TW202117988A - Electronic package and method for fabricating the same - Google Patents

Electronic package and method for fabricating the same Download PDF

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Publication number
TW202117988A
TW202117988A TW108138623A TW108138623A TW202117988A TW 202117988 A TW202117988 A TW 202117988A TW 108138623 A TW108138623 A TW 108138623A TW 108138623 A TW108138623 A TW 108138623A TW 202117988 A TW202117988 A TW 202117988A
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Taiwan
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layer
antenna
insulating layer
electronic package
electronic
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TW108138623A
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Chinese (zh)
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TWI713190B (en
Inventor
王維賓
林恩立
莊孟宗
李聰明
鄭坤一
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矽品精密工業股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

This invention provides an electronic package and a method for fabricating the same, which attaches an electronic component to a side of a load-bearing structure, coats the electronic component with an encapsulation layer, forms an antenna structure on the lower side of the load-bearing structure, and then covers the encapsulating layer with a shielding body without contacting the antenna structure, avoiding the shielding body shielding the antenna structure for the antenna structure to operate effectively.

Description

電子封裝件及其製法 Electronic package and its manufacturing method

本發明係關於一種電子封裝件，特別是關於一種具有天線結構之電子封裝件及其製法。 The present invention relates to an electronic package, in particular to an electronic package with an antenna structure and a manufacturing method thereof.

隨著半導體技術的演進，半導體產品已開發出不同封裝產品型態，而為提升電性品質，多種半導體產品(例如射頻模組)係具有屏蔽之功能，以防止電磁干擾(Electromagnetic Interference，簡稱EMI)產生。 With the evolution of semiconductor technology, semiconductor products have developed different packaging product types. In order to improve electrical quality, many semiconductor products (such as radio frequency modules) have a shielding function to prevent electromagnetic interference (EMI) )produce.

如第1A及1B圖所示，習知射頻模組1係將複數射頻晶片11電性連接在一具有天線層12之封裝基板10上，再以封裝膠體13包覆各該射頻晶片11，並於該封裝膠體13之頂面13a與側面13c及該封裝基板10之側面10c上形成一金屬屏蔽層14，以藉由該金屬屏蔽層14保護該些射頻晶片11免受外界EMI影響。 As shown in Figures 1A and 1B, the conventional radio frequency module 1 electrically connects a plurality of radio frequency chips 11 on a packaging substrate 10 with an antenna layer 12, and then covers each of the radio frequency chips 11 with a packaging compound 13 and A metal shielding layer 14 is formed on the top surface 13a and the side surface 13c of the packaging compound 13 and the side surface 10c of the packaging substrate 10 to protect the radio frequency chips 11 from external EMI.

惟，習知射頻模組1中，由於該金屬屏蔽層14覆蓋於該封裝基板10之側面10c上，致使該金屬屏蔽層14屏蔽該天線層12，導致該天線層12之天線功能無法有效運作。 However, in the conventional radio frequency module 1, since the metal shielding layer 14 covers the side surface 10c of the packaging substrate 10, the metal shielding layer 14 shields the antenna layer 12, resulting in the antenna function of the antenna layer 12 not working effectively .

因此，如何克服上述習知技術的問題，實已成目前亟欲解決的課題。 Therefore, how to overcome the above-mentioned problems of the conventional technology has become an urgent problem to be solved at present.

鑑於上述習知技術之缺失，本發明係提供一種電子封裝件，係包括：承載結構，係具有相對之第一側與第二側；第一電子元件，係接置於該承載結構之第一側上；封裝層，係形成於該承載結構之第一側上且包覆該第一電子元件；天線結構，係接置於該承載結構之第二側上，其中，該天線結構係包含一絕緣層，且該絕緣層係具有相對之第一表面與第二表面及連接該第一表面與第二表面之側面，以令該絕緣層之第一表面結合於該承載結構上，且該絕緣層之側面呈斜面；以及遮蔽體，係形成於該封裝層上且未接觸該天線結構，其中，該遮蔽體未形成於該絕緣層之側面與第二表面上。 In view of the deficiencies of the above-mentioned conventional technology, the present invention provides an electronic package, which includes: a supporting structure having a first side and a second side opposite to each other; and a first electronic component connected to the first of the supporting structure On the side; the encapsulation layer is formed on the first side of the supporting structure and covers the first electronic element; the antenna structure is connected to the second side of the supporting structure, wherein the antenna structure includes a The insulating layer has a first surface and a second surface opposite to each other and a side surface connecting the first surface and the second surface, so that the first surface of the insulating layer is bonded to the supporting structure, and the insulating layer The side surface of the layer is inclined; and the shielding body is formed on the encapsulation layer and is not in contact with the antenna structure, wherein the shielding body is not formed on the side surface and the second surface of the insulating layer.

