TWI768322B - Electronic device and manufacturing method thereof - Google Patents

Abstract

An electronic device comprises an antenna module disposed on a flexible circuit board and a packaging module disposed on the flexible circuit board, so that the antenna module can be arranged near a housing of an electronic product based on a signal strength qualification. Therefore, a structure design of the flexible circuit board is not limited by a position of the antenna module, so a space of the electronic product is free from restricting design of other internal components in the electronic product to achieve expected functions of the electronic product.

Description

Electronic device and method of making the same

The present invention relates to an electronic device, in particular to an electronic device with an antenna module and a manufacturing method thereof.

With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, the fourth generation (4G) wireless transmission communication technology has been widely used in various consumer electronic products to receive or transmit various wireless signals.

However, with the rapid development of wireless communication and the increasing flow of network resources, the required wireless transmission bandwidth is also increasing, so the research and development of the fifth generation (5G) of wireless transmission has become a trend.

FIG. 1 is a three-dimensional schematic diagram of a conventional wireless communication device. As shown in FIG. 1 , the wireless communication device 1 includes: a circuit board 10 provided with electronic components 11 , a plurality of chip components 16 disposed on the circuit board 10 , an antenna component 12 and a package body 13 . The chip element 16 is disposed on the circuit board 10 and is electrically connected to the circuit board 10 . The antenna element 12 is electrically connected to the chip element 16 through a transmission line 17 . The package body 13 covers the chip element 16 and the part of the transmission line 17 .

However, in the conventional wireless communication device 1, in order to enhance the signal strength of the antenna element 12 for 5G, the antenna element 12 needs to be located near the casing of the portable electronic product, so The portable electronic product can provide limited space for disposing the antenna element 12, so it is necessary to further meet the miniaturization requirements of the wireless communication device 1; in addition, how does the wireless communication device 1 located near the casing interact with the centrally located wireless communication device 1? It is also a problem to be solved for the electrical communication with other components (such as the motherboard) inside the portable electronic product.

Therefore, how to overcome the above-mentioned various problems of the prior art has actually become an urgent problem to be overcome in the current industry.

In view of various deficiencies in the above-mentioned prior art, the present invention provides an electronic device, comprising: a package module including at least one electronic component and having opposite first sides and second sides, and the first side is defined with each other The non-overlapping active area and the external area; the antenna module is electrically connected to the active area of the packaging module through at least one conductive element, and air is generated between the first side of the packaging module and the antenna module a gap; a flexible circuit board, which is connected to the external connection area of the package module; and a connector, which is arranged on the flexible circuit board.

The present invention also provides a method for manufacturing an electronic device, comprising: providing a package module including at least one electronic component, an antenna module, a flexible circuit board and a connector, wherein the package module has opposite first sides and the second side, and the first side defines a non-overlapping active area and an external area; and the antenna module is electrically connected to the active area of the package module through at least one conductive element, so that the package mold An air gap is created between the first side of the group and the antenna module, the flexible circuit board is connected to the external area of the package module, and the connector is arranged on the flexible circuit board.

In the aforementioned electronic device and its manufacturing method, the antenna module is a flexible structure or a non-flexible structure.

In the aforementioned electronic device and the manufacturing method thereof, the antenna module is superimposed on the flexible circuit board or displaced from the flexible circuit board from the viewing angle of the first side.

In the aforementioned electronic device and its manufacturing method, the flexible circuit board has a first bonding portion and a second bonding portion disposed at opposite ends thereof, so that the flexible circuit board can be bonded to the flexible circuit board by the first bonding portion. on the external connection area of the package module, and the second combining portion is used for combining the connector.

In the aforementioned electronic device and its manufacturing method, the steps of arranging the packaging module, the antenna module, the flexible circuit board and the connector include: disposing the connector and the packaging module before the flexible circuit board ; and then set the antenna module on the action area of the package module.

In the aforementioned electronic device and its manufacturing method, the steps of arranging the package module, the antenna module, the flexible circuit board and the connector include: disposing the connector on the flexible circuit board first, and then placing the connector on the package. The antenna module is arranged on the action area of the module; and then the flexible circuit board is arranged on the external connection area of the package module.

