TW202312563A - Electronic device - Google Patents

Abstract

An electronic device in which an antenna module is stacked on a PCB provided with a reflector for stacking, it is a three dimensional antenna structure by stacking so that enables the reflector to effectively reflect the signal from the antenna module to improve the antenna. The signal directionality of the line module further enables the radiation direction of the antenna module to be in an ideal direction.

Description

electronic device

The invention relates to an electronic device, especially an electronic device with an antenna module and a manufacturing method thereof.

Due to the improvement of the image quality of the current multimedia content, the amount of file data has become larger, so the bandwidth of wireless transmission also needs to be enlarged, resulting in the fifth generation of wireless transmission (5G). In addition, due to the higher transmission frequency of 5G, The size requirements of the related wireless communication modules are also relatively high.

FIG. 1 is a perspective view of a conventional electronic device 1 . As shown in FIG. 1 , the electronic device 1 includes: a circuit board 10 , a plurality of electronic components 11 disposed on the circuit board 10 , an antenna structure 12 and a packaging material 13 . The electronic component 11 is disposed on the circuit board 10 and electrically connected to the circuit board 10 . The antenna structure 12 is planar and has an antenna body 120 and a wire 121a, and the antenna body 120 is electrically connected to the electronic component 11 through the wire 121a. The packaging material 13 covers the electronic component 11 and the part of the wire 121a.

However, in the conventional electronic device 1 , the antenna structure 12 is planar, so the electromagnetic radiation characteristics between the antenna structure 12 and the electronic component 11 will be limited.

Therefore, how to overcome the problems of the above-mentioned conventional technologies has become an urgent problem in the industry.

In view of the problems of the prior art, the present invention provides an electronic device comprising: a circuit board; a carrying structure having opposite first and second sides, and the second side is stacked on the second side by a plurality of conductive elements On the circuit board; electronic components are arranged on the first side of the carrying structure and are electrically connected to the carrying structure; the antenna carrier is arranged on the first side of the carrying structure, and the antenna carrier is relatively One side of the first side of the bearing structure is provided with an antenna layer; the packaging layer is arranged on the first side of the bearing structure to cover the electronic component and the antenna carrier; the antenna part is combined with the bearing on the encapsulation layer of the first side of the structure, and communicated with the antenna carrier, and the antenna part corresponds to the antenna layer of the antenna carrier; and the reflector is arranged on the side of the circuit board opposite to the antenna carrier, And communicate with the antenna carrier.

The present invention also provides a manufacturing method of an electronic device, the steps include: providing a carrying structure having opposite first and second sides; disposing electronic components and an antenna carrier on the first side of the carrying structure, and the carrying structure The electronic component and the antenna carrier are electrically connected to the carrier structure; an encapsulation layer is formed on the first side of the carrier structure, so that the encapsulation layer covers the electronic component and the antenna carrier; on the second side of the carrier structure One side of the encapsulation layer is combined with an antenna part that communicates with the antenna carrier; and the carrier structure is mounted on a circuit board with a reflector on the second side through a plurality of conductive elements; wherein the antenna carrier is opposite to An antenna layer is disposed on one side of the first side of the carrying structure; wherein the antenna portion corresponds to the antenna layer of the antenna carrier; and wherein the reflector is disposed on one of the circuit board opposite to the antenna carrier side, and communicate with the antenna carrier.

In the aforementioned electronic device, the antenna carrier is further provided with a grounding circuit.

In the aforementioned electronic device, the antenna layer is a coplanar waveguide, and the width of the reflector is larger than the width of the coplanar waveguide.

In the aforementioned electronic device, the antenna part includes an antenna body communicatively connected to the antenna carrier, and the position of the antenna body corresponds to the position of the antenna carrier.

In the aforementioned electronic device, the position of the reflector corresponds to the position of the antenna carrier.

It can be seen from the above that the electronic device and its manufacturing method of the present invention mainly form a three-dimensional antenna structure by stacking the antenna carrier, the antenna part and the reflector up and down, so that the reflector can effectively reflect the radiation coming from the antenna part through the antenna carrier. signal, so as to improve the signal directivity of the antenna part, so that the radiation direction of the antenna part can be directed toward an ideal direction.

Furthermore, the vertical projected area of the reflector relative to the first side of the carrying structure is greater than the vertical projected area of the antenna carrier relative to the first side of the carrying structure, so as to prevent scattering and cause a decrease in gain (Gain) question.

In addition, the antenna carrier is provided with a coplanar waveguide (CPW for short), so as to increase the distance between the CPW and the reflector, so that the electronic device can obtain better resonance effect and better antenna performance.