本發明復提供一種電子封裝件之製法，係包括：提供一具有相對之第一側與第二側的承載結構，且於該第一側上設置有第一電子元件，並於該第二側上形成有天線結構；形成封裝層於該承載結構之第一側上，使該封裝層包覆該第一電子元件；以及形成遮蔽體於該封裝層上，且該遮蔽體未接觸該天線結構。 The present invention further provides a method for manufacturing an electronic package, which includes: providing a supporting structure having a first side and a second side opposite to each other, and a first electronic component is arranged on the first side and placed on the second side An antenna structure is formed thereon; an encapsulation layer is formed on the first side of the carrying structure so that the encapsulation layer covers the first electronic component; and a shielding body is formed on the encapsulation layer, and the shielding body does not contact the antenna structure .

前述之電子封裝件及其製法中，前述之電子封裝件及其製法中，該承載結構復形成有屏蔽層，其位於該第一電子元件與該天線結構之間。 In the aforementioned electronic package and its manufacturing method, in the aforementioned electronic package and its manufacturing method, the carrier structure is multiplexed with a shielding layer, which is located between the first electronic element and the antenna structure.

前述之電子封裝件及其製法中，該天線結構中埋設有第二電子元件。 In the aforementioned electronic package and its manufacturing method, the second electronic element is embedded in the antenna structure.

前述之電子封裝件及其製法中，該天線結構係包含一設於該承載結構上之第一天線層、及設於該絕緣層上之第二天線層，且該絕緣層覆蓋該第一天線層。例如，該第一天線層與該第二天線層係相互作用。或者，該第二天線層外露於該絕緣層之第二表面。 In the aforementioned electronic package and its manufacturing method, the antenna structure includes a first antenna layer provided on the carrying structure and a second antenna layer provided on the insulating layer, and the insulating layer covers the first antenna layer. An antenna layer. For example, the first antenna layer interacts with the second antenna layer. Alternatively, the second antenna layer is exposed on the second surface of the insulating layer.

前述之電子封裝件及其製法中，復包括移除該絕緣層之部分材質，使該絕緣層之第二表面與側面之間的交界處形成倒角。 The aforementioned electronic package and its manufacturing method further include removing part of the material of the insulating layer, so that the boundary between the second surface and the side surface of the insulating layer is chamfered.

前述之電子封裝件及其製法中，復包括形成遮蔽體於該絕緣層之側面上，再採用斜邊研磨方式，移除該絕緣層之側面上之部分材質及其上遮蔽體，使該側面呈斜面，且該遮蔽體未接觸該天線結構。 The aforementioned electronic package and its manufacturing method include forming a shielding body on the side surface of the insulating layer, and then adopting a bevel grinding method to remove part of the material on the side surface of the insulating layer and the upper shielding body so that the side surface It is inclined, and the shielding body does not touch the antenna structure.

前述之電子封裝件及其製法中，該遮蔽體係對應該第一電子元件之位置。 In the aforementioned electronic package and its manufacturing method, the shielding system corresponds to the position of the first electronic component.

前述之電子封裝件及其製法中，該遮蔽體係設於該封裝層之頂面與側面及該承載結構之側面上。 In the aforementioned electronic package and its manufacturing method, the shielding system is provided on the top surface and the side surface of the package layer and the side surface of the carrying structure.

由上可知，本發明之電子封裝件及其製法中，主要藉由該遮蔽體未接觸該天線結構，使該遮蔽體不會形成於該絕緣層之側面與第二表面上，故相較於習知技術，本發明之電子封裝件之遮蔽體不會屏蔽該天線結構，因而該天線結構之天線功能可有效運作。 It can be seen from the above that, in the electronic package and the manufacturing method thereof of the present invention, the shielding body is not formed on the side surface and the second surface of the insulating layer mainly because the shielding body does not contact the antenna structure. In the prior art, the shielding body of the electronic package of the present invention does not shield the antenna structure, so the antenna function of the antenna structure can operate effectively.

