CN113534360A - Optical module - Google Patents
Optical module Download PDFInfo
- Publication number
- CN113534360A CN113534360A CN202010322829.9A CN202010322829A CN113534360A CN 113534360 A CN113534360 A CN 113534360A CN 202010322829 A CN202010322829 A CN 202010322829A CN 113534360 A CN113534360 A CN 113534360A
- Authority
- CN
- China
- Prior art keywords
- optical
- signal
- wavelength
- electrically connected
- optical signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 308
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 39
- 239000010703 silicon Substances 0.000 claims abstract description 39
- 238000012216 screening Methods 0.000 claims abstract description 21
- 239000013307 optical fiber Substances 0.000 claims description 47
- 230000003321 amplification Effects 0.000 claims description 18
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 abstract description 22
- 238000000034 method Methods 0.000 description 10
- 238000004891 communication Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000010365 information processing Effects 0.000 description 6
- 230000002457 bidirectional effect Effects 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000000835 fiber Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29379—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device
- G02B6/29398—Temperature insensitivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
- G02B6/425—Optical features
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
The application discloses optical module, including circuit board, the light source that is used for exporting broadband light signal, silicon optical chip and the wavelength tuning control chip that is used for sending wavelength tuning control signal. The silicon optical chip is internally provided with a wavelength screening device, a modulator and an optical switch which are electrically connected in sequence. The modulator modulates the data carrier on the optical signal with the specific wavelength to obtain the optical signal with the specific wavelength carrying the data. The light source and the wavelength screening device are respectively an inner cavity and an outer cavity of the outer cavity semiconductor laser, the outer cavity semiconductor laser continuously works, the outer cavity semiconductor laser continuously outputs a specific wavelength optical signal, and the optical switch realizes the burst emission on or off of the specific wavelength optical signal carrying data. Because the external cavity semiconductor laser continuously works and the temperature of the external cavity semiconductor laser is unchanged, wavelength drift caused by temperature difference between burst opening and shutting of a light source is avoided, and the wavelength of emitted light in the intrinsic channel can not influence the normal service of an adjacent channel.
Description
Technical Field
The application relates to the technical field of optical fiber communication, in particular to an optical module.
Background
In an application scenario of the NGPON2, an ONU (Optical network unit) needs to send an Optical signal with a specific wavelength according to an instruction sent by an OLT (Optical Line Terminal). Since the optical signal emitted by the ONU may be an optical signal composed of multiple wavelength bands, the optical signal emitted by the ONU needs to be tuned.
The conventional tuning method is to control the operating temperature of a laser in an optical module by a TEC (Thermoelectric cooler) so that the laser outputs emitted light with different wavelengths.
Due to a temperature drift coefficient between the operating temperature of the laser and the wavelength of the emitted light. Generally, the wavelength of the emitted light is shifted by 0.1-0.15 nm/DEG C, i.e., one degree per liter or one degree lower. When the temperature difference is large enough, the wavelength of the emitted light of the intrinsic channel may shift to the adjacent channel, causing normal traffic of the adjacent channel, and in severe cases causing the adjacent channel to fail to operate.
Disclosure of Invention
The application provides an optical module to achieve that the wavelength of emitted light in an intrinsic channel does not affect normal services of adjacent channels.
A light module, comprising:
a circuit board;
the light source is arranged on the circuit board and used for outputting a broadband optical signal;
the silicon optical chip is arranged on the circuit board and is connected with the light source through a light path;
the wavelength tuning control chip is electrically connected with the silicon optical chip and used for sending a wavelength tuning control signal;
the silicon optical chip is internally provided with:
the wavelength screening device is connected with the light source through a light path and used for selecting a specific wavelength optical signal from the broadband optical signals according to the wavelength tuning control signal;
the modulator is connected with the wavelength screening device and used for modulating the data carrier on the optical signal with the specific wavelength to obtain the optical signal with the specific wavelength carrying data;
and the optical switch is used for controlling the burst emission of the optical signal with the specific wavelength carrying the data to be switched on or switched off according to the switching-on or switching-off signal.
