CN113551826A - Pressure sensor and preparation method thereof - Google Patents
Pressure sensor and preparation method thereof Download PDFInfo
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- CN113551826A CN113551826A CN202110831350.2A CN202110831350A CN113551826A CN 113551826 A CN113551826 A CN 113551826A CN 202110831350 A CN202110831350 A CN 202110831350A CN 113551826 A CN113551826 A CN 113551826A
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- circuit board
- sinking groove
- printed circuit
- pressure sensor
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
- G01L9/065—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices with temperature compensating means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a pressure sensor and a preparation method thereof, wherein the pressure sensor comprises: the top surface of the first base is provided with a first sinking groove, the first base is also provided with a second sinking groove, and the second sinking groove is positioned at the bottom of the first sinking groove; the second base is internally provided with an accommodating groove for accommodating the pressure sensing chip and is positioned in the second sinking groove; the corrugated membrane covers the first sinking groove and is fixedly connected with the top surface of the first base around the first sinking groove; and a filling space for filling transmission oil is formed between the corrugated diaphragm and the accommodating groove. The testing precision of the pressure sensor is improved.
Description
Technical Field
The invention relates to the technical field of pressure sensing, in particular to a pressure sensor and a preparation method thereof.
Background
With the continuous research and progress of sensor technology, pressure sensors are increasingly used in fields such as aerospace, deep sea exploration, automotive engines, and explosion mechanics. The core device of the pressure sensor is a pressure sensing chip, and the pressure sensing chip mainly works based on piezoresistive effect. The pressure sensor also comprises a package which is assembled with the pressure sensing chip in a matching way.
However, the existing pressure sensor has poor testing accuracy.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the problem of poor test accuracy in the prior art, and to provide a pressure sensor and a manufacturing method thereof.
The present invention provides a pressure sensor, comprising: the top surface of the first base is provided with a first sinking groove, the first base is also provided with a second sinking groove, and the second sinking groove is positioned at the bottom of the first sinking groove; the second base is internally provided with an accommodating groove for accommodating the pressure sensing chip and is positioned in the second sinking groove; the corrugated membrane covers the first sinking groove and is fixedly connected with the top surface of the first base around the first sinking groove; and a filling space for filling transmission oil is formed between the corrugated diaphragm and the accommodating groove.
Optionally, the coefficient of thermal expansion of the second base is smaller than the coefficient of thermal expansion of the first base.
Optionally, the second base comprises a ceramic base; the first base comprises a stainless steel base.
Optionally, the second base is adhered to the inner wall surface of the second sinking groove through a first adhesive layer; the pressure sensing chip is adhered to the inner wall surface of the accommodating groove through a second adhesive layer; the strength of the second adhesive layer is less than that of the first adhesive layer.
Optionally, the first base is further provided with a first through hole, and the first through hole penetrates through the first base located at the bottom of the second sinking groove; the pressure sensor further includes: a first conductive probe, a portion of the first conductive probe being located in the first through hole, a portion of the first conductive probe protruding from a bottom surface of the first base; a sintered layer in the first via and surrounding a sidewall of the first conductive probe; and the conductive connecting line is connected with one end, facing the corrugated diaphragm, of the first conductive probe and the pressure sensing chip.
Optionally, the method further includes: a printed circuit board unit; an N-core connector connected to one side of the printed circuit board unit, the printed circuit board unit being located between the N-core connector and the first base; n is an integer greater than or equal to 1; the first conductive probe is connected with the printed circuit board unit.
Optionally, the printed circuit board unit includes: the first printed circuit board and the second printed circuit board are oppositely arranged and spaced; the first conductive connecting piece is fixedly connected with one side surface of the first printed circuit board facing the second printed circuit board; the second conductive connecting piece is fixedly connected with one side surface of the second printed circuit board facing the first printed circuit board; the second conductive connecting piece is electrically connected with the first conductive connecting piece; the first printed circuit board is located between the second printed circuit board and the first base, and the first conductive probe is connected with the first printed circuit board.
Optionally, the first conductive connector has a first socket therein, and the second conductive connector is adapted to be inserted into the first socket; alternatively, the second conductive connector has a second socket therein, and the first conductive connector is adapted to be inserted into the second socket.
Optionally, the second sinking groove is located in a part of the first base at the bottom of the first sinking groove; the first base is internally provided with an oil injection channel communicated with the first sinking groove, and the oil injection channel is positioned at the side part of the second sinking groove and at the bottom of the first sinking groove; the pressure sensor further includes: the sealing element is positioned in the first base on one side, facing away from the first sunken groove, of the oil injection channel.
Optionally, the method further includes: the pressing ring is located on one side, back to the first base, of the corrugated diaphragm and fixedly connected with the edge area of the corrugated diaphragm.
