CN108962878B - Electronic package and manufacturing method thereof - Google Patents
Electronic package and manufacturing method thereof Download PDFInfo
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- CN108962878B CN108962878B CN201710377667.7A CN201710377667A CN108962878B CN 108962878 B CN108962878 B CN 108962878B CN 201710377667 A CN201710377667 A CN 201710377667A CN 108962878 B CN108962878 B CN 108962878B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 24
- 238000005538 encapsulation Methods 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 14
- 239000008393 encapsulating agent Substances 0.000 claims description 10
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 113
- 239000004065 semiconductor Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 5
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- -1 Polyoxadiazole (PBO) Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
An electronic package and a manufacturing method thereof are provided, wherein a first packaging layer is formed on a bearing member with a circuit, an electronic component and an antenna structure are arranged on the first packaging layer, and the antenna structure and the circuit of the bearing member are isolated by the first packaging layer, so that when the antenna structure receives or emits electromagnetic waves, the interference of the antenna structure with the signal transmission of the circuit of the bearing member can be reduced.
Description
Technical Field
The present invention relates to an electronic package, and more particularly, to an electronic package with an antenna structure and a method for fabricating the same.
Background
With the rapid development of portable electronic products in recent years, the development of like-related products is also oriented to the trend of high density, high performance, light weight, thinness, shortness and smallness, and therefore, various integrated multifunctional packaging aspects are developed in the industry to meet the requirements of light weight, shortness, smallness and high density of electronic products. For example, wireless communication technology is widely used in various consumer electronics products, such as mobile phones (cell phones), tablets, etc., to receive or transmit various Radio Frequency (RF) signals via an antenna.
Fig. 1 is a schematic cross-sectional view of a semiconductor package 1 with an antenna structure. The method for fabricating the semiconductor package 1 includes disposing a semiconductor element 13 on a circuit 100 of a package substrate 10 via a plurality of conductive bumps 130, forming an antenna layer 14 on the package substrate 10, and encapsulating the semiconductor element 13 and the antenna layer 14 with an encapsulant 15 to radiate electromagnetic waves from the antenna layer 14.
However, in the semiconductor package 1, since the antenna layer 14 is formed on the surface of the package substrate 10, the characteristics of the antenna layer 14 for transmitting and receiving Electromagnetic waves may cause Electromagnetic Interference (EMI) to the internal circuit 100' of the package substrate 10 and the semiconductor element 13.
Therefore, how to overcome the above-mentioned problems of the prior art has become an issue to be solved.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides an electronic package and a method for fabricating the same, which can reduce interference of the antenna structure with signal transmission of the circuit of the carrier.
The electronic package of the present invention includes: a carrier with a circuit; a first packaging layer formed on the bearing piece; an electronic component disposed on the first encapsulation layer; and an antenna structure disposed on the first encapsulation layer.
The invention also provides a manufacturing method of the electronic packaging piece, which comprises the following steps: forming a first packaging layer on a bearing piece with a circuit; and disposing at least one electronic component and an antenna structure on the first packaging layer.
In the electronic package and the method for manufacturing the same, a conductor electrically connecting the electronic component and the circuit is formed in the first package layer.
In the electronic package and the manufacturing method thereof, the antenna structure is planar or three-dimensional.
The electronic package and the method for manufacturing the same further include forming a second encapsulation layer on the first encapsulation layer to encapsulate the electronic component, wherein the second encapsulation layer has a first surface and a second surface opposite to each other, so that the first surface of the second encapsulation layer is bonded to the first encapsulation layer. For example, the antenna structure includes an antenna layer bonded to the first surface or the second surface and a first active layer bonded to the first surface. Further, the antenna structure further comprises a second active layer combined with the bearing member.
In addition, the electronic package and the method for manufacturing the same further include forming a shielding structure on the first package layer to cover the electronic component. Further, the shielding structure is electrically connected to the antenna structure.
In view of the above, in the electronic package and the method for manufacturing the same of the present invention, the first package layer is formed on the carrier to isolate the antenna structure from the circuit of the carrier, so that compared with the prior art, the present invention can reduce the interference of the antenna structure with the signal transmission of the circuit when receiving or transmitting electromagnetic waves.