1‧‧‧射頻模組 1‧‧‧RF Module

10‧‧‧封裝基板 10‧‧‧Packaging substrate

10c,13c‧‧‧側面 10c,13c‧‧‧side

11‧‧‧射頻晶片 11‧‧‧RF chip

12‧‧‧天線層 12‧‧‧Antenna layer

13‧‧‧封裝膠體 13‧‧‧Packaging gel

13a,26a‧‧‧頂面 13a,26a‧‧‧Top surface

14‧‧‧金屬屏蔽層 14‧‧‧Metal shielding layer

2,2’‧‧‧電子封裝件 2,2’‧‧‧Electronic package

2a‧‧‧天線結構 2a‧‧‧antenna structure

20‧‧‧承載結構 20‧‧‧Bearing structure

20’‧‧‧介電體 20’‧‧‧Dielectric

20a‧‧‧第一側 20a‧‧‧First side

20b‧‧‧第二側 20b‧‧‧Second side

20c,24c,26c‧‧‧側面 20c,24c,26c‧‧‧side

200‧‧‧線路層 200‧‧‧Line layer

201‧‧‧屏蔽層 201‧‧‧Shielding layer

21‧‧‧第一電子元件 21‧‧‧The first electronic component

210‧‧‧導電凸塊 210‧‧‧Conductive bump

22‧‧‧第二電子元件 22‧‧‧Second electronic component

23‧‧‧第一天線層 23‧‧‧First antenna layer

24‧‧‧絕緣層 24‧‧‧Insulation layer

24a‧‧‧第一表面 24a‧‧‧First surface

24b‧‧‧第二表面 24b‧‧‧Second surface

25‧‧‧第二天線層 25‧‧‧Second antenna layer

26‧‧‧封裝層 26‧‧‧Encapsulation layer

27‧‧‧遮蔽體 27‧‧‧Shading body

30‧‧‧傾斜載台 30‧‧‧Tilt stage

31‧‧‧研磨輪 31‧‧‧Grinding wheel

S‧‧‧斜面 S‧‧‧Slope

Z‧‧‧箭頭方向 Z‧‧‧Arrow direction

第1A圖係為習知射頻模組之剖面示意圖； Figure 1A is a schematic cross-sectional view of a conventional radio frequency module;

第1B圖係為習知射頻模組之立體示意圖； Figure 1B is a three-dimensional schematic diagram of a conventional radio frequency module;

第2A至2D圖係為本發明之電子封裝件之製法之剖面示意圖； Figures 2A to 2D are schematic cross-sectional views of the manufacturing method of the electronic package of the present invention;

第2E圖係為對應第2D圖之另一實施例之剖面示意圖； FIG. 2E is a schematic cross-sectional view of another embodiment corresponding to FIG. 2D;

第2E’圖係為對應第2E圖之立體示意圖；以及 Fig. 2E’ is a three-dimensional schematic diagram corresponding to Fig. 2E; and

第3圖係為對應第2E圖之其中一製程之剖面示意圖。 Figure 3 is a schematic cross-sectional view of one of the processes corresponding to Figure 2E.

以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following specific examples illustrate the implementation of the present invention. Those familiar with the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification.

須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如「上」、「第一」、「第二」及「一」等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。 It should be noted that the structure, ratio, size, etc. shown in the accompanying drawings in this manual are only used to match the content disclosed in the manual for the understanding and reading of those familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it does not have any technical significance. Any structural modification, proportional relationship change or size adjustment should still fall within the scope of the present invention without affecting the effects that can be produced and the goals that can be achieved by the present invention. The technical content disclosed by the invention can be covered. At the same time, the terms "on", "first", "second" and "one" cited in this specification are only for ease of description, and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall be regarded as the scope of the implementation of the present invention without substantial changes to the technical content.

第2A至2E圖係為本發明之電子封裝件2之製法之剖面示意圖。 2A to 2E are schematic cross-sectional views of the manufacturing method of the electronic package 2 of the present invention.

如第2A圖所示，提供一承載結構20，其具有相對之第一側20a與第二側20b及連接該第一側20a與第二側20b之側面20c，且於該承載結構20之第一側20a上接置有至少一第一電子元件21，並於該承載結構20之第二側20b上接置至少一第二電子元件22及形成一天線結構2a。 As shown in Figure 2A, a supporting structure 20 is provided, which has opposite first sides 20a and second sides 20b, and a side surface 20c connecting the first and second sides 20a and 20b, and is positioned on the first side of the supporting structure 20 At least one first electronic component 21 is connected to one side 20a, and at least one second electronic component 22 is connected to the second side 20b of the supporting structure 20 to form an antenna structure 2a.

於本實施例中，該承載結構20例如為具有核心層與線路結構之封裝基板(substrate)或無核心層(coreless)之線路結構，其係於介電體20’上形成複數線路層200，如扇出(fan out)型重佈線路層(redistribution layer，簡稱RDL)。具體地，形成該介電體20’之材質如預浸材(prepreg，簡稱PP)、聚醯亞胺(polyimide，簡稱PI)、環氧樹脂(epoxy)或玻纖(glass fiber)。較佳地，於該承載結構20中復形成有一屏蔽層(shielding layer)201，其可例如為至少一完整、網狀或任意圖案之金屬薄片(foil)或為圖案化之導電材。應可理解地，該承載結構20亦可為其它可供承載如晶片等電子元件之承載單元，例如導線架(leadframe)，並不限於上述。 In this embodiment, the carrying structure 20 is, for example, a package substrate with a core layer and a circuit structure or a coreless circuit structure, which forms a plurality of circuit layers 200 on the dielectric 20', Such as fan out (fan out) redistribution layer (RDL). Specifically, the material forming the dielectric body 20' may be prepreg (PP), polyimide (PI), epoxy or glass fiber. Preferably, a shielding layer 201 is formed in the supporting structure 20, which can be, for example, at least one complete, mesh-like or random patterned metal foil or a patterned conductive material. It should be understood that the carrying structure 20 can also be other carrying units capable of carrying electronic components such as chips, such as lead frames, and is not limited to the above.

