CN113564569A - Lcp塑料的化学粗化及金属化工艺方法 - Google Patents
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Abstract
本发明公开了一种LCP塑料的化学粗化及金属化工艺方法,包括以下步骤:(1)第一次粗化:使用蚀刻液对产品进行浸泡;(2)第二次粗化:调整浸泡温度和时间继续浸泡,使得所述产品表面出现一层均匀的孔洞;(3)活化:使用离子催化剂对所述产品进行活化,将所述产品放置在所述离子催化剂中浸泡;(4)还原:使用离子钯还原剂对所述产品进行浸泡还原;(5)化学铜:使用高速化学铜溶液对所述产品进行沉铜;(6)电镀铜:使用高速高整平性酸性镀铜对所述产品电镀铜;(7)化学镍:使用光亮中磷高温化学镍溶液对所述产品进行沉镍。其本粗化工艺对LCP塑料工件有着良好的粗化效果,具有浸泡时间短,易于操作等特点。
Description
技术领域
本发明涉及了金属化加工领域,具体的是一种LCP塑料的化学粗化及金属化工艺方法。
背景技术
LCP塑料,又称液晶聚合物,是一种新型的高分子材料,有优异的耐酸碱腐蚀性能,耐热性能和成型加工性能,主要应用在电子电气、印刷电路板、人造卫星电子部件、喷气发动机零件、汽车机械零件、医疗等方面。
LCP塑料耐酸碱程度高,表面难以用一般化学方法粗化;表面不易被粗化,再加上一般镀层内应力大,附着力得不到保证;LCP塑料表面经化学粗化后表面非常粗糙,后续镀层无法有效填补孔隙,导致工件镀层外观较差。
发明内容
为了克服现有技术中的缺陷,本发明实施例提供了一种LCP塑料的化学粗化及金属化工艺方法,其可使LCP塑料表面产生均匀的孔隙,可得到平整均匀的金属镀层。
为实现上述目的,本申请实施例公开了一种LCP塑料的化学粗化及金属化工艺方法,包括以下步骤:
(1)第一次粗化:使用蚀刻液对产品进行浸泡;
(2)第二次粗化:调整浸泡温度和时间继续浸泡,使得所述产品表面出现一层均匀的孔洞;
(3)活化:使用离子催化剂对所述产品进行活化,将所述产品放置在所述离子催化剂中浸泡;
(4)还原:使用离子钯还原剂对所述产品进行浸泡还原;
(5)化学铜:使用高速化学铜溶液对所述产品进行沉铜;
(6)电镀铜:使用高速高整平性酸性镀铜对所述产品电镀铜;
(7)化学镍:使用光亮中磷高温化学镍溶液对所述产品进行沉镍。
优选的,所述蚀刻液为麦德美科技(苏州)有限公司的LCP ETCH产品,所述离子催化剂为麦德美科技(苏州)有限公司的MID Catalyst 100系列产品,所述离子钯还原剂为麦德美科技(苏州)有限公司的MID Reducer系列产品,所述高速化学铜溶液为麦德美科技(苏州)有限公司的MID Cu XD系列产品,所述高速高整平性酸性镀铜为麦德美科技(苏州)有限公司的SYSTEK BMP-LP8系列产品,所述光亮中磷高温化学镍溶液为麦德美科技(苏州)有限公司的MID Ni200中磷系列产品。
优选的,所述步骤(1)中第一次粗化的浸泡温度为65-75℃;所述步骤(2)中第二次粗化的浸泡温度为70-80℃;所述步骤(3)中活化的浸泡温度为40-50℃;所述步骤(4)中还原的浸泡温度为40-50℃;所述步骤(5)中化学铜的浸泡温度为45-55℃;所述步骤(6)中电镀温度为40-50℃;所述步骤(7)中化学镍的浸泡温度为80-90℃。
优选的,所述步骤(1)中第一次粗化的浸泡时间为5-10min;所述步骤(2)中第二次粗化的浸泡10-30min;所述步骤(3)中活化的浸泡时间为5-15min;所述步骤(4)中还原的浸泡时间为5-10min;所述步骤(5)中化学铜的浸泡时间为15-30min。
优选的,所述步骤(6)的电流密度为2-3ASD。
优选的,所述蚀刻液的操作浓度为:300ml/L(步骤(1)),500ml/L(步骤(2));所述离子催化剂的操作浓度60ppm;所述离子钯还原剂操作浓度为50ml/L。