Optionally, the method further includes: the third base is provided with a sample inlet hole and a third sinking groove, and the third sinking groove is positioned at the bottom of the sample inlet hole and is communicated with the sample inlet hole; the damper is positioned in a port of the sampling hole, which is opposite to one side of the third sinking groove; the first base, the second base, the pressure sensing chip, the corrugated diaphragm and the pressure ring are positioned in the third sinking groove; the convoluted diaphragm is positioned between the sample entry well and the first base.
Optionally, the damper has a head hole and a bottom hole located at the bottom of the head hole, the aperture of the bottom hole is smaller than the aperture of the head hole, and the central axis of the bottom hole is located at the side of the central axis of the head hole.
Optionally, the corrugated diaphragm comprises a stainless steel corrugated diaphragm, and the thickness of the corrugated diaphragm is 0.01mm to 0.09 mm.
The invention also provides a preparation method of the pressure sensor, which comprises the following steps: forming a first base, wherein a first sinking groove is formed in the top surface of the first base, a second sinking groove is further formed in the first base, and the second sinking groove is located at the bottom of the first sinking groove; forming a second base, wherein the second base is provided with an accommodating groove; providing a corrugated diaphragm and a pressure sensing chip; fixing the pressure sensing chip in the accommodating groove; fixing the second base in the second sink; after the pressure sensing chip is fixed in the accommodating groove and the second base is fixed in the second sinking groove, the corrugated diaphragm covers the first sinking groove and is fixedly connected with the top surface of the first base around the first sinking groove; and filling transmission oil between the corrugated diaphragm and the pressure sensing chip.
Optionally, the step of covering the corrugated diaphragm with the first sinking groove and fixedly connecting the corrugated diaphragm with the top surface of the first base around the first sinking groove includes welding the corrugated diaphragm with the top surface of the first base around the first sinking groove by a laser welding process or an argon arc welding process.
Optionally, the first base is further provided with a first through hole, and the first through hole penetrates through the first base located at the bottom of the second sinking groove; the preparation method of the pressure sensor further comprises the following steps: providing a first conductive probe; positioning a part of the first conductive probe in the first through hole, wherein the part of the first conductive probe protrudes out of the bottom surface of the first base; filling a sintering material between the first conductive probe and a sidewall surface of the first via; and carrying out a sintering process to enable the sintering material to form a sintering layer.
Optionally, the method further includes: providing a compression ring; the pressing ring is arranged on one side, back to the first base, of the corrugated diaphragm and fixedly connected with the edge area of the corrugated diaphragm; the process for fixedly connecting the pressure ring and the edge area of the corrugated diaphragm comprises a laser welding process or an argon arc welding process.
Optionally, the method further includes: providing a third base, wherein the third base is provided with a sample inlet hole and a third heavy groove, and the third heavy groove is positioned at the bottom of the sample inlet hole and is communicated with the sample inlet hole; arranging the first base, the second base, the pressure sensing chip, the corrugated diaphragm and the pressure ring in the third sinking groove, wherein the corrugated diaphragm is positioned between the sample inlet and the first base; providing a damper; and arranging the damper in a port of the sampling hole, which is back to one side of the third sinking groove.
Optionally, the method further includes: providing an N-core connector, wherein N is an integer greater than or equal to 1; providing a printed circuit board unit comprising: the circuit board comprises a first printed circuit board and a second printed circuit board, wherein one side surface of the first printed circuit board is fixedly connected with a first conductive connecting piece, and one side surface of the second printed circuit board is fixedly connected with a second conductive connecting piece; fixedly connecting the N-core connector with the second printed circuit board, wherein the second printed circuit board is positioned between the second conductive connecting piece and the N-core connector; fixedly connecting one end of the first conductive probe extending out of the first base with the first printed circuit board, wherein the first printed circuit board is positioned between the first conductive probe and the first conductive connecting piece; and inserting the second conductive connecting piece with the first conductive connecting piece.
The technical scheme of the invention has the following beneficial effects:
1. according to the pressure sensor provided by the technical scheme of the invention, the pressure sensing chip is placed in the second base, and the second base is placed in the second sinking groove, so that the second base occupies the main space of the second sinking groove, and the pressure transmitting oil is mainly distributed in the first sinking groove, therefore, when the pressure sensing chip is positioned in the accommodating groove, the filling amount of the pressure transmitting oil between the corrugated diaphragm and the pressure sensing chip is reduced, and thus, even if the volume of the pressure transmitting oil is expanded when the temperature is increased, the total volume expansion amount of the pressure transmitting oil is reduced, the additional pressure to the pressure sensing chip is reduced due to the thermal expansion of the pressure transmitting oil, and the precision reduction of the pressure testing of the pressure sensing chip is avoided.