Has the advantages that: the application provides an optical module, including circuit board, the light source that is used for exporting broadband light signal, silicon optical chip and the wavelength tuning control chip that is used for sending wavelength tuning control signal. The silicon optical chip is internally provided with a wavelength screening device, a modulator and an optical switch, wherein one end of the wavelength screening device is connected with the light source through a light path, the other end of the wavelength screening device is electrically connected with one end of the modulator, and the other end of the modulator is electrically connected with the optical switch. The wavelength screening device is used for selecting a specific wavelength optical signal from the broadband optical signals according to the wavelength tuning control signal. The modulator is used for modulating the data carrier wave on the specific wavelength optical signal to obtain the specific wavelength optical signal carrying data. The optical switch is used for controlling the burst transmission of the optical signal with the specific wavelength carrying data to be switched on or switched off according to the switching-on or switching-off signal. In the application, the light source and the wavelength screening device are respectively an inner cavity and an outer cavity of the outer cavity semiconductor laser, the outer cavity semiconductor laser continuously works, the outer cavity semiconductor laser continuously outputs a specific wavelength optical signal, and the optical switch realizes the burst emission on or off of the specific wavelength optical signal carrying data. Because the external cavity semiconductor laser continuously works and the temperature of the external cavity semiconductor laser is unchanged, wavelength drift caused by temperature difference between burst opening and shutting of a light source can be avoided, and the wavelength of emitted light in the intrinsic channel can not influence the normal service of an adjacent channel; the problem of slow response of rapid burst turn-on and turn-off can also be avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
FIG. 2 is a schematic diagram of an optical network unit;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present invention;
FIG. 4 is an exploded view of an optical module according to an embodiment of the present invention;
fig. 5 is a schematic view of a partial structure of an optical module according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.
The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;
one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.
The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.
At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.
The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.
Fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an optical module according to an embodiment of the present invention. As shown in fig. 3 and 4, the optical module 200 according to the embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, a silicon optical chip 400, a light source 500, an optical fiber socket 600, and a wavelength tuning control chip 700;
the upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.
The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect the silicon optical chip 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the silicon optical chip 400 are positioned in the packaging cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the silicon optical chip 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the optical module; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.
The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).
And the MCU is used for receiving the wavelength selection information sent by the upper computer, outputting a wavelength selection control instruction and outputting a starting or closing signal. The opening or closing signal output by the MCU is directly transmitted to the light switch through the golden finger.
The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.
The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.
A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.
The silicon optical chip 400 is arranged on the circuit board 300 and electrically connected with the circuit board 300, and specifically can be wire bonding connection; the periphery of the silicon optical chip is connected to the circuit board 300 by a plurality of conductive wires, so the silicon optical chip 400 is generally disposed on the surface of the circuit board 300.
The silicon optical chip 400 is connected with the light source 500 through a light path, receives light from the light source 500, and modulates the light, specifically, loads a signal on the light; the silicon optical chip 400 receives light from the fiber optic receptacle 600, and converts the optical signal into an electrical signal.
The silicon optical chip 400 and the optical fiber receptacle 600 are optically connected by the optical fiber ribbon 401, and the optical fiber receptacle 600 is optically connected to an optical fiber outside the optical module. The light modulated by the silicon optical chip 400 is transmitted to the optical fiber socket 600 through the optical fiber ribbon 401, and is transmitted to the external optical fiber through the optical fiber socket 600; light transmitted from the external optical fiber is transmitted to the optical fiber ribbon 401 through the optical fiber socket 600, and is transmitted to the silicon optical chip 400 through the optical fiber ribbon 401; therefore, the silicon optical chip 400 outputs light carrying data to the optical module external optical fiber or receives light carrying data from the optical module external optical fiber.
