CN114428379B - Optical module - Google Patents
Optical module Download PDFInfo
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- CN114428379B CN114428379B CN202011182185.4A CN202011182185A CN114428379B CN 114428379 B CN114428379 B CN 114428379B CN 202011182185 A CN202011182185 A CN 202011182185A CN 114428379 B CN114428379 B CN 114428379B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The application discloses an optical module, which comprises a circuit board, an SOA light source, a beam splitter, a silicon optical chip, a wavelength division multiplexer and a plurality of wavelength tuning control chips which send out wavelength tuning control signals, wherein the SOA light source, the beam splitter, the silicon optical chip, the wavelength division multiplexer and the plurality of wavelength tuning control chips are respectively and electrically connected with the circuit board; a plurality of laser resonant cavities and a plurality of modulators are arranged in the silicon optical chip, a plurality of beams of light are respectively transmitted into the corresponding laser resonant cavities, each laser resonant cavity carries out wavelength selection on the light beams to obtain light with specific wavelength, and the light beams with specific wavelength are modulated to obtain signal light with specific wavelength; the wavelength division multiplexer is connected with the silicon optical chip and multiplexes a plurality of signal lights with specific wavelengths into a beam of signal lights. The application adopts the optical module in an integrated mode, realizes the integration of multiple paths of emitted light, adopts the external cavity modulation mode to select the wavelength, reduces the use quantity of the optical modules, does not need to distinguish the wavelength deliberately, is easy for 5G networking management, and is beneficial to the miniaturization development of the optical modules.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module.
Background
Along with the development of economy and the improvement of the daily living standard of people, the 5G network with the advantages of large bandwidth, everything interconnection, low time delay, high reliable connection and the like is imperative. According to the radio access network (Radio Access Network, RAN) in 5G, the radio access network is reconfigured into AAU (Active Antenna Unit ), DU (Distributed Unit), CU (Central Unit) multi-level architecture, and the 5G bearer network is composed of three parts of a forward, a mid-transmission and a backward transmission, wherein the forward is mainly responsible for network transmission between the antenna station AAU and the baseband station DU/CU.
In the early stage of 5G service construction, the bandwidth requirement is limited, and the system can be realized in the form of a 25Gbps gray optical module, and with the promotion of 5G construction and the increase of the bandwidth requirement, the network bandwidth needs to be further expanded by using a color optical module. With the requirement of 5G capacity expansion, the current mainstream networking mode adopts a color light double-fiber or color light single-fiber bidirectional mode, an external wavelength division multiplexer and a demultiplexer are used for combining and dividing waves, and then information mutual transmission between the AAU and the DU is realized.
However, the networking method uses a large number of optical modules, the system panel needs to be plugged and unplugged, and the wavelengths of the optical modules need to be distinguished deliberately, so that the optical fiber system is complex and maintenance is complex due to the large number of laser types required by the optical modules.
Disclosure of Invention
The application provides an optical module to solve the problem that 5G group management is complex due to the fact that the requirements of color optical modules are more and more along with the requirement of 5G capacity expansion.
In order to solve the technical problems, the embodiment of the application discloses the following technical scheme:
in a first aspect, an embodiment of the present application discloses an optical module, including:
a circuit board;
the SOA light source is electrically connected with the circuit board and is used for emitting wide-spectrum light with various wavelengths;
The light splitter is connected with the SOA light source and is used for splitting the wide-spectrum light emitted by the SOA light source into a plurality of identical light beams;
the plurality of wavelength tuning control chips are electrically connected with the circuit board and are used for sending out wavelength tuning control signals;
the silicon optical chip is electrically connected with the circuit board, a plurality of laser resonant cavities and a plurality of modulators are arranged in the silicon optical chip, and the laser resonant cavities are respectively connected with the optical splitter and are used for respectively receiving a plurality of beams of split light output by the optical splitter; the laser resonant cavity is connected with the wavelength tuning control signal and is used for selecting light with a specific wavelength from the light splitting according to the wavelength tuning control signal; the modulator is connected with the laser resonant cavity and is used for modulating a data carrier wave on the light with the specific wavelength to obtain signal light with the specific wavelength;
and the wavelength division multiplexer is electrically connected with the silicon optical chip and is used for receiving a plurality of signal lights with specific wavelengths output by the silicon optical chip and multiplexing the signal lights with the specific wavelengths into a beam of signal lights.