优选的,所述高速化学铜溶液的组分为:0.10mol/L络合剂、3.0g/L铜离子、5.0g/L氢氧化钠和4.0g/L甲醛;
所述高速高整平性酸性镀铜的组分为100g/L硫酸铜,200g/L硫酸,2ml/L镀铜光泽剂, 12.5ml/L整平剂;
所述化学镍的操作浓度为Part A 50ml/L,Part B 150ml/L。
本发明的有益效果如下:
1、本工艺流程可使LCP塑料表面产生均匀的孔隙,有利于后续的金属化流程的进行;
2、本工艺流程使用低内应力的电镀铜和化学镍药水,镀层的附着力更有保障;
3、本工艺流程使用的电镀铜工艺可有效填补塑料表面因化学粗化产生的孔隙与凹坑,可得到平整均匀的金属镀层,工件外观表现大大改善。
为让本发明的上述和其他目的、特征和优点能更明显易懂,下文特举较佳实施例,作详细说明如下。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本发明的描述中,需要说明的是,术语“上”、“下”、“底”、“内”、“外”等指示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”等的特征可以明示或隐含地包括一个或者更多个该特征。
实施例1
(1)第一次粗化:使用蚀刻液对产品进行浸泡,浸泡温度70℃,浸泡时间8min;
(2)第二次粗化:调整浸泡温度和时间继续浸泡,使得所述产品表面出现一层均匀的孔洞,75℃,浸泡时间15min;
(3)活化:使用离子催化剂对所述产品进行活化,将所述产品放置在所述离子催化剂中浸泡,浸泡温度45℃,浸泡时间10min;
(4)还原:使用离子钯还原剂对所述产品进行浸泡还原,浸泡温度45℃,浸泡时间8min;
(5)化学铜:使用高速化学铜溶液对所述产品进行沉铜,浸泡温度50℃,浸泡时间20min;
(6)电镀铜:使用高速高整平性酸性镀铜对所述产品电镀铜,浸泡温度45℃,使用电流密度为2-3ASD,电镀时间按照客户要求的厚度而定;
(7)化学镍:使用光亮中磷高温化学镍溶液对所述产品进行沉镍,浸泡温度85℃,浸泡时间根据客户所需要的镍厚度而定。
其中,所述蚀刻液的操作浓度分别为:300ml/L(步骤(1)),500ml/L(步骤(2));所述离子催化剂的操作浓度为60ppm;所述离子钯还原剂操作浓度分别为50ml/L;所述高速化学铜溶液的组分为0.10mol/L络合剂、3.0g/L铜离子、5.0g/L氢氧化钠和4.0g/L甲醛;所述高速高整平性酸性镀铜的组分为100g/L硫酸铜,200g/L硫酸,2ml/L镀铜光泽剂, 12.5ml/L整平剂;所述化学镍的操作浓度Part A 50ml/L,Part B 150ml/L。
实施例2
(1)第一次粗化:使用蚀刻液对产品进行浸泡,浸泡温度65℃,浸泡时间5min;
(2)第二次粗化:调整浸泡温度和时间继续浸泡,使得所述产品表面出现一层均匀的孔洞,浸泡温度70℃,浸泡时间10min;
(3)活化:使用离子催化剂对所述产品进行活化,将所述产品放置在所述离子催化剂中浸泡,浸泡温度45℃,浸泡时间10min;
(4)还原:使用离子钯还原剂对所述产品进行浸泡还原,浸泡温度45℃,浸泡时间8min;
(5)化学铜:使用高速化学铜溶液对所述产品进行沉铜,浸泡温度50℃,浸泡时间20min;
(6)电镀铜:使用高速高整平性酸性镀铜对所述产品电镀铜,浸泡温度45℃,使用电流密度为2-3ASD,电镀时间按照客户要求的厚度而定;
(7)化学镍:使用光亮中磷高温化学镍溶液对所述产品进行沉镍,浸泡温度85℃,浸泡时间根据客户所需要的镍厚度而定。
