electroplating removable film with the thickness of 10-30um on the bearing plate on the first step;
step three: forming a circuit pattern on the bearing plate after the second step by using laser direct-etching equipment or an exposure development process according to pattern data;
step four: copper plating the whole bearing plate subjected to the third step to the required thickness of the product circuit;
step five: removing all the residual film-removing agents for the removable film coated on the bearing plate in the step two;
step six: carrying out hot pressing synthesis on the bearing plate subjected to the fifth step and an electrical insulating material such as TPI, PP or BT;
step seven: and tearing off the bearing plate after the sixth step to finish the manufacture of the precise circuit.
2. The method of claim 1, wherein the carrier plate is made of stainless steel, copper foil or non-metal.
3. A method of manufacturing a precision circuit according to claim 1, characterized in that the thickness of the carrier plate is greater than 0.08 mm.
4. The method of claim 1, wherein the carrier board is treated to resist oxidation before the fourth step.
5. The method of claim 1, wherein the thickness of the whole copper plating layer in the fourth step is greater than 5 um.
6. The method as claimed in claim 1, wherein the temperature used for the thermal pressing of the carrier plate and the electrically insulating material such as TPI, PP or BT in the sixth step is 300-400 ℃, and the thermal pressing time is 30-150 min.
7. The method for manufacturing a precision circuit according to claim 1, wherein the precision circuit in the seventh step is configured as a single-layer, double-layer or multi-layer precision circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111065979.7A CN113630973A (en) | 2021-09-10 | 2021-09-10 | Method for manufacturing precision circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111065979.7A CN113630973A (en) | 2021-09-10 | 2021-09-10 | Method for manufacturing precision circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113630973A true CN113630973A (en) | 2021-11-09 |
Family
ID=78389636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111065979.7A Pending CN113630973A (en) | 2021-09-10 | 2021-09-10 | Method for manufacturing precision circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113630973A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072816A (en) * | 2015-07-14 | 2015-11-18 | 复旦大学 | Improved template electroplating peeling technology of conductive line |
| US20160113120A1 (en) * | 2014-10-17 | 2016-04-21 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| JP2017073533A (en) * | 2015-10-08 | 2017-04-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed circuit board and manufacturing method of the same |
-
2021
- 2021-09-10 CN CN202111065979.7A patent/CN113630973A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160113120A1 (en) * | 2014-10-17 | 2016-04-21 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| CN105072816A (en) * | 2015-07-14 | 2015-11-18 | 复旦大学 | Improved template electroplating peeling technology of conductive line |
| JP2017073533A (en) * | 2015-10-08 | 2017-04-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed circuit board and manufacturing method of the same |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211109 |
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| RJ01 | Rejection of invention patent application after publication |