再者，該第一電子元件21係為主動元件、被動元件或其二者組合等，其中，該主動元件係例如為半導體晶片，且該被動元件係例如為電阻、電容及電感。於本實施例中，該第一電子元件21係為半導體晶片，其藉由複數如銲錫材料之導電凸塊210以覆晶方式設於該線路層200上並電性連接該線路層200；或者，該第一電子元件21可藉由複數銲線(圖略)以打線方式電性連接該線路層200；亦或，該第一電子元件21可直接接觸該線路層200。然而，有關該第一電子元件21電性連接該承載結構20之方式不限於上述。 Furthermore, the first electronic element 21 is an active element, a passive element, or a combination of the two, etc., wherein the active element is, for example, a semiconductor chip, and the passive element is, for example, a resistor, a capacitor, and an inductor. In this embodiment, the first electronic component 21 is a semiconductor chip, which is provided on the circuit layer 200 in a flip chip manner by a plurality of conductive bumps 210 such as solder material, and is electrically connected to the circuit layer 200; or , The first electronic component 21 can be electrically connected to the circuit layer 200 through a plurality of bonding wires (not shown); or, the first electronic component 21 can directly contact the circuit layer 200. However, the manner in which the first electronic component 21 is electrically connected to the supporting structure 20 is not limited to the above.

又，該天線結構2a係於該承載結構20之第二側20b上形成有一第一天線層23及一覆蓋該第一天線層23之絕緣層24，並於該絕緣層24上形成一可由交變電壓、交變電流或輻射變化產生輻射能量之第二天線層25，使該第一天線層23與該第二天線層25相互作用以產生天線訊號。例如，該屏蔽層201於該承載結構20之佈設面積係大於該第一天線層23於該承載結構20之佈設面積，且該絕緣層24具有相對之第一表面24a與第二表面24b及連接該第一表面24a與第二表面24b之側面24c，以令該絕緣層24之第一表面24a結合於該承載結構20之第二側20b上，且該第二天線層25外露於該絕緣層24之第二表面24b。具體地，該輻射能量係為電磁場，並可藉由濺鍍(sputtering)、蒸鍍(vaporing)、電鍍、無電電鍍、化鍍或貼膜(foiling)等方式製作厚度輕薄之第一天線層23與第二天線層25，且形成該絕緣層24之材質如預浸材(PP)、聚醯亞胺(PI)、環氧樹脂或玻纖，故該天線結構2a與該承載結構20可整體視為一天線基板。 In addition, the antenna structure 2a is formed on the second side 20b of the supporting structure 20 with a first antenna layer 23 and an insulating layer 24 covering the first antenna layer 23, and an insulating layer 24 is formed on the insulating layer 24 The second antenna layer 25, which can generate radiated energy by alternating voltage, alternating current, or radiation change, enables the first antenna layer 23 and the second antenna layer 25 to interact to generate an antenna signal. For example, the layout area of the shielding layer 201 on the supporting structure 20 is larger than the layout area of the first antenna layer 23 on the supporting structure 20, and the insulating layer 24 has a first surface 24a and a second surface 24b opposite to each other. The side surface 24c connecting the first surface 24a and the second surface 24b, so that the first surface 24a of the insulating layer 24 is bonded to the second side 20b of the supporting structure 20, and the second antenna layer 25 is exposed on the The second surface 24b of the insulating layer 24. Specifically, the radiant energy is an electromagnetic field, and the first antenna layer 23 with a light thickness can be made by sputtering, vaporing, electroplating, electroless plating, electroless plating, or foaming. And the second antenna layer 25, and the insulating layer 24 is formed of a material such as prepreg (PP), polyimide (PI), epoxy resin or glass fiber, so the antenna structure 2a and the carrying structure 20 can be The whole is regarded as an antenna substrate.

另外，該第二電子元件22係嵌埋於該絕緣層24中，其為主動元件、被動元件或其二者組合等，其中，該主動元件係例如半導體晶片，且該被動元件係例如電阻、電容及電感。於本實施例中，該第二電子元件22係為天線晶片，其直接接觸該線路層200；或者，該第二電子元件22係為天線晶片，其以覆晶方式或打線方式電性連接該線路層200。然而，有關該第二電子元件22電性連接該承載結構20之方式不限於上述。 In addition, the second electronic component 22 is embedded in the insulating layer 24, which is an active component, a passive component, or a combination of the two, etc., wherein the active component is a semiconductor chip, and the passive component is a resistor, Capacitance and inductance. In this embodiment, the second electronic element 22 is an antenna chip, which directly contacts the circuit layer 200; or, the second electronic element 22 is an antenna chip, which is electrically connected to the circuit layer by flip chip or wire bonding.线层200。 Line layer 200. However, the manner in which the second electronic component 22 is electrically connected to the supporting structure 20 is not limited to the above.