2. Furthermore, because the thermal expansion coefficient of the second base is smaller than that of the first base, the difference between the thermal expansion coefficient of the second base and the thermal expansion coefficient of the pressure sensing chip is smaller than that of the first base, so that the additional stress generated on the pressure sensing chip caused by heating is reduced, and the deformation of the pressure sensing chip is further reduced. Because the deformation of the pressure sensing chip is reduced, the self deformation of the sensitive film on the front surface of the pressure sensing chip mainly contains the magnitude information of the external pressure, and the sensitive film contains less additional stress information, so that the reduction of the precision of the pressure testing of the pressure sensing chip is further avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is an exploded view of a pressure sensor provided in accordance with an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a pressure sensor provided in accordance with an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a first base, a first conductive probe, a sintering layer, a second base, a pressure sensing chip, a corrugated diaphragm, a pressure ring, a third base, and a damper in a pressure sensor according to an embodiment of the present invention;
FIG. 4 is a schematic view of a corrugated diaphragm provided in accordance with an embodiment of the present invention;
FIG. 5 is a perspective view of a damper according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a damper provided in accordance with an embodiment of the present invention;
FIG. 7 is a top view of a first base according to an embodiment of the present invention;
FIG. 8 is a top view of a second base provided in accordance with one embodiment of the present invention;
fig. 9 is a top view of a second base fixed in a second sink of a first base according to an embodiment of the invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
An embodiment of the present invention provides a pressure sensor, which is combined with fig. 1 to 9, including:
a first base 160, a first sinking groove 165 (refer to fig. 7 and 9) being provided on a top surface of the first base 160, and a second sinking groove 166 (refer to fig. 7) being further provided in the first base 160, the second sinking groove 166 being located at a bottom of the first sinking groove 165;
a second base 150, wherein a receiving groove 152 (refer to fig. 8) for receiving a pressure sensing chip 210 is disposed in the second base 150, and the second base 150 is located in the second sinking groove 166;
a bellows 140, wherein the bellows 140 covers the first sinker 165 and is fixedly connected to the top surface of the first base 160 around the first sinker 165;
a filling space for filling the transmission oil is formed between the bellows diaphragm 140 and the receiving groove 152.
The pressure sensor of the present embodiment is capable of measuring the pressure of different media (gases, liquids, etc.), for example, the pressure of lubricating oil.
The lubricating oil is corrosive, and if the lubricating oil directly contacts the pressure sensing chip 210, the lubricating oil corrodes the pressure sensing chip 210. In this embodiment, the corrugated diaphragm 140 is used to isolate the medium to be measured from the pressure sensing chip 210, so as to prevent the medium to be measured from contacting the pressure sensing chip 210 and corroding the pressure sensing chip 210.
The material of the corrugated diaphragm 140 is metal. In this embodiment, the convoluted diaphragm 140 comprises a stainless steel convoluted diaphragm, for example, the material of the convoluted diaphragm 140 is 316L stainless steel. When the corrugated diaphragm 140 is made of 316L stainless steel, the corrugated diaphragm 140 has excellent linear elastic characteristic curve and corrosion resistance under low pressure, and has good weldability.
The corrugated diaphragm 140 is a circular diaphragm having concentric annular shapes. The corrugated shape of the corrugated diaphragm 140 is arc, sine, triangle or trapezoid. In the present embodiment, the corrugated shape of the corrugated diaphragm 140 is exemplified by a circular arc shape.
The thickness of the corrugated membrane 140 is 0.01mm to 0.09mm, such as 0.025 mm. The thickness of the corrugated diaphragm 140 is small, so that the elastic deformation of the corrugated diaphragm 140 has good linearity, and pressure can be transmitted to the pressure sensing chip 210 without loss.
A sealed cavity is formed between the corrugated diaphragm 140 and the first base 160, and is filled with a pressure-transmitting oil, the second base 150 is located in the second sunken groove 166, and the pressure-sensing chip 210 is located in the receiving groove 152. The corrugated diaphragm 140 utilizes its own elastic mechanical characteristics and incompressibility of the pressure-transmitting oil under low pressure, so that the pressure of the medium to be measured on the corrugated diaphragm 140 is transmitted to the pressure sensing chip 210 with almost no loss.
The pressure sensing chip 210 includes four semiconductor resistors of equal value, which constitute a wheatstone bridge, and have piezoresistive effect. When the sensing film in the pressure sensing chip 210 is acted by the external pressure, and the wheatstone bridge is unbalanced, if an excitation power supply (constant current or constant voltage) is applied to the wheatstone bridge, an output voltage proportional to the measured pressure can be obtained, so that the purpose of measuring the pressure is achieved.