In the aforementioned electronic device and its manufacturing method, the flexible circuit board is superimposed on the action area of the package module from the viewing angle of the first side, and the flexible circuit board is formed with at least one opening for The conductive element is passed through the opening to connect the antenna module and the packaging module. For example, the steps of arranging the package module, the antenna module and the flexible circuit board include: firstly forming the opening on the flexible circuit board; then connecting the antenna module on the flexible circuit board above, so that the antenna module is configured to correspond to the opening; and then the package module is connected to the antenna module by passing the conductive element through the opening to configure. Further, the number of the openings corresponds to the number of signal contacts of the antenna module.

In the aforementioned electronic device and the manufacturing method thereof, the functional module provided on the flexible circuit board is further included. For example, the steps of disposing the packaging module, the antenna module, the flexible circuit board and the functional module include: firstly disposing the antenna module and the functional module on the flexible circuit board; and then arranging the The packaging module is arranged on the flexible circuit board. Alternatively, the flexible circuit board has a first joint portion and a second joint portion disposed at opposite ends thereof, so that the first joint portion is used for the flexible circuit board to be combined with the functional module, and the first joint portion is The two combining parts are used for combining the connector, and the packaging module and/or the antenna module are located between the first combining part and the second combining part. Further, the functional module has an antenna structure.

As can be seen from the above, the electronic device and the manufacturing method of the present invention mainly rely on the design of the flexible circuit board, so that the antenna module can be arranged near the casing of the electronic product according to the signal strength requirements, so compared with the above In the prior art, when the position of the antenna module is close to the casing of the electronic product, the configuration of the flexible circuit board is not limited by the position of the antenna module, so other components inside the electronic product are not limited by the position of the antenna module. The design will not be limited by space, so that the electronic product can meet the preset functions according to the needs.

Furthermore, by disposing the connector on the flexible circuit board, the size of the mold used in the packaging process only needs to match the volume of the antenna module and the packaging module, without considering the packaging of the connector. Compared with the prior art, the electronic device of the present invention can effectively reduce the volume of the antenna module and the packaging module, so as to improve the utilization rate of the internal space at the system end and reduce the packaging cost.

1: Wireless communication device

10: circuit board

11: Electronic Components

12: Antenna elements

13: Package body

16: Chip components

17: Transmission line

2, 3, 4: Electronics

2a: Package module

2b, 3b: Antenna module

20: Bearing part

20a: First side

20b: Second side

200: Insulation layer

201: Circuit layer

21,21': Electronic components

21a: Action surface

21b: Non-active surface

210: Electrode pads

211, 212: Protective film

22: Conductive bumps

23: Solid crystal layer

24: Cladding

24': Shield structure

25,45: Flexible circuit board

25a, 45a: first surface

25b, 45b: Second surface

251, 451, 451': the first joint

252,452: Second joint

26: Connector

27,47: Conductive elements

28,28': Antenna substrate

280: Antenna main layer

281: Signal contact

282: Electrical contacts

4b: function module

450: Opening

480: Antenna Structure

8: Adapter

80: Circuit Interposer Board

81: first port

82: Second port

9: Electronics

9a: Chassis

90: Motherboard

900: port

91: Support frame

A: Action area

B: External area

t: air gap

250: Conductor

FIG. 1 is a three-dimensional schematic diagram of a conventional wireless communication device.

2A to 2C are schematic cross-sectional views of the first embodiment of the manufacturing method of the electronic device of the present invention.

Fig. 2C' is a schematic cross-sectional view of another embodiment of Fig. 2C.

Figures 2D, 2D' and 2D" are schematic cross-sectional views of different embodiments of subsequent applications of Figure 2C.

FIGS. 3A to 3B are schematic cross-sectional views of the second embodiment of the manufacturing method of the electronic device of the present invention.

FIGS. 4A to 4C are schematic cross-sectional views of the third embodiment of the manufacturing method of the electronic device of the present invention.

Figure 4A' is a partial top view of Figure 4A.

Figure 4C' is another aspect of Figure 4C.

FIG. 4D is a schematic cross-sectional view of an embodiment of the subsequent application of FIG. 4C.