In addition, the electronic package of the present invention can isolate the electronic component from the antenna structure by using the shielding structure, so as to avoid the occurrence of the EMI problem of the antenna structure to the electronic component.
Drawings
Fig. 1 is a cross-sectional view of a semiconductor package with an antenna structure;
fig. 2A to 2D are schematic cross-sectional views illustrating a method for fabricating an electronic package according to the present invention;
FIG. 2C' is a schematic cross-sectional view of another embodiment corresponding to FIG. 2C;
FIG. 2D' is a cross-sectional illustration of another embodiment corresponding to FIG. 2D; and
fig. 3A and 3B are schematic cross-sectional views of other different embodiments corresponding to fig. 2D.
Description of the main Components
1 semiconductor package
10 packaging substrate
100, 100' line
13 semiconductor component
130,230 conductive bump
14 antenna layer
15 packaging colloid
2,2 ', 3, 3' electronic package
20 load bearing member
20a first side
20b second side
200, 200' circuit
201 dielectric material
21 first encapsulation layer
22 electrical conductor
22a surface
23 electronic assembly
24,24 ', 34, 34' antenna structure
240,340 antenna layer
241,241 ', 341,341' first active layer
25 second encapsulation layer
25a first surface
25b second surface
26 Shielding structure
260 support part
261 shield part
342 second active layer
d, t interval.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for understanding and reading the present disclosure, and are not used for limiting the conditions of the present disclosure, which will not be technically significant, and any structural modifications, ratio changes or size adjustments should be made within the scope of the present disclosure without affecting the function and the achievable purpose of the present disclosure. In addition, the terms "above", "first", "second" and "a" as used in the present specification are for clarity of description only, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention unless otherwise specified.
Fig. 2A to 2D are schematic cross-sectional views illustrating a method for fabricating an electronic package according to the present invention.
As shown in fig. 2A, a carrier 20 having a first side 20a and a second side 20b opposite to each other is provided.
In the present embodiment, the carrier 20 is, for example, a package substrate (substrate) having a core layer and a circuit structure or a coreless (wire) circuit structure, and a plurality of circuits 200, 200' such as fan-out (fan out) redistribution layer (RDL) are formed on the dielectric material 201. For example, the lines 200, 200' are metal materials such as copper, and the dielectric material 201 is prepreg (PP), Polyimide (PI), benzocyclobutene (BCB), Polyoxadiazole (PBO), or glass fiber (glass fiber).
It should be understood that the supporting member 20 may also be other supporting units for supporting electronic components such as chips, for example, lead frame (leadframe) or semiconductor plate such as silicon interposer (silicon interposer).
As shown in fig. 2B, a first package layer 21 is formed on the first side 20a of the carrier 20, and a plurality of conductors 22 electrically connected to the circuit 200 are formed in the first package layer 21.
In the embodiment, the first package layer 21 is formed through a molding process or a film lamination process, and the material forming the first package layer 21 is, for example, a prepreg (PP), Polyimide (PI), benzocyclobutene (BCB), poly-p-oxadiazole benzene (PBO), dry film (dry film), epoxy resin (epoxy), or a molding compound (molding compound), but is not limited thereto.
In addition, the conductive body 22 is, for example, a column, a line or a block, such as a metal column (e.g., a copper column), a solder wire segment, a solder ball (solder ball) or other types.
The conductor 22 can be manufactured in a variety of ways. For example, the conductive body 22 is formed on the circuit 200, and then the first encapsulation layer 21 is formed on the first side 20a of the carrier 20 to cover the conductive body 22, so that a portion of the surface 22a of the conductive body 22 is exposed out of the first encapsulation layer 21. Alternatively, the first encapsulating layer 21 is formed on the first side 20a of the carrier 20, a through hole is formed in the first encapsulating layer 21, and then the conductor 22 is formed in the through hole, and a portion of the surface 22a of the conductor 22 is exposed out of the first encapsulating layer 21.
As shown in fig. 2C, at least one electronic component 23 is disposed on the first packaging layer 21, and an antenna structure 24 is formed on the first packaging layer 21, wherein the electronic component 23 is separated from the antenna structure 24.