The light source 500 is an SOA (semiconductor optical amplifier). The principle of SOA is similar to but different from rare earth doped fiber amplifiers, and its amplification characteristics depend mainly on the dielectric properties of the active layer and the characteristics of the laser cavity. Although it is also a population inversion amplification light emitting, the light emitting medium is an unbalanced carrier, i.e., an electron-hole pair, not a rare element.
The SOA acts as an internal cavity or an intrinsic cavity of an external cavity semiconductor laser.
The SOA is used to output a wide spectrum optical signal. Specifically, the SOA outputs a wide-spectrum dc optical signal according to the received bias current, and couples the wide-spectrum dc optical signal with the silicon optical chip 400.
The light source 500 and the circuit board 300 are electrically connected, and may be connected through a flexible board. The light source 500 may be disposed on the surface of the circuit board 300, or may be disposed outside the circuit board 300. Therefore, in the present application, the positions of the light source 500 and the circuit board 300 are not limited.
A temperature adjusting electric device such as a TEC may be disposed in the light source 500 to realize temperature control for the laser chip, and the temperature adjusting electric device obtains power supply driving from the outside of the light source 500 through a flexible board.
Fig. 5 is a partial schematic view of an optical module provided in the present application. As shown in fig. 5, the present application provides a circuit board on which a wavelength tuning control chip 700 and a modulation driver 800 are disposed.
One end of the wavelength tuning control chip 700 is electrically connected to the silicon optical chip 400, and is configured to send a wavelength tuning control signal. Specifically, the wavelength tuning control chip 700 has one end electrically connected to the MCU and the other end electrically connected to the silicon optical chip 400, and sends a wavelength tuning control signal according to a received signal output by the MCU.
The modulation driver 800 may be disposed on the upper surface of the silicon optical chip 400 or on the circuit board 300, and is configured to provide the silicon optical chip 400 with a data signal from the optical network terminal, where the data signal is a modulation signal.
As shown in fig. 4 and 5, a silicon optical chip 400 of the present application is provided with a wavelength screening device 402, a modulator 403, an optical switch 404, a spot size converter 405, a first optical multiplexing component 406, a PSR407, a second optical multiplexing component 408, and a plurality of PDs 409.
In particular, the method comprises the following steps of,
the wavelength selective device 402 acts as an external cavity. An external cavity semiconductor laser is a laser in which an external cavity is introduced outside an internal cavity. The external cavity semiconductor laser continuously works, the temperature of the external cavity semiconductor laser is unchanged, wavelength drift caused by temperature difference between burst opening and shutting of a light source can be avoided, and the wavelength of emitted light in the intrinsic channel can not influence the normal service of an adjacent channel; the problem of slow response of rapid burst turn-on and turn-off can also be avoided.
The wavelength screening device 402 has a first end connected to the light source 500 through an optical path, a second end electrically connected to the first end of the modulator 403, and a third end electrically connected to the wavelength tuning control chip 700, and is configured to select a specific wavelength optical signal from the broad-spectrum optical signals according to the wavelength tuning control signal. In particular, the method comprises the following steps of,
the wavelength screening device 402 includes a microring waveguide. The micro-ring waveguide changes the refractive index of the micro-ring waveguide according to the wavelength tuning control signal so as to realize the selection of the optical signal with specific wavelength. At this time, the optical signal output by the wavelength selective device 402 is also direct current light, but the wavelength after the wavelength selection is specifically one of 1532.68nm,1533.47nm,1534.25nm and 1535.04 nm.
The Modulator 403 is an MZM Modulator (Mach Zehnder Modulator) for modulating light that does not carry data. Specifically, the mach-zehnder modulator adopts the same-wavelength optical interference principle to provide two beams of light with the same wavelength and without data to the mach-zehnder modulator, and after the two beams of light with data are modulated by the mach-zehnder modulator, the two beams of light with data are fused into a beam of light with data. Because the silicon-based modulator does not emit light, the modulation of the light can be directly turned off by turning off the light source.
