CN113540055A - Electronic device and method for manufacturing the same - Google Patents

Electronic device and method for manufacturing the same Download PDF

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Publication number
CN113540055A
CN113540055A CN202010331962.0A CN202010331962A CN113540055A CN 113540055 A CN113540055 A CN 113540055A CN 202010331962 A CN202010331962 A CN 202010331962A CN 113540055 A CN113540055 A CN 113540055A
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CN
China
Prior art keywords
module
circuit board
flexible circuit
electronic device
antenna
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Pending
Application number
CN202010331962.0A
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Chinese (zh)
Inventor
蔡文荣
邱志贤
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Siliconware Precision Industries Co Ltd
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Siliconware Precision Industries Co Ltd
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Publication date
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Publication of CN113540055A publication Critical patent/CN113540055A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

An electronic device and its manufacturing method, it connects and puts antenna module and encapsulation module on a flexible breadboard, make the antenna module can be set up in the chassis of the electronic product near according to the signal strength demand, so the disposition of the flexible breadboard is not limited by position of the antenna module, therefore the design of other assemblies in the inside of the electronic product will not be limited by space, make the electronic product can meet the function preserved according to the demand.

Description

Electronic device and method for manufacturing the same
Technical Field
The present invention relates to an electronic device, and more particularly, to an electronic device with an antenna module and a method for manufacturing the same.
Background
With the rapid development of the electronic industry, electronic products are also gradually moving toward multi-function and high-performance. Currently, the fourth generation (4G) wireless transmission communication technology is widely applied to various consumer electronic products to receive or transmit various wireless signals.
However, as wireless communication is rapidly developed and network resource flow is becoming huge, the required wireless transmission bandwidth is also becoming larger, so the development of the fifth generation (5G) of wireless transmission is in a trend.
Fig. 1 is a perspective view of a conventional wireless communication device. As shown in fig. 1, the wireless communication device 1 includes: a circuit board 10 configured with electronic components 11, a plurality of chip components 16 disposed on the circuit board 10, an antenna element 12 and a package 13. The chip component 16 is disposed on the circuit board 10 and electrically connected to the circuit board 10. The antenna element 12 is electrically connected to the chip element 16 by a transmission line 17. The package 13 covers the chip element 16 and the portion of the transmission line 17.
However, in the conventional wireless communication device 1, since the antenna element 12 for 5G is required to be disposed near the housing of the portable electronic product in order to enhance the signal strength, the space for disposing the antenna element 12 is limited, and thus the miniaturization requirement of the wireless communication device 1 needs to be further satisfied; in addition, how the wireless communication device 1 disposed near the housing electrically communicates with other components (such as a motherboard) disposed inside the portable electronic product at the center is also a problem to be solved.
Therefore, how to overcome the above problems of the prior art has become a problem to be overcome in the industry.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides an electronic device and a method for manufacturing the same, which can prevent the flexible circuit board from being limited by the position of the antenna module.
The electronic device of the present invention includes: the packaging module comprises at least one electronic element and is provided with a first side and a second side which are opposite, and the first side is defined with an action area and an external area which are not overlapped; the antenna module is electrically connected with the active area of the packaging module through at least one conductive element, and an air gap is generated between the first side of the packaging module and the antenna module; the flexible circuit board is connected with the external connection area of the packaging module; and the connector is arranged on the flexible circuit board.
The invention also provides a method for manufacturing the electronic device, which comprises the following steps: providing a packaging module comprising at least one electronic element, an antenna module, a flexible circuit board and a connector, wherein the packaging module is provided with a first side and a second side which are opposite, and the first side is defined with an action area and an external area which are not overlapped; and electrically connecting the antenna module with the active region of the packaging module through at least one conductive element to generate an air gap between the first side of the packaging module and the antenna module, connecting the flexible circuit board with the external region of the packaging module, and arranging the connector on the flexible circuit board.
In the electronic device and the manufacturing method thereof, the antenna module is of a flexible structure or a non-flexible structure.
In an embodiment of the present invention, the antenna module is overlapped on the flexible circuit board or staggered with the flexible circuit board at the viewing angle of the first side.