其中,所述蚀刻液的操作浓度、所述离子催化剂、所述离子钯还原剂操作浓度分别为: 300ml/L(第一次粗化),500ml/L,(第二次粗化),离子钯60ppm,还原剂50ml/L;所述高速化学铜溶液的组分为0.10mol/L络合剂、3.0g/L铜离子、5.0g/L氢氧化钠和4.0g/L甲醛;高速高整平性酸性镀铜的组分为100g/L硫酸铜,200g/L硫酸,2ml/L镀铜光泽剂,12.5ml/L整平剂;化学镍的操作浓度Part A 50ml/L,Part B 150ml/L。
实施例3
(1)第一次粗化:使用蚀刻液对产品进行浸泡,浸泡温度75℃,浸泡时间5min;
(2)第二次粗化:调整浸泡温度和时间继续浸泡,使得所述产品表面出现一层均匀的孔洞,浸泡温度80℃,浸泡时间10min;
(3)活化:使用离子催化剂对所述产品进行活化,将所述产品放置在所述离子催化剂中浸泡,浸泡温度45℃,浸泡时间10min;
(4)还原:使用离子钯还原剂对所述产品进行浸泡还原,浸泡温度45℃,浸泡时间8min;
(5)化学铜:使用高速化学铜溶液对所述产品进行沉铜,浸泡温度50℃,浸泡时间20min;
(6)电镀铜:使用高速高整平性酸性镀铜对所述产品电镀铜,浸泡温度45℃,使用电流密度为2-3ASD,电镀时间按照客户要求的厚度而定;
(7)化学镍:使用光亮中磷高温化学镍溶液对所述产品进行沉镍,浸泡温度85℃,浸泡时间根据客户所需要的镍厚度而定。
其中,所述蚀刻液的操作浓度为300ml/L(步骤(1)),500ml/L(步骤(2)),所述离子催化剂的操作浓度为60ppm,所述离子钯还原剂操作浓度分别为50ml/L;
所述高速化学铜溶液的组分为0.10mol/L络合剂、3.0g/L铜离子、5.0g/L氢氧化钠和 4.0g/L甲醛;所述高速高整平性酸性镀铜的组分为100g/L硫酸铜,200g/L硫酸,2ml/L镀铜光泽剂,12.5ml/L整平剂;所述化学镍的操作浓度Part A 50ml/L,Part B 150ml/L。
对比例1
与实施例3的区别仅在于,将步骤(1)中的蚀刻液替换为NaOH,得到的LCP塑料工件的外观较差,LCP塑料工件表面得不到有效粗化,后续镀层的附着力较差。
对比例2
与实施例3的区别仅在于,将步骤(3)中的离子催化剂替换为胶体钯,得到的LCP塑料工件的镀层较为粗糙,外观较差,镀层粗糙度不符合要求。
对比例3
与实施例3的区别仅在于,将步骤(1)中的蚀刻液替换为KOH,得到的LCP塑料工件的外观较差,LCP塑料工件表面得不到有效粗化,后续镀层的附着力较差。
对比例4
与实施例3的区别仅在于,步骤(1)中第一次粗化的浸泡温度为80℃。
对比例5
与实施例3的区别仅在于,步骤(2)中第二次粗化的浸泡温度为85℃。
对比例6
与实施例3的区别仅在于,步骤(3)中活化的浸泡温度为51℃。
对比例7
与实施例3的区别仅在于,步骤(4)中还原的浸泡温度为51℃。
对比例8
与实施例3的区别仅在于,步骤(5)中化学铜的浸泡温度为56℃。
对比例9
与实施例3的区别仅在于,步骤(6)中电镀的浸泡温度为51℃。
对比例10
与实施例3的区别仅在于,步骤(7)中还原的浸泡温度为91℃。
附着力测试
试验1:用百格刀在产品表面划出十字格形状,共计100个方格(1mm×1mm),切口直至基材,用软毛刷沿十字格的每一条对角线轻轻地扫几次,再向前、后扫几次,使用3M 600#胶带拉扯3次,观察各自区域的情况,统计未脱落面积占总面积的百分比,得到下表1:
表1
实例 | 未脱落面积占比(%) |
实施例1 | 100 |
实施例2 | 100 |
实施例3 | 100 |
对比例1 | 80 |
对比例2 | 90 |
对比例3 | 75 |
对比例4 | 70 |
对比例5 | 90 |
对比例6 | 80 |
对比例7 | 50 |
对比例8 | 60 |
对比例9 | 50 |
对比例10 | 60 |