And a second end of the modulator 403 is electrically connected to the first end of the optical switch 404, and is configured to modulate a data carrier onto the optical signal with the specific wavelength to obtain the optical signal with the specific wavelength carrying data. Specifically, the modulator 403 modulates the data carrier onto the specific wavelength optical signal according to the received modulation signal output by the modulation driver 800, so as to obtain the specific wavelength optical signal carrying data.
The Optical switch 404, which is a VOA (Variable Optical Attenuator), implements real-time control of the signal by attenuating the transmitted Optical power.
And a second terminal of the optical switch 404 is electrically connected to the first terminal of the first optical multiplexing component 406, and is configured to control, according to the on or off signal, to turn on or off burst transmission of the optical signal with the specific wavelength for carrying data. In particular, the method comprises the following steps of,
when the optical switch 404 receives the start signal, the optical switch 404 is turned on, the modulator 403, the optical switch 404 and the first optical multiplexing component 406 are turned on, burst transmission of the optical signal with the specific wavelength carrying the data is turned on, and the optical signal with the specific wavelength carrying the data is transmitted to the first optical multiplexing component 406 through the VOA; when the optical switch 404 receives the close signal, the optical switch 404 is closed, the modulator 403, the optical switch 404 and the first optical multiplexing component 406 are closed, the burst transmission of the optical signal with the specific wavelength carrying data is closed, and the optical signal with the specific wavelength carrying data cannot be transmitted to the first optical multiplexing component 406.
Because the turn-on or turn-off of the VOA can achieve nanosecond-level response, the VOA can be used in the application to achieve turn-on or turn-off of burst emission of the optical signal with the specific wavelength carrying data.
The external cavity semiconductor laser works continuously, so that the difference of wavelength drift caused by the temperature difference between the burst opening and the burst closing of the light source can be avoided; the problem of slow response of rapid burst turn-on and turn-off can also be avoided. However, since one OLT corresponds to a plurality of ONUs, in order to prevent the light output by the ONUs during polling operation from colliding, it is necessary to utilize an optical switch in an optical module to implement burst transmission of a specific wavelength optical signal carrying data to be turned on or off.
A spot size converter 405 coupled to the optical fiber ribbon 401 at a first end thereof for shaping and/or sizing the light of the specific wavelength carrying the data to improve the coupling efficiency into the optical fiber ribbon 401.
The optical signals transmitted to the optical fiber ribbon 401 from the light source 500 are all uplink optical signals, and the optical signals transmitted to the optical module from the optical fiber ribbon 401 are all downlink optical signals. In the application, the wave bands of the uplink optical signals are 1530-1540 nm, specifically 1532.68nm,1533.47nm,1534.25nm and 1535.04nm, and the wavelength bands of the downlink signals are 1595-1600 nm, specifically 1596.34nm, 1597.19nm, 1598.04nm and 1598.89 nm.
And a first optical multiplexing component 406, having a first end electrically connected to the optical switch 404 and a second end optically connected to the second end of the spot size converter 405, for transmitting the optical signal with the data-carrying specific wavelength to the optical fiber ribbon 401 or transmitting the downstream optical signal transmitted by the optical fiber ribbon 401 to the silicon optical chip 400. In particular, the method comprises the following steps of,
the first optical multiplexing component 406 is a first MUX (multiplexer). The first multiplexer is adopted to enable the multiple data messages to share one channel. Multiple optical signals with specific wavelengths are transmitted to optical fiber ribbon 401 through the first MUX, and multiple upstream optical signals transmitted from optical fiber ribbon 401 are transmitted to silicon optical chip 400 through the first MUX. For example, 1532.68nm,1533.47nm,1534.25nm, and 1535.04nm may all be transmitted to ribbon 401 via the first MUX; 1596.34nm, 1597.19nm, 1598.04nm and 1598.89nm are transmitted to the silicon photonics chip 400 through the first MUX.
And a first MUX, a first terminal of which is electrically connected to the optical switch 404, and a second terminal of which is electrically connected to a second terminal of the spot size converter 405. When optical switch 404 is turned on, an optical signal of a particular wavelength carrying data is transmitted to fiber ribbon 401 by modulator 403, optical switch 404, first MUX and spot size converter 405 in that order.