The following specific embodiments are used to illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the present invention without affecting the effect and the purpose that the present invention can achieve. The technical content disclosed by the invention must be able to cover within the range. At the same time, the terms such as "above", "first", "second" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantial changes to the technical content, should also be regarded as the scope of the present invention.

2A to 2C are schematic cross-sectional views of the first embodiment of the manufacturing method of the electronic device 2 of the present invention.

As shown in FIG. 2A, a package module 2a including at least one electronic component 21 is provided (this embodiment is illustrated by a plurality of electronic components 21, 21'), wherein the package module 2a has a corresponding first One side 20a and the second side 20b, and the first side 20a defines an active area A and a circumscribed area B that do not overlap each other.

In this embodiment, the package module 2a further includes a carrier portion 20 on the first side 20a for disposing the electronic components 21, 21', such as a circuit structure or a substrate structure, and the substrate structure is of a core layer type. Or the type without core layer, for example, a package substrate with a core layer and a circuit structure or a circuit substrate structure without a core layer (coreless), and the carrier portion 20 has at least one insulating layer 200 and is provided on the insulating layer 200. The upper line layer 201 is, for example, a line redistribution layer (redistribution layer, RDL for short). For example, the material for forming the circuit layer 201 is copper, and the material for forming the insulating layer 200 is, for example, polybenzoxazole (PBO), polyimide (PI), prepreg (Prepreg, referred to as PP) and other dielectric materials. It should be understood that the carrying portion 20 can also be other carrying units capable of carrying electronic components such as chips, such as a leadframe or a silicon interposer, which is not limited to the above.

Furthermore, the electronic components 21, 21' are active components, passive components or a combination of both, and the active components are, for example, semiconductor chips (eg, the electronic components 21), and the passive components (eg, the electronic components 21') are Such as resistors, capacitors and inductors. Specifically, the semiconductor wafer has an opposite active surface 21a and an inactive surface 21b, the electronic device 21 is combined with a solid die layer 23 for a process with its inactive surface 21b, and the active surface 21a has a plurality of electrode pads 210 , and the electrode pads 210 are formed with conductive bumps 22 and protective films 211 and 212 covering the electrode pads 210 and the conductive bumps 22 (for example, two-layer protective films in this embodiment, but not intended to limit the The number of layers of the protective film), wherein, the protective films 211, 212 are, for example, polyparaoxadiazole (PBO), and the conductive bumps 22 are spherical such as conductive lines, solder balls, or copper posts, solder Columnar shapes of metal materials such as bumps, or studs made by wire bonding machines, but not limited to these.

In addition, the package module 2a further includes a coating layer 24 formed on the carrier portion 20 and located on the second side 20b, which covers the electronic components 21, 21'. For example, the cladding layer 24 is an insulating material, such as polyimide (PI), dry film, epoxy or molding compound, which can be laminated ( Lamination) or molding (molding) is formed on the carrier portion 20 .

In addition, it should be understood that there are various types of the package module 2a, such as flip chip type, wire bonding type or other packaging types, or even with other components (such as the shielding structure 24' shown in 2C'), etc. , not limited to the above.

As shown in FIG. 2B , a flexible circuit board 25 is connected to the external area B of the package module 2 a , and at least one connector 26 is disposed on the flexible circuit board 25 .

In this embodiment, the flexible circuit board 25 is a flexible circuit board, which can be bent according to requirements, and is electrically connected to the packaging module 2a. The flexible circuit board 25 is made of solder material such as Conductors 250 (such as solder balls) are bonded to the external connection area B of the package module 2a, so that the flexible circuit board 25 is electrically connected to the circuit layer 201 of the package module 2a. Specifically, the flexible circuit board 25 has an opposite first surface 25a and a second surface 25b, and the first surface 25a is connected to the first side 20a of the package module 2a, and the second surface 25b Then, the connector 26 is connected, that is, the connector 26 and the package module 2 a are located on different sides with respect to the flexible circuit board 25 . It should be understood that the connector 26 and the package module 2a may also be located on the same side with respect to the flexible circuit board 25 (as shown in the position of the connector 26 in FIG. 4C ).