In a second aspect, an embodiment of the present application further discloses an optical module, including:
a circuit board;
the wavelength tuning control chip is electrically connected with the circuit board and is used for sending out a wavelength tuning control signal;
The silicon optical chip is electrically connected with the circuit board, a plurality of laser resonant cavities and a plurality of modulators are arranged in the silicon optical chip, each laser resonant cavity comprises a plurality of micro-ring waveguides and a plurality of heating resistors, the micro-ring waveguides and the heating resistors are arranged in a one-to-one correspondence manner, the micro-ring waveguides are arranged on the heating resistors, and the micro-ring waveguides and the heating resistors are connected with the wavelength tuning control chip; a half-reflecting half-lens is arranged in the emergent direction of the micro-ring waveguide close to the modulator, a reflecting mirror is arranged at the light entering position of the silicon optical chip, a resonant cavity is formed between the reflecting mirror and the half-reflecting mirror, and the resonant cavity is used for controlling the heating resistor to heat and change the refractive index of the micro-ring waveguide according to the wavelength tuning control signal so as to select light with specific wavelength from the received broad spectrum light through a plurality of micro-ring waveguides; the modulator is connected with the laser resonant cavities in a one-to-one correspondence manner and is used for modulating the data carrier wave on the light with the specific wavelength to obtain a plurality of signal lights with the specific wavelength.
The optical module provided by the application comprises a circuit board, an SOA light source, an optical splitter, a silicon optical chip, a wavelength division multiplexer and a plurality of wavelength tuning control chips, wherein the SOA light source is electrically connected with the circuit board and is used for emitting wide-spectrum light with a plurality of wavelengths; the optical splitter is connected with the SOA light source and is used for splitting the wide-spectrum light emitted by the SOA light source into a plurality of identical light beams; the wavelength tuning control chip is electrically connected with the circuit board and is used for sending out a wavelength tuning control signal; the silicon optical chip is electrically connected with the circuit board, a plurality of laser resonant cavities and a plurality of modulators are arranged in the silicon optical chip, and the laser resonant cavities are respectively connected with the optical splitter and are used for respectively receiving a plurality of beams of optical splitters output by the optical splitter; the laser resonant cavity is connected with the wavelength tuning control chip and is used for selecting light with specific wavelength from the light splitting according to the wavelength tuning control signal; the modulator is connected with the laser resonant cavity and is used for modulating the data carrier wave on the light with the specific wavelength to obtain the signal light with the specific wavelength; the wavelength division multiplexer is electrically connected with the silicon optical chip and is used for receiving the signal light with a plurality of specific wavelengths output by the silicon optical chip and multiplexing the signal light with the plurality of specific wavelengths into a beam of signal light. The application integrates a plurality of laser resonant cavities and a plurality of modulators in the silicon optical chip, can realize the integration of a plurality of emission channels, adopts an external cavity modulation mode to select wavelengths, multiplexes the plurality of emission lights into one path of signal light, can reduce the use quantity of optical modules, only needs to plug one optical module on a system panel, does not need to distinguish the wavelengths deliberately, can simplify an optical fiber system, is easy for 5G networking management, and is further beneficial to the miniaturization development of the optical modules.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.
Drawings
In order to more clearly illustrate the technical solution of the present application, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic diagram of the connection relationship of an optical communication terminal;
fig. 2 is a schematic diagram of an optical network terminal structure;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;
fig. 4 is an exploded view of an optical module according to an embodiment of the present application;
FIG. 5 shows the wavelengths and implementation schemes of the current coarse wavelength division multiplexing CWDM, medium wavelength division multiplexing MWDM and fine wavelength division multiplexing LWDM;
fig. 6 is a schematic structural diagram of a light emitting sub-module in an optical module according to an embodiment of the present application;
fig. 7 is an exploded schematic diagram of a light emitting sub-module in an optical module according to an embodiment of the present application;
fig. 8 is a schematic diagram of a partial structure of a light emitting sub-module in an optical module according to an embodiment of the present application;
Fig. 9 is a schematic diagram of an emission principle of an optical emission sub-module in an optical module according to an embodiment of the present application;
fig. 10 is a schematic diagram of a local emission principle of an optical emission sub-module in an optical module according to an embodiment of the present application;
FIG. 11 is a schematic diagram illustrating wavelength selection of a laser resonator in an optical module according to an embodiment of the present application;
fig. 12 is a schematic diagram of a receiving principle of an optical receiving sub-module in an optical module according to an embodiment of the present application.