1,2: Electronic device

10,2b: circuit board

11,21: Electronic components

12: Antenna structure

120,24a: Antenna body

121a: wire

13: Packaging material

2a: Antenna module

20: Bearing structure

20a: First side

20b: Second side

200: insulating layer

201: line layer

21a: Action surface

21b: Non-active surface

210,220: Conductive bumps

22: Antenna carrier

22a: Antenna layer

23: Encapsulation layer

24: Antenna

24b: Inclusion

240: dielectric layer

242: insulating protective layer

25: reflector

26: Conductive element

9: Support

90: Adhesive layer

A: The first area

B: the second area

H: distance

P1: width of reflector

P2: width of coplanar waveguide

FIG. 1 is a schematic cross-sectional view of a conventional electronic device.

FIG. 2 is a schematic cross-sectional view of the electronic device of the present invention.

3A to 3F are schematic cross-sectional views of the manufacturing method of the electronic device of the present invention.

The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "above", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall also be regarded as the applicable scope of the present invention if there is no substantial change in the technical content.

FIG. 2 is a schematic cross-sectional view of an electronic device 2 of the present invention. The electronic device 2 at least includes: an antenna module 2a and a circuit board 2b equipped with a reflector 25, wherein the antenna module 2a includes a carrying structure 20, an electronic component 21, an antenna carrier 22, and a packaging layer 23 and an antenna part 24.

The carrying structure 20 has opposite first side 20a and second side 20b, and a plurality of conductive elements 26 such as solder balls are implanted on the second side 20b, so as to be combined with the circuit board 2b by the conductive elements 26 .

The electronic component 21 is disposed on the first side 20a of the carrying structure 20 and electrically The carrier structure 20 is connected. The antenna carrier 22 is also disposed on the first side 20 a of the carrying structure 20 , and the antenna carrier 22 is configured separately from the electronic component 21 .

The encapsulation layer 23 is disposed on the first side 20 a of the carrying structure 20 and covers the electronic component 21 and the antenna carrier 22 . The antenna part 24 has an antenna body 24 a covered by an insulating layer, disposed on the encapsulation layer 23 , and communicated with the antenna carrier 22 .

The reflector 25 is disposed on one side of the circuit board 2b opposite to the second side 20b of the carrier structure 20 (ie the reflector 25 is disposed between the second side 20b of the carrier structure 20 and the circuit board 2b), And communicate with the antenna carrier 22 .

According to an embodiment of the present invention, the electronic device 2 of the present invention arranges the reflector 25 on the circuit board 2b, so that the reflector 25 can effectively reflect the antenna body 24a from the antenna part 24 through the antenna carrier 22 signal to improve the signal directivity of the antenna body 24a, so that the radiation direction of the antenna body 24a can be directed towards an ideal direction.

3A to 3F are schematic cross-sectional views of the manufacturing method of the electronic device 2 of the present invention.

As shown in FIG. 3A, a load-bearing structure 20 disposed on the support member 9 is provided, the load-bearing structure 20 has a first side 20a and a second side 20b opposite to each other, wherein the first side 20a defines an adjacent first side 20a. An area A and a second area B, and the carrying structure 20 is bonded to the support member 9 with its second side 20b. Next, at least one electronic component 21 is disposed on the first area A of the first side 20 a of the carrying structure 20 , and at least one antenna carrier 22 is disposed on the second area B of the first side 20 a of the carrying structure 20 . Wherein, the antenna carrier 22 is configured separately from the electronic component 21 .

In this embodiment, the carrying structure 20 is composed of an insulating layer (dielectric layer) 200 and For example, the circuit layer 201 of a fan-out redistribution layer (redistribution layer, RDL for short) is formed. Wherein, the material forming the wiring layer 201 can be copper or gold, and the material forming the insulating layer 200 can be such as polybenzoxazole (Polybenzoxazole, PBO for short), polyimide (Polyimide, PI for short), etc. ), prepreg (Prepreg, PP for short) and other dielectric materials.

Furthermore, the supporting member 9 can be, for example, a plate made of semiconductor material (such as silicon or glass), and the carrying structure 20 can be fixed on the supporting member 9 through materials such as an adhesive layer 90 .