Furthermore, the flexible circuit board 25 is, for example, an elongated sheet, and has a first joint portion 251 and a second joint portion 252 opposite to each other in the longitudinal direction, so that the first joint portion 251 is combined with the packaging mold. The group 2a is externally connected to the area B, and the second coupling portion 252 is coupled to the connector 26 .

Also, as shown in FIG. 2D , the connector 26 is used to electrically connect to the connection port 900 of the motherboard 90 in an electronic product 9 (eg, a smart phone). For example, in the manufacturing process, the connector 26 can be disposed on the second surface 25b of the second joint portion 252 of the flexible circuit board 25 first, and then the package module 2a can be disposed on the flexible circuit board 25 on the first surface 25a of the first joint portion 251 . It should be understood that there are various types of the connector 26 without particular limitation, and the manner of connecting the flexible circuit board 25 is also not particularly limited.

In addition, it should be understood that there are various types of flexible circuit boards 25, which can be designed according to requirements, and there is no particular limitation.

As shown in FIG. 2C, an antenna module 2b is disposed on the first side 20a of the packaging module 2a by at least one conductive element 27 such as a solder ball to electrically connect the active area A of the packaging module 2a The circuit layer 201 is formed, and an air gap t is formed between the first side 20a of the package module 2a and the antenna module 2b.

In this embodiment, the antenna module 2b includes an antenna substrate 28, which is, for example, a package substrate with a core layer and a circuit structure or a circuit structure without a core layer (coreless). For example, the antenna substrate 28 forms a plurality of antenna main layers 280 and at least one signal contact 281 on the dielectric material, so that the conductive elements 27 are combined with the signal contact 281 . It should be understood that the antenna module 2b can be configured with related elements on the antenna substrate 28 according to requirements, and there is no particular limitation.

Furthermore, the antenna module 2b is a non-flexible structure. Alternatively, the antenna module 2b is a flexible structure (such as the bending shape shown in FIG. 2C'), which enables the antenna substrate 28' to adjust the bending angle arbitrarily according to requirements, and not only can match the electronic product 9 (such as a smart phone), and can adjust and change the signal emission direction of the main layer 280 of the antenna.

In addition, the antenna module 2b is superimposed on the first joint portion 251 of the flexible circuit board 25 from the viewing angle of the first side 20a. For example, the antenna substrate 28 extends to the outer contact area B of the package module 2a. Therefore, the electronic device 2 can make the overall volume of the electronic product 9 ( such as width) is reduced in order to meet the needs of miniaturization.

In addition, it should be understood that there are various types of the antenna module 2b, which are not limited to the above.

In subsequent applications, as shown in FIG. 2D, the connector 26 can be connected to the connection port 900 of the motherboard 90 of the electronic product 9, so that the electronic device 2 is electrically connected to the motherboard 90, so that the The electronic device 2 is integrated in the electronic product 9 .

It should be understood that the electronic device 2 can be arranged according to the internal space of the electronic product 9 . For example, when the motherboard 90 of the electronic product 9 is far away from the electronic device 2, as in the first As shown in Figure 2D', the connector 26 and the connection port 900 are electrically connected by an adaptor 8, wherein the adaptor 8 is, for example, a double-head connecting component, which has a circuit board 80, a device A first transfer port 81 on the circuit board 80 and electrically connected to the connector 26 , and a second transfer port 82 on the circuit board 80 and electrically connected to the connection port 900 . Alternatively, when the internal space of the electronic product 9 is narrow, the flexible circuit board 25 can be bent, and the orientation of the first joint portion 251 and the orientation of the second joint portion 252 form an included angle of about 90 degrees (but the The angle can be adjusted arbitrarily, not limited to this), as shown in Figure 2D", in order to facilitate the design of other components of the electronic product 9, wherein the electronic product 9 can be fixed by the support frame 91. The package module 2a and/or the antenna module 2b.

FIGS. 3A to 3B are schematic cross-sectional views of the second embodiment of the manufacturing method of the electronic device 3 of the present invention. The main difference between this embodiment and the first embodiment lies in the configuration of the antenna module and its manufacturing steps. Other components are substantially the same, so the same points will not be repeated below.