由表1可知,使用百格刀划后,再使用3M 600#胶带拉扯3次,实施例1-3中的产品表面均无脱落现象发生,可见本发明中产品表面优异的附着力。而将各对比例与实施例3比较发现,当将粗化步骤中的蚀刻液进行替换,或者将各物质的操作浓度进行改变时,由于产品表面孔洞大小、均匀度受到影响,进而影响后续镀层的附着力产品表面的附着力明显下降。而当其它步骤中各类工作液的操作浓度发生改变时,由于产品表面电性等性质的改变,镀层附着力也将受到一定的影响,进而导致相应的降低。
本发明中应用了具体实施例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想;同时,对于本领域的一般技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明的限制。
Claims (7)
1.一种LCP塑料的化学粗化及金属化工艺方法,其特征在于,包括以下步骤:
(1)第一次粗化:使用蚀刻液对产品进行浸泡;
(2)第二次粗化:调整浸泡温度和时间继续浸泡,使得所述产品表面出现一层均匀的孔洞;
(3)活化:使用离子催化剂对所述产品进行活化,将所述产品放置在所述离子催化剂中浸泡;
(4)还原:使用离子钯还原剂对所述产品进行浸泡还原;
(5)化学铜:使用高速化学铜溶液对所述产品进行沉铜;
(6)电镀铜:使用高速高整平性酸性镀铜对所述产品电镀铜;
(7)化学镍:使用光亮中磷高温化学镍溶液对所述产品进行沉镍。
2.如权利要求1所述的LCP塑料的化学粗化及金属化工艺方法,其特征在于,所述蚀刻液为麦德美科技(苏州)有限公司的LCP ETCH产品,所述离子催化剂为麦德美科技(苏州)有限公司的MID Catalyst 100系列产品,所述离子钯还原剂为麦德美科技(苏州)有限公司的MID Reducer系列产品,所述高速化学铜溶液为麦德美科技(苏州)有限公司的MID Cu XD系列产品,所述高速高整平性酸性镀铜为麦德美科技(苏州)有限公司的SYSTEK BMP-LP8系列产品,所述光亮中磷高温化学镍溶液为麦德美科技(苏州)有限公司的MID Ni200中磷系列产品。
3.如权利要求1所述的LCP塑料的化学粗化及金属化工艺方法,其特征在于,所述步骤(1)中第一次粗化的浸泡温度为65-75℃;所述步骤(2)中第二次粗化的浸泡温度为70-80℃;所述步骤(3)中活化的浸泡温度为40-50℃;所述步骤(4)中还原的浸泡温度为40-50℃;所述步骤(5)中化学铜的浸泡温度为45-55℃;所述步骤(6)中电镀温度为40-50℃;所述步骤(7)中化学镍的浸泡温度为80-90℃。
4.如权利要求1所述的LCP塑料的化学粗化及金属化工艺方法,其特征在于,所述步骤(1)中第一次粗化的浸泡时间为5-10min;所述步骤(2)中第二次粗化的浸泡10-30min;所述步骤(3)中活化的浸泡时间为5-15min;所述步骤(4)中还原的浸泡时间为5-10min;所述步骤(5)中化学铜的浸泡时间为15-30min。
5.如权利要求1所述的LCP塑料的化学粗化及金属化工艺方法,其特征在于,所述步骤(6)的电流密度为2-3ASD。
6.如权利要求1所述的LCP塑料的化学粗化及金属化工艺方法,其特征在于,所述蚀刻液的操作浓度为:300ml/L(步骤(1)),500ml/L(步骤(2));所述离子催化剂的操作浓度60ppm;所述离子钯还原剂操作浓度为50ml/L。
7.如权利要求1所述的LCP塑料的化学粗化及金属化工艺方法,其特征在于,所述高速化学铜溶液的组分为:0.10mol/L络合剂、3.0g/L铜离子、5.0g/L氢氧化钠和4.0g/L甲醛;
所述高速高整平性酸性镀铜的组分为100g/L硫酸铜,200g/L硫酸,2ml/L镀铜光泽剂,12.5ml/L整平剂;
所述化学镍的操作浓度为Part A 50ml/L,Part B 150ml/L。
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