Since the pressure sensing chip 210 is disposed in the second base 150 and the second base 150 is disposed in the second sinking groove 166, the second base 150 occupies a main space of the second sinking groove 166, and the pressure-transferring oil is mainly distributed in the first sinking groove 165, when the pressure sensing chip is disposed in the receiving groove, a filling amount of the pressure-transferring oil between the corrugated diaphragm 140 and the pressure sensing chip 210 is reduced, so that even if the pressure-transferring oil expands in volume at an elevated temperature, a total volume expansion amount of the pressure-transferring oil is reduced, and an additional pressure to the pressure sensing chip 210 is reduced due to thermal expansion of the pressure-transferring oil, thereby preventing a reduction in accuracy of a test pressure of the pressure sensing chip 210.
In one embodiment, the second base 150 has a smaller coefficient of thermal expansion than the first base 160. Since the thermal expansion coefficient of the second base 150 is smaller than that of the first base 160, the difference between the thermal expansion coefficient of the second base 150 and the thermal expansion coefficient of the pressure sensing chip 210 is smaller than that of the first base 160 and the thermal expansion coefficient of the pressure sensing chip 210, so as to reduce the additional stress generated on the pressure sensing chip 210 caused by heat, and further reduce the deformation of the pressure sensing chip 210.
Because the deformation of the pressure sensing chip 210 is reduced, the deformation of the sensitive film on the front side of the pressure sensing chip 210 mainly contains the magnitude information of the external pressure, and the sensitive film contains less additional stress information, so that the precision reduction of the pressure testing of the pressure sensing chip 210 is further avoided.
In this embodiment, a second sinking groove 166 is disposed in a portion of the first base 160 at the bottom of the first sinking groove 165.
In one embodiment, the second pedestal 150 comprises a ceramic pedestal.
When the second base 150 is a ceramic base, since the ceramic is an insulator, the second base 150 does not adsorb impurities, so that the second base 150 does not contaminate the conductive oil.
The first base 160 includes a stainless steel base.
In a specific embodiment, when the first base 160 is a stainless steel base, the material of the first base 160 is 316L stainless steel or 304L stainless steel, and the first base 160 has high corrosion resistance and good weldability.
The opening size of the first sinking groove 165 is larger than that of the second sinking groove 166.
The pressure transmitting oil comprises a silicone oil, such as dimethicone. The silicone oil has good dielectric property, small thermal expansion coefficient, good chemical stability and small compression ratio, and can transmit the pressure to the pressure sensing chip 210 without loss.
The second base 150 is adhered to the inner wall surface of the second sinking groove 166 through a first adhesive layer (not shown); the pressure sensing chip 210 is adhered to the inner wall surface of the accommodating groove 152 by a second adhesive layer (not shown); the strength of the second adhesive layer is less than that of the first adhesive layer.
Because the intensity of second glue film is less, and the second glue film belongs to the flexible glue material, consequently the second glue film has the cushioning effect to the power, reduces the stress deformation of first base 160 to pressure sensing chip 210. The first adhesive layer has high strength, so that the first base 160 and the second base 150 have good bonding strength and high rigidity.
In this embodiment, the first glue layer has high strength and high temperature resistance characteristics, and the first glue layer includes the epoxy glue. The second adhesive layer has the characteristics of low hardness and low elastic modulus, and comprises silica gel.
The first base 160 further has a first through hole 161a therein, and the first through hole 161a penetrates through the first base 160 at the bottom of the second sinking groove 166.
The front surface of the pressure sensing chip 210 faces the corrugated diaphragm 140, and the back surface of the pressure sensing chip 210 faces away from the corrugated diaphragm 140, so that the chip pad on the front surface of the pressure sensing chip 210 is electrically led out.
The pressure sensor further includes: a first conductive probe 161, a portion of the first conductive probe 161 being located in the first through hole 161a, a portion of the first conductive probe 161 protruding from a bottom surface of the first base 160; a frit layer 162 positioned in the first via hole 161a and surrounding a sidewall of the first conductive probe 161; the conductive connection line connects one end of the first conductive probe 161 facing the corrugated diaphragm 140 and the pressure sensing chip 210, and specifically, the conductive connection line connects one end of the first conductive probe 161 facing the corrugated diaphragm 140 and the chip pad of the pressure sensing chip 210.
The material of the first conductive probe 161 includes kovar. The material of the frit layer 162 includes glass.
In this embodiment, the second base 150 has a fourth sinking groove 153 therein, the receiving groove 152 is located in the second base 150 at the bottom of the fourth sinking groove 153, the second base 150 further has a second through hole 151 therein, and the second through hole 151 is located at the bottom of the fourth sinking groove 153 and at the side of the receiving groove 152. The second through hole 151 is penetrated through the first through hole 161 a. After the second base 150 is fixed in the second sinking groove 166, the first conductive probe 161 also extends into the second through hole 151. In other embodiments, the second base 150 may not have the fourth sinking groove, but only have the second through hole and the receiving groove, and the second through hole is located at a side portion of the receiving groove and penetrates through the second base.