As shown in FIG. 3A, the antenna module 3b is firstly disposed on the active area A of the package module 2a.

In this embodiment, the antenna module 3b does not extend to the outer region B. As shown in FIG. For example, the antenna substrate 28 does not extend above the outer contact area B of the package module 2a.

As shown in FIG. 3B , then the flexible circuit board 25 with the connector 26 is disposed on the external connection area B of the package module 2a, so that the antenna module 3b is staggered (not superimposed) on the flexible circuit board 25 . Flexible circuit board 25 .

Therefore, compared with the fabrication of the electronic device 2 of the first embodiment, the electronic device 3 of the present embodiment is designed to stagger (not overlap) the flexible circuit board 25 due to the antenna module 3b during the fabrication process. , the step of "soldering the flexible circuit board 25 on the external connection area B of the package module 2a" is more flexible than the first embodiment. The electronic device 2 of the first embodiment is because the antenna module 2b is perpendicular to the The direction of the first side 20a (such as the upper and lower directions) is superimposed on the flexible circuit board 25, so the fabrication of this step can only be performed in a packaging factory, while this implementation can be performed in a packaging factory, a system assembly factory or other manufacturers Therefore, the flexibility of the process can be increased, and the cost of the electronic product 9 can be reduced.

FIGS. 4A to 4D are schematic cross-sectional views of the third embodiment of the manufacturing method of the electronic device 4 of the present invention. The main difference between this embodiment and the first embodiment lies in the configuration of the flexible circuit board and its manufacturing steps.

As shown in FIG. 4A, a flexible circuit board 45 formed with at least one opening 450 is provided, and the conductive element 27 is formed on the signal contact 281 of the antenna module 2b, and on other electrical contacts A plurality of conductive elements 47 such as solder balls are formed on the 282, and then the antenna module 2b is electrically connected to the flexible circuit board 45 through the plurality of conductive elements 47 such as solder balls, and at the same time, the conductive elements 27 pass through the The openings 450 are arranged so that the antenna module 2b is arranged corresponding to the openings 450 , so that the signal contacts 281 of the antenna module 2b correspond to the openings 450 .

In this embodiment, the openings 450 are connected to the first surface 45a and the second surface 45b of the flexible circuit board 45, and the number of the openings 450 corresponds to the number of the signal contacts 281 of the antenna module 2b. Quantity, such as the two openings 450 shown in FIG. 4A'.

Furthermore, the opening 450 is located between the first joint portion 451 and the second joint portion 452 of the flexible circuit board 45 , so that the antenna module 2b is disposed on the first joint portion 451 and the second joint portion 452 . between sections 452.

In addition, at least one functional module 4b can be disposed on the second surface 45b of the first joint portion 451 of the flexible circuit board 45 . For example, the functional module 4b has an antenna structure 480 . Specifically, the functional module 4b is configured with the antenna structure 480 in the form of an antenna board (eg, the antenna substrate 28 ), and the functional module 4b is electrically connected to the flexible circuit through a plurality of conductive elements 47 such as solder balls plate 45. It should be understood that the function module 4b can be configured with required functions according to requirements, and is not limited to the antenna function.

As shown in FIG. 4B, the package module 2a is combined with the conductive elements 27 in the openings 450 with the circuit layer 201 on the first side 20a of the package module 2a, so that the package module 2a is arranged on the flexible circuit board On the first surface 45a of 45, the packaging module 2a is electrically connected to the flexible circuit board 45 through the conductor 250, the packaging module 2a is electrically connected to the antenna module 2b, and the Part of the area of the flexible circuit board 45 overlaps with the active area A of the package module 2a.

In this embodiment, the package module 2a and/or the antenna module 2b are located between the first joint portion 451 and the second joint portion 452 of the flexible circuit board 45 .

Furthermore, an air gap t is formed between the packaging module 2a and the antenna module 2b, and the positions of the openings 450 are located on the area of the air gap t.

Therefore, through the design of the opening 450, the conductive element 27 does not contact the flexible circuit board 45, so the package module 2a can directly electrically connect the antenna module 2b with the conductive element 27, so as to avoid The transmission signal generates electrical loss when passing through the flexible circuit board 45 , thereby enhancing the stability of the antenna signal and increasing the transmission speed.

