CN113600830A - 利用响应性聚合物基质进行硬质合金光打印的方法 - Google Patents

利用响应性聚合物基质进行硬质合金光打印的方法 Download PDF

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CN113600830A
CN113600830A CN202111008064.2A CN202111008064A CN113600830A CN 113600830 A CN113600830 A CN 113600830A CN 202111008064 A CN202111008064 A CN 202111008064A CN 113600830 A CN113600830 A CN 113600830A
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赵治
王悦
王海滨
邢明
宋晓艳
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Abstract

利用响应性聚合物基质进行硬质合金光打印的方法,属于合金材料增材制造领域。利用响应性聚合物基质配制兼容全组分硬质合金的光固化前体,并在打印后进行分子冷压与分步致密化,大大提升了打印质量。以上方法操作简单,可将现有硬质合金打印精度由百微米量级提升一个数量级,并可实现致最高密度接近100%的样品打印。

Description

利用响应性聚合物基质进行硬质合金光打印的方法
技术领域
本发明涉及一种基于动态光处理技术(DLP),利用响应性聚合物基质在室温下对硬质合金进行3D打印的方法,属于合金材料增材制造领域。
背景技术
硬质合金因具有高硬度和耐磨性、优良的抗压和耐腐蚀性能,在航空航天、石油钻井、机械加工等领域中获得广泛应用并占据着重要地位。当前硬质合金产品主要依靠粉末冶金法制备,流程繁琐、成形难度大,无法满足现代工业的需求。3D打印是硬质合金的新型制备方法,工序简单、周期短,可实现产品一步制备成形,引起了业内广泛关注。激光选区熔化(SLM)是目前打印硬质合金的最常用技术。其工作流程是在打印设备成形区中均匀铺涂一层金属粉末,利用高能激光束熔化粉末,并在惰性气体保护下冷却,完成单层打印。经过循环上述步骤可实现三维零部件打印。然而,SLM成形的零件质量较低(特别是粘结相含量较低的硬质合金),成型精度差,且在快速升降温过程中内部应力来不及释放,易在工件内部产生由残余应力导致的微观与宏观缺陷,降低材料的服役性能与寿命。硬质合金的其他3D打印方法,如选区激光烧结(SLS)、熔丝制造(FFF)、墨水直写法(DIW)等其综合表现一般逊于SLM方法。
DLP技术是一类利用光化学反应固化打印前体的3D打印技术,具有成形速度快、打印精度高、打印质量优异等优势,特别适合作为硬质合金打印的新型技术手段。尽管DLP在打印树脂、水凝胶、金属纳米颗粒和陶瓷材料方面已有成功实践,但在硬质合金打印上的应用仍处于技术空白。
针对上述需求与技术瓶颈,本申请的发明人开发了首个基于DLP技术的硬质合金打印方法。利用响应性聚合物基质配制兼容全组分硬质合金的光固化前体,并在打印后进行分子冷压与分步致密化,大大提升了打印质量。以上方法操作简单,可将现有硬质合金打印精度由百微米量级提升一个数量级,并可实现致最高密度接近100%的样品打印。
发明内容
本发明针对现有硬质合金主要3D打印方法成形精度差、样品缺陷较多的问题以及DLP在硬质合金打印领域的技术空白,提出利用响应性聚合物基质开发硬质合金的动态光处理打印方法,以达到同时提高打印质量与精度的目的(图1)。
基于响应性聚合物基质的硬质合金DLP打印方法包括如下步骤:
(1)按照一定比例混合响应性聚合物单体、交联剂、光引发剂、粘稠剂与溶剂,在室温下超声约30min使各组分混合均匀,再加入硬质合金粉末如WC-Co复合粉末震荡均匀配制成可光固化前体;为便于显微镜下观察,可以再加入0.1mg/mL的荧光素-O-甲基丙烯酸酯。
响应性聚合物单体选自如丙烯酰胺、丙烯酸等;交联剂选自N,N’亚甲基双丙烯酰胺、聚乙二醇二丙烯酸酯等;光引发剂选自Irgacure819、Irgacure2959等;粘稠剂选自聚乙二醇PEG等;溶剂选自水、乙醇、乙二醇、二甲亚砜等。