The first base 160 has an oil injection passage 163 therein, which communicates with the first sinking groove 165, the oil injection passage 163 being located at the side of the second sinking groove 166 and at the bottom of the first sinking groove 165.
The pressure sensor further includes: a seal 164, the seal 164 being located in the first base 160 on a side of the oil injection passage 163 facing away from the first undercut 165. The seal 164 comprises steel balls.
The pressure sensor further includes: a printed circuit board unit; an N-core connector 190 connected to one side of the printed circuit board unit between the N-core connector 190 and the first base 160; n is an integer greater than or equal to 1; the first conductive probe 161 is connected to the printed circuit board unit.
In this embodiment, the N-core connector 190 is exemplified as a four-core connector, and in other embodiments, the N-core connector 190 may be a three-core connector or a five-core connector. In this embodiment, the selection of N is not limited.
The printed circuit board unit includes: a first printed circuit board 171 and a second printed circuit board 172 which are oppositely arranged and spaced; a first conductive connector (not shown) fixedly connected to a surface of the first printed circuit board 171 facing the second printed circuit board 172; a second conductive connector (not shown) fixedly connected to a side surface of the second printed circuit board 172 facing the first printed circuit board; the second conductive connecting piece is electrically connected with the first conductive connecting piece; the first printed circuit board 171 is located between the second printed circuit board 172 and the first base 160.
The first conductive probe 161 is connected to the first printed circuit board 171. Specifically, the first conductive probe 161 penetrates the first printed circuit board 171, so that the connection between the first conductive probe 161 and the first printed circuit board 171 is more stable. In other embodiments, the first conductive probe 161 is connected to a surface of the first printed circuit board 171 on a side facing away from the second printed circuit board 172.
In one embodiment, the first conductive connector has a first socket therein, and the second conductive connector is a solid structure and is adapted to be inserted into the first socket.
In another embodiment, the second conductive connector has a second socket therein, and the first conductive connector is of a solid structure and is adapted to be inserted into the second socket.
The first conductive connecting piece and the second conductive connecting piece can be spliced.
The first conductive connector and the second conductive connector may be detachably provided so that the first conductive connector and the second conductive connector are disconnected, thereby enabling the replacement of a different second printed circuit board 172 and selecting a different type and function of the second printed circuit board 172 to be electrically connected to the first printed circuit board 171.
The N-core connector 190 has a second conductive connection probe 191, and the second conductive connection probe 191 is connected to the second printed circuit board 172. In this embodiment, the second conductive connection probe 191 penetrates the second printed circuit board 172, so that the connection between the second conductive connection probe 191 and the second printed circuit board 172 is more stable. In other embodiments, the second conductive connection probe is fixedly connected with one side surface of the second printed circuit board, which faces away from the first printed circuit board.
The second conductive connection probe 191 is electrically connected to the second printed circuit board 172. The first conductive probe 161 is electrically connected to the first printed circuit board 171. The first conductive connector is electrically connectable with the second conductive connector. This enables the first conductive probe 161 to be electrically connected to the N-core connector 190. The first conductive probe 161 is in turn electrically connected to the pressure sensing die 210. Thus, the electrical signal of the pressure sensing chip 210 is led out through the first conductive probe 161, the first printed circuit board 171, the first conductive connector, the second conductive probe, the second printed circuit board 172 and the N-core connector 190.
In this embodiment, the printed circuit board unit is a compensation circuit board. In a specific embodiment, the printed circuit board unit includes a compensation unit and an analog-to-digital conversion unit, the compensation unit is configured to compensate for a zero point of the output signal of the pressure sensing chip 210, and the compensation unit is further configured to compensate for a temperature drift of the output signal of the pressure sensing chip 210, so that an influence of a temperature change is removed from the output signal of the pressure sensing chip 210. Finally, the compensation unit outputs an analog signal having a linear relationship with the input signal of the pressure sensing chip 210. The analog signal output by the compensation unit is input to an analog-to-digital conversion unit, and the analog-to-digital conversion unit outputs a corresponding digital signal.
The compensation unit and the analog-to-digital conversion unit are both provided in the first printed circuit board 171, or the compensation unit and the analog-to-digital conversion unit are both provided in the second printed circuit board 172. Alternatively, the compensation unit is disposed in the first printed circuit board 171, and the analog-to-digital conversion unit is disposed in the second printed circuit board 172. Alternatively, the analog-to-digital conversion unit is disposed in the first printed circuit board 171, and the compensation unit is disposed in the second printed circuit board 172.