The tuning of the emitted optical signal is realized by combining the components, and the specific process is as follows: the light source 500 emits a broad-spectrum optical signal, the wavelength screening device 402 screens the received broad-spectrum optical signal out a specific wavelength optical signal according to the wavelength tuning control signal, the specific wavelength optical signal is modulated by the modulator 403 to obtain a specific wavelength optical signal carrying data, and the optical switch 404 implements on and off of the optical switch according to the received on or off signal, so as to implement transmission of the specific wavelength optical signal carrying data to the first optical multiplexing component 406 and to the optical fiber ribbon 401 through the spot size converter 405.
A PSR (polarization beam splitter-rotator) 407, a first end of which is electrically connected to the third end of the first optical multiplexing component 406, for converting the TM mode downlink optical signal into the TE mode downlink optical signal. In particular, the method comprises the following steps of,
the downstream optical signal has a TM mode form and also a TE mode form. After being converted by PSR407, the TM mode downlink optical signal is converted into a TE mode downlink optical signal; the downstream optical signal in TE mode is unchanged by passing through PSR 407. At this time, the PSR407 outputs two downstream optical signals in the form of TE modes.
A second optical multiplexing component 408, a first end of which is electrically connected to the second end of the PSR407, for separating the downlink optical signal into multiple optical signals. In particular, the method comprises the following steps of,
the second optical multiplexing component 408 includes a second MUX and a third MUX. And a first end of the second MUX is connected with the second end of the PSR, and the rest ends of the second MUX are respectively and electrically connected with the first ends of the PDs 409. And a first end of the third MUX is connected with the second end of the PSR407, and the rest ends of the third MUX are respectively and electrically connected with the second ends of the PDs 409.
A plurality of PDs (photo detectors) 409 electrically connected to the second optical multiplexer 408 respectively for converting the plurality of optical signals into a plurality of corresponding current signals.
The number of remaining terminals of the second MUX and the third MUX is the same as the number of PDs 409. When the number of PDs 409 is 4, the number of the remaining terminals of the second MUX and the third MUX is 4. For example, the second terminal of the second MUX and the second terminal of the third MUX are both electrically connected to the first PD, the third terminal of the second MUX and the third terminal of the third MUX are both electrically connected to the second PD, the fourth terminal of the second MUX and the fourth terminal of the third MUX are both electrically connected to the third PD, and the fifth terminal of the second MUX and the fifth terminal of the third MUX are both electrically connected to the fourth PD.
When the number of the PDs 409 is 4, the second MUX and the third MUX separate the downlink optical signal into four optical signals, specifically 1596.34nm, 1597.19nm, 1598.04nm and 1598.89nm, and then transmit the four optical signals to the four PDs 409, respectively, and the four PDs 409 convert the received optical signals into corresponding current signals, respectively.
As shown in fig. 4 and 5, the circuit board provided by the present application is further provided with a transimpedance amplification array 301, a selection switch 302, and a limiting amplification chip 303.
One end of the transimpedance amplification array 301 is electrically connected to the PDs 409 respectively, and is configured to convert the multiple current signals into multiple voltage signals.
The transimpedance amplification array 301 includes four transimpedance amplification chips, and one end of one transimpedance amplification chip is electrically connected to one PD.
A selection switch 302 having one end electrically connected to the transimpedance amplification array 301, for selecting one voltage signal from the plurality of voltage signals. In particular, the method comprises the following steps of,
the selection switch 302 receives a channel selection signal provided by the MCU, selects a voltage signal from a plurality of voltage signals according to a channel selected by the onu, and transmits the voltage signal to the limiting amplifier chip 403.
One end of the amplitude limiting amplification chip 303 is electrically connected with the selection switch 302, and the amplitude limiting amplification chip amplifies the voltage signal and outputs the amplified voltage signal through the golden finger of the optical module. Specifically, the amplitude limiting amplifier chip 303 amplifies the voltage signal output by the selection switch 302 and outputs the amplified voltage signal via the gold finger of the optical module.