In the present embodiment, the electronic component 23 is an active component, such as a semiconductor chip, a passive component, such as a resistor, a capacitor, or an inductor, or a combination thereof. For example, the electronic component 23 is a semiconductor chip which is flip-chip mounted on the exposed surface 22a of the conductor 22 by a plurality of conductive bumps 230 such as solder material and electrically connected to the conductor 22; alternatively, the electronic component 23 can be electrically connected to the conductor 22 by wire bonding (not shown); alternatively, the electronic component 23 may directly contact the conductor 22. However, the manner of electrically connecting the electronic component 23 to the conductor 22 is not limited to the above.
In addition, the antenna structure 24 includes an antenna layer 240 and a first active layer 241 communicatively connected to each other, and the first active layer 241 extends from the antenna layer 240. Specifically, as shown in fig. 2C, the antenna structure 24 is planar, so that the first active layer 241 and the antenna layer 240 are both bonded to the first package layer 21, which can be formed by sputtering (sputtering), evaporation (evaporation), electroplating, chemical plating or film (foil) method. Alternatively, as shown in fig. 2C ', the antenna structure 24 ' is three-dimensional, such that the first active layer 241 ' is erected on the first package layer 21 to mount the antenna layer 240 on the first package layer 21, which can be formed by folding a metal sheet into a metal frame.
Furthermore, as shown in fig. 2D, the electronic package 2' may further include a second package layer 25 formed on the first package layer 21 to encapsulate the electronic component 23, the conductive bump 230 and the antenna structure 24, wherein the second package layer 25 has a first surface 25a and a second surface 25b opposite to each other, such that the second package layer 25 is bonded to the first package layer 21 by the first surface 25a thereof, and the first active layer 241 and the antenna layer 240 are located on the same side (i.e., the side of the first surface 25 a) without exposing the second surface 25b of the second package layer 25.
Specifically, the second package layer 25 is formed by a molding process or a film lamination process, and the material of the second package layer 25 is prepreg, polyimide, benzocyclobutene, polyoxadiazole, dry film, epoxy resin, or packaging material, but not limited thereto, so the materials of the first and second package layers 21,25 may be the same or different according to the requirement. It should be understood that an underfill (not shown) may also be formed between the first package layer 21 and the electronic component 23 to encapsulate the conductive bumps 230, and then the second package layer 25 encapsulates the underfill.
In addition, a shielding (shielding) structure 26 may be further formed around the electronic component 23, and the shielding structure 26 is electrically connected to the antenna structure 24, wherein the shielding structure 26 includes at least one supporting portion 260 surrounding the electronic component 23, standing on the first package layer 21 and electrically connected to the first active layer 241, and a shielding portion 261 correspondingly disposed above the electronic component 23, and the shielding portion 261 exposes the second surface 25b of the second package layer 25.
Specifically, the shielding structure 26 can be fabricated by first erecting the shielding structure 26, such as a metal frame structure, on the first packaging layer 21, as shown in fig. 2D', and then forming the second packaging layer 25, wherein the supporting portion 260 is a metal pillar or a metal wall, and the shielding portion 261 is a metal sheet. Alternatively, the second package layer 25 is formed first, then a through hole (via) is formed on the second package layer 25 by laser, then the supporting portion 260 is formed in the through hole by sputtering, evaporation, electroplating, chemical plating, and the like, and the shielding portion 261 is formed on the second surface 25b of the second package layer 25 by sputtering, evaporation, electroplating, chemical plating, or film pasting, and the shielding structure 26 is completed, wherein the supporting portion 260 is in a conductive through hole type, and the shielding portion 261 is in a metal layer type. The manufacturing of the shielding structure 26 is not limited to the above.
In another embodiment, the electronic package 2 ″ shown in fig. 2D' may omit the fabrication of the second packaging layer 25, and only the shielding structure 26 is fabricated.
In other embodiments, such as the electronic packages 3,3 'shown in fig. 3A and 3B, the antenna structures 34, 34' may be exposed at the second surface 25B of the second encapsulation layer 25. Specifically, as shown in fig. 3A, the antenna layer 340 of the antenna structure 34 is an antenna body, which is formed on the second surface 25b of the second package layer 25 and exposed to the second surface 25b of the second package layer 25, and the first active layer 341 is a signal line, which is located on the first surface 25a of the second package layer 25 (or on the first package layer 21) and electrically connected to the supporting portion 260 of the shielding structure 26 and the electronic component 23, so that the antenna layer 340 and the first active layer 341 are stacked oppositely and have a gap t therebetween, so that the first active layer 341 and the antenna layer 340 transmit signals in an electromagnetic coupling manner, and the shape and arrangement design of the antenna layer has a higher degree of freedom because no other component occupies space.