Detailed Description
In order to make the technical solution of the present application better understood by those skilled in the art, the technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
One of the key links of optical fiber communication is the mutual conversion of optical signals and electric signals. The optical fiber communication uses the optical signal carrying information to transmit in the information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by utilizing the passive transmission characteristic of the light in the optical fiber/optical waveguide; in order to establish an information connection between an information transmission device such as an optical fiber and an information processing device such as a computer, it is necessary to perform interconversion between an electric signal and an optical signal.
The optical module realizes the function of the mutual conversion of the optical signal and the electric signal in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electric signal is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the golden finger has become the mainstream connection mode of the optical module industry, and on the basis of the main connection mode, the definition of pins on the golden finger forms various industry protocols/specifications.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.
One end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
The optical port of the optical module 200 is externally connected to the optical fiber 101, and bidirectional optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected into the optical network terminal 100, and bidirectional electrical signal connection is established with the optical network terminal 100; the optical module is internally provided with an optical module, and the optical module is internally provided with an optical signal and an electric signal, so that information connection between the optical fiber and the optical network terminal is established. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.
The optical network terminal is provided with an optical module interface 102, which is used for accessing the optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104 which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable, transmits the signal from the network cable to the optical module, and monitors the operation of the optical module as an upper computer of the optical module.
So far, the remote server establishes a bidirectional signal transmission channel with the local information processing equipment through the optical fiber, the optical module, the optical network terminal and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, which provides data signals for the optical module and receives data signals from the optical module, and the common optical module upper computer also includes an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is provided on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and is used for accessing an optical module electrical port such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a first boss portion such as a fin that increases a heat dissipation area.
The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical connector inside the cage 106 is inserted into an electrical port of the optical module, and the optical port of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged inside the cage; the light module is inserted into the cage, the light module is fixed by the cage, and the heat generated by the light module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.
Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application, and fig. 4 is an exploded schematic diagram of an optical module according to an embodiment of the present application. As shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, a light emitting sub-module 400, a light receiving sub-module 500, and an optical fiber adapter 600.
The upper case 201 is covered on the lower case 202 to form a packing cavity having two openings; the outer contour of the wrapping cavity generally presents a square shape. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers the two side plates of the upper shell to form a wrapping cavity; the upper case may further include two sidewalls disposed at both sides of the cover plate and perpendicular to the cover plate, and the two sidewalls are combined with the two side plates to realize the covering of the upper case 201 on the lower case 202.
The two openings can be two end openings (204, 205) positioned at the same end of the optical module, or two openings positioned at different ends of the optical module; one opening is an electric port 204, and a golden finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect the optical transmitting sub-module 400 and the optical receiving sub-module 500 inside the optical module; the circuit board 300, the light emitting sub-module 400, the light receiving sub-module 500, the optical fiber adapter 600, and other optoelectronic devices are located in the encapsulation cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that devices such as the circuit board 300, the light emitting sub-module 400, the light receiving sub-module 500, the optical fiber adapter 600 and the like can be conveniently installed in the shells, and the upper shell and the lower shell form an encapsulation protection shell of the outermost layer of the module; the upper shell and the lower shell are made of metal materials, electromagnetic shielding and heat dissipation are realized, the shell of the optical module is not made into an integral part, and therefore, when devices such as a circuit board and the like are assembled, the positioning part, the heat dissipation and the electromagnetic shielding part cannot be installed, and the production automation is not facilitated.
The unlocking component 203 is located on the outer wall of the lower housing 202, and is used for realizing or releasing the fixed connection between the optical module and the host computer.
The unlocking part 203 is provided with a clamping part matched with the upper computer cage; pulling the distal end of the unlocking member 203 can relatively move the unlocking member 203 on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component 203; by pulling the unlocking part 203, the clamping part of the unlocking part 203 moves along with the unlocking part, so that the connection relation between the clamping part and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be pulled out of the cage of the upper computer.