Moreover, the electronic component 21 is an active component, a passive component or a combination thereof, and the active component is such as a semiconductor chip, and the passive component is such as a resistor, a capacitor and an inductor. In this embodiment, the electronic component 21 is a semiconductor chip, such as a radio frequency chip (Radio Frequency Integrated Circuits, referred to as RFID), which has an opposite active surface 21a and a non-active surface 21b. The conductive bump 210 of the material is disposed on the circuit layer 201 in a flip-chip manner and electrically connected to the circuit layer 201; or, the electronic component 21 can be electrically connected to the circuit layer 201 by a plurality of bonding wires (not shown in the figure). The circuit layer 201 ; alternatively, the electronic component 21 can directly contact the circuit layer 201 . However, the manner in which the electronic component 21 is electrically connected to the carrying structure 20 is not limited to the above.

In addition, the antenna carrier 22 is made of glass or silicon material covering the antenna element, and has an antenna layer 22a and an antenna ground disposed on a side opposite to the first side 20a of the carrier structure 20 . In this embodiment, the antenna carrier 22 is a chip specification such as a carrier chip, and the antenna layer 22a is a coplanar waveguide (CPW for short). In addition, as shown in FIG. 3A , the antenna carrier 22 can be provided on the circuit layer in a flip-chip manner by a plurality of conductive bumps 220 such as solder materials. 201 to be electrically connected to the circuit layer 201.

As shown in FIG. 3B , an encapsulation layer 23 is formed on the first side 20 a of the carrying structure 20 , so that the encapsulation layer 23 covers the electronic component 21 and the antenna carrier 22 . In this embodiment, the packaging layer 23 is an insulating dielectric material, such as ABF (Ajinomoto Build-up Film), photosensitive resin, polyimide (polyimide, referred to as PI), bismaleimide triazine (Bismaleimide Triazine, referred to as BT), FR5 prepreg (Prepreg, referred to as PP), dry film (dry film), epoxy resin (epoxy), molding resin (molding compound), molding epoxy resin (Epoxy Molding Compound, EMC for short) or other suitable materials can be formed on the first side 20a of the carrying structure 20 by lamination or molding.

As shown in FIG. 3C, an antenna portion 24 is formed on the encapsulation layer 23, and the antenna portion 24 includes a dielectric layer 240 formed on the encapsulation layer 23 and an antenna body formed on the dielectric layer 240. 24a. In this embodiment, the antenna body 24 a is a patch antenna (Patch antenna), which is pasted on the dielectric layer 240 . In other embodiments, a metal layer may also be formed by electroplating, chemical coating, physical vapor deposition, sputtering or other suitable methods to serve as the antenna body 24a.

Furthermore, the antenna body 24a and the antenna layer 22a are connected in communication with each other (such as signal inductive coupling). For example, the position of the antenna body 24 a corresponds to the position of the antenna carrier 22 , that is, the two are opposite up and down in the second region B of the first side 20 a.

Moreover, the encapsulation layer 23 and the dielectric layer 240 can be made of the same or different materials, and there is no special limitation. Alternatively, the dielectric layer 240 can be omitted, and the antenna body 24 a is directly disposed on the encapsulation layer 23 .

As shown in FIG. 3D, remove the support member 9 and the adhesive layer 90 on it to expose the second side 20b of the carrying structure 20, and the antenna part 24 can be provided with an insulating protection covering the antenna body 24a as required. Layer 242. In this embodiment, the adhesive layer 90 can be a release film to facilitate removal of the support member 9 .

Furthermore, the insulating protection layer 242 is a dielectric material, which is formed on the dielectric layer 240, so the insulating protection layer 242 and the dielectric layer 240 can be regarded as one body, and can be used as a covering body 24b to cover Cover the antenna body 24a.

As shown in FIG. 3E , a plurality of conductive elements 26 such as solder balls are disposed on the second side 20 b of the carrying structure 20 , which are electrically connected to the circuit layer 201 of the carrying structure 20 .

As shown in FIG. 3F , the carrier structure 20 is mounted on a circuit board 2b with at least one reflector 25 through the conductive elements 26, so that the circuit layer 201 of the carrier structure 20 passes through the plurality of conductive elements 26 and the circuit board 2b. The circuit board 2b is electrically connected.

In this embodiment, the reflector 25 is communicatively connected to the antenna carrier 22 , so that the antenna carrier 22 , the antenna part 24 and the reflector 25 serve as an antenna structure. Wherein, the side of the antenna carrier 22 opposite to the circuit board 2b has a coplanar waveguide (CPW) as the antenna structure, and a part of the circuit layer 201 of the carrier structure 20 is a ground circuit connecting the electronic component 21 and the antenna carrier 22 , to provide the antenna structure grounding function. In addition, the width P1 of the reflector 25 is greater than the width P2 of the coplanar waveguide, so as to avoid the problems of scattering and gain reduction. Therefore, since the coplanar waveguide (antenna layer 22a) of the antenna carrier 22 is connected to the circuit layer 201 of the carrying structure 20 through the conductive bump 220, the distance H between the CPW and the reflector 25 will be increased, so that The electronic device 2 can obtain better resonance effect and better antenna performance.