The pressure sensor further includes: and the pressing ring 130 is positioned on one side of the corrugated diaphragm 140, which faces away from the first base 160, and is fixedly connected with the edge area of the corrugated diaphragm 140. The material of the pressure ring 130 includes a metal, such as stainless steel. In this embodiment, the material of the pressure ring 130 is 316L stainless steel, and the pressure ring 130 has strong corrosion resistance and high weldability.
The pressure sensor further includes: a third base 120, wherein the third base 120 has a sample inlet 121 and a third sink, and the third sink is located at the bottom of the sample inlet 121 and is communicated with the sample inlet; and the damper 100 is positioned in a port of the sampling hole 121 on the side opposite to the third sinking groove. The sample inlet 121 is used for filling a medium to be measured.
The material of the damper 100 includes a metal, such as stainless steel. In this embodiment, the material of the damper 100 is 316L stainless steel.
The damper 100 has a function of buffering pressure, and the damper 100 can buffer the impact of the external pressure impact on the corrugated diaphragm 140.
Referring to fig. 6, the damper 100 has a head hole 102 therein and a bottom hole 101 at the bottom of the head hole 102, and the caliber of the bottom hole 101 is smaller than that of the head hole 102.
In one embodiment, the head hole 102 has a diameter of 1.8mm to 2.2mm, for example 2mm, and the bottom hole 101 has a diameter of 0.5mm to 0.7mm, for example 0.6 mm.
Referring to fig. 6, the central axis of the bottom hole 101 is located on the side of the central axis of the head hole 102, that is, the central axis of the bottom hole 101 is offset from the central axis of the head hole 102, so that the impact of the airflow entering from the bottom hole 101 on the corrugated diaphragm 140 in the region directly above the pressure sensing chip 210 is small, and the impact on the pressure sensing chip 210 is also reduced. In a specific embodiment, the orthographic projection of the pressure sensing chip 210 on the third base 120 has no overlapping area with the bottom hole 101.
It should be noted that, in other embodiments, the central axis of the bottom hole and the central axis of the head hole coincide.
The damper 100 and the third base 120 are connected to each other by interference fit.
The first base 160, the second base 150, the pressure sensing chip 210, the corrugated diaphragm 140 and the pressure ring 130 are located in the third sinking groove; the convoluted diaphragm 140 is positioned between the sample inlet 121 and the first base 160.
The pressure sensor further includes: a housing 180 adapted to surround the sides of the printed circuit board unit and the sides of the N-core connector 190.
The housing 180 is coupled to the third base 120.
Another embodiment of the present invention further provides a method for manufacturing a pressure sensor, including:
forming a first base 160, wherein a first sinking groove 165 is formed in the top surface of the first base 160, a second sinking groove 165 is further formed in the first base 160, and the second sinking groove 165 is located at the bottom of the first sinking groove 165;
forming a second base 150, wherein the second base 150 is provided with a receiving groove 152;
providing a corrugated diaphragm 140 and a pressure sensing chip 210;
fixing the pressure sensing chip 210 in the accommodating groove 152;
securing the second base 150 in the second sink 165;
after the pressure sensing chip 210 is fixed in the receiving groove 152 and the second base 150 is fixed in the second sinking groove 165, the corrugated diaphragm 140 covers the first sinking groove 165 and is fixedly connected with the top surface of the first base 160 around the first sinking groove 165;
the bellows diaphragm 140 and the pressure sensing chip 210 are filled with pressure oil.
In one embodiment, the second base 150 has a smaller coefficient of thermal expansion than the first base 160.
In this embodiment, a second sinking groove 165 is formed in a portion of the first base 160 at the bottom of the first sinking groove 165.
In this embodiment, the step of covering the corrugated diaphragm 140 on the first sinking groove 165 and fixedly connecting the corrugated diaphragm 140 to the top surface of the first base 160 around the first sinking groove 165 includes welding the corrugated diaphragm 140 to the top surface of the first base 160 around the first sinking groove 165 by using a laser welding process or an argon arc welding process. The advantage of welding the corrugated diaphragm 140 and the top surface of the first base 160 around the first sinking groove 165 by using a laser welding process or argon arc welding process is that: the welding speed is fast, the depth is big, the deformation is little, welding strength is high, the welding outward appearance is level and smooth.
The first base 160 further has a first through hole 161a therein, and the first through hole 161a penetrates through the first base 160 at the bottom of the second sinking groove 166. The preparation method of the pressure sensor further comprises the following steps: providing a first conductive probe 161; positioning a portion of the first conductive probe 161 in the first through hole 161a, the portion of the first conductive probe 161 protruding from the bottom surface of the first base 160; filling a sintered material between the first conductive probe 161 and a sidewall surface of the first via 161 a; a sintering process is performed such that the sintered material forms a sintered layer 162.