如第2B圖所示，形成一封裝層26於該承載結構20之第一側20a上，使該封裝層26包覆該第一電子元件21。 As shown in FIG. 2B, an encapsulation layer 26 is formed on the first side 20 a of the supporting structure 20 so that the encapsulation layer 26 covers the first electronic component 21.

於本實施例中，形成該封裝層26之材質係為聚醯亞胺(PI)、乾膜(dry film)、環氧樹脂或封裝材(molding compound)等，但並不限於上述。 In this embodiment, the material for forming the encapsulation layer 26 is polyimide (PI), dry film, epoxy resin, or molding compound, etc., but it is not limited to the above.

如第2C圖所示，形成一對應該第一電子元件21位置之遮蔽體27於該封裝層26之頂面26a上，且該遮蔽體27復形成於該封裝層26之側面26c、該承載結構20之側面20c及該絕緣層24之側面24c上，以令該遮蔽體27作為散熱或屏蔽之用。 As shown in FIG. 2C, a shielding body 27 corresponding to the position of the first electronic component 21 is formed on the top surface 26a of the encapsulation layer 26, and the shielding body 27 is formed on the side surface 26c of the encapsulation layer 26 and the carrier On the side surface 20c of the structure 20 and the side surface 24c of the insulating layer 24, the shielding body 27 is used for heat dissipation or shielding.

於本實施例中，可藉由濺鍍、蒸鍍、電鍍、化鍍或貼膜等方式製作一如金屬層之遮蔽體27，且該遮蔽體27接觸該屏蔽層201，以作為該承載結構20之接地。 In this embodiment, the shielding body 27 such as a metal layer can be made by sputtering, evaporation, electroplating, electroless plating, or filming, etc., and the shielding body 27 contacts the shielding layer 201 to serve as the carrying structure 20 The grounding.

再者，該遮蔽體27未接觸該第一電子元件21，亦即該遮蔽體27與該第一電子元件21之間形成有間隔，如該封裝層26或空氣縫隙。或者，該遮蔽體27亦可接觸(圖未示)該第一電子元件21；亦或，該遮蔽體27可藉由一結合層(圖未示)結合至該第一電子元件21上，其中，該結合層係例如為薄膜(film)、環氧樹脂或熱介面材料(thermal interface material，簡稱TIM)。 Furthermore, the shielding body 27 does not contact the first electronic component 21, that is, a gap is formed between the shielding body 27 and the first electronic component 21, such as the encapsulation layer 26 or an air gap. Alternatively, the shielding body 27 can also contact (not shown) the first electronic component 21; or, the shielding body 27 can be bonded to the first electronic component 21 by a bonding layer (not shown), wherein The bonding layer is, for example, a film, epoxy, or thermal interface material (TIM for short).

如第2D圖所示，移除該絕緣層24之側面24c上之遮蔽體27，以外露出該絕緣層24之側面24c，使該遮蔽體27未接觸該天線結構2a。 As shown in FIG. 2D, the shielding body 27 on the side surface 24c of the insulating layer 24 is removed, and the side surface 24c of the insulating layer 24 is exposed, so that the shielding body 27 does not contact the antenna structure 2a.

於本實施例中，採用蝕刻方式移除該絕緣層24之側面24c上之遮蔽體27。 In this embodiment, the shielding body 27 on the side surface 24c of the insulating layer 24 is removed by etching.

再者，於另一實施例中，如第2E圖所示之電子封裝件2’，可進一步移除該絕緣層24之部分材質，使該絕緣層24之第二表面24b與側面24c之間的交界處形成倒角。例如，接續第2C圖所示之製程，採用斜邊研磨方式(如第3圖所示)，將第2C圖所示之結構置放於一傾斜載台30(如第3圖所示之直角卡合方式)上，再以研磨輪31沿上、下方向(如第3圖所示之箭頭方向Z)移除該絕緣層24之側面24c上之部分材質及其上遮蔽體27，使該側面24c呈斜面S，以獲取最佳效率及外觀品質，如第2E’圖所示之梯形體絕緣層24。 Furthermore, in another embodiment, as shown in FIG. 2E of the electronic package 2', part of the material of the insulating layer 24 can be further removed, so that the second surface 24b and the side surface 24c of the insulating layer 24 The junction formed a chamfer. For example, following the process shown in Fig. 2C, using the bevel grinding method (as shown in Fig. 3), the structure shown in Fig. 2C is placed on an inclined stage 30 (as shown in Fig. 3 at right angles). In the engagement method), the grinding wheel 31 is used to remove part of the material on the side surface 24c of the insulating layer 24 and the upper shielding body 27 along the up and down directions (as shown in the arrow direction Z in Figure 3) to make the The side surface 24c is inclined surface S to obtain the best efficiency and appearance quality, such as the trapezoidal insulating layer 24 shown in FIG. 2E'.