响应性聚合物单体、交联剂、光引发剂、粘稠剂、溶剂、硬质合金粉末的用量关系为:当使用1mL溶剂时,响应性聚合物单体为0.1-0.3g,交联剂为10-40mg,光引发剂为1-5mg,粘稠剂为1g,硬质合金粉末为1-2g。
(2)利用常规DLP打印设备与流程打印步骤(1)可光固化前体;其中打印光源应选择波长不大于405nm的LED光源或在紫光波段具有一定强度的连续光源,光源强度应选择200mW,以保证适当的聚合速率;
(3)将打印后的毛坯置于溶剂中浸泡以脱去粘稠剂;此过程中响应性聚合物膨胀加速粘稠剂脱除,随后毛坯在室温环境中自然干燥,或在真空箱中室温干燥除去溶剂,获得初步致密化的打印坯体;在上述干燥过程中响应性聚合物网络收缩,从而具有对WC-Co复合粉料进行分子级别的冷压,可有效提高坯体致密度,经过分子冷压的坯体致密度可提高到80%以上,有利于后期烧结过程中进一步致密化。
所述的溶剂为响应性聚合物浸泡其中时能够膨胀且加速粘稠剂脱除,同时脱除粘稠剂与溶剂后膨胀的响应性聚合物能够收缩;可使用相应溶剂如水、乙醇等进行浸泡干燥。
(4)将初步致密化的坯体脱蜡烧结,脱蜡烧结可以在真空炉、低压炉或热等静压炉中进行,其中低压炉及热等静压炉烧结应保持还原性或惰性气氛;烧结时应先以小于1℃/min升温至高于有机物组分分解温度50℃左右,保持一段时间,使有机物分解气化完全,再升温至1390-1480℃,进行高温致密化烧结。经烧结后的样品致密度进一步提高,最高可达到接近100%,同时缺陷大幅减少。
与现有硬质合金3D打印技术相比,本发明的优势在于:分子冷压与分步致密化可有效提升产品的最终致密度,减少有机物的影响;温和的打印条件有助于减少应力导致的材料缺陷;动态光处理打印可有效提升产品的成形速度与分辨率。
附图说明
图1本发明打印原理示意图。
图2实施例1中试样各阶段实物图(a)和荧光显微图片(b)。
图3不同有机物、WC-Co含量前体打印干燥后的荧光显微图片。
图4打印毛坯可用烧结工艺曲线。(a)实施例1对应的1390℃烧结;(b)是实施例2对应的1480℃烧结,均为氩气气氛,压力5MPa。
图5实施例1中打印样品烧结后的SEM显微形貌。
图6实施例1中打印样品烧结后的物相XRD图谱。
图7实施例1中打印样品烧结后的EDS分析。
图8不同条件下打印样品的最终致密度统计。
图9对比例1中样品存在的微观缺陷
图10本打印方法与SLM打印方法的样品分辨率对比。(a)SLM方法;(b)、(c)本方法。
具体实施方式
下面结合实施例对本发明作进一步说明,但本发明并不限于以下实施例。
实施例1:
取丙烯酰胺(AAM)0.2g、N,N’亚甲基双丙烯酰胺0.02g、2-羟基-4’-(2-羟乙氧基)-2-甲基苯丙酮0.005g、聚乙二醇1g为原料,加入1ml去离子水,1mg荧光素-O-甲基丙烯酸酯(作为荧光标记),室温下超声约30min混合均匀,再加入1.6g WC-7Co复合粉末震荡均匀配制成可光固化前体,通过DLP打印机逐层打印出毛坯。将打印后的毛坯置于去离子水中浸泡24h,然后在室温环境中干燥约40h,获得初步致密化的WC-Co坯体。将获得的坯体再经过1390℃低压烧结获得WC-Co硬质合金最终产物。打印过程中各阶段状态荧光显微图片如图2所示。烧结后显微形貌和物相分别如图3和图4所示。产物的显微与物相分析如图5-7所示,当改变AAM与WC-7Co复合粉末的配比时最终致密度如图8所示。可知在最适条件下,平均值密度约为94%,最高致密度可达99-100%。
实施例2:
取丙烯酰胺(AAM)0.2g、N,N’亚甲基双丙烯酰胺0.02g、2-羟基-4’-(2-羟乙氧基)-2-甲基苯丙酮0.005g,加入1ml甘油,1mg荧光素-O-甲基丙烯酸酯(作为荧光标记),室温下超声约30min混合均匀,再加入1.6g WC-7Co复合粉末震荡均匀配制成可光固化前体,通过DLP打印机逐层打印出毛坯。将打印后的毛坯置于去离子水中浸泡24h,然后在室温环境中干燥约40h,获得初步致密化的WC-Co坯体。将获得的坯体再经过1480℃低压烧结获得WC-Co硬质合金最终产物,宏观与微观形貌与实施例1中类似。
对比例1:
取WC-8Co球形复合粉末,粒径在15-50μm,用SLM方式进行打印。打印激光功率60W,扫描速度350mm/s,扫描间隔0.04mm,层厚0.02mm。打印的样品在SEM下可观察到大量明显的缺陷,如图9所示,质量远远低于DLP方式打印的相近Co含量硬质合金(图5)。SLM方法打印的样品分辨率也低于本方法打印的样品,如图10。