The preparation method of the pressure sensor further comprises the following steps: providing a compression ring 130; the pressing ring 130 is arranged on one side of the corrugated diaphragm 140, which faces away from the first base 160, and is fixedly connected with the edge area of the corrugated diaphragm 140; the process of fixedly connecting the pressing ring 130 and the edge region of the corrugated diaphragm 140 includes a laser welding process or an argon arc welding process.
The preparation method of the pressure sensor further comprises the following steps: providing a third base 120, wherein the third base 120 has a sample inlet 121 and a third sink, and the third sink is located at the bottom of the sample inlet 121 and is communicated with the sample inlet 121; arranging the first base 160, the second base 150, the pressure sensing chip 210, the corrugated diaphragm 140 and the pressure ring 130 in the third sinking groove; the corrugated diaphragm 140 is located between the sample inlet 121 and the first base 160; providing a damper 100; the damper 100 is disposed in a port of the sample inlet hole 121 on a side facing away from the third sinking groove.
The preparation method of the pressure sensor further comprises the following steps: providing an N-core connector 190, wherein N is an integer greater than or equal to 1; providing a printed circuit board unit comprising: a first printed circuit board 171 and a second printed circuit board 172, wherein a first conductive connector is fixedly connected to one side surface of the first printed circuit board 171, and a second conductive connector is fixedly connected to one side surface of the second printed circuit board 172; fixedly connecting the N-core connector 190 to the second printed circuit board 172, the second printed circuit board 172 being positioned between the second conductive connection and the N-core connector 190; fixedly connecting one end of the first conductive probe extending out of the first base with the first printed circuit board, wherein the first printed circuit board is positioned between the first conductive probe and the first conductive connecting piece; and inserting the second conductive connecting piece with the first conductive connecting piece.
The preparation method of the pressure sensor further comprises the following steps: providing a housing 180; before the first base 160, the second base 150, the pressure sensing chip 210, the corrugated diaphragm 140 and the press ring 130 are disposed in the third sinker, the ring 180 is wrapped around the side of the printed circuit board unit and the side of the N-core connector 190; the housing 180 is coupled to the third base 120 in the process of disposing the first base 160, the second base 150, the pressure sensing chip 210, the bellows 140, and the pressing ring 130 in the third sink.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (19)
1. A pressure sensor, comprising:
the top surface of the first base is provided with a first sinking groove, the first base is also provided with a second sinking groove, and the second sinking groove is positioned at the bottom of the first sinking groove;
the second base is internally provided with an accommodating groove for accommodating the pressure sensing chip and is positioned in the second sinking groove;
the corrugated membrane covers the first sinking groove and is fixedly connected with the top surface of the first base around the first sinking groove;
and a filling space for filling transmission oil is formed between the corrugated diaphragm and the accommodating groove.
2. The pressure sensor of claim 1, wherein the second base has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the first base.
3. The pressure sensor of claim 2, wherein the second base comprises a ceramic base; the first base comprises a stainless steel base.
4. The pressure sensor according to claim 1, wherein the second base is adhered to the inner wall surface of the second sinking groove through a first adhesive layer; the pressure sensing chip is adhered to the inner wall surface of the accommodating groove through a second adhesive layer; the strength of the second adhesive layer is less than that of the first adhesive layer.
5. The pressure sensor of claim 1, wherein the first base further has a first through hole therein, the first through hole penetrating the first base at the bottom of the second sink;
the pressure sensor further includes: a first conductive probe, a portion of the first conductive probe being located in the first through hole, a portion of the first conductive probe protruding from a bottom surface of the first base; a sintered layer in the first via and surrounding a sidewall of the first conductive probe; and the conductive connecting line is connected with one end, facing the corrugated diaphragm, of the first conductive probe and the pressure sensing chip.
6. The pressure sensor of claim 5, further comprising: a printed circuit board unit; an N-core connector connected to one side of the printed circuit board unit, the printed circuit board unit being located between the N-core connector and the first base; n is an integer greater than or equal to 1;
the first conductive probe is connected with the printed circuit board unit.
7. The pressure sensor of claim 6, wherein the printed circuit board unit comprises: the first printed circuit board and the second printed circuit board are oppositely arranged and spaced; the first conductive connecting piece is fixedly connected with one side surface of the first printed circuit board facing the second printed circuit board; the second conductive connecting piece is fixedly connected with one side surface of the second printed circuit board facing the first printed circuit board; the second conductive connecting piece is electrically connected with the first conductive connecting piece;
the first printed circuit board is located between the second printed circuit board and the first base, and the first conductive probe is connected with the first printed circuit board.
8. The pressure sensor of claim 7, wherein the first conductive connector has a first socket therein, the second conductive connector being adapted to be inserted into the first socket; alternatively, the second conductive connector has a second socket therein, and the first conductive connector is adapted to be inserted into the second socket.