本發明之製法主要藉由該遮蔽體27未接觸該天線結構2a，即令該遮蔽體27未形成於該絕緣層24之側面24c與第二表面24b上，故相較於習知技術，本發明之電子封裝件2之遮蔽體27不會屏蔽該天線結構2a，因而該天線結構2a之天線功能可有效運作。 The manufacturing method of the present invention is mainly because the shielding body 27 does not contact the antenna structure 2a, that is, the shielding body 27 is not formed on the side surface 24c and the second surface 24b of the insulating layer 24. Therefore, compared with the conventional technology, the present invention The shielding body 27 of the electronic package 2 does not shield the antenna structure 2a, so the antenna function of the antenna structure 2a can operate effectively.

再者，本發明可利用該屏蔽層201防止該天線結構2a對該第一電子元件21的串音干擾(cross talking)、噪音干涉(noise interfering)及輻射干擾(radiation interference)等問題。較佳者，該屏蔽層201係由多層金屬薄片所製成，以強化上述功能。 Furthermore, in the present invention, the shielding layer 201 can be used to prevent cross-talking, noise interfering, and radiation interference caused by the antenna structure 2a to the first electronic component 21. Preferably, the shielding layer 201 is made of multiple metal sheets to strengthen the above-mentioned functions.

本發明復提供一種電子封裝件2,2’，其包括：一承載結構20、至少一第一電子元件21、一封裝層26、天線結構2a以及一遮蔽體27。 The present invention further provides an electronic package 2, 2', which includes: a carrying structure 20, at least one first electronic component 21, an encapsulation layer 26, an antenna structure 2a, and a shielding body 27.

所述之承載結構20係具有相對之第一側20a與第二側20b。 The supporting structure 20 has a first side 20a and a second side 20b opposite to each other.

所述之第一電子元件21係接置於該承載結構20之第一側20a上。 The first electronic component 21 is connected to the first side 20 a of the supporting structure 20.

所述之封裝層26係形成於該承載結構20之第一側20a上且包覆該第一電子元件21。 The encapsulation layer 26 is formed on the first side 20 a of the supporting structure 20 and covers the first electronic component 21.

所述之天線結構2a係接置於該承載結構20之第二側20b上，且該天線結構2a係包含一設於該承載結構20上之第一天線層23、一覆蓋該第一天線層23之絕緣層24、及設於該絕緣層24上之第二天線層25。 The antenna structure 2a is connected to the second side 20b of the supporting structure 20, and the antenna structure 2a includes a first antenna layer 23 provided on the supporting structure 20, and a cover for the first antenna The insulating layer 24 of the wire layer 23 and the second antenna layer 25 provided on the insulating layer 24.

所述之遮蔽體27係形成於該封裝層26上且未接觸該天線結構2a。 The shielding body 27 is formed on the encapsulation layer 26 and does not touch the antenna structure 2a.

於一實施例中，該承載結構20復形成有一屏蔽層201，其位於該第一電子元件21與該天線結構2a之間。 In one embodiment, the supporting structure 20 is further formed with a shielding layer 201 located between the first electronic component 21 and the antenna structure 2a.

於一實施例中，該天線結構2a中埋設有第二電子元件22。 In one embodiment, the second electronic element 22 is embedded in the antenna structure 2a.

於一實施例中，該第一天線層23與該第二天線層25係相互作用。 In one embodiment, the first antenna layer 23 and the second antenna layer 25 interact.

於一實施例中，該絕緣層24係具有相對之第一表面24a與第二表面24b及連接該第一表面24a與第二表面24b之側面24c，以令該絕緣層24之第一表面24a結合於該承載結構20之第二側20b上，且該第二天線層26外露於該絕緣層24之第二表面24b。進一步，該遮蔽體27未形成於該絕緣層24之側面24c與第二表面24b上。或者，該絕緣層24之側面24c呈斜面S。 In one embodiment, the insulating layer 24 has a first surface 24a and a second surface 24b opposite to each other, and a side surface 24c connecting the first surface 24a and the second surface 24b, so that the first surface 24a of the insulating layer 24 It is combined on the second side 20 b of the supporting structure 20, and the second antenna layer 26 is exposed on the second surface 24 b of the insulating layer 24. Furthermore, the shielding body 27 is not formed on the side surface 24c and the second surface 24b of the insulating layer 24. Alternatively, the side surface 24c of the insulating layer 24 is a slope S.

於一實施例中，該遮蔽體27係對應該第一電子元件21之位置。 In one embodiment, the shielding body 27 corresponds to the position of the first electronic component 21.

於一實施例中，該遮蔽體27係設於該封裝層26之頂面26a與側面26c及該承載結構20之側面20c上。 In one embodiment, the shielding body 27 is disposed on the top surface 26 a and the side surface 26 c of the encapsulation layer 26 and the side surface 20 c of the supporting structure 20.