Alternatively, as shown in fig. 3B, the antenna structure 34 'further includes a second active layer 342 serving as a signal line, which is formed on the first side 20a of the carrier 20 and electrically connected to the circuit 200, and the first active layer 341' serves as a patch cord for transferring the signal of the second active layer 342 to the antenna layer 340, which is not in contact with or electrically connected to the shielding structure 26, and has another gap d between the second active layer 342 and the first active layer 341 'so that the second active layer 342 and the first active layer 341' transmit the signal in an electromagnetic coupling manner.
The method of the present invention isolates the antenna structures 24,24 ', 34, 34' from the lines 200,200 'of the carrier 20 by forming the first encapsulation layer 21 on the first side 20a of the carrier 20, so that the interference of the antenna layers 240,340 with the lines 200, 200' of the carrier 20 during receiving or transmitting electromagnetic waves can be reduced compared to the prior art.
In addition, the electronic packages 2 ', 2 ", 3,3 ' of the present invention can utilize the shielding structure 26 to isolate the electronic component 23 from the antenna structures 24,34,34 ', so as to avoid the occurrence of EMI problems such as crosstalk, noise interference and radiation interference (radiation interference) of the antenna layers 240,340 on the electronic component 23.
The invention also provides an electronic package 2,2 ', 2 ", 3, 3', comprising: a carrier 20 with a circuit 200,200 ', a first encapsulation layer 21 formed on the carrier 20, at least one electronic component 23 disposed on the first encapsulation layer 21, and an antenna structure 24,24 ', 34,34 ' formed on the first encapsulation layer 21.
In one embodiment, the first package layer 21 has a plurality of conductors 22 formed therein, which electrically connect the electronic components 23 and the circuit 200.
In one embodiment, the antenna structure 24,34, 34' is planar; alternatively, the antenna structure 24' is a three-dimensional structure.
In one embodiment, the electronic package 2 ', 3, 3' further includes a second packaging layer 25 formed on the first packaging layer 21 to encapsulate the electronic component 23, and the second packaging layer 25 has a first surface 25a and a second surface 25b opposite to each other, so that the second packaging layer 25 is bonded to the first packaging layer 21 by the first surface 25a thereof. For example, the antenna structure 24,24 ', 34,34 ' includes an antenna layer 240,340 and a first active layer 241,241 ', 341,341 ', the antenna layer 240,340 is formed on the first surface 25a or the second surface 25b, and the first active layer 241,341,341 ' is bonded to the first surface 25 a. Alternatively, the antenna structure 34' further includes a second active layer 342 coupled to the carrier 20.
In one embodiment, the electronic package 2 ', 2 ", 3, 3' further includes a shielding structure 26 formed on the first packaging layer 21 to cover the electronic component 23. Further, the shielding structure 26 is electrically connected to the antenna structures 24, 34.
In summary, the electronic package and the method for fabricating the same of the present invention form the package layer on the carrier and then form the antenna structure on the package layer to isolate the antenna structure from the circuit of the carrier, so that the interference of the antenna structure with the signal transmission of the circuit when receiving or transmitting electromagnetic waves can be reduced.
In addition, a shielding structure is formed outside the electronic component to isolate the electronic component from the antenna structure, so as to prevent the electromagnetic interference of the antenna structure to the electronic component.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention, and the contents of the above embodiments can be combined with each other and used. Therefore, the scope of the invention should be determined from the following claims.
Claims (16)
1. An electronic package, characterized in that the electronic package comprises:
a carrier with a circuit;
a first packaging layer formed on the bearing piece;
an electronic component disposed on the first encapsulation layer; and
and the antenna structure is arranged on the first packaging layer.
2. The electronic package of claim 1, wherein the first encapsulant layer has conductors formed therein for electrically connecting the electronic component and the trace.
3. The electronic package of claim 1, wherein the antenna structure is planar or volumetric.
4. The electronic package of claim 1, further comprising a second encapsulant layer having opposite first and second surfaces formed on the first encapsulant layer to encapsulate the electronic component, wherein the second encapsulant layer is bonded to the first encapsulant layer at its first surface.