As shown in FIG. 4C , the connector 26 is disposed on the second joint portion 452 of the flexible circuit board 45 .

In this embodiment, the connector 26 is connected to the first surface 45 a of the flexible circuit board 45 , that is, the connector 26 and the package module 2 a are located on the same side relative to the flexible circuit board 45 . . In other embodiments, the connector 26 and the package module 2a are located on different sides relative to the flexible circuit board 45 (as shown in the position of the connector 26 in FIG. 2C ). further, no Regardless of the position of the connector 26 , the connector 26 can be mounted on the flexible circuit board 45 together with the components on the same side (eg, the package module 2 a or the antenna module 2 b ).

It should be understood that the configuration of the functional module 4b can be omitted according to requirements, so that the first joint portion 451' of the flexible circuit board 45 only extends below the active area A without protruding out of the packaging module 2a. side, as shown in Figure 4C'.

Furthermore, the flexible circuit board 45 can be bent, and the orientation of the first joint portion 451 and the orientation of the second joint portion 452 form an included angle of about 90 degrees (but the angle of the included angle can be adjusted arbitrarily, not limited to this). ), as shown in FIG. 4D, so that the function module 4b can be arbitrarily adjusted in position according to requirements, not only can match the structural configuration in the electronic product 9 (such as a smart phone), but also can adjust and change the antenna structure 480 direction of signal transmission.

Therefore, the electronic devices 2 , 3 , and 4 of the present invention mainly use the design of the flexible circuit boards 25 , 45 to electrically connect the antenna modules 2 b , 3 b and the packaging module 2 a to the motherboard 90 at the system end , so that the antenna modules 2b, 3b (or the function module 4b) can be arranged near the casing 9a of the electronic product 9 according to the signal strength and/or angle requirements (as shown in Fig. 2D" or 4D), so Compared with the prior art, when the antenna modules 2b, 3b (or the function module 4b) are located near the casing 9a of the electronic product 9, the design of the flexible circuit boards 25, 45 , so that the electrical connection between the antenna modules 2b, 3b and the packaging module 2a and the motherboard 90 on the system side is not limited by the position of the antenna modules 2b, 3b (or the function module 4b), so the electronic product The design of other internal components (such as the motherboard 90 ) of 9 is also not limited by space, so that the electronic product 9 can meet preset functions according to requirements.

Furthermore, the number of the antenna modules 2b, 3b (or the functional modules 4b) on the flexible circuit boards 25, 45 can be adjusted according to requirements, and even the antenna module 2b adopts a flexible structure (eg, the number of the antenna modules 2b). The design of the antenna substrate 28') shown in Figure 2C' enables the angle of the antenna's emission direction to be adjusted according to the needs of the electronic product 9, so as to enhance the strength of the antenna signal.

In addition, by disposing the connector 26 on the flexible circuit boards 25, 45, the size of the mold used in the packaging process only needs to match the volume of the antenna modules 2b, 3b and the packaging module 2a, without the need for Considering that the connector 26 is packaged, that is, the antenna modules 2b, 3b and/or the packaging module 2a do not need to accommodate the connector 26, so compared with the prior art, the electronic devices 2, 3, 4 of the present invention can be effectively The volume of the antenna modules 2b, 3b and the packaging module 2a is reduced to improve the utilization rate of the internal space of the system side (or the electronic product 9) and reduce the packaging cost (eg, the connector 26 does not need to be packaged).

In addition, the antenna modules 2b, 3b and the packaging module 2a are electrically connected directly by the conductive element 27 without passing through the design of the flexible circuit boards 25, 45, so that the antenna modules 2b, 3b and the packaging module The electrical connection paths of the group 2a have no other interfering media (such as air gaps t), so the electronic devices 2, 3, and 4 of the present invention can avoid electrical losses when the transmission signals pass through the flexible circuit boards 25, 45 ( loss), thus enhancing the stability of the antenna signal and increasing the transmission speed.

The present invention further provides an electronic package 2 , 3 , 4 , which includes: a package module 2 a , an antenna module 2 b , 3 b , a flexible circuit board 25 , 45 and at least one connector 26 .

