CN113579760A - Radiating fin locking equipment - Google Patents
Radiating fin locking equipment Download PDFInfo
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- CN113579760A CN113579760A CN202110930847.XA CN202110930847A CN113579760A CN 113579760 A CN113579760 A CN 113579760A CN 202110930847 A CN202110930847 A CN 202110930847A CN 113579760 A CN113579760 A CN 113579760A
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- 239000013078 crystal Substances 0.000 claims abstract description 196
- 235000012431 wafers Nutrition 0.000 claims abstract description 130
- 230000007246 mechanism Effects 0.000 claims abstract description 129
- 238000005520 cutting process Methods 0.000 claims abstract description 65
- 238000004140 cleaning Methods 0.000 claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 59
- 238000012546 transfer Methods 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 97
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000036544 posture Effects 0.000 description 5
- 241000252254 Catostomidae Species 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/06—Metal-working plant comprising a number of associated machines or apparatus
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Abstract
The invention discloses a radiating fin locking device, which comprises: the eight-station index plate periodically rotates relative to the equipment machine table frame; the eight product jigs bear and move the crystal wafers and/or the radiating fins in the processing process; the feeding and pin-cutting mechanism is used for providing and cutting pin crystal wafers for the eight-station index plate; the brush cleaning mechanism is used for cleaning the crystal wafers in the eight-station dividing disc; the screw locking mechanism locks the crystal wafer and the radiating fin in the eight-station indexing disc; the blanking mechanism is used for moving the crystal wafer and the cooling fin of the locking pair out of the eight-station dividing plate; and the blanking detection mechanism is used for detecting whether the crystal plate and the radiating fin of the locking pair are successfully blanked. The invention can automatically lock the crystal plate and the radiating fin, improve the working efficiency and the stability of the product quality and ensure the output supply.
Description
Technical Field
The present invention relates to the field of heat dissipation, and more particularly, to a heat sink locking apparatus.
Background
A wafer is an important component electronic component of a circuit chip, wherein the unit constituting the wafer is a transistor one by one. The transistors themselves act as a switch and the voltage of the output can be determined by controlling their switches. The number of transistors in a wafer varies from hundreds of millions to billions. Each wafer contributes only very little power consumption and heat generation, but its overall value will be a horror number. When current passes through the crystal plate, a part of heat is released, and the electric heater is like an electric heater in life. Meanwhile, as the heat dissipation speed is far less than the generation speed, a local high-temperature area is formed. It should be noted that, in most of the crystal plates, even if the heat generation is high, the heat dissipation problem of the crystal plate is only generated in a local area to a great extent, and therefore, the problem to be solved is also a problem which needs to be solved at present. The problem of overheating of the crystal wafer can be effectively solved by locking the radiating fins on the crystal wafer, the radiating fins can effectively increase the radiating area and increase the radiating speed of the crystal wafer, and the efficiency of manually locking the crystal wafer and the radiating fins is very low, so that short-term batch component demand supply cannot be completed.
Aiming at the problem of low efficiency of manual locking of a crystal wafer and a radiating fin in the prior art, no effective solution is available at present.
Disclosure of Invention
In view of the above, an object of the embodiments of the present invention is to provide a heat sink locking device, which can automatically lock a crystal wafer and a heat sink, improve the working efficiency and the stability of product quality, and ensure the yield and supply.
In view of the above object, a first aspect of an embodiment of the present invention provides a heat sink locking apparatus, including:
a machine frame of the equipment;
the eight-station index plate is arranged on the equipment machine table frame and periodically rotates relative to the equipment machine table frame;
the eight product jigs are respectively arranged on eight stations in the eight-station index plate, and bear and move the crystal wafers and/or the radiating fins in the processing process;
the feeding and pin-cutting mechanism is arranged on the machine table frame of the equipment and corresponds to the positions of the product jigs of the first station and the second station in the eight-station index plate, and provides and cuts pin crystal slices for the eight-station index plate;
the brush cleaning mechanism is arranged on the machine table frame of the equipment and corresponds to a product jig at a third station in the eight-station dividing disc and is used for cleaning crystal plates in the eight-station dividing disc;
the screw locking mechanism is arranged on the machine table frame of the equipment and corresponds to the positions of the product jigs of the fifth station and the sixth station in the eight-station index plate, and locks the crystal plates and the radiating plates in the eight-station index plate;
the blanking mechanism is arranged on the machine table frame of the equipment and corresponds to a product jig at a seventh station in the eight-station graduated disk, and the blanking mechanism moves the locked crystal plate and the cooling fin out of the eight-station graduated disk;
and the blanking detection mechanism is arranged at a position, corresponding to a product jig at an eighth station in the eight-station index plate, on the equipment machine table frame, and detects whether the crystal plate and the radiating fin locked by the blanking detection mechanism are successfully blanked.
In some embodiments, each product fixture comprises:
the carrier is arranged on the product jig and is used for providing fixed limit for the crystal wafer and/or the radiating fin contained by the product jig;
the crystal wafer stop block is arranged on the product jig and close to the carrier, and the crystal wafer stop block is matched with the carrier to provide fixed limit for the crystal wafer;
the radiating fin stop block is arranged on the product jig and close to the carrier, and is matched with the carrier to fix the radiating fin when the radiating fin is fed on the fourth station;
the spring clamping plate is arranged on the product jig and is opposite to the crystal wafer stop block, and when the crystal wafers are fed in the first station and the second station, the spring clamping plate provides elasticity for the crystal wafers so that the crystal wafers abut against the crystal wafer stop block to fix the crystal wafers;
spring clamp plate sets up the position that is close to the spring cardboard on the product tool, and spring clamp plate compresses tightly the spring in the spring cardboard with spacing spring cardboard.
In some embodiments, the loading and cutting mechanism comprises:
the ratchet wheel cylinder turntable mechanism is used for loading the crystal wafer plate material, and the crystal wafer plate material is used as a feeding and pin cutting mechanism for feeding the crystal wafer;
the pin cutting mechanism is connected to the ratchet wheel cylinder turntable mechanism to cut the pins of the crystal wafer plate;
the feeding and cutting mechanism is connected to the pin cutting mechanism so as to cut the crystal wafer plate materials of the pins into crystal wafers;
the transferring and feeding mechanism is connected to the feeding and cutting mechanism to absorb the crystal wafer;
and the reversing sub-mechanism is connected to the transferring sub-mechanism to adjust the posture of the crystal wafer and push the crystal wafer to the product jig of the eight-station index plate on the second station.
In some embodiments, a ratchet cylinder carousel mechanism comprises:
the ratchet wheel is provided with a plurality of clamping grooves, each clamping groove corresponds to one crystal wafer plate, and the crystal wafer plate of the next clamping groove is provided for the pin cutting mechanism during rotation;
and the ratchet wheel cylinder is connected to the ratchet wheel, and the ratchet wheel rotates one clamping groove after the crystal plate material of the current clamping groove is exhausted.
In some embodiments, the pin cutter mechanism comprises: the upper cutter and the lower cutter are arranged close to the ratchet wheel cylinder turntable mechanism and are matched with each other to cut the feet of the arriving crystal plate;
the material loading blank sub-mechanism includes: and the material cutting cylinder and the material cutting jig are arranged close to the pin cutting mechanism, and the material cutting jig fixes the crystal wafer plate material of the cutting pin and applies force by the material cutting cylinder to further cut the crystal wafer into crystal wafers.
In some embodiments, the transfer sub-mechanism comprises: the crystal wafer sucker is arranged opposite to the product jig at the second station in the eight-station index plate, and the crystal wafer sucker sucks and moves the crystal wafer to the product jig at the second station in the eight-station index plate; the first positioning inserted rod is fixed relative to the crystal wafer sucker and is in contact with a specific position of the eight-station index plate to limit the position of the crystal wafer sucker; the transferring servo motor and the first material taking cylinder are connected to the crystal wafer sucker and provide power for sucking and moving the crystal wafer for the crystal wafer sucker;
the commutator mechanism includes: the reversing cylinder is connected to the first positioning insertion rod through a gear, and the reversing cylinder adjusts the posture of the crystal piece on the eight-station index plate through the first positioning insertion rod.
In some embodiments, the brush cleaning mechanism comprises:
the first suction sucker is arranged opposite to the product jig at the third station in the eight-station index plate, and sucks the crystal wafer from the product jig at the third station in the eight-station index plate;
the transfer motor and the second material taking cylinder are connected to the first suction sucker and provide power for sucking the crystal wafer for the first suction sucker;
the brush motor is arranged close to the first suction sucker and operates to clean the crystal wafer;
and the first traversing motor is connected to the first sucking sucker and enables the first sucking sucker to reset the crystal wafer.
In some embodiments, the screw locking mechanism comprises:
the vibration disc is arranged close to the product jigs of the fifth station and the sixth station in the eight-station index disc, screws are arranged in the vibration disc, and the vibration disc vibrates to enable the screws to move;
the automatic electric screwdriver is arranged right opposite to the product jigs of the fifth station and the sixth station in the eight-station index plate, is connected to the vibration plate to obtain screws, and locks the crystal plates and the radiating plates in the product jigs of the fifth station and the sixth station by using the screws;
and the first lifting cylinder is connected to the automatic electric screwdriver to provide power for the automatic electric screwdriver.
In some embodiments, the blanking mechanism comprises:
the second suction sucker is arranged right opposite to the product jig at the seventh station in the eight-station index plate, and sucks the crystal plate and the radiating fin which are locked from the product jig at the seventh station in the eight-station index plate and discharges the crystal plate and the radiating fin;
the second positioning inserted rod is fixed relative to the second suction sucker and is in contact with the specific position of the eight-station index plate to limit the position of the second suction sucker;
and the second transverse moving motor and the second lifting cylinder are connected to the second suction sucker and provide power for sucking the crystal piece and the radiating fin which are locked and discharged by the second suction sucker.
In some embodiments, the blanking detection mechanism comprises:
and the color sensor is arranged right opposite to the product jig of the eighth station in the eight-station index plate, and the color sensor responds to the color of the product jig sensing that the product jig of the eighth station in the eight-station index plate is the color of the product jig and determines that the locked crystal plate and the cooling fin are successfully blanked.
The invention has the following beneficial technical effects: the cooling fin locking device provided by the embodiment of the invention uses the device machine frame; the eight-station index plate is arranged on the equipment machine table frame and periodically rotates relative to the equipment machine table frame; the eight product jigs are respectively arranged on eight stations in the eight-station index plate, and bear and move the crystal wafers and/or the radiating fins in the processing process; the feeding and pin-cutting mechanism is arranged on the machine table frame of the equipment and corresponds to the positions of the product jigs of the first station and the second station in the eight-station index plate, and provides and cuts pin crystal slices for the eight-station index plate; the brush cleaning mechanism is arranged on the machine table frame of the equipment and corresponds to a product jig at a third station in the eight-station dividing disc and is used for cleaning crystal plates in the eight-station dividing disc; the screw locking mechanism is arranged on the machine table frame of the equipment and corresponds to the positions of the product jigs of the fifth station and the sixth station in the eight-station index plate, and locks the crystal plates and the radiating plates in the eight-station index plate; the blanking mechanism is arranged on the machine table frame of the equipment and corresponds to a product jig at a seventh station in the eight-station graduated disk, and the blanking mechanism moves the locked crystal plate and the cooling fin out of the eight-station graduated disk; the blanking detection mechanism is arranged at a position, corresponding to a product jig at an eighth station in the eight-station index plate, on the equipment machine table frame, and detects whether the crystal piece and the radiating fin which are locked and paid are successfully blanked or not, so that the crystal piece and the radiating fin can be automatically locked and paid, the working efficiency and the product quality stability are improved, and the yield supply is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is an overall structural view of a fin locking device provided by the present invention;
fig. 2 is a detailed structural view of a product jig of the fin locking device provided by the present invention;
FIG. 3 is a detailed structure diagram of a material loading and pin cutting mechanism of the cooling fin locking device provided by the invention;
FIG. 4 is a detailed structure diagram of a ratchet cylinder turntable mechanism of a feeding and pin-cutting mechanism of the cooling fin locking device provided by the invention;
FIG. 5 is a detailed structural diagram of a pin cutting mechanism of a feeding pin cutting mechanism of the cooling fin locking device provided by the invention;
FIG. 6 is a detailed structure diagram of a feeding and cutting mechanism of the cooling fin locking device provided by the present invention;
FIG. 7 is a detailed structural view of a transferring and feeding mechanism of a feeding and cutting mechanism of the cooling fin locking device according to the present invention;
FIG. 8 is a detailed structural view of a commutator mechanism of a feeding and pin-cutting mechanism of the fin locking device provided by the invention;
FIG. 9 is a detailed structural view of a brush cleaning mechanism of the fin locking apparatus according to the present invention;
fig. 10 is a detailed structural view of a screw locking mechanism of the fin locking device provided in the present invention;
FIG. 11 is a detailed structural view of a blanking mechanism of the fin locking device provided by the present invention;
fig. 12 is a detailed structural view of a blanking detection mechanism of the fin locking device provided by the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In view of the above, a first aspect of the embodiments of the present invention provides an embodiment of a heat sink locking apparatus for automatically locking a crystal wafer and a heat sink, improving work efficiency and product quality stability, and ensuring yield supply. Fig. 1 is an overall configuration diagram of a first embodiment of a fin locking device according to the present invention.
The heat sink locking apparatus, as shown in fig. 1, includes:
an equipment machine frame 1;
the eight-station index plate 2 is arranged on the equipment machine table frame 1, and the eight-station index plate 2 periodically rotates relative to the equipment machine table frame 1;
the eight product jigs 3 are respectively arranged on eight stations in the eight-station index plate 2, and the eight product jigs 3 bear and move crystal plates and/or radiating fins in machining;
the feeding and pin-cutting mechanism 4 is arranged on the machine table frame 1 and corresponds to the positions of the product jigs 3 of the first station and the second station in the eight-station index plate 2, and the feeding and pin-cutting mechanism 4 provides and cuts pin crystal slices for the eight-station index plate 2;
the brush cleaning mechanism 5 is arranged on the equipment machine table frame 1 and corresponds to the position of the product jig 3 at the third station in the eight-station dividing disc 2, and the brush cleaning mechanism 5 cleans crystal plates in the eight-station dividing disc 2;
the screw locking mechanism 6 is arranged on the machine table frame 1 and corresponds to the positions of the product jigs 3 of the fifth station and the sixth station in the eight-station index plate 2, and the screw locking mechanism 6 locks the crystal plates and the radiating plates in the eight-station index plate 2;
the blanking mechanism 7 is arranged on the equipment machine table frame 1 and corresponds to the position of the product jig 3 at the seventh station in the eight-station index plate 2, and the blanking mechanism 7 moves the locked crystal piece and the cooling fin out of the eight-station index plate 2;
and the blanking detection mechanism 8 is arranged on the equipment machine table frame 1 and corresponds to the position of the product jig 3 at the eighth station in the eight-station index plate 2, and the blanking detection mechanism 8 detects whether the crystal piece and the radiating fin which are locked are blanked successfully or not.
In some embodiments, each product fixture 3 comprises:
the carrier 31 is arranged on the product jig 3, and the carrier 31 provides fixing limit for the crystal wafer and/or the heat sink accommodated by the product jig 3;
the crystal wafer stopper 32 is arranged on the product jig 3 and close to the carrier 31, and the crystal wafer stopper 32 is matched with the carrier 31 to provide fixing and limiting for the crystal wafer;
the radiating fin stop block 33 is arranged on the product jig 3 and close to the carrier 31, and the radiating fin stop block 33 is matched with the carrier 31 to fix the radiating fin when the radiating fin is fed on the fourth station;
the spring clamping plate 34 is arranged on the product jig 3 and is opposite to the crystal wafer stopper 32, and the spring clamping plate 34 provides elasticity for the crystal wafer when the crystal wafer is fed at the first station and the second station so that the crystal wafer is abutted against the crystal wafer stopper 32 to fix the crystal wafer;
In some embodiments, the loading and cutting mechanism 4 comprises:
the ratchet wheel cylinder turntable sub-mechanism 41 is used for loading the crystal wafer plate, and the crystal wafer plate is used as a feeding and pin cutting mechanism 4 for feeding the crystal wafer;
a pin cutting mechanism 42 connected to the ratchet cylinder turntable mechanism 41 to cut the crystal plate material into pins;
a feeding and cutting mechanism 43 connected to the pin cutting mechanism 42 to cut the pin-cut crystal plate material into crystal pieces;
a transfer material feeding mechanism 44 connected to the material feeding and cutting mechanism 43 for sucking the crystal wafer;
and the reversing sub-mechanism 45 is connected to the transferring sub-mechanism 44 to adjust the posture of the crystal wafer and push the crystal wafer to the product jig 3 of the eight-station index plate 2 on the second station.
In some embodiments, the ratchet cylinder carousel mechanism 41 comprises:
a ratchet 411 having a plurality of slots, each slot corresponding to one crystal plate, and providing the crystal plate of the next slot to the pin cutter 42 during rotation;
and a ratchet cylinder 412 connected to the ratchet 411, and rotating the ratchet 411 by one card slot after the crystal plate material of the current card slot is exhausted.
In some embodiments, the cutting foot mechanism 42 includes:
the upper cutter 421 and the lower cutter 422 are arranged close to the ratchet cylinder turntable mechanism 41, and the upper cutter 421 and the lower cutter 422 are matched with each other to perform foot cutting on the reached crystal plate material.
The feeding and blanking mechanism 43 includes: and the material cutting cylinder 431 and the material cutting jig 432 are arranged close to the pin cutting mechanism 42, and the material cutting jig 432 fixes the crystal wafer plate material of the pin cutting and is applied by the material cutting cylinder 431 for further cutting into crystal wafers.
In some embodiments, the transfer sub-mechanism 44 includes:
the crystal piece sucker 441 is arranged opposite to the product jig 3 at the second station in the eight-station index plate 2, and the crystal piece sucker 441 sucks and moves the crystal piece to the product jig 3 at the second station in the eight-station index plate 2;
a first positioning rod 442 fixed with respect to the wafer suction cup 441 and contacting a specific position of the eight-station index plate 2 to define the position of the wafer suction cup 441;
the transferring servo motor 443 and the first material taking cylinder 444 are connected to the crystal wafer sucker 441, and the transferring servo motor 443 and the first material taking cylinder 444 provide power for sucking and moving the crystal wafer sucker 441.
The commutator mechanism 45 includes: and the reversing cylinder 445 is connected to the first positioning insertion rod 442 through a gear, and the reversing cylinder 445 adjusts the posture of the crystal piece on the eight-station index plate 2 through the first positioning insertion rod 442.
In some embodiments, the brush washing mechanism 5 includes:
the first suction sucker 51 is arranged opposite to the product jig 3 at the third station in the eight-station index plate 2, and the first suction sucker 51 sucks the crystal wafer from the product jig 3 at the third station in the eight-station index plate 2;
the transferring motor 52 and the second material taking cylinder 53 are connected to the first sucking sucker 51, and the transferring motor and the second material taking cylinder 53 provide power for sucking the crystal wafer for the first sucking sucker 51;
a brush motor 54 disposed adjacent to the first suction cup 51, the brush motor 54 operating to clean the lens sheet;
and a first traverse motor 55 connected to the first suction pad 51, the first traverse motor 55 traversing the first suction pad 51 to return the crystal piece.
In some embodiments, the screw locking mechanism 6 includes:
the vibration disc 61 is arranged close to the product jigs 3 of the fifth station and the sixth station in the eight-station index disc 2, screws are arranged in the vibration disc 61, and the vibration disc 61 vibrates to enable the screws to move;
the automatic electric screwdriver 62 is arranged opposite to the product jigs 3 of the fifth station and the sixth station in the eight-station index plate 2, is connected to the vibration plate 61 to obtain screws, and is used for locking the crystal plates and the radiating plates in the product jigs 3 of the fifth station and the sixth station by the automatic electric screwdriver 62;
and a first lifting cylinder 63 connected to the automatic electric screw 62 to power the automatic electric screw 62.
In some embodiments, the blanking mechanism 7 comprises:
the second sucking and sucking disc 71 is arranged right opposite to the product jig 3 at the seventh station in the eight-station index plate 2, and the second sucking and sucking disc 71 sucks the crystal plates and the radiating fins which are locked from the product jig 3 at the seventh station in the eight-station index plate 2 and discharges the materials;
a second positioning insertion rod 72 fixed with respect to the second suction cup 71, in contact with a specific position of the eight-station index plate 2 to define the position of the second suction cup 71;
and the second traverse motor 73 and the second lifting cylinder 74 are connected to the second suction cup 71, and the second traverse motor 73 and the second lifting cylinder 74 provide power for sucking the crystal piece and the cooling fin which are locked and fixed to the second suction cup 71 and discharging.
In some embodiments, the blanking detection mechanism 8 includes:
and the color sensor 81 is arranged right opposite to the product jig 3 at the eighth station in the eight-station indexing disc 2, and the color sensor 81 responds to the color of the product jig 3 at the eighth station in the eight-station indexing disc 2 and determines that the locked crystal plates and the cooling fins are successfully blanked.
The invention can provide double-station automatic crystal wafer locking and cooling fin equipment for a server type crystal wafer, the equipment is designed in double stations, is provided with an eight-station dividing disc 2, a cylinder, a motor and the like, and has the functions of automatic feeding, automatic crystal surface cleaning, automatic screw locking, automatic blanking and the like, so that the working efficiency is greatly improved, and the yield supply is ensured; the automatic locking of the equipment greatly improves the stability of the product quality.
During operation, firstly, a crystal wafer plate is inserted into the feeding and pin cutting mechanism 4, and the mechanism can perform the functions of automatic feeding, automatic pin cutting and the like; the product jig 3 on the eight-station index plate 2 is divided into a left station and a right station, so that the front two stations are both the feeding and pin-cutting mechanism 4, and the equipment is provided with two crystal plate material troughs; the third station is a brush cleaning mechanism 5 which is used for cleaning the crystal wafer on the station and ensuring the cleaning degree before locking the radiating fin on the rear station; the fourth station is used for manually feeding the radiating fins, and the product jig 3 is provided with clamping positions of the radiating fins; the fifth station and the sixth station are screw locking mechanisms 6 for automatically locking crystal plates and radiating fins on the product jig 3, and the left crystal plate and the right crystal plate and the radiating fins are respectively locked; the seventh station is a blanking mechanism 7; and the blanking detection mechanism 8 at the eighth station detects whether the product is successfully blanked or not, and ensures that the product jig 3 enters the next cycle in a no-load manner.
As shown in fig. 2, the product fixture 3 is divided into two parts, i.e., a left part and a right part, which are designed and configured identically. When the crystal wafer is fed, the crystal wafer is fed to the product jig 3 at the first and second stations respectively, the upper surface and the lower surface of the crystal wafer are limited by the carrier 31, the crystal wafer stopper 32 is designed on the left surface, the elastic spring clamping plate 34 is designed on the right surface, the elasticity of the spring clamping plate 34 is provided by a spring, and the spring is compressed by the spring pressing plate 35 to prevent the spring from flying. When the heat dissipation sheet is manually prevented from being arranged on the product jig 3 at the fourth station, a heat dissipation sheet stop block 33 is designed on the left surface of the heat dissipation sheet and used for limiting the heat dissipation sheet.
As shown in fig. 3-8, the crystal plate is a plate-shaped material, and is vertically inserted into the material loading disc, the plate material of the crystal plate slides downwards by gravity to be loaded, when the current plate material is used up, the ratchet cylinder turntable sub-mechanism 41 pushes the material loading turntable to rotate, so as to realize the material waiting of the next material loading station, the pushing mode is realized by the ratchet 411, and when the rotation is needed, the ratchet cylinder 412 extends out, so that the turntable rotates 45 degrees, and the clamping groove position of the ratchet 411 clamps the turntable. The pin cutting mechanism 42 is divided into an upper cutter 421 and a lower cutter 422, the pin-cut crystal slices slide to the feeding and cutting mechanism 43, the feeding and cutting mechanism 43 can transversely cut and move out products, and the transferring and feeding mechanism 44 sucks the cut and moved crystal slices to the commutator mechanism 45 by using the crystal slice sucker 441; the commutator mechanism 45 is designed as a rack and pinion, and when the cylinder extends out and retracts, the two postures of the crystal piece are respectively adjusted by controlling the commutator cylinder 445. The material transferring and feeding mechanism 44 is designed to have a double transferring function, the reversed crystal wafer is sucked to the product jig 3 on the eight-station dividing disc 2, and the distance between the two suckers is the same as the distance between the suckers and the material cutting completion position, so that the double transferring function is realized. The transfer servo motor 443 provides transverse transfer power, the first material taking cylinder 444 stretches out to take materials and retracts to lift the crystal wafer; first location inserted bar 442 can inject and get the material position, improves the accuracy that equipment got the material.
As shown in fig. 9, the third station is a wafer surface cleaning station of the brush cleaning mechanism 5, after the wafer transfer motor transfers the first suction cup 51 to the upper side of the product on the product fixture 3, the second material taking cylinder 53 descends to suck and transfer the product to the inner side of the work station, at this time, the brush motor 54 rotates, the wafer returns to the product fixture 3 after cleaning to place the wafer in the home position, then the first traverse motor 55 transfers the wafer to the position, another wafer is cleaned according to the same steps, and the work station ends after the wafer is placed back to the product fixture 3.
As shown in fig. 10, the fifth and sixth stations are screw locking mechanisms 6, screws in the dual vibration discs 61 are of the same type, and are respectively locked to the left and right crystal plate products on the product jig 3, after the screws are directly vibrated to the tail ends by the vibration discs 61, the screws are locked to the heat sink by the automatic electronic screwdriver 62, and the heat sink and the crystal plate are locked together to form the final product.
As shown in fig. 11, the seventh station is a blanking mechanism 7, the blanking mechanism 7 is a dual-material blanking design, the second traverse motor 73 transfers the product to the upper side of the product fixture 3, the second lifting cylinder 74 descends, the second suction cup 71 sucks the product, then the second lifting cylinder 74 rises, the product is lifted, the second traverse motor 73 transfers the product to the outer side of the eight-station index plate 2, and the blanking operation is completed by conveying or other methods.
As shown in fig. 12, the eighth station is a blanking detection mechanism 8, a color sensor 81 is disposed right above the product fixture 3, a focused light spot of the color sensor 81 irradiates on the product fixture 3, if the blanking is successful, the color of the empty product fixture 3 is distinguished from the natural color with the product, and the blanking detection is completed.
As can be seen from the foregoing embodiments, the cooling fin locking device provided in the embodiments of the present invention uses the device machine frame; the eight-station index plate is arranged on the equipment machine table frame and periodically rotates relative to the equipment machine table frame; the eight product jigs are respectively arranged on eight stations in the eight-station index plate, and bear and move the crystal wafers and/or the radiating fins in the processing process; the feeding and pin-cutting mechanism is arranged on the machine table frame of the equipment and corresponds to the positions of the product jigs of the first station and the second station in the eight-station index plate, and provides and cuts pin crystal slices for the eight-station index plate; the brush cleaning mechanism is arranged on the machine table frame of the equipment and corresponds to a product jig at a third station in the eight-station dividing disc and is used for cleaning crystal plates in the eight-station dividing disc; the screw locking mechanism is arranged on the machine table frame of the equipment and corresponds to the positions of the product jigs of the fifth station and the sixth station in the eight-station index plate, and locks the crystal plates and the radiating plates in the eight-station index plate; the blanking mechanism is arranged on the machine table frame of the equipment and corresponds to a product jig at a seventh station in the eight-station graduated disk, and the blanking mechanism moves the locked crystal plate and the cooling fin out of the eight-station graduated disk; the blanking detection mechanism is arranged at a position, corresponding to a product jig at an eighth station in the eight-station index plate, on the equipment machine table frame, and detects whether the crystal piece and the radiating fin which are locked and paid are successfully blanked or not, so that the crystal piece and the radiating fin can be automatically locked and paid, the working efficiency and the product quality stability are improved, and the yield supply is ensured.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the disclosure herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as software or hardware depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments of the present invention.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items. The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, where the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. A fin lock payment device, comprising:
a machine frame of the equipment;
the eight-station index plate is arranged on the equipment machine table frame and periodically rotates relative to the equipment machine table frame;
the eight product jigs are respectively arranged on eight stations in the eight-station index plate, and bear and move crystal wafers and/or radiating fins in machining;
the feeding and pin-cutting mechanism is arranged on the machine table frame of the equipment and corresponds to the positions of the product jigs of the first station and the second station in the eight-station index plate, and provides and cuts pin crystal slices for the eight-station index plate;
the brush cleaning mechanism is arranged on the machine table frame of the equipment and corresponds to the position of the product jig at the third station in the eight-station indexing disc and cleans crystal plates in the eight-station indexing disc;
the screw locking mechanism is arranged on the machine table frame of the equipment and corresponds to the positions of the product jigs of the fifth station and the sixth station in the eight-station indexing disc, and locks the crystal plates and the radiating plates in the eight-station indexing disc;
the blanking mechanism is arranged on the machine table frame of the equipment and corresponds to the position of the product jig at the seventh station in the eight-station index plate, and the blanking mechanism moves the locked crystal piece and the radiating fin out of the eight-station index plate;
and the blanking detection mechanism is arranged at the position, corresponding to the eighth station in the eight-station index plate, of the product jig on the equipment machine table frame and detects whether the crystal plate and the radiating fin of the locking pair are blanked successfully or not.
2. The fin lock-payment apparatus as claimed in claim 1, wherein each of the product jigs comprises:
the carrier is arranged on the product jig and is used for providing fixed limit for the crystal wafer and/or the radiating fin contained by the product jig;
the crystal wafer stop block is arranged on the product jig and close to the carrier, and is matched with the carrier to provide fixed limit for the crystal wafer;
the radiating fin stop block is arranged on the product jig and close to the carrier, and is matched with the carrier to fix the radiating fin when the radiating fin is fed on the fourth station;
the spring clamping plate is arranged on the product jig and is opposite to the crystal wafer stop block, and when the crystal wafers are fed on the first station and the second station, the spring clamping plate provides elasticity for the crystal wafers so that the crystal wafers abut against the crystal wafer stop block to fix the crystal wafers;
and the spring pressing plate is arranged on the product jig and close to the spring clamping plate, and the spring pressing plate presses the springs in the spring clamping plate to limit the spring clamping plate.
3. The fin locking apparatus as claimed in claim 1, wherein the loading and cutting mechanism comprises:
the ratchet wheel cylinder turntable mechanism is used for loading a crystal wafer plate material, and the crystal wafer plate material is used as a feeding crystal wafer of the feeding and pin cutting mechanism;
the pin cutting mechanism is connected to the ratchet wheel cylinder turntable mechanism to cut the pins of the crystal wafer plate;
the feeding and cutting mechanism is connected to the pin cutting mechanism so as to cut the crystal wafer plate materials of the pins into crystal wafers;
the material transferring and cutting mechanism is connected to the material loading and cutting mechanism to absorb the crystal wafer;
and the reversing sub-mechanism is connected to the transferring sub-mechanism to adjust the posture of the crystal wafer and push the crystal wafer to the product jig of the eight-station index plate on the second station.
4. The fin lock pay device of claim 3, wherein the ratchet cylinder turntable mechanism comprises:
the ratchet wheel is provided with a plurality of clamping grooves, each clamping groove corresponds to one crystal wafer plate, and the crystal wafer plate of the next clamping groove is provided for the pin cutting mechanism during rotation;
and the ratchet wheel cylinder is connected to the ratchet wheel, and the ratchet wheel rotates one clamping groove after the crystal plate material of the current clamping groove is exhausted.
5. The fin locking apparatus of claim 3, wherein the pin cutter mechanism comprises: the upper cutter and the lower cutter are arranged close to the ratchet wheel cylinder turntable mechanism and are mutually matched to cut the feet of the arriving crystal plate;
the material loading sub-mechanism of cutting material includes: and the material cutting cylinder and the material cutting jig are arranged close to the pin cutting mechanism, and the material cutting jig fixes the crystal wafer plate of the cutting pin and further cuts the crystal wafer into crystal wafers through the material cutting cylinder.
6. The fin lock-pay device according to claim 3, wherein the transfer sub-mechanism comprises: the crystal wafer sucker is arranged opposite to the product jig at the second station in the eight-station index plate, and sucks and moves a crystal wafer to the product jig at the second station in the eight-station index plate; a first positioning insertion rod fixed relative to the crystal wafer sucker and contacted with a specific position of the eight-station indexing disc to limit the position of the crystal wafer sucker; the transferring servo motor and the first material taking cylinder are connected to the crystal wafer sucker and provide power for sucking and moving the crystal wafer for the crystal wafer sucker;
the commutator mechanism comprises: and the reversing cylinder is connected to the first positioning insertion rod through a gear, and the reversing cylinder adjusts the posture of the crystal piece on the eight-station index plate through the first positioning insertion rod.
7. The fin lock apparatus of claim 1, wherein the brush cleaning mechanism comprises:
the first suction sucker is arranged opposite to the product jig at the third station in the eight-station index plate, and sucks a crystal wafer from the product jig at the third station in the eight-station index plate;
the transfer motor and the second material taking cylinder are connected to the first suction sucker and provide power for sucking the crystal wafer for the first suction sucker;
the brush motor is arranged close to the first sucking sucker and operates to clean the crystal wafer;
a first traverse motor connected to the first suction cup, the first traverse motor causing the first suction cup to reposition the crystal piece.
8. The fin lock set apparatus of claim 1, wherein the lock screw mechanism comprises:
the vibration disc is arranged close to the product jigs of a fifth station and a sixth station in the eight-station index disc, screws are arranged in the vibration disc, and the vibration disc vibrates to enable the screws to move;
the automatic electric screwdriver is arranged right opposite to the product jigs of a fifth station and a sixth station in the eight-station index plate, is connected to the vibration plate to obtain screws, and locks the crystal plates and the radiating plates in the product jigs of the fifth station and the sixth station by using the screws;
and the first lifting cylinder is connected to the automatic electric screwdriver to provide power for the automatic electric screwdriver.
9. The fin lock-up apparatus according to claim 1, wherein the blanking mechanism includes:
the second sucking sucker is arranged opposite to the product jig at the seventh station in the eight-station index plate, and sucks the crystal plate and the radiating fin which are locked from the product jig at the seventh station in the eight-station index plate and discharges the crystal plate and the radiating fin;
a second positioning insertion rod fixed relative to the second suction sucker and contacted with a specific position of the eight-station index plate to limit the position of the second suction sucker;
and the second transverse moving motor and the second lifting cylinder are connected to the second suction sucker, and provide power for sucking the crystal piece and the radiating fin which are locked and discharged by the second suction sucker.
10. The fin lock-payment apparatus as claimed in claim 1, wherein the blanking detection mechanism comprises:
the color sensor is arranged opposite to the product jig of the eighth station in the eight-station index plate, and the color sensor responds to the fact that the color of the product jig of the eighth station in the eight-station index plate is the color of the product jig, and determines that the locked crystal piece and the cooling fin have been successfully blanked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110930847.XA CN113579760A (en) | 2021-08-13 | 2021-08-13 | Radiating fin locking equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110930847.XA CN113579760A (en) | 2021-08-13 | 2021-08-13 | Radiating fin locking equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113579760A true CN113579760A (en) | 2021-11-02 |
Family
ID=78257763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110930847.XA Pending CN113579760A (en) | 2021-08-13 | 2021-08-13 | Radiating fin locking equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113579760A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1000237A (en) * | 1963-06-07 | 1965-08-04 | Commissariat Energie Atomique | Automatic machine for milling fins on cylindrical parts |
| US6249943B1 (en) * | 1997-12-08 | 2001-06-26 | Nitto Denko Corporation | Automatic semiconductor wafer applying apparatus |
| CN202780394U (en) * | 2012-08-23 | 2013-03-13 | 深圳市智源鹏发科技有限公司 | Automatic screw locking machine |
| CN105436909A (en) * | 2016-01-11 | 2016-03-30 | 广东顺德为艾斯机器人有限公司 | Automatic assembling and sealing performance testing device for water tank |
-
2021
- 2021-08-13 CN CN202110930847.XA patent/CN113579760A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1000237A (en) * | 1963-06-07 | 1965-08-04 | Commissariat Energie Atomique | Automatic machine for milling fins on cylindrical parts |
| US6249943B1 (en) * | 1997-12-08 | 2001-06-26 | Nitto Denko Corporation | Automatic semiconductor wafer applying apparatus |
| CN202780394U (en) * | 2012-08-23 | 2013-03-13 | 深圳市智源鹏发科技有限公司 | Automatic screw locking machine |
| CN105436909A (en) * | 2016-01-11 | 2016-03-30 | 广东顺德为艾斯机器人有限公司 | Automatic assembling and sealing performance testing device for water tank |
Non-Patent Citations (1)
| Title |
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| 专业设计风格: "《沐风网》", 19 May 2015 * |
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Application publication date: 20211102 |