In an embodiment of the present invention, the flexible circuit board has a first bonding portion and a second bonding portion disposed at two opposite ends of the flexible circuit board, so that the flexible circuit board is bonded to the external connection region of the package module by the first bonding portion, and the second bonding portion is used for bonding the connector.
In the electronic device and the manufacturing method thereof, the steps of configuring the package module, the antenna module, the flexible circuit board and the connector include: arranging the connector and the packaging module on the flexible circuit board; and then the antenna module is arranged on the active area of the packaging module.
In the electronic device and the manufacturing method thereof, the steps of configuring the package module, the antenna module, the flexible circuit board and the connector include: arranging the connector on the flexible circuit board, and arranging the antenna module on the active area of the packaging module; and then arranging the flexible circuit board on the outer connection area of the packaging module.
In an embodiment of the electronic device and the manufacturing method thereof, the flexible circuit board overlaps the active area of the package module at the viewing angle of the first side, and the flexible circuit board is formed with at least one opening, so that the conductive element passes through the opening to connect the antenna module and the package module. For example, the steps of configuring the package module, the antenna module and the flexible circuit board include: forming the opening on the flexible circuit board; then, the antenna module is arranged on the flexible circuit board so as to be configured corresponding to the opening; and then connecting the package module to the antenna module by disposing the conductive element through the opening. Further, the number of the openings corresponds to the number of the signal contacts of the antenna module.
The electronic device and the manufacturing method thereof further include a functional module disposed on the flexible circuit board. For example, the steps of configuring the package module, the antenna module, the flexible circuit board and the functional module include: arranging the antenna module and the functional module on the flexible circuit board; and then the packaging module is arranged on the flexible circuit board. Or the flexible circuit board is provided with a first combining part and a second combining part which are arranged at two opposite ends of the flexible circuit board, so that the first combining part is used for the flexible circuit board to combine the functional module, the second combining part is used for combining the connector, and the packaging module and/or the antenna module are/is positioned between the first combining part and the second combining part. Further, the functional module has an antenna structure.
Therefore, compared with the prior art, when the antenna module is close to the housing of the electronic product, the configuration of the flexible circuit board is not limited by the position of the antenna module, so that the design of other components in the electronic product is not limited by space, and the electronic product can meet the preset function according to the requirement.
In addition, the connector is arranged on the flexible circuit board, so that the size of a die used by the packaging manufacturing method only needs to be matched with the volumes of the antenna module and the packaging module, and the connector does not need to be packaged.
Drawings
Fig. 1 is a perspective view of a conventional wireless communication device.
Fig. 2A to 2C are schematic cross-sectional views illustrating a method for manufacturing an electronic device according to a first embodiment of the invention.
FIG. 2C' is a schematic cross-sectional view of another embodiment of FIG. 2C.
Fig. 2D, 2D' and 2D ″ are schematic cross-sectional views of different embodiments of subsequent applications of fig. 2C.
Fig. 3A to 3B are schematic cross-sectional views illustrating a method for manufacturing an electronic device according to a second embodiment of the invention.
Fig. 4A to 4C are schematic cross-sectional views illustrating a method for manufacturing an electronic device according to a third embodiment of the invention.
Fig. 4A' is a partial top view of fig. 4A.
Fig. 4C' is another embodiment of fig. 4C.
FIG. 4D is a schematic cross-sectional view of an embodiment of a subsequent application of FIG. 4C.
Description of the reference numerals
1 Wireless communication device 10 circuit board
11 electronic component 12 antenna element
13 Package 16 chip component
17 transmission line 2,3,4 electronic device
2a encapsulation module 2b,3b antenna module
20 bearing part 20a first side
20b second side 200 insulating layer
201 wiring layer 21, 21' electronic component
21a active surface 21b inactive surface
210 electrode pads 211,212 protective film
22 conductive bump 23 die attach layer
24 cladding 24' shielding structure
25,45 flexible circuit board 25a,45a first surface
25b,45b second surface 251,451,451' first junction
252,452 second mating portion 26 connector
27,47 conductive element 28, 28' antenna substrate
280 antenna main layer 281 signal contact
282 electrical contact 4b functional module
450 opening 480 antenna structure
8 adaptor 80 circuit intermediate plate
81 first transfer port 82 second transfer port
9 electronic product 9a shell
900 connecting port of 90 host board
91 support frame A action zone
Air gap of B outer connection region t
250 electrical conductors.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings attached to the present specification are only used for matching with the disclosure of the present specification for understanding and reading of the present invention, and are not used for limiting the conditions of the present invention, so they have no technical significance, and any structural modifications, ratio relationship changes or size adjustments should fall within the scope of the present invention without affecting the function and the achievable purpose of the present invention. In addition, the terms "above", "first", "second" and "a" as used in the present specification are for clarity of description only, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention unless otherwise specified.
Fig. 2A to 2C are schematic cross-sectional views illustrating a method for manufacturing an electronic device 2 according to a first embodiment of the invention.
As shown in fig. 2A, a package module 2A (a plurality of electronic components 21, 21' are illustrated in the present embodiment) including at least one electronic component 21 is provided, wherein the package module 2A has a first side 20a and a second side 20B opposite to each other, and the first side 20a defines an active region a and an external region B that are not overlapped with each other.
In the present embodiment, the package module 2a further includes a carrier 20, such as a circuit structure or a substrate structure, located on the first side 20a for configuring the electronic components 21, 21', the substrate structure is a core layer type or a coreless layer type, for example, a package substrate (substrate) having a core layer and a circuit structure or a coreless layer (core) circuit substrate structure, and the carrier 20 has at least one insulating layer 200 and a circuit layer 201, such as a redistribution layer (RDL), disposed on the insulating layer 200. For example, the circuit layer 201 is made of copper, and the insulating layer 200 is made of a dielectric material such as Polyoxadiazole (PBO), Polyimide (PI), or Prepreg (PP). It should be understood that the carrier 20 may be other carrier units for carrying electronic devices such as chips, such as lead frame (leadframe) or silicon interposer (silicon interposer), but is not limited thereto.
In addition, the electronic component 21,21 'is an active component, such as a semiconductor chip (e.g., the electronic component 21), a passive component, or a combination thereof, and the passive component (e.g., the electronic component 21') is, for example, a resistor, a capacitor, or an inductor. Specifically, the semiconductor chip has an active surface 21a and an inactive surface 21b opposite to each other, the electronic component 21 is combined with a die bonding layer 23 for a manufacturing method by the inactive surface 21b, and the active surface 21a has a plurality of electrode pads 210, and conductive bumps 22 and protective films 211 and 212 (for example, two protective films in the embodiment, but not for limiting the number of layers of the protective films) covering the electrode pads 210 and the conductive bumps 22 are formed on the electrode pads 210, wherein the protective films 211 and 212 are, for example, poly-p-diazole (PBO), and the conductive bumps 22 are, for example, conductive traces, spherical balls of solder balls, or pillars of metal materials such as copper pillars and solder bumps, or nails (stud) made by a wire bonding machine.
In addition, the package module 2a further includes a coating layer 24 formed on the carrier portion 20 and located on the second side 20b, which coats the electronic elements 21, 21'. For example, the coating layer 24 is an insulating material, such as Polyimide (PI), dry film (dry film), epoxy resin (epoxy), or molding compound (molding compound), and may be formed on the carrier portion 20 by pressing or molding.
It should be understood that the type of the package module 2a can be implemented in many ways, such as flip-chip, wire-bonding or other package types, or even other devices (such as the shielding structure 24 'shown in fig. 2C') are not limited to the above.
As shown in fig. 2B, a flexible circuit board 25 is connected to the external connection area B of the package module 2a, and at least one connector 26 is disposed on the flexible circuit board 25.
In the embodiment, the flexible circuit board 25 is a flexible circuit board, which can be bent as required and electrically connected to the package module 2 a. The flexible circuit board 25 is bonded to the external connection area B of the package module 2a through a conductive body 250 such as solder material (e.g., solder ball), so that the flexible circuit board 25 is electrically connected to the circuit layer 201 of the package module 2 a. Specifically, the flexible circuit board 25 has a first surface 25a and a second surface 25b opposite to each other, the first surface 25a is disposed on the first side 20a of the package module 2a, and the second surface 25b is disposed on the connector 26, that is, the connector 26 and the package module 2a are located on different sides relative to the flexible circuit board 25. It should be understood that the connector 26 and the package module 2a may also be located on the same side (as the position of the connector 26 shown in fig. 4C) with respect to the flexible circuit board 25.
In addition, the flexible circuit board 25 is, for example, a long sheet, and has a first combining portion 251 and a second combining portion 252 opposite to each other in the longitudinal direction, so that the first combining portion 251 is combined with the external connection region B of the package module 2a, and the second combining portion 252 is combined with the connector 26.
In addition, as shown in fig. 2D, the connector 26 is used to electrically connect to a connection port 900 of a motherboard 90 in an electronic product 9 (e.g., a smart phone). For example, in the manufacturing method, the connector 26 may be disposed on the second surface 25b of the second combining portion 252 of the flexible circuit board 25, and the package module 2a may be disposed on the first surface 25a of the first combining portion 251 of the flexible circuit board 25. It should be understood that the type of the connector 26 is various and is not limited, and the way of connecting the flexible circuit board 25 is not limited.
It should be understood that the flexible circuit board 25 may be designed as desired, and is not particularly limited.
As shown in fig. 2C, an antenna module 2b is disposed on the first side 20a of the package module 2a through at least one conductive element 27 such as a solder ball to electrically connect to the circuit layer 201 of the active area a of the package module 2a, and an air gap t is formed between the first side 20a of the package module 2a and the antenna module 2 b.
In the present embodiment, the antenna module 2b includes an antenna substrate 28, and the main body thereof is, for example, a package substrate (substrate) having a core layer and a circuit structure or a circuit structure without a core layer (core). For example, the antenna substrate 28 forms a plurality of antenna main layers 280 and at least one signal contact 281 on a dielectric material, so as to combine the conductive elements 27 through the signal contact 281. It should be understood that the antenna module 2b can be configured with relevant elements on the antenna substrate 28 according to the requirement, and is not particularly limited.
In addition, the antenna module 2b is a non-flexible structure. Alternatively, the antenna module 2b is a flexible structure (e.g. a bent structure as shown in fig. 2C '), which enables the antenna substrate 28' to be arbitrarily adjusted in bending angle according to the requirement, so as to not only match the structural configuration in the electronic product 9 (e.g. a smart phone), but also adjust and change the signal transmission direction of the antenna main layer 280.
In addition, the antenna module 2b overlaps the first combining portion 251 of the flexible circuit board 25 under the viewing angle of the first side 20 a. For example, the antenna substrate 28 extends to the external connection region B of the package module 2 a. Therefore, the electronic device 2 can reduce the overall volume (e.g., width) of the electronic product 9 by the design of overlapping the flexible circuit board 25 in the direction (e.g., up and down direction) perpendicular to the first side 20a through the antenna module 2b, so as to achieve the requirement of miniaturization.
It should be understood that the antenna module 2b is not limited to the above description, but may be of various types.
In a subsequent application, as shown in fig. 2D, the connector 26 is connected to the connection port 900 of the motherboard 90 of the electronic product 9, so that the electronic device 2 is electrically connected to the motherboard 90, and the electronic device 2 is integrally configured in the electronic product 9.
Understandably, the electronic device 2 can be arranged according to the internal space condition of the electronic product 9. For example, when the motherboard 90 of the electronic product 9 is far from the electronic device 2, as shown in fig. 2D', the connector 26 and the connection port 900 are electrically connected through a connector 8, wherein the connector 8 is, for example, a dual-head connection assembly having a circuit interposer 80, a first connection port 81 disposed on the circuit interposer 80 and electrically connected to the connector 26, and a second connection port 82 disposed on the circuit interposer 80 and electrically connected to the connection port 900. Alternatively, when the internal space of the electronic product 9 is narrow, the flexible circuit board 25 may be bent, and the orientation of the first combining portion 251 and the orientation of the second combining portion 252 form an included angle of about 90 degrees (but the included angle may be arbitrarily adjusted, but not limited thereto), as shown in fig. 2D ″, so as to facilitate the design of other components of the electronic product 9, wherein the package module 2a and/or the antenna module 2b may be fixed in the electronic product 9 by a support frame 91.
Fig. 3A to 3B are schematic cross-sectional views illustrating a method for manufacturing an electronic device 3 according to a second embodiment of the invention. The main difference between this embodiment and the first embodiment is the configuration of the antenna module and the steps of the manufacturing method thereof, and other components are substantially the same, so the same parts will not be described again.
As shown in fig. 3A, the antenna module 3b is first disposed on the active area a of the package module 2 a.
In the present embodiment, the antenna module 3B does not extend to the external connection region B. For example, the antenna substrate 28 does not extend over the outer region B of the package module 2 a.
As shown in fig. 3B, the flexible circuit board 25 with the connector 26 is then disposed on the external connection area B of the package module 2a, so that the antenna module 3B is staggered (not overlapped) with the flexible circuit board 25.
Therefore, compared to the manufacturing of the electronic device 2 of the first embodiment, the electronic device 3 of this embodiment has the design that the antenna module 3B is staggered (not overlapped) with respect to the flexible circuit board 25, so that the step of "soldering the flexible circuit board 25 to the external connection area B of the package module 2 a" in the manufacturing process is more flexible than that of the first embodiment, and the electronic device 2 of the first embodiment can only perform the manufacturing of the step in a package factory because the antenna module 2B overlaps the flexible circuit board 25 in a direction (such as up and down directions) perpendicular to the first side 20a, and the manufacturing process can be performed in the package factory, a system assembly factory, or other manufacturers, so that the flexibility of the manufacturing method can be increased, and the cost of the electronic product 9 can be reduced.
Fig. 4A to 4D are schematic cross-sectional views illustrating a method for manufacturing an electronic device 4 according to a third embodiment of the invention. The main difference between this embodiment and the first embodiment is the configuration of the flexible circuit board and the steps of the manufacturing method thereof, and other components are substantially the same, so the same parts will not be described again.
As shown in fig. 4A, a flexible circuit board 45 having at least one opening 450 is provided, the conductive element 27 is formed on the signal contact 281 of the antenna module 2b, and a plurality of conductive elements 47 such as solder balls are formed on other electrical contacts 282, the antenna module 2b is electrically connected to the flexible circuit board 45 through the plurality of conductive elements 47 such as solder balls, and the conductive element 27 passes through the opening 450, so that the antenna module 2b is disposed corresponding to the opening 450, and the signal contact 281 of the antenna module 2b corresponds to the opening 450.
In the present embodiment, the openings 450 communicate the first surface 45a and the second surface 45b of the flexible circuit board 45, and the number of the openings 450 corresponds to the number of the signal contacts 281 of the antenna module 2b, such as the two openings 450 shown in fig. 4A'.
In addition, the opening 450 is located between the first combining portion 451 and the second combining portion 452 of the flexible circuit board 45, so that the antenna module 2b is disposed between the first combining portion 451 and the second combining portion 452.
In addition, at least one functional module 4b may be disposed on the second surface 45b of the first combining portion 451 of the flexible circuit board 45. For example, the functional module 4b has an antenna structure 480. Specifically, the functional module 4b is configured with the antenna structure 480 in the form of an antenna board (e.g., the antenna substrate 28), and the functional module 4b is electrically connected to the flexible circuit board 45 through a plurality of conductive elements 47, such as solder balls. It should be understood that the functional module 4b can be configured with the required functions according to the requirement, and is not limited to the antenna function.
As shown in fig. 4B, the circuit layer 201 of the first side 20a of the package module 2a is combined with the conductive elements 27 in the openings 450, so that the package module 2a is disposed on the first surface 45a of the flexible circuit board 45, the package module 2a is electrically connected to the flexible circuit board 45 through the conductor 250, the package module 2a is electrically connected to the antenna module 2B, and a portion of the flexible circuit board 45 overlaps the active area a of the package module 2 a.
In this embodiment, the package module 2a and/or the antenna module 2b are located between the first combining portion 451 and the second combining portion 452 of the flexible circuit board 45.
In addition, an air gap t is formed between the package module 2a and the antenna module 2b, and the openings 450 are located in the area of the air gap t.
Therefore, through the design of the opening 450, the conductive element 27 does not contact the flexible circuit board 45, so that the package module 2a can be directly electrically connected to the antenna module 2b through the conductive element 27 to avoid the occurrence of electrical loss (loss) when the transmission signal passes through the flexible circuit board 45, thereby enhancing the stability of the antenna signal and increasing the transmission speed.
As shown in fig. 4C, the connector 26 is disposed on the second combining portion 452 of the flexible circuit board 45.
In this embodiment, the connector 26 is connected to the first surface 45a of the flexible circuit board 45, that is, the connector 26 and the package module 2a are located on the same side of the flexible circuit board 45. In other embodiments, the connector 26 and the package module 2a are located on different sides (as shown in the position of the connector 26 shown in fig. 2C) relative to the flexible circuit board 45. Further, regardless of the position of the connector 26, the connector 26 can be mounted on the flexible circuit board 45 together with the components (such as the package module 2a or the antenna module 2b) on the same side as the connector 26.
It should be understood that the functional module 4b can be omitted as required, such that the first connecting portion 451 'of the flexible circuit board 45 only extends to the lower side of the active region a and does not protrude out of the side surface of the package module 2a, as shown in fig. 4C'.
In addition, the flexible circuit board 45 can be bent, and the orientation of the first combining portion 451 and the orientation of the second combining portion 452 form an included angle of about 90 degrees (but the included angle can be arbitrarily adjusted, but not limited thereto), as shown in fig. 4D, so that the position of the functional module 4b can be arbitrarily adjusted as required, and not only can be matched with the structural configuration in the electronic product 9 (such as a smart phone), but also the signal transmitting direction of the antenna structure 480 can be adjusted and changed.
Therefore, the electronic device 2,3,4 of the present invention mainly uses the design of the flexible circuit board 25,45 to electrically connect the antenna module 2b,3b and the package module 2a to the motherboard 90 of the system end, so that the antenna module 2b,3b (or the functional module 4b) can be disposed near the housing 9a of the electronic product 9 according to the signal strength and/or angle requirement (as shown in fig. 2D "or fig. 4D), so compared with the prior art, when the position of the antenna module 2b,3b (or the functional module 4b) is close to the housing 9a of the electronic product 9, the electrical connection between the antenna module 2b,3b and the package module 2a and the motherboard 90 of the system end is not limited by the position of the antenna module 2b,3b (or the functional module 4b) through the design of the flexible circuit board 25,45, therefore, the design of other components (such as the motherboard 90) inside the electronic product 9 is not limited by space, so that the electronic product 9 can satisfy the predetermined function according to the requirement.
In addition, the number of the antenna modules 2b and 3b (or the functional modules 4b) on the flexible circuit boards 25 and 45 can be adjusted according to the requirement, and even the antenna module 2b adopts a flexible structure (such as the antenna substrate 28 'shown in fig. 2C'), so that the angle of the antenna emission direction can be adjusted according to the requirement of the electronic product 9, thereby improving the strength of the antenna signal.
In addition, by disposing the connector 26 on the flexible circuit board 25,45, the size of the mold used in the package manufacturing method only needs to be matched with the volume of the antenna module 2b,3b and the package module 2a, and does not need to consider the package of the connector 26, i.e. the antenna module 2b,3b and/or the package module 2a does not need to accommodate the connector 26, so compared with the prior art, the electronic device 2,3,4 of the present invention can effectively reduce the volume of the antenna module 2b,3b and the package module 2a, so as to improve the utilization rate of the internal space of the system end (or the electronic product 9) and reduce the packaging cost (e.g. the connector 26 does not need to be packaged).
In addition, the antenna modules 2b and 3b and the package module 2a are directly electrically connected through the conductive element 27 without passing through the flexible circuit boards 25 and 45, so that the electrical connection paths between the antenna modules 2b and 3b and the package module 2a have no other interference medium (such as air gap t), and thus the electronic devices 2,3 and 4 of the present invention can avoid the generation of electrical loss (loss) when the transmission signals pass through the flexible circuit boards 25 and 45, thereby enhancing the stability of the antenna signals and increasing the transmission speed.
The present invention also provides an electronic package 2,3,4 comprising: a package module 2a, an antenna module 2b,3b, a flexible circuit board 25,45 and at least one connector 26.
The package module 2a has a first side 20a and a second side 20B opposite to each other, and the first side 20a defines an active area a and an external area B that are not overlapped with each other, wherein the package module 2a includes at least one electronic component 21, 21'.
The antenna modules 2b and 3b are electrically connected to the active area a of the package module 2a through at least one conductive element 27, and an air gap t is formed between the first side 20a of the package module 2a and the antenna modules 2b and 3 b.
The flexible circuit boards 25 and 45 are connected to the external connection area B of the package module 2 a.
The connector 26 is disposed on the flexible circuit boards 25 and 45.
In one embodiment, the antenna modules 2b and 3b are flexible structures or non-flexible structures.
In one embodiment, the antenna modules 2b and 3b are overlapped or staggered with respect to the view angle of the first side 20a of the flexible circuit board 25.
In one embodiment, the flexible circuit board 25 has a first combining portion 251 and a second combining portion 252 disposed at two opposite ends thereof, so that the first combining portion 251 is combined with the external connection region B of the package module 2a, and the second combining portion 252 is combined with the connector 26.
In an embodiment, the flexible circuit board 45 overlaps the active area a of the package module 2a at the view angle of the first side 20a, and the flexible circuit board 45 is formed with at least one opening 450, so that the conductive element 27 passes through the opening 450 to connect the antenna module 2b and the package module 2 a. For example, the number of the openings 450 corresponds to the number of the signal contacts 281 of the antenna module 2 b.
In an embodiment, the electronic device 4 further includes at least one functional module 4b disposed on the flexible circuit board 45. For example, the flexible circuit board 45 has a first combining portion 451 and a second combining portion 452 disposed at two opposite ends thereof, so that the first combining portion 451 is combined with the functional module 4b, and the second combining portion 452 is combined with the connector 26, so that the package module 2a and/or the antenna module 2b is located between the first combining portion 451 and the second combining portion 452. Further, the functional module 4b has an antenna structure.
In summary, according to the electronic device and the manufacturing method thereof of the present invention, the antenna module can be disposed near the housing of the electronic product according to the signal strength requirement through the design of the flexible circuit board, so the configuration of the flexible circuit board is not limited by the position of the antenna module, and the design of other components inside the electronic product is not limited by space, so that the electronic product can satisfy the predetermined function according to the requirement.
In addition, the connector is arranged on the flexible circuit board, so that the size of a mould used by the packaging manufacturing method only needs to be matched with the volumes of the antenna module and the packaging module, and the connector does not need to be packaged, therefore, the electronic device can effectively reduce the volumes of the antenna module and the packaging module, improve the utilization rate of the internal space of a system end (or the electronic product) and reduce the packaging cost.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above-described embodiments without departing from the spirit and scope of the present invention. The scope of the invention is therefore indicated by the appended claims.

Claims (22)

1. An electronic device, comprising:
the packaging module comprises at least one electronic element and is provided with a first side and a second side which are opposite, and the first side is defined with an action area and an external area which are not overlapped;
the antenna module is electrically connected with the active area of the packaging module through at least one conductive element, and an air gap is formed between the first side of the packaging module and the antenna module;
a flexible circuit board which is combined to the external connection area of the packaging module and is electrically connected with the packaging module; and
the connector is arranged on the flexible circuit board.
2. The electronic device of claim 1, wherein the antenna module is of a flexible structure or a non-flexible structure.
3. The electronic device of claim 1, wherein the antenna module is stacked on the flexible circuit board or staggered with the flexible circuit board at the viewing angle of the first side.
4. The electronic device of claim 1, wherein the flexible circuit board has a first bonding portion and a second bonding portion disposed at opposite ends thereof, so that the flexible circuit board is bonded to the external connection region of the package module via the first bonding portion, and the second bonding portion is used for bonding the connector.
5. The electronic device of claim 1, wherein the flexible circuit board overlaps the active area of the package module at the viewing angle of the first side, and the flexible circuit board has at least one opening, so that the conductive element passes through the opening to connect the antenna module and the package module.
6. The electronic device of claim 5, wherein the number of openings corresponds to the number of signal contacts of the antenna module.
7. The electronic device of claim 1, further comprising at least one functional module disposed on the flexible circuit board.
8. The electronic device of claim 7, wherein the flexible circuit board has a first coupling portion and a second coupling portion disposed at opposite ends thereof, such that the first coupling portion is used for the flexible circuit board to couple the functional module, and the second coupling portion is used for coupling the connector, and the package module and/or the antenna module is located between the first coupling portion and the second coupling portion.
9. The electronic device of claim 7, wherein the functional module has an antenna structure.
10. A method of manufacturing an electronic device, the method comprising:
providing a packaging module comprising at least one electronic element, an antenna module, a flexible circuit board and a connector, wherein the packaging module is provided with a first side and a second side which are opposite, and the first side is defined with an action area and an external area which are not overlapped; and
the antenna module is electrically connected with the active area of the packaging module through at least one conductive element, so that an air gap is generated between the first side of the packaging module and the antenna module, the flexible circuit board is connected with the external connection area of the packaging module, and the connector is arranged on the flexible circuit board.
11. The method for manufacturing an electronic device according to claim 10, wherein the antenna module is of a flexible structure or a non-flexible structure.
12. The method for manufacturing an electronic device according to claim 10, wherein the antenna module is stacked on the flexible circuit board or staggered with the flexible circuit board at the viewing angle of the first side.
13. The method for manufacturing an electronic device according to claim 10, wherein the flexible circuit board has a first bonding portion and a second bonding portion disposed at opposite ends thereof, so that the flexible circuit board is bonded to the external connection region of the package module by the first bonding portion, and the second bonding portion is used for bonding the connector.
14. The method for manufacturing an electronic device according to claim 10, wherein the steps of disposing the package module, the antenna module, the flexible circuit board and the connector comprise:
arranging the connector and the packaging module on the flexible circuit board; and
the antenna module is then disposed on the active area of the package module.
15. The method for manufacturing an electronic device according to claim 10, wherein the steps of disposing the package module, the antenna module, the flexible circuit board and the connector comprise:
arranging the connector on the flexible circuit board, and arranging the antenna module on the active area of the packaging module; and
and arranging the flexible circuit board on the outer connection area of the packaging module.
16. The method of claim 10, wherein the flexible circuit board overlaps the active area of the package module at the first side view angle, and the flexible circuit board has at least one opening for the conductive element to pass through to connect the antenna module and the package module.
17. The method for manufacturing an electronic device according to claim 16, wherein the steps of disposing the package module, the antenna module and the flexible circuit board comprise:
forming the opening on the flexible circuit board;
then, the antenna module is arranged on the flexible circuit board so as to be configured corresponding to the opening; and
the package module is then coupled to the antenna module by disposing the conductive element through the opening.
18. The method of claim 16, wherein the number of openings corresponds to the number of signal contacts of the antenna module.
19. The method for manufacturing an electronic device according to claim 10, further comprising disposing a functional module on the flexible circuit board.
20. The method for manufacturing an electronic device according to claim 19, wherein the steps of configuring the package module, the antenna module, the flexible circuit board and the functional module comprise:
arranging the antenna module and the functional module on the flexible circuit board; and
and then the packaging module is arranged on the flexible circuit board.
21. The method for manufacturing an electronic device according to claim 19, wherein the flexible circuit board has a first bonding portion and a second bonding portion disposed at opposite ends thereof, so that the first bonding portion is used for the flexible circuit board to bond the functional module, and the second bonding portion is used for bonding the connector, so that the package module and/or the antenna module is located between the first bonding portion and the second bonding portion.
22. The method for manufacturing an electronic device according to claim 19, wherein the functional module has an antenna structure.
CN202010331962.0A 2020-04-15 2020-04-24 Electronic device and method for manufacturing the same Pending CN113540055A (en)

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Publication number Priority date Publication date Assignee Title
DE112016007571T5 (en) * 2016-12-30 2019-10-24 Intel Corporation MICROELECTRONIC COMPONENTS DESIGNED WITH FLEXIBLE HOUSING SUBSTRATES WITH DISTRIBUTED STACKED ANTENNAS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS
CN109599370A (en) * 2017-09-30 2019-04-09 财团法人工业技术研究院 Flexible chip package
US11088468B2 (en) * 2017-12-28 2021-08-10 Samsung Electro-Mechanics Co., Ltd. Antenna module
KR102066903B1 (en) * 2018-07-03 2020-01-16 삼성전자주식회사 Antenna module
KR102089285B1 (en) * 2018-07-17 2020-03-16 삼성전자주식회사 Antenna module

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