5. The electronic package of claim 4, wherein the antenna structure comprises an antenna layer and a first active layer, the antenna layer being bonded to the first surface or the second surface, and the first active layer being bonded to the first surface.
6. The electronic package of claim 5, wherein the antenna structure further comprises a second active layer bonded to the carrier.
7. The electronic package of claim 1, further comprising a shielding structure formed on the first encapsulation layer to cover the electronic component.
8. The electronic package of claim 7, wherein the shielding structure is electrically connected to the antenna structure.
9. A method of fabricating an electronic package, the method comprising:
forming a first packaging layer on a bearing piece with a circuit; and
at least one electronic component and an antenna structure are disposed on the first packaging layer.
10. The method of claim 9, wherein the first encapsulation layer has conductors formed therein for electrically connecting the electronic components and the traces.
11. The method of claim 9, wherein the antenna structure is planar or three-dimensional.
12. The method of claim 9, further comprising forming a second encapsulant layer having opposite first and second surfaces over the first encapsulant layer to encapsulate the electronic component, wherein the second encapsulant layer is bonded to the first encapsulant layer at the first surface thereof.
13. The method of claim 12, wherein the antenna structure comprises an antenna layer and a first active layer, the antenna layer being bonded to the first surface or the second surface, and the first active layer being bonded to the first surface.
14. The method of claim 13, wherein the antenna structure further comprises a second active layer bonded to the carrier.
15. The method of claim 9, further comprising forming a shielding structure on the first encapsulation layer to cover the electronic component.
16. The method of claim 15, wherein the shielding structure is electrically connected to the antenna structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106116438 | 2017-05-18 | ||
| TW106116438A TWI659518B (en) | 2017-05-18 | 2017-05-18 | Electronic package and method for fabricating the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108962878A CN108962878A (en) | 2018-12-07 |
| CN108962878B true CN108962878B (en) | 2019-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710377667.7A Active CN108962878B (en) | 2017-05-18 | 2017-05-25 | Electronic package and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108962878B (en) |
| TW (1) | TWI659518B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11508678B2 (en) | 2019-08-01 | 2022-11-22 | Mediatek Inc. | Semiconductor package structure including antenna |
| US11587881B2 (en) | 2020-03-09 | 2023-02-21 | Advanced Semiconductor Engineering, Inc. | Substrate structure including embedded semiconductor device |
| US11335646B2 (en) * | 2020-03-10 | 2022-05-17 | Advanced Semiconductor Engineering, Inc. | Substrate structure including embedded semiconductor device and method of manufacturing the same |
| TWI762197B (en) * | 2021-02-18 | 2022-04-21 | 矽品精密工業股份有限公司 | Electronic package and manufacturing method thereof |
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| CN103311213A (en) * | 2012-05-04 | 2013-09-18 | 日月光半导体制造股份有限公司 | Semiconductor packaging member integrating shielding film and antenna |
| TW201541704A (en) * | 2014-04-30 | 2015-11-01 | Auden Techno Corp | Chip-type antenna device and chip structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003086728A (en) * | 2001-07-05 | 2003-03-20 | Matsushita Electric Ind Co Ltd | Method of manufacturing high-frequency circuit and device using the same |
| CN102299142B (en) * | 2010-06-23 | 2013-06-12 | 环旭电子股份有限公司 | Packaging structure with antenna and manufacturing method thereof |
| CN103258817B (en) * | 2012-09-20 | 2016-08-03 | 日月光半导体制造股份有限公司 | Semiconductor package and manufacture method thereof |
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2017
- 2017-05-18 TW TW106116438A patent/TWI659518B/en active
- 2017-05-25 CN CN201710377667.7A patent/CN108962878B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311213A (en) * | 2012-05-04 | 2013-09-18 | 日月光半导体制造股份有限公司 | Semiconductor packaging member integrating shielding film and antenna |
| TW201541704A (en) * | 2014-04-30 | 2015-11-01 | Auden Techno Corp | Chip-type antenna device and chip structure |
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| Publication number | Publication date |
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| TW201901915A (en) | 2019-01-01 |
| TWI659518B (en) | 2019-05-11 |
| CN108962878A (en) | 2018-12-07 |
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