Furthermore, the reflector 25 and the antenna layer 22a are inductively coupled to each other. For example, the position of the reflector 25 corresponds to the position of the antenna carrier 22, that is, the two are vertically aligned with respect to the first side 20a.

In addition, the reflector 25 can be formed on the circuit board 2b by RDL wiring process, so that the reflector 25 is located between the second side 20b of the carrying structure 20 and the circuit board 2b, and the reflector 25 is not in contact with the circuit board 2b. The second side 20b of the carrying structure 20 .

Therefore, in the manufacturing method of the electronic device 2 of the present invention, the antenna carrier 22, the antenna part 24 and the reflector 25 are stacked up and down to form a three-dimensional antenna structure, so that in the manufacturing process, the antenna carrier 22 and the antenna part 24 can be combined with The electronic component 21 is manufactured in an integrated way, that is, it is packaged together, so that the packaging layer 23 can cover the electronic component 21 and the antenna carrier 22, so the mold used in the packaging process can correspond to the size of the carrying structure 20, which is beneficial to the packaging process. .

Furthermore, the manufacturing method of the present invention is to arrange the antenna part 24 corresponding to the electronic component 21 in the same antenna module 2a, so that the reflector 25 of the antenna structure only needs to be connected to any one of the antenna modules 2a The radio frequency chip (the electronic component 21) of the frequency can make the antenna part 24 of the electronic device 2 emit the 5G millimeter wave of the required frequency, so when the electronic device 2 is mass-produced, the manufacturing method of the present invention can produce various Frequency of radio frequency products, so the number of production lines can be reduced to reduce production costs, and production speed can be increased to increase production capacity.

In addition, in the manufacturing method of the present invention, the antenna structure is manufactured by using the circuit substrate manufacturing process, so that the antenna structure can be manufactured by the encapsulation process during the manufacturing process, which is beneficial to the encapsulation operation.

In addition, the 5G system requires more line configurations due to the signal quality and transmission speed requirements, so as to improve the signal quality and transmission speed. Antenna layer 22a, in order to support Under the condition that the length and width of the carrier structure 20 are fixed, the wiring space (number of layers) can be increased, thereby increasing the function of the antenna structure, so the electronic device 2 can provide the electrical functions required for the operation of the 5G system, namely It can meet the requirements of the antenna operation of the 5G system.

In summary, the electronic device and its manufacturing method of the present invention are designed to increase the reflector and the antenna carrier by disposing the reflector on the circuit board and the coplanar waveguide at the bottom of the antenna carrier. The distance between them, so as to get better resonance effect and better antenna performance.

The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of the patent application described later.

2: Electronic device

2a: Antenna module

2b: circuit board

20: Bearing structure

20a: First side

20b: Second side

21: Electronic components

22: Antenna carrier

23: Encapsulation layer

24: Antenna

24a: Antenna body

25: reflector

26: Conductive element

H: distance

Claims (5)

An electronic device comprising: circuit board; The carrying structure has a first side and a second side opposite to each other, and the second side is stacked on the circuit board through a plurality of conductive elements; An electronic component is disposed on the first side of the carrying structure and is electrically connected to the carrying structure; An antenna carrier is arranged on the first side of the carrier structure, and the side of the antenna carrier opposite to the first side of the carrier structure is provided with an antenna layer; An encapsulation layer is disposed on the first side of the carrying structure to cover the electronic component and the antenna carrier; An antenna part is combined on the encapsulation layer on the first side of the carrier structure and communicated with the antenna carrier, and the antenna part corresponds to the antenna layer of the antenna carrier; and The reflector is arranged on one side of the circuit board opposite to the antenna carrier, and communicated with the antenna carrier. The electronic device as claimed in claim 1, wherein the antenna carrier is further provided with a ground circuit. The electronic device according to claim 1, wherein the antenna layer is a coplanar waveguide, and the width of the reflector is larger than the width of the coplanar waveguide. The electronic device according to claim 1, wherein the antenna part includes an antenna body communicatively connected to the antenna carrier, and the position of the antenna body corresponds to the position of the antenna carrier. The electronic device according to claim 1, wherein the position of the reflector corresponds to the position of the antenna carrier.

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