The packaging module 2a has an opposite first side 20a and a second side 20b, and the first side 20a defines a non-overlapping active area A and an external area B, wherein the packaging module 2a is At least one electronic component 21, 21' is included.

The antenna modules 2b, 3b are electrically connected to the active area A of the package module 2a through at least one conductive element 27, and the first side 20a of the package module 2a is connected to the antenna modules 2b, 3b There is an air gap t between them.

The flexible circuit boards 25, 45 are connected to the external connection area B of the package module 2a.

The connectors 26 are provided on the flexible circuit boards 25 and 45 .

In one embodiment, the antenna modules 2b, 3b are flexible structures or non-flexible structures.

In one embodiment, the antenna modules 2b, 3b are superimposed on or staggered from the flexible circuit board 25 from the viewing angle of the first side 20a.

In one embodiment, the flexible circuit board 25 has a first joint portion 251 and a second joint portion 252 disposed at opposite ends thereof, so that the first joint portion 251 is combined with the external connection of the package module 2a. Area B, and the second coupling portion 252 is coupled with the connector 26 .

In one embodiment, the flexible circuit board 45 overlaps the active area A of the packaging module 2a from the viewing angle of the first side 20a, and the flexible circuit board 45 is formed with at least one opening 450, so that the conductive element 27 passes through the opening 450 to connect the antenna module 2b and the packaging module 2a. For example, the number of the openings 450 corresponds to the number of the signal contacts 281 of the antenna module 2b.

In one embodiment, the electronic device 4 further includes at least one functional module 4 b disposed on the flexible circuit board 45 . For example, the flexible circuit board 45 has a first coupling portion 451 and a second coupling portion 452 disposed at opposite ends thereof, so that the first coupling portion 451 is coupled with the functional module 4b, and the second coupling portion is coupled with the functional module 4b. The part 452 is combined with the connector 26 and makes the package module 2a and/or the antenna module 2b located between the first joint part 451 and the second joint part 452 . Further, the functional module 4b has an antenna structure.

To sum up, the electronic device and the manufacturing method of the present invention are based on the design of the flexible circuit board, so that the antenna module can be installed on the casing of the electronic product according to the signal strength requirements. Therefore, the configuration of the flexible circuit board is not limited by the position of the antenna module, so the design of other components inside the electronic product will not be limited by space, so that the electronic product can meet the preset requirements according to requirements. Function.

Furthermore, by arranging the connector on the flexible circuit board, the size of the mold used in the packaging process only needs to match the volume of the antenna module and the packaging module, without the need to package the connector. The electronic device of the invention can effectively reduce the volume of the antenna module and the packaging module, so as to improve the utilization rate of the internal space of the system end (or the electronic product) and reduce the packaging cost.

The above embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Anyone skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the right of the present invention should be listed in the scope of the patent application described later.

2: Electronic device

2a: Package module

2b: Antenna module

20a: First side

20b: Second side

201: Circuit layer

21: Electronic Components

25: Flexible circuit board

26: Connector

27: Conductive elements

28: Antenna substrate

280: Antenna main layer

281: Signal contact

A: Action area

B: External area

t: air gap

Claims (20)