綜上所述，本發明之電子封裝件及其製法，係藉由該遮蔽體未接觸該天線結構，使該遮蔽體不會形成於該絕緣層之側面與第二表面上，故本發明之電子封裝件之遮蔽體不會屏蔽該天線結構，以供該天線結構之天線功能可有效運作。 In summary, the electronic package of the present invention and its manufacturing method are based on the fact that the shielding body does not contact the antenna structure, so that the shielding body will not be formed on the side surface and the second surface of the insulating layer. The shielding body of the electronic package does not shield the antenna structure, so that the antenna function of the antenna structure can operate effectively.

上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改，且前述各實施例之內容可再相互組合應用。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。 The above-mentioned embodiments are used to exemplify the principles and effects of the present invention, but not to limit the present invention. Anyone familiar with the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention, and the contents of the above-mentioned embodiments can be combined and applied with each other. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

2’‧‧‧電子封裝件 2’‧‧‧Electronic package

2a‧‧‧天線結構 2a‧‧‧antenna structure

20‧‧‧承載結構 20‧‧‧Bearing structure

20a‧‧‧第一側 20a‧‧‧First side

20c,24c,26c‧‧‧側面 20c,24c,26c‧‧‧side

21‧‧‧第一電子元件 21‧‧‧The first electronic component

22‧‧‧第二電子元件 22‧‧‧Second electronic component

23‧‧‧第一天線層 23‧‧‧First antenna layer

24‧‧‧絕緣層 24‧‧‧Insulation layer

24a‧‧‧第一表面 24a‧‧‧First surface

24b‧‧‧第二表面 24b‧‧‧Second surface

25‧‧‧第二天線層 25‧‧‧Second antenna layer

26‧‧‧封裝層 26‧‧‧Encapsulation layer

26a‧‧‧頂面 26a‧‧‧Top surface

27‧‧‧遮蔽體 27‧‧‧Shading body

S‧‧‧斜面 S‧‧‧Slope

Claims (20)

一種電子封裝件，係包括： An electronic package including: 承載結構，係具有相對之第一側與第二側； The supporting structure has a first side and a second side opposite to each other; 第一電子元件，係接置於該承載結構之第一側上； The first electronic component is connected to the first side of the carrying structure; 封裝層，係形成於該承載結構之第一側上且包覆該第一電子元件； An encapsulation layer is formed on the first side of the carrying structure and covers the first electronic component; 天線結構，係接置於該承載結構之第二側上，其中，該天線結構係包含一絕緣層，且該絕緣層係具有相對之第一表面與第二表面及連接該第一表面與第二表面之側面，以令該絕緣層之第一表面結合於該承載結構上，且該絕緣層之側面呈斜面；以及 The antenna structure is connected to the second side of the supporting structure, wherein the antenna structure includes an insulating layer, and the insulating layer has a first surface and a second surface opposite to each other and connects the first surface and the second surface The side surfaces of the two surfaces, so that the first surface of the insulating layer is bonded to the supporting structure, and the side surfaces of the insulating layer are inclined; and 遮蔽體，係形成於該封裝層上且未接觸該天線結構，其中，該遮蔽體未形成於該絕緣層之側面與第二表面上。 The shielding body is formed on the encapsulation layer without contacting the antenna structure, wherein the shielding body is not formed on the side surface and the second surface of the insulating layer. 如申請專利範圍第1項所述之電子封裝件，其中，該承載結構復形成有屏蔽層，且該屏蔽層位於該第一電子元件與該天線結構之間。 According to the electronic package described in item 1 of the scope of patent application, wherein the supporting structure is multiplexed with a shielding layer, and the shielding layer is located between the first electronic element and the antenna structure. 如申請專利範圍第1項所述之電子封裝件，其中，該天線結構中埋設有第二電子元件。 According to the electronic package described in item 1 of the scope of patent application, the second electronic element is embedded in the antenna structure. 如申請專利範圍第1項所述之電子封裝件，其中，該天線結構係包含一設於該承載結構上之第一天線層及一設於該絕緣層上之第二天線層，且該絕緣層覆蓋該第一天線層。 The electronic package described in claim 1, wherein the antenna structure includes a first antenna layer provided on the carrier structure and a second antenna layer provided on the insulating layer, and The insulating layer covers the first antenna layer. 如申請專利範圍第4項所述之電子封裝件，其中，該第一天線層與該第二天線層係相互作用。 According to the electronic package described in item 4 of the scope of patent application, the first antenna layer and the second antenna layer interact with each other. 如申請專利範圍第4項所述之電子封裝件，其中，該第二天線層外露於該絕緣層之第二表面。 According to the electronic package described in claim 4, wherein the second antenna layer is exposed on the second surface of the insulating layer. 如申請專利範圍第1項所述之電子封裝件，其中，該遮蔽體係對應該第一電子元件之位置。 The electronic package described in item 1 of the scope of patent application, wherein the shielding system corresponds to the position of the first electronic component. 如申請專利範圍第1項所述之電子封裝件，其中，該遮蔽體係設於該封裝層之頂面與側面及該承載結構之側面上。 The electronic package described in item 1 of the scope of patent application, wherein the shielding system is provided on the top surface and the side surface of the encapsulation layer and the side surface of the supporting structure. 一種電子封裝件之製法，係包括： A manufacturing method of electronic packaging includes: 提供一具有相對之第一側與第二側的承載結構，且於該第一側上設置有第一電子元件，並於該第二側上形成有天線結構； Providing a supporting structure having a first side and a second side opposite to each other, and a first electronic component is arranged on the first side, and an antenna structure is formed on the second side; 形成封裝層於該承載結構之第一側上，使該封裝層包覆該第一電子元件；以及 Forming an encapsulation layer on the first side of the carrying structure so that the encapsulation layer covers the first electronic component; and 形成遮蔽體於該封裝層上，且該遮蔽體未接觸該天線結構。 A shielding body is formed on the packaging layer, and the shielding body does not contact the antenna structure. 如申請專利範圍第9項所述之電子封裝件之製法，其中，該承載結構復形成有屏蔽層，且該屏蔽層位於該第一電子元件與該天線結構之間。 According to the manufacturing method of the electronic package described in item 9 of the scope of patent application, wherein the supporting structure is double-formed with a shielding layer, and the shielding layer is located between the first electronic element and the antenna structure. 如申請專利範圍第9項所述之電子封裝件之製法，其中，該天線結構中埋設有第二電子元件。 According to the manufacturing method of the electronic package described in item 9 of the scope of patent application, the second electronic element is embedded in the antenna structure. 如申請專利範圍第9項所述之電子封裝件之製法，其中，該天線結構係包含一設於該承載結構上之第一天線層、一覆蓋該第一天線層之絕緣層及一設於該絕緣層上之第二天線層。 According to the manufacturing method of the electronic package described in claim 9, wherein the antenna structure includes a first antenna layer provided on the carrier structure, an insulating layer covering the first antenna layer, and A second antenna layer arranged on the insulating layer. 如申請專利範圍第12項所述之電子封裝件之製法，其中，該第一天線層與該第二天線層係相互作用。 According to the manufacturing method of the electronic package described in item 12 of the scope of patent application, the first antenna layer and the second antenna layer interact with each other. 如申請專利範圍第12項所述之電子封裝件之製法，其中，該絕緣層係具有相對之第一表面與第二表面及連接該第一表面與第二表面 之側面，以令該絕緣層之第一表面結合於該承載結構上，且該第二天線層外露於該絕緣層之第二表面。 The method for manufacturing an electronic package as described in claim 12, wherein the insulating layer has a first surface and a second surface opposite to each other and connects the first surface and the second surface The side surface is such that the first surface of the insulating layer is bonded to the supporting structure, and the second antenna layer is exposed on the second surface of the insulating layer. 如申請專利範圍第14項所述之電子封裝件之製法，其中，該遮蔽體未形成於該絕緣層之側面與第二表面上。 According to the manufacturing method of the electronic package described in item 14 of the scope of patent application, the shielding body is not formed on the side surface and the second surface of the insulating layer. 如申請專利範圍第14項所述之電子封裝件之製法，其中，該絕緣層之側面呈斜面。 The method for manufacturing an electronic package as described in item 14 of the scope of patent application, wherein the side surface of the insulating layer is inclined. 如申請專利範圍第14項所述之電子封裝件之製法，復包括移除該絕緣層之部分材質，使該絕緣層之第二表面與側面之間的交界處形成倒角。 The manufacturing method of the electronic package as described in item 14 of the scope of patent application includes removing part of the material of the insulating layer to form a chamfer at the junction between the second surface and the side surface of the insulating layer. 如申請專利範圍第14項所述之電子封裝件之製法，復包括形成遮蔽體於該絕緣層之側面上，再採用斜邊研磨方式，移除該絕緣層之側面上之部分材質及其上遮蔽體，使該側面呈斜面，且該遮蔽體未接觸該天線結構。 For example, the manufacturing method of electronic package described in item 14 of the scope of patent application includes forming a shielding body on the side surface of the insulating layer, and then adopting a bevel grinding method to remove part of the material and the upper surface of the side surface of the insulating layer. The shielding body makes the side surface bevel, and the shielding body does not contact the antenna structure. 如申請專利範圍第9項所述之電子封裝件之製法，其中，該遮蔽體係對應該第一電子元件之位置。 The manufacturing method of the electronic package as described in item 9 of the scope of patent application, wherein the shielding system corresponds to the position of the first electronic component. 如申請專利範圍第9項所述之電子封裝件之製法，其中，該遮蔽體係設於該封裝層之頂面與側面及該承載結構之側面上。 The manufacturing method of the electronic package as described in item 9 of the scope of patent application, wherein the shielding system is provided on the top surface and the side surface of the package layer and the side surface of the supporting structure.
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