The selection of the received optical signal is achieved in combination with the above-described devices. The specific process is as follows: the downlink optical signal transmitted by the optical fiber ribbon 401 is transmitted to the silicon optical chip 400 through the first optical multiplexing component 406, the TM mode downlink optical signal is converted into the TE mode downlink optical signal through the PSR407, the two paths of TE mode optical signals are divided into four paths of downlink optical signals through the second MUX and the third MUX, the four paths of downlink optical signals are converted into corresponding current signals through the PD409, the four paths of current signals are converted into corresponding voltage signals through the transimpedance amplification array 301, the four paths of voltage signals are selected by the selection switch 302 and then output one path of voltage signal, and the limiter amplification chip 303 amplifies the voltage signal and outputs the amplified voltage signal through the golden finger of the optical module.
In the application, the tuning of the emitted light signal is realized through the external cavity semiconductor laser, the MZM modulator and the VOA, and the selection of the light receiving signal is realized through the first light multiplexing component, the PSR, the second light multiplexing component, the transimpedance amplification array, the selection switch and the amplitude limiting amplification chip.
The application provides an optical module, including circuit board, the light source that is used for exporting broadband light signal, silicon optical chip and the wavelength tuning control chip that is used for sending wavelength tuning control signal. The silicon optical chip is internally provided with a wavelength screening device, a modulator and an optical switch, wherein one end of the wavelength screening device is connected with the light source through a light path, the other end of the wavelength screening device is electrically connected with one end of the modulator, and the other end of the modulator is electrically connected with the optical switch. The wavelength screening device is used for selecting a specific wavelength optical signal from the broadband optical signals according to the wavelength tuning control signal. The modulator is used for modulating the data carrier wave on the specific wavelength optical signal to obtain the specific wavelength optical signal carrying data. The optical switch is used for controlling the burst transmission of the optical signal with the specific wavelength carrying data to be switched on or switched off according to the switching-on or switching-off signal. In the application, the light source and the wavelength screening device are respectively an inner cavity and an outer cavity of the outer cavity semiconductor laser, the outer cavity semiconductor laser continuously works, the outer cavity semiconductor laser continuously outputs a specific wavelength optical signal, and the optical switch realizes the burst emission on or off of the specific wavelength optical signal carrying data. Because the external cavity semiconductor laser continuously works and the temperature of the external cavity semiconductor laser is unchanged, wavelength drift caused by temperature difference between burst opening and shutting of a light source can be avoided, and the wavelength of emitted light in the intrinsic channel can not influence the normal service of an adjacent channel; the problem of slow response of rapid burst turn-on and turn-off can also be avoided.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (9)
1. A light module, comprising:
a circuit board;
a light source for outputting a broad spectrum optical signal;
the silicon optical chip is arranged on the circuit board and is connected with the light source through a light path;
the wavelength tuning control chip is electrically connected with the silicon optical chip and used for sending a wavelength tuning control signal;
the silicon optical chip is internally provided with:
the wavelength screening device is connected with the light source through a light path and used for selecting a specific wavelength optical signal from the broad spectrum optical signal according to the wavelength tuning control signal;
the modulator is connected with the wavelength screening device and used for modulating a data carrier on the specific wavelength optical signal to obtain the specific wavelength optical signal carrying data;
and the optical switch is used for controlling the burst emission of the optical signal with the specific wavelength carrying the data to be switched on or switched off according to the switching-on or switching-off signal.
2. The light module of claim 1, wherein the light switch is configured to:
when receiving a starting signal, starting burst transmission of a specific wavelength optical signal carrying data;
when a shutdown signal is received, burst transmission of the optical signal of the particular wavelength carrying the data is shut down.
3. The optical module of claim 1, wherein the wavelength screening device is a micro-ring waveguide;
and the micro-ring waveguide is used for changing the refractive index of the micro-ring waveguide according to the wavelength tuning control signal so as to realize the selection of the optical signal with the specific wavelength.