Claims (6)

1.一种基于响应性聚合物基质的硬质合金DLP打印方法,其特征在于,包括如下步骤:
(1)按照一定比例混合响应性聚合物单体、交联剂、光引发剂、粘稠剂和溶剂,在室温下超声使各组分混合均匀,再加入硬质合金粉末震荡均匀配制成可光固化前体;
(2)利用DLP打印设备与流程打印步骤(1)可光固化前体;其中打印光源应选择波长不大于405nm的LED光源或在紫光波段具有一定强度的连续光源,光源强度应选择200mW,以保证适当的聚合速率;
(3)将打印后的毛坯置于溶剂中浸泡以脱去粘稠剂;此过程中响应性聚合物膨胀加速粘稠剂脱除,随后毛坯在室温环境中自然干燥,或在真空箱中室温干燥除去溶剂,获得初步致密化的打印坯体;在上述干燥过程中响应性聚合物网络收缩,从而具有对硬质合金粉末进行分子级别的冷压,有效提高坯体致密度;
所述的溶剂为响应性聚合物浸泡其中时能够膨胀且加速粘稠剂脱除,同时脱除粘稠剂与溶剂后膨胀的响应性聚合物能够收缩;(4)将初步致密化的坯体脱蜡烧结,脱蜡烧结可以在真空炉、低压炉或热等静压炉中进行,其中低压炉及热等静压炉烧结应保持还原性或惰性气氛;烧结时应先以小于1℃/min升温至高于有机物组分分解温度50℃左右,保持一段时间,使有机物分解气化完全,再升温至1390-1480℃,进行高温致密化烧结。
2.按照权利要求1所述的一种基于响应性聚合物基质的硬质合金DLP打印方法,其特征在于,步骤(1)中响应性聚合物单体、交联剂、光引发剂、粘稠剂、溶剂、硬质合金粉末的用量关系为:当使用1mL溶剂时,响应性聚合物单体为0.1-0.3g,交联剂为10-40mg,光引发剂为1-5mg,粘稠剂为1g,硬质合金粉末为1-2g。
3.按照权利要求1所述的一种基于响应性聚合物基质的硬质合金DLP打印方法,其特征在于,步骤(1)响应性聚合物单体选自如丙烯酰胺、丙烯酸等;交联剂选自N,N’亚甲基双丙烯酰胺、聚乙二醇二丙烯酸酯等;光引发剂选自Irgacure819、Irgacure2959等;粘稠剂选自聚乙二醇PEG等;溶剂选自水、乙醇、乙二醇、二甲亚砜等。
4.按照权利要求1所述的一种基于响应性聚合物基质的硬质合金DLP打印方法,其特征在于,溶剂选自水、乙醇等进行浸泡干燥。
5.按照权利要求1所述的一种基于响应性聚合物基质的硬质合金DLP打印方法,其特征在于,硬质合金粉末选自WC-Co复合粉末。
6.按照权利要求1所述的一种基于响应性聚合物基质的硬质合金DLP打印方法,其特征在于,在可光固化前体中加入0.1mg/mL的荧光素-O-甲基丙烯酸酯。
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