An electronic device, comprising: a package module, which includes at least one electronic component and has opposite first and second sides, and the first side defines a non-overlapping active area and an external area; an antenna module , which includes an antenna substrate, which is contacted and connected to the action area of the package module through at least one conductive element, and an air gap is formed between the first side of the package module and the antenna substrate; a flexible circuit board, which is The flexible circuit board is coupled to the external connection area of the package module and electrically connected to the package module, wherein the flexible circuit board has a first joint portion and a second joint portion disposed at opposite ends thereof, so as to use the first joint portion and the second joint portion at opposite ends of the flexible circuit board. A connecting part is used for connecting the flexible circuit board to the external connection area of the package module; and a connector is connected to the second connecting part of the flexible circuit board. The electronic device of claim 1, wherein the antenna substrate is a flexible structure or a non-flexible structure. The electronic device as claimed in claim 1, wherein the antenna substrate is superimposed on the flexible circuit board or displaced from the flexible circuit board from the viewing angle of the first side. The electronic device of claim 1, wherein the flexible circuit board is superimposed on the active area of the package module from the viewing angle of the first side, and the flexible circuit board is At least one opening is formed so that the conductive element passes through the opening to connect the antenna substrate and the package module. The electronic device as described in claim 4, wherein the number of the openings corresponds to the number of signal contacts on the antenna substrate. The electronic device as described in item 1 of the claimed scope further comprises at least one functional module disposed on the flexible circuit board. The electronic device of claim 6, wherein the flexible circuit board has a first joint portion and a second joint portion disposed at opposite ends thereof, so that the first joint portion is used for the flexible circuit board. The flexible circuit board is combined with the functional module, and the second combining part is used for combining the connector, and the package module and/or the antenna substrate are located between the first combining part and the second combining part. The electronic device as described in claim 6, wherein the functional module has an antenna structure. A method of manufacturing an electronic device, comprising: providing a package module including at least one electronic component, an antenna module including an antenna substrate, a flexible circuit board and a connector, wherein the package module has a first opposite side and a second side, and the first side defines a non-overlapping active area and an external area; and the antenna substrate is contacted and connected to the active area of the packaging module through at least one conductive element, so that the packaging module An air gap is generated between the first side and the antenna substrate, the flexible circuit board is connected to the external area of the package module, and the connector is arranged on the flexible circuit board, wherein the flexible circuit board is The flexible circuit board has a first joint portion and a second joint portion disposed at opposite ends of the flexible circuit board, so that the flexible circuit board can be combined with the external connection area of the package module by the first joint portion, and the The second coupling portion is used for coupling the connector. The method for manufacturing an electronic device as described in claim 9, wherein the antenna substrate is a flexible structure or a non-flexible structure. The manufacturing method of the electronic device as described in claim 9, wherein the antenna substrate is superimposed on the flexible circuit board or is displaced from the flexible circuit board in the viewing angle of the first side. The method for manufacturing an electronic device as described in claim 9, wherein the steps of arranging the package module, the antenna substrate, the flexible circuit board and the connector include: prior to arranging the flexible circuit board a connector and the packaging module; and then disposing the antenna substrate on the active area of the packaging module. The method for manufacturing an electronic device as described in claim 9, wherein the steps of arranging the package module, the antenna substrate, the flexible circuit board and the connector include: prior to arranging the flexible circuit board a connector, and the antenna substrate is arranged on the action area of the packaging module; and the flexible circuit board is then arranged on the external connection area of the packaging module. The method for manufacturing an electronic device as described in item 9 of the claimed scope, wherein the flexible circuit board is superimposed on the active area of the package module from the viewing angle of the first side, and the flexible circuit The board is formed with at least one opening, so that the conductive element passes through the opening to connect the antenna substrate and the package module. The method for manufacturing an electronic device as described in claim 14, wherein the step of arranging the package module, the antenna substrate and the flexible circuit board comprises: forming the opening before the flexible circuit board; then connecting the antenna substrate on the flexible circuit board, so that the antenna substrate is arranged corresponding to the opening; and Then, the package module is connected to the antenna substrate by passing the conductive element through the opening. The method for manufacturing an electronic device as described in claim 14, wherein the number of the openings corresponds to the number of signal contacts on the antenna substrate. The manufacturing method of the electronic device as described in item 9 of the scope of the patent application further includes arranging functional modules on the flexible circuit board. The method for manufacturing an electronic device as described in claim 17, wherein the steps of disposing the package module, the antenna substrate, the flexible circuit board and the functional module include: prior to the flexible circuit board disposing the antenna substrate and the functional module; and then disposing the packaging module on the flexible circuit board. The method for manufacturing an electronic device as described in claim 17, wherein the flexible circuit board has a first joint portion and a second joint portion disposed at opposite ends of the flexible circuit board, so that the first joint portion is used for The flexible circuit board is combined with the functional module, and the second combining part is used for combining the connector, and the package module and/or the antenna substrate are located between the first combining part and the second combining part between. The method for manufacturing an electronic device as described in claim 17, wherein the functional module has an antenna structure.

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