4. The optical module according to claim 2, wherein the circuit board is further provided with an MCU;
and the MCU is used for outputting a starting or closing signal.
5. The optical module of claim 1, further comprising:
the first end of the spot size converter is coupled with the optical fiber ribbon;
the first optical multiplexing component is electrically connected with the optical switch at a first end, and electrically connected with the second end of the spot size converter at a second end, and is used for transmitting a specific wavelength optical signal carrying data to an optical fiber ribbon or transmitting a downlink optical signal transmitted by the optical fiber ribbon to a silicon optical chip;
a first end of the PSR is electrically connected with a third end of the first optical multiplexing component and is used for converting the downlink optical signal of the TM mode into the downlink optical signal of the TE mode;
a second optical multiplexing component, a first end of which is electrically connected with a second end of the PSR, for separating the downlink optical signal into multiple optical signals;
and the PDs are respectively and electrically connected with the second optical multiplexing component and are used for converting the multi-path optical signals into corresponding multi-path current signals.
6. The optical module of claim 5, wherein the first optical multiplexing component is a first MUX;
the first MUX has a first end electrically connected to the optical switch and a second end optically connected to the second end of the spot size converter 405.
7. The light module of claim 5, wherein the second light multiplexing component comprises:
a first end of the second MUX is connected with the second end of the PSR, and the remaining ends of the second MUX are respectively electrically connected with the first ends of the PDs;
and a first end of the third MUX is connected with the second end of the PSR, and the rest ends of the third MUX are respectively and electrically connected with the second ends of the PDs.
8. The optical module according to claim 4, wherein the circuit board further comprises:
one end of the transimpedance amplification array is electrically connected with the PDs respectively and used for converting the multi-path current signals into multi-path voltage signals;
a selection switch, one end of which is electrically connected with the transimpedance amplification array and is used for selecting one voltage signal from a plurality of voltage signals;
and one end of the amplitude limiting amplification chip is electrically connected with the selection switch, and the voltage signal is amplified and then output through the golden finger of the optical module.
9. The optical module according to claim 1, wherein the circuit board further has disposed thereon:
and the modulation driver is used for outputting a modulation signal for the modulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010322829.9A CN113534360A (en) | 2020-04-22 | 2020-04-22 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010322829.9A CN113534360A (en) | 2020-04-22 | 2020-04-22 | Optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113534360A true CN113534360A (en) | 2021-10-22 |
Family
ID=78124050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010322829.9A Pending CN113534360A (en) | 2020-04-22 | 2020-04-22 | Optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113534360A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103916195A (en) * | 2014-04-14 | 2014-07-09 | 四川华拓光通信股份有限公司 | Multi-wavelength light receiving device |
| CN104104011A (en) * | 2014-08-08 | 2014-10-15 | 武汉光迅科技股份有限公司 | Broadband tunable laser |
| CN104297854A (en) * | 2014-11-05 | 2015-01-21 | 武汉邮电科学研究院 | Silicon-based multi-wavelength light source and implementation method thereof |
| CN104459881A (en) * | 2014-12-31 | 2015-03-25 | 武汉邮电科学研究院 | Wavelength division multiplexing type silicon substrate optical receiving chip insensitive to polarization |