9. The pressure sensor of claim 1, wherein the second sinker is located in a portion of the first base at the bottom of the first sinker; the first base is internally provided with an oil injection channel communicated with the first sinking groove, and the oil injection channel is positioned at the side part of the second sinking groove and at the bottom of the first sinking groove;
the pressure sensor further includes: the sealing element is positioned in the first base on one side, facing away from the first sunken groove, of the oil injection channel.
10. The pressure sensor of claim 1, further comprising: the pressing ring is located on one side, back to the first base, of the corrugated diaphragm and fixedly connected with the edge area of the corrugated diaphragm.
11. The pressure sensor of claim 10, further comprising: the third base is provided with a sample inlet hole and a third sinking groove, and the third sinking groove is positioned at the bottom of the sample inlet hole and is communicated with the sample inlet hole; the damper is positioned in a port of the sampling hole, which is opposite to one side of the third sinking groove;
the first base, the second base, the pressure sensing chip, the corrugated diaphragm and the pressure ring are positioned in the third sinking groove; the convoluted diaphragm is positioned between the sample entry well and the first base.
12. The pressure sensor of claim 11, wherein the damper has a head hole therein and a bottom hole at the bottom of the head hole, the bottom hole having a smaller diameter than the head hole, and a central axis of the bottom hole being located on a side of the central axis of the head hole.
13. The pressure sensor of claim 1, wherein the corrugated diaphragm comprises a stainless steel corrugated diaphragm having a thickness of 0.01mm to 0.09 mm.
14. A method of making a pressure sensor, comprising:
forming a first base, wherein a first sinking groove is formed in the top surface of the first base, a second sinking groove is further formed in the first base, and the second sinking groove is located at the bottom of the first sinking groove;
forming a second base, wherein the second base is provided with an accommodating groove;
providing a corrugated diaphragm and a pressure sensing chip;
fixing the pressure sensing chip in the accommodating groove;
fixing the second base in the second sink;
after the pressure sensing chip is fixed in the accommodating groove and the second base is fixed in the second sinking groove, the corrugated diaphragm covers the first sinking groove and is fixedly connected with the top surface of the first base around the first sinking groove;
and filling transmission oil between the corrugated diaphragm and the pressure sensing chip.
15. The method for manufacturing a pressure sensor according to claim 14, wherein the step of covering the corrugated diaphragm on the first sinking groove and fixedly connecting the corrugated diaphragm to the top surface of the first base around the first sinking groove comprises welding the corrugated diaphragm to the top surface of the first base around the first sinking groove by a laser welding process or an argon arc welding process.
16. The method for manufacturing a pressure sensor according to claim 14, wherein the first base further has a first through hole therein, and the first through hole penetrates through the first base located at the bottom of the second sinking groove;
the preparation method of the pressure sensor further comprises the following steps: providing a first conductive probe; positioning a part of the first conductive probe in the first through hole, wherein the part of the first conductive probe protrudes out of the bottom surface of the first base; filling a sintering material between the first conductive probe and a sidewall surface of the first via; and carrying out a sintering process to enable the sintering material to form a sintering layer.
17. The method of manufacturing a pressure sensor according to claim 14, further comprising: providing a compression ring; the pressing ring is arranged on one side, back to the first base, of the corrugated diaphragm and fixedly connected with the edge area of the corrugated diaphragm;
the process for fixedly connecting the pressure ring and the edge area of the corrugated diaphragm comprises a laser welding process or an argon arc welding process.
18. The method of manufacturing a pressure sensor according to claim 17, further comprising:
providing a third base, wherein the third base is provided with a sample inlet hole and a third heavy groove, and the third heavy groove is positioned at the bottom of the sample inlet hole and is communicated with the sample inlet hole;
arranging the first base, the second base, the pressure sensing chip, the corrugated diaphragm and the pressure ring in the third sinking groove, wherein the corrugated diaphragm is positioned between the sample inlet and the first base;
providing a damper; and arranging the damper in a port of the sampling hole, which is back to one side of the third sinking groove.
19. The method of manufacturing a pressure sensor according to claim 16, further comprising:
providing an N-core connector, wherein N is an integer greater than or equal to 1;
providing a printed circuit board unit comprising: the circuit board comprises a first printed circuit board and a second printed circuit board, wherein one side surface of the first printed circuit board is fixedly connected with a first conductive connecting piece, and one side surface of the second printed circuit board is fixedly connected with a second conductive connecting piece;
fixedly connecting the N-core connector with the second printed circuit board, wherein the second printed circuit board is positioned between the second conductive connecting piece and the N-core connector;
fixedly connecting one end of the first conductive probe extending out of the first base with the first printed circuit board, wherein the first printed circuit board is positioned between the first conductive probe and the first conductive connecting piece;
and inserting the second conductive connecting piece with the first conductive connecting piece.
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Application publication date: 20211026 |