The circuit board 300 is provided with circuit wiring, electronic components (such as capacitor, resistor, triode, MOS tube) and chips (such as MCU, laser driving chip, limiting amplifying chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.
The circuit board 300 is used to provide signal circuitry for signal electrical connection, which may provide signals. The circuit board 300 connects the electrical devices in the optical module together according to a circuit design through circuit wiring, so as to realize electrical functions such as power supply, electrical signal transmission, grounding and the like.
The circuit board is generally a hard circuit board, and the hard circuit board can also realize bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear chips; when the optical transceiver component is positioned on the circuit board, the hard circuit board can provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, specifically, a metal pin/golden finger is formed on the surface of one side tail end of the hard circuit board and is used for being connected with the electric connector; these are all inconvenient to implement with flexible circuit boards.
A flexible circuit board is also used in part of the optical modules and is used as a supplement of the hard circuit board; the flexible circuit board is generally used in cooperation with the hard circuit board, for example, the hard circuit board and the optical transceiver assembly can be connected by using the flexible circuit board.
In the initial stage of 5G business construction, the method can be realized in the form of a 25Gbps gray light module due to limited bandwidth requirement, but with the promotion of 5G construction and the increase of bandwidth requirement, the network bandwidth needs to be further expanded by using a color light module. In the middle and later stages of 5G network construction, with depth coverage such as high-frequency networking and low-frequency point adding, the deployment scale of wavelength division multiplexing is gradually expanded to fully utilize the existing optical fiber resources, a 25Gb/s WDM scheme becomes an industrial research hot spot, and four 25Gb/s color light module schemes of coarse wavelength division multiplexing (Coarse Wavelength Division Multiplexer, CWDM), medium wavelength division multiplexing (Micro-optic Wavelength Division Multiplexer, MWDM), fine wavelength division multiplexing (Lan Wavelength Division Multiplexer, LWDM) and dense wavelength division multiplexing (Dense Wavelength Division Multiplexer, DWDM) exist at present. For the S111 station type of 100M spectrum bandwidth, a single base station typically requires 6 waves 25Gb/S; for the S111 station type of 160M/200M spectrum bandwidth, a single base station typically requires 12 waves 25Gb/S. Meanwhile, considering the co-station with 4G, the requirement of wavelength division multiplexing with different rates of 25Gb/s and 10Gb/s exists.
Fig. 5 shows the wavelengths and implementation schemes of the current coarse wavelength division multiplexing CWDM, medium wavelength division multiplexing MWDM and fine wavelength division multiplexing LWDM. As shown in FIG. 5, the 25Gb/s MWDM color optical module is shifted left and right to be expanded into 12 waves on the basis of 6 waves before CWDM, and a non-uniform wavelength interval is adopted. The MWDM scheme can reuse the mature design experience of the DML laser in the CWDM scheme, namely the process control technology, and wavelength shift is realized by adjusting grating parameters, so that the MWDM scheme is co-epitaxial with the CWDM and the chip manufacturing industry chain is realized. The 25Gb/s LWDM color optical module is based on 8 wavelengths of 400GE LR8 in IEEE 802.3-2018 specification, and realizes 12 wavelengths according to an equidistant expansion mode of 800GHz channel spacing. LWDM wavelength is located in O wave band, dispersion cost is low, DML laser and PIN detector can be used for solving 10/15km distance transmission, wherein basic 8 wavelengths can reuse 100GE LR4 and 400GE LR8 industrial chains.
Aiming at MWDM or LWDM, the current mainstream networking mode adopts a color light double-fiber or color light single-fiber bidirectional mode, an external wavelength division multiplexer and a demultiplexer are used for combining and dividing waves, and then information mutual transmission between an AAU and a DU is realized. However, the number of optical modules used is large, the number of optical modules to be plugged and unplugged on a system panel is large, the wavelengths of the optical modules need to be distinguished deliberately, the types of lasers needed by the optical modules are large, an optical fiber system is complex, maintenance is complex, and the problem of complex management of the optical modules is caused.
In order to solve the problems, the integrated optical module provided by the embodiment of the application adopts an independent QSFP-DD packaging mode optical module, can realize the integration of multiple paths of optical modules, can theoretically expand 8 paths at maximum, can reduce the number of lasers used by adopting an external cavity modulation mode, and simultaneously avoids the complexity of constructors in identifying the wavelengths of the optical modules.
Fig. 6 is a schematic structural diagram of an optical emission sub-module 400 in an optical module according to an embodiment of the present application, and fig. 7 is an exploded schematic diagram of the optical emission sub-module 400 in the optical module according to an embodiment of the present application. As shown in fig. 6 and 7, the light emission sub-module 400 includes a housing 401 and a light emitting device 700 disposed in the housing 401, a notch is disposed on the housing 401, a ceramic transfer block 402 is disposed at the notch, and the ceramic transfer block 402 is connected with the notch in a sealing manner. Pins are arranged on the outer wall of the switching ceramic block 402 and can be connected with the pins through the flexible circuit board or the circuit board 300 so as to realize the connection between the circuit board 300 and the light emission sub-module 400; the inside of the transfer ceramic block 402 is provided with a pad, and the light emitting device 700 is connected with the pad through a gold wire bonding wire to transmit an electric signal, a high frequency signal, etc., transmitted from the circuit board 300 to the light emitting sub-module 400 to the light emitting device 700, so that the light emitting device 700 emits signal light.
The housing 401 is a housing with openings at the upper and lower ends, the upper end of the housing is provided with an upper cover plate 403, the lower end of the housing is provided with a bottom plate 404, the housing 401, the adapting ceramic block 402, the upper cover plate 403 and the bottom plate 404 form a sealed cavity, and the light emitting device 700 is arranged in the sealed cavity.
When the light emission sub-module 400 is assembled, the light emitting device 700 is fixed on the bottom plate 404, and then the shell 401 is covered on the bottom plate 404, so that the bottom surface of the shell 401 is in braze welding sealing connection with the upper side surface of the bottom plate 404; then, the switching ceramic block 402 is mounted at the notch of the shell 401, the bottom surface of the switching ceramic block 402 is in braze welding sealing connection with the upper side surface of the bottom plate 404, and the top surface and the side surface of the switching ceramic block 402 are respectively in braze welding sealing connection with the side surface of the notch; then, the upper cover plate 403 is covered on the housing 401, and the top surface of the housing 401 is connected with the lower side surface of the upper cover plate 403 in a sealing manner, so that the sealing assembly of the housing 401 is completed, and the light emitting device 700 is packaged in the housing 401.
Fig. 8 is a schematic structural diagram of a light emitting device 700 in an optical module according to an embodiment of the present application. As shown in fig. 8, the light emitting device 700 includes a semiconductor refrigerator 701, a adapting ceramic plate 702 disposed on the semiconductor refrigerator 701, a silicon optical chip 703 and an SOA light source 705, where the semiconductor refrigerator 701 is disposed on the bottom plate 404, and is used to control the temperature in the housing 401, and the silicon optical chip 703 and the SOA light source 705 are both in direct contact with the surface of the semiconductor refrigerator 701, so as to ensure better heat dissipation for the silicon optical chip 703 and the SOA light source.
The silicon optical chip 703 is arranged in the light emitting direction of the SOA optical source 705, the SOA optical source 705 and the silicon optical chip 703 form an external cavity laser, light which is emitted by the SOA optical source 705 and does not carry signals is injected into the silicon optical chip 703, the light interferes in the silicon optical chip 703, part of the light returns to the SOA optical source 705 again for resonance amplification, the process is repeated until the intensity of the light meets the standard requirement, the amplified light is modulated by the silicon optical chip 703 to obtain signal light, and the signal light is coupled to the optical fiber adapter 600 through a lens after being emitted by the silicon optical chip 703, so that the emission of the signal light is realized.
In the embodiment of the present application, an SOA lens 706 is further disposed between the SOA light source 705 and the silicon optical chip 703, and the SOA lens 706 is a converging lens for converging the light emitted by the SOA light source 705 to the silicon optical chip 703, so as to improve the optical path coupling efficiency.
A heat sink 704 is further disposed between the SOA light source 705 and the semiconductor refrigerator 701, the heat sink 704 is adhered to the upper surface of the semiconductor refrigerator 701, the SOA light source 705 is adhered to the upper surface of the heat sink 704, so that heat generated by the SOA light source 705 is conducted to the semiconductor refrigerator 701 through the heat sink 704, and heat dissipation efficiency of the SOA light source 705 can be improved.
Fig. 9 is