CN108447829B - Package structure and its manufacturing method - Google Patents

Abstract

A packaging structure and a manufacturing method thereof are provided, wherein a covering part is connected to a bearing part to cover at least one electronic element on the bearing part, and the bearing part is combined to a metal frame by a plurality of conductive elements, so that the design of the covering part improves the heat dissipation efficiency of the packaging structure and provides an EMI shielding effect for the electronic element.

Description

Package structure and its manufacturing method

technical field

The present invention relates to a package structure, in particular to a stacked package structure and a manufacturing method thereof.

Background technique

With the vigorous development of portable electronic products in recent years, the development of various related products is also towards the trend of high density, high performance, light, thin, short and small. Therefore, the industry has developed various integrated multi-chip packages. In order to meet the requirements of light, thin, short and high density of electronic products.

FIG. 1 is a schematic cross-sectional view of a conventional semiconductor package structure 1 . As shown in FIG. 1 , the manufacturing method of the semiconductor package structure 1 includes arranging semiconductor elements 11 and passive elements 11 ′ on the upper and lower sides of a substrate 10 , and then encapsulating the semiconductor elements 11 and passive elements with encapsulant 14 . 11', and expose the contacts (I/O) 100 of the substrate 10 to the molding compound 14, and then form a plurality of solder balls 13 on the contacts 100, so that in the subsequent process, the semiconductor package structure 1. Connect an electronic device such as a circuit board or another circuit board through the solder balls 13 (not shown).

However, in the conventional semiconductor package structure 1, since the molding range of the encapsulant 14 is reduced to expose the contacts 100, a molding mold of a specific size needs to be used depending on the size of the semiconductor package structure 1, so a single molding The mold cannot be adapted to various sizes of the semiconductor package structure 1, thereby increasing the production cost.

In addition, the semiconductor elements 11 and the passive elements 11' are encapsulated in the encapsulant 14, so that the heat dissipation effect of the semiconductor elements 11 and the passive elements 11' is not good.

Therefore, how to overcome the above-mentioned various problems of the prior art has become an urgent problem to be solved at present.

SUMMARY OF THE INVENTION

In view of the above-mentioned deficiencies in the prior art, the present invention provides a package structure and a manufacturing method thereof, which can improve the heat dissipation efficiency of the package structure and provide an EMI shielding effect to the electronic component.

The packaging structure of the present invention includes: a carrier; an electronic element, which is connected to the carrier; a plurality of conductive elements, which are connected to the carrier; and a cover, which is connected to the carrier and covers the electronic component; and a metal frame including a plurality of electrical contact pads for the plurality of conductive elements to be bonded to the plurality of electrical contact pads.

The present invention also provides a method for manufacturing a package structure, comprising: providing an electronic component including a carrier, an electronic component and a plurality of conductive elements mounted on the carrier; and attaching a cover on the carrier to cover The electronic component; and the electronic component is bonded to a metal frame including a plurality of electrical contact pads through the conductive component, so that the plurality of conductive components are connected to the plurality of electrical contact pads.

In the aforementioned packaging structure and its manufacturing method, the metal frame is a lead frame.

In the aforementioned package structure and its manufacturing method, the metal frame further includes a board body corresponding to the position of the electronic component, and the plurality of electrical contact pads are located around the board body. The plate body is combined with the cover.

In the aforementioned package structure and its manufacturing method, the cover member is bonded to the electronic component through an interposer.

In the aforementioned packaging structure and the manufacturing method thereof, a support member is further included, which is connected to the carrier member, so that the cover member abuts on the support member. For example, the support is arranged between the two electronic components, and the support is grounded.

In the aforementioned package structure and its manufacturing method, a coating layer is also included, which is formed between the carrier and the metal frame to cover the cover and the conductive elements and expose the electrical contact pads. the cladding. For example, the covering element exposes the cladding layer or does not expose the cladding layer; or, the electrical contact pads are exposed on the side of the cladding layer.

In the aforementioned package structure and its manufacturing method, the carrier has opposite first and second sides, and the electronic component includes a first electronic component and a first electronic component respectively connected to the first and second sides. Two electronic components for the cover member to be mounted on the second side and cover the second electronic component. For example, a coating layer is formed on the first side of the carrier; or, the metal is mounted on the first side and/or the second side of the carrier.

In addition, in the aforementioned package structure and the manufacturing method thereof, the cover member is electrically connected to the carrier member. The cover covers a plurality of the electronic components. The cover is arranged between the two electronic components. The cover is grounded.

As can be seen from the above, in the packaging structure and the manufacturing method of the present invention, the electronic components are mainly bonded to the metal frame including a plurality of electrical contact pads through a plurality of conductive elements, so that the electrical contact pads of the metal frame are formed. As an electrical contact, compared with the prior art, the present invention can use a general molding die to form a cladding layer covering the electronic components without selecting different dies according to the size of the package structure, thereby effectively reducing the production cost.

Furthermore, by arranging a cover on the carrier to cover the electronic component, the heat dissipation efficiency of the package structure can be improved, and the EMI shielding effect can be provided for the electronic component.

Description of drawings

1 is a schematic cross-sectional view of a conventional semiconductor packaging structure;

2A to 2C are schematic cross-sectional views of a method for manufacturing a packaging structure of the present invention;

3A is a schematic cross-sectional view corresponding to the subsequent process of FIG. 2C;

3B is a schematic cross-sectional view corresponding to another embodiment of FIG. 3A;

3C is a schematic cross-sectional view corresponding to another embodiment of FIG. 3A;

4 is a schematic cross-sectional view of another embodiment corresponding to FIG. 2C;

FIG. 5A is a schematic bottom view corresponding to FIG. 2C; and

FIG. 5B is a schematic diagram corresponding to another embodiment of FIG. 5A .

Symbol Description:

1 Semiconductor package structure

10 Substrates

100 contacts

11 Semiconductor components

11' passive components

13 solder balls

14 Encapsulant

2,3,3’,3”,4 package structure

2a Electronic components

20 Carrier

20a First side

20b Second side

200 circuit layers

21,21’,41 First electronic component

210,220 Conductive bumps

22,42 Second electronic component

221 Primer

23, 23’, 23” conductive element

24 First cladding

25,25”,45 Metal Frame

250 Electrical Contact Pads

251 Board body

26 Second cladding

26a First surface

26b Second surface

26c side

27,47 Supports

28 Covers

280,29 Interposer.

Detailed ways

The embodiments of the present invention are described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation of the present invention. Restricted conditions, it does not have technical substantive significance, any structural modification, proportional relationship change or size adjustment, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the present invention. The disclosed technical content must be within the scope of coverage. At the same time, the terms such as "above", "first", "second", and "one" quoted in this specification are only for the convenience of description and clarity, and are not used to limit the scope of the present invention. , the change or adjustment of the relative relationship, without substantial change of the technical content, should also be regarded as the scope of the present invention.

FIG. 2A to FIG. 2C are schematic cross-sectional views of the manufacturing method of the package structure 2 of the present invention.

As shown in FIG. 2A , an electronic component 2 a is provided, which includes a carrier 20 , and first electronic components 21 , 21 ′, second electronic components 22 , conductive components 23 and support members 27 disposed on the carrier 20 . .

The carrier 20 has opposite first sides 20a and second sides 20b. In the present embodiment, the carrier 20 is, for example, a package substrate with a core layer and a circuit structure or a circuit structure without a core layer (coreless), which has a plurality of circuit layers 200, such as a fan out (fan out) Type redistribution layer (redistribution layer, referred to as RDL). It should be understood that the carrier 20 can also be other carrier units capable of carrying electronic components such as chips, such as a lead frame, which is not limited to the above.

The first electronic components 21, 21' are disposed on the first side 20a of the carrier 20. In this embodiment, the first electronic components 21, 21' are active components (such as reference numeral 21), passive components (such as reference numeral 21'), or a combination of the two, etc., wherein the active components are, for example, semiconductor chips, and The passive elements are, for example, resistors, capacitors and inductors. For example, the first electronic element 21 is disposed on the circuit layer 200 in a flip-chip manner through a plurality of conductive bumps 210 such as solder material and is electrically connected to the circuit layer 200; A bonding wire (not shown) is electrically connected to the circuit layer 200 in a bonding manner; alternatively, the first electronic component 21 ′ can directly contact the circuit layer 200 . However, the manner in which the first electronic components 21, 21' are electrically connected to the carrier 20 is not limited to the above.

After the first electronic components 21, 21' are disposed on the carrier 20, a first coating layer 24 can be formed to cover the first electronic components 21, 21'. In this embodiment, the material for forming the first cladding layer 24 is polyimide (PI), dry film, epoxy or molding compound. In other embodiments, the electronic component 2a may not form the first cladding layer 24 .

After the first cladding layer 24 is formed, the second electronic element 22 , the conductive element 23 and the supporting element 27 can be disposed on the carrier 20 .

The second electronic component 22 is disposed on the second side 20b of the carrier 20 . In this embodiment, the second electronic element 22 is an active element, a passive element, or a combination thereof, wherein the active element is, for example, a semiconductor chip, and the passive element is, for example, a resistor, a capacitor, and an inductor. For example, the second electronic component 22 is disposed on the circuit layer 200 in a flip-chip manner through a plurality of conductive bumps 220 such as solder material; The wiring layer 200 is electrically connected to the wiring layer 200 . However, the manner in which the second electronic component 22 is electrically connected to the carrier 20 is not limited to the above.

The conductive element 23 is disposed on the circuit layer 200 on the second side 20 b of the carrier 20 . In this embodiment, the conductive element 23 is a solder ball, but it is not limited to the above.

The support member 27 is disposed on the second side 20b of the carrier member 20 and is located around the second electronic component 22 . In this embodiment, the support member 27 is a metal frame (or other material frame) and is electrically connected (eg, grounded) to the carrier member 20 , and the conductive element 23 is located outside the support member 27 .

As shown in FIG. 2B , a primer 221 is formed between the second electronic component 22 and the second side 20 b of the carrier 20 to cover the conductive bumps 220 . Next, a cover member 28 is disposed on the second side 20b of the carrier member 20 to cover the second electronic component 22 .

In this embodiment, the cover member 28 is a metal cover, which abuts against the support member 27 to facilitate the erection and electrical connection (eg, grounding) of the carrier member 20 , and is coupled to the second electronic device through an interposer 280 . element 22. For example, the interposer 280 is, for example, a film, an epoxy, or a thermal interface material (TIM for short).

As shown in FIG. 2C , the electronic component 2 a is bonded to a metal frame 25 with its conductive element 23 , and the cover 28 is also bonded to the metal frame 25 to form a package structure 2 .

In this embodiment, the metal frame 25 is, for example, a lead frame, which includes a board body 251 and a plurality of electrical contact pads 250 located around the board body 251 and separated from each other, and make the electrical contact pads 250 . The pads 250 are combined with the conductive elements 23 , and the board body 251 corresponds to the position of the second electronic element 22 , so that the cover member 28 is bonded to the board body 251 through another interposer 29 . Specifically, the board body 251 is separated from the electrical contact pads 250 , and as shown in FIG. 5A , the electrical contact pads 250 surround the board body 251 . It should be understood that the electrical contact pads 250 can be surrounded by multiple circles around the board body 251 , such as two circles as shown in FIG. 5B .

In addition, in the subsequent process, solder material such as solder balls (not shown) may be formed on the electrical contact pads 250 for connecting to an electronic device such as a circuit board or another circuit board.

Therefore, the packaging structure manufacturing method of the present invention can provide the electromagnetic interference (Electromagnetic Interference, EMI) shielding effect to the second electronic component 22 through the design of the cover member 28 to be grounded.

In addition, the package structure 2 can conduct the heat of the second electronic element 22 through the board body 251 to improve the heat dissipation effect.

In other embodiments, as shown in FIG. 3A , a second cladding layer 26 may be selectively formed between the second side 20b of the carrier 20 and the metal frame 25 in a subsequent process, so that the second cladding layer 26 is formed between the second side 20b of the carrier 20 and the metal frame 25 . The covering layer 26 covers the cover 28 and the conductive elements 23 .

In this embodiment, the material for forming the second cladding layer 26 is polyimide (PI), epoxy resin (epoxy) or a molding compound, and the second cladding layer 26 is The first surface 26a and the second surface 26b are opposite to each other, so that the second cladding layer 26 is combined with the second side 20b of the carrier 20 with its second surface 26b, and the metal frame 25 is embedded in the second cladding The first surface 26a of the cladding layer 26, and the electrical contact pads 250 are exposed to the first surface 26a of the second cladding layer 26 (for example, the lower surfaces of the electrical contact pads 250 are flush with the second cladding layer 26). The first surface 26a) of the cladding layer 26 is formed with a solder material (not shown) such as solder balls on the exposed surfaces of the electrical contact pads 250, so as to be used for connecting electronic devices such as a circuit board or another circuit board. device.

It should be understood that the material of the second cladding layer 26 and the material of the first cladding layer 24 may be the same or different.

Furthermore, if the electronic component 2a is not formed with the first cladding layer 24 in the process of FIG. 2A , when the second cladding layer 26 is formed, the second cladding layer 26 also covers the first cladding layers 26 . An electronic component 21 , 21 ′, as shown in FIG. 3B , forms another package structure 3 ′.

Also, as shown in FIG. 3C , the conductive elements 23 ′, 23 ″ disposed on the carrier 20 can also be copper core balls, passive elements or metal parts (such as columns, blocks or needles), etc. Specifically, the conductive element 23' on the left is a copper core ball, and the conductive element 23" on the right is a passive element, such as a resistor, a capacitor and an inductor, and a decoupling capacitor is used as an example in the figure.

In addition, a conductive element 23 can also be formed on the circuit layer 200 of the first side 20a of the carrier 20, as shown in FIG. 3C, and combined with another metal frame 25".

In another embodiment, the support member 27 can also be omitted, and the cover member 28 can be combined with the second electronic component 22, as shown in FIG. 3C .

Therefore, the manufacturing method of the package structure of the present invention uses the metal frame 25 as an electrical contact, so it is not necessary to use a molding die of a specific size according to the size of the package structure 2, 3, 3', 3", that is, through the A general-purpose molding die forms the second cladding layer 26, thereby reducing production costs.

In other embodiments, the support member 27 (or the cover member 28 ) can surround (cover) a plurality of second electronic components 42 , as shown in FIG. The support member 47 (or the cover member 28 ) is grounded, so as to provide the effect of EMI shielding between the second electronic components 42 .

In addition, the metal frame 45 may not have the plate body 251 , so that the cover member 28 exposes the second cladding layer 26 (not shown) or does not expose the second cladding layer 26 (as shown in FIG. 4 ).

In addition, the electrical contact pad 250 can also be exposed on the side surface 26c of the second cladding layer 26, as shown in FIG. 4 or FIG. 5, so as to be similar to a quad flat no-leads (Quad Flat No-leads, QFN for short). )structure.

The present invention also provides a package structure 2, 3, 3', 3", 4, which includes: a carrier 20, a first electronic element 21, 21', a second electronic element 22, 42, and a plurality of conductive elements 23 , 23', 23", at least one metal frame 25, 25", 45 and a cover 28.

The carrier 20 has opposite first sides 20a and second sides 20b.

The first electronic components 21, 21' are connected to the first side 20a of the carrier 20. The second electronic components 22 , 42 are mounted on the second side 20 b of the carrier 20 .

The conductive elements 23 , 23 ′, 23 ″ are connected to the first side 20 a and/or the second side 20 b of the carrier 20 .

The metal frames 25 , 25 ″, 45 include a plurality of electrical contact pads 250 bonded to the conductive elements 23 .

The cover member 28 is mounted on the second side 20b of the carrier member 20 and covers the second electronic components 22 and 42 .

In one embodiment, the metal frames 25, 25", 45 are lead frames.

In one embodiment, the metal frame 25 further includes a board body 251 corresponding to the position of the second electronic component 22 . For example, the electrical contact pad 250 is separated from the board body 251 . Alternatively, the board body 251 is bonded to the cover member 28 , for example, the board body 251 is bonded to the cover member 28 through an interposer 29 .

In one embodiment, the cover member 28 is bonded to the second electronic device 22 through an interposer 280 .

In one embodiment, it can be inferred from FIG. 4 that the cover member 28 covers the plurality of second electronic components 42 .

In one embodiment, the package structure 2, 3, 3', 4 further includes a support member 27, 47, which is connected to the second side 20b of the carrier member 20, so that the cover member 28 abuts against the second side 20b of the carrier member 20. on the support 27 . For example, the support member 47 is located between at least two of the second electronic components 42 .

In one embodiment, the package structure 3, 3', 3", 4 further includes a second covering layer 26 formed between the carrier 20 and the metal frame 25, 45 to cover the cover 28 and the conductive elements 23, 23', 23". For example, the electrical contact pad 250 is exposed on the first surface 26 a (and the side surface 26 c ) of the second cladding layer 26 .

To sum up, in the package structure and the manufacturing method of the present invention, the metal frame is used as the electrical contact, so the second cladding layer can be formed by using a general molding die, thereby reducing the production cost.

Furthermore, the support member (or the cover member) can improve the heat dissipation efficiency of the electronic components and provide the EMI shielding effect of the electronic components.

The above embodiments are only used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present invention, and the contents of the above embodiments can be used in combination with each other. Therefore, the protection scope of the present invention should be as listed in the claims.

Claims (32)

1. a package structure, it is characterized in that, this package structure comprises: carrier; an electronic component attached to the carrier; a plurality of conductive elements connected to the carrier; a cover, which is attached to the carrier and covers the electronic component; a metal frame including a plurality of electrical contact pads for the plurality of conductive elements to be bonded to the plurality of electrical contact pads; and A cladding layer is formed between the carrier and the metal frame to cover the cover and the plurality of conductive elements, and the electrical contact pad exposes the side surface of the cladding layer. 2 . The packaging structure of claim 1 , wherein the metal frame is a lead frame. 3 . 3 . The package structure of claim 1 , wherein the metal frame further comprises a board body corresponding to the position of the electronic component, and the plurality of electrical contact pads are located around the board body. 4 . 4 . The package structure of claim 3 , wherein the board body is coupled to the cover member. 5 . 5 . The package structure of claim 1 , wherein the cover member is bonded to the electronic component through an interposer. 6 . 6 . The package structure of claim 1 , wherein the package structure further comprises a support member connected to the carrier member, and the cover member abuts against the support member. 7 . 7 . The package structure of claim 6 , wherein the support member is disposed between the two electronic components. 8 . 8. The package structure of claim 6, wherein the support member is grounded. 9 . The package structure according to claim 1 , wherein the covering element exposes the cladding layer or does not expose the cladding layer. 10 . 10 . The package structure according to claim 1 , wherein the carrier has opposite first and second sides, and the electronic component comprises a The first electronic component and the second electronic component are used for the cover member to be mounted on the second side and cover the second electronic component. 11. The package structure of claim 10, wherein the cladding layer or another cladding layer is formed on the first side of the carrier. 12 . The package structure of claim 10 , wherein the metal is mounted on the first side and/or the second side of the carrier. 13 . 13 . The package structure of claim 1 , wherein the cover is electrically connected to the carrier. 14 . 14 . The package structure of claim 1 , wherein the cover member covers a plurality of the electronic components. 15 . 15 . The package structure of claim 1 , wherein the cover is disposed between the two electronic components. 16 . 16. The package structure of claim 1, wherein the cover is grounded. 17. A method for making a package structure, wherein the method comprises: Provide an electronic assembly including a carrier, an electronic element and a plurality of conductive elements connected to the carrier; attaching a cover on the carrier to cover the electronic component; bonding the electronic component to a metal frame including a plurality of electrical contact pads through the plurality of conductive elements, so that the plurality of conductive elements are connected to the plurality of electrical contact pads; and A cladding layer covering the covering element and the plurality of conductive elements is formed between the carrier and the metal frame, and the side surface of the cladding layer is exposed from the electrical contact pad. 18. The method of claim 17, wherein the metal frame is a lead frame. 19 . The method of claim 17 , wherein the metal frame further comprises a board body corresponding to the position of the electronic component, and the plurality of electrical contact pads are located around the board body. 20 . 20 . The method of claim 19 , wherein the board body is bonded to the cover member. 21 . 21 . The method of claim 17 , wherein the cover member is bonded to the electronic device through an interposer. 22 . 22 . The manufacturing method of the package structure according to claim 17 , wherein the manufacturing method further comprises attaching a support member on the carrier, so that the cover member abuts on the support member. 23 . 23 . The method of claim 22 , wherein the support member is disposed between the two electronic components. 24 . 24. The method of claim 22, wherein the support member is grounded. 25 . The method of claim 17 , wherein the covering element exposes the cladding layer or does not expose the cladding layer. 26 . 26 . The method of claim 17 , wherein the carrier has opposite first and second sides, and the electronic component includes a device connected to the first and second sides, respectively. 27 . The first electronic element and the second electronic element on the side are used for the cover to be mounted on the second side and cover the second electronic element. 27. The method of claim 26, wherein the cladding layer or another cladding layer is formed on the first side of the carrier. 28. The method of claim 26, wherein the metal is mounted on the first side and/or the second side of the carrier. 29. The method of claim 17, wherein the cover is electrically connected to the carrier. 30. The method of claim 17, wherein the cover member covers a plurality of the electronic components. 31. The method of claim 17, wherein the cover member is disposed between the two electronic components. 32. The method of claim 17, wherein the cover is grounded.

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