| CN104539370A (en) * | 2014-12-22 | 2015-04-22 | 青岛海信宽带多媒体技术有限公司 | Laser and optical module |
| CN104966989A (en) * | 2015-06-29 | 2015-10-07 | 武汉光迅科技股份有限公司 | External cavity laser with tunable wavelength and adjustable light emitting module |
| CN106444092A (en) * | 2016-10-12 | 2017-02-22 | 华中科技大学 | Turnable filter made of silicon based micro-ring |
| WO2017028803A1 (en) * | 2015-08-20 | 2017-02-23 | 中兴通讯股份有限公司 | Olt optical transceiver module, and method and system for processing a plurality of pons |
| US9653882B1 (en) * | 2016-02-09 | 2017-05-16 | Oracle America, Inc. | Wavelength control of an external cavity laser |
| CN107294606A (en) * | 2017-07-26 | 2017-10-24 | 深圳市傲科光电子有限公司 | A kind of single-mode fiber bidirectional optical transceiver |
| CN107710528A (en) * | 2015-06-25 | 2018-02-16 | 华为技术有限公司 | The variable grid laser of fast tunable |
| CN109669248A (en) * | 2017-10-13 | 2019-04-23 | 苏州旭创科技有限公司 | Optical waveguide coupled encapsulating structure, installation method and optical module |
-
2020
- 2020-04-22 CN CN202010322829.9A patent/CN113534360A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103916195A (en) * | 2014-04-14 | 2014-07-09 | 四川华拓光通信股份有限公司 | Multi-wavelength light receiving device |
| CN104104011A (en) * | 2014-08-08 | 2014-10-15 | 武汉光迅科技股份有限公司 | Broadband tunable laser |
| CN104297854A (en) * | 2014-11-05 | 2015-01-21 | 武汉邮电科学研究院 | Silicon-based multi-wavelength light source and implementation method thereof |
| CN104539370A (en) * | 2014-12-22 | 2015-04-22 | 青岛海信宽带多媒体技术有限公司 | Laser and optical module |
| CN104459881A (en) * | 2014-12-31 | 2015-03-25 | 武汉邮电科学研究院 | Wavelength division multiplexing type silicon substrate optical receiving chip insensitive to polarization |
| CN107710528A (en) * | 2015-06-25 | 2018-02-16 | 华为技术有限公司 | The variable grid laser of fast tunable |
| CN104966989A (en) * | 2015-06-29 | 2015-10-07 | 武汉光迅科技股份有限公司 | External cavity laser with tunable wavelength and adjustable light emitting module |
| WO2017028803A1 (en) * | 2015-08-20 | 2017-02-23 | 中兴通讯股份有限公司 | Olt optical transceiver module, and method and system for processing a plurality of pons |
| US9653882B1 (en) * | 2016-02-09 | 2017-05-16 | Oracle America, Inc. | Wavelength control of an external cavity laser |
| CN106444092A (en) * | 2016-10-12 | 2017-02-22 | 华中科技大学 | Turnable filter made of silicon based micro-ring |
| CN107294606A (en) * | 2017-07-26 | 2017-10-24 | 深圳市傲科光电子有限公司 | A kind of single-mode fiber bidirectional optical transceiver |
| CN109669248A (en) * | 2017-10-13 | 2019-04-23 | 苏州旭创科技有限公司 | Optical waveguide coupled encapsulating structure, installation method and optical module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113810115B (en) | Optical module | |
| CN213122371U (en) | Optical module | |
| US8186892B2 (en) | Optoelectronic subassembly with integral thermoelectric cooler driver | |
| CN114545564B (en) | Optical module | |
| CN110989099B (en) | Optical module | |
| CN110780398A (en) | Direct-adjusting analog electro-optical conversion integrated assembly | |
| CN212649474U (en) | Optical module | |
| CN114826409B (en) | Optical module | |
| CN210775929U (en) | Optical module | |
| CN213302584U (en) | Optical module | |
| CN112817098A (en) | Optical module | |
| CN114167554B (en) | Optical module | |
| CN212627918U (en) | Optical module | |
| CN212543788U (en) | Optical module | |
| CN213279662U (en) | Optical module | |
| CN113423028A (en) | Optical module | |
| US8447187B2 (en) | Optoelectronic interconnect for high frequency data transmission at low power consumption | |
| CN114167553B (en) | Optical module | |
| CN216144989U (en) | Optical module | |
| CN113534360A (en) | Optical module | |
| CN113917624B (en) | Optical module | |
| CN118285031A (en) | Optical module | |
| CN114879319A (en) | Optical module | |
| CN113488832A (en) | Laser with modulator and optical module | |
| CN114428379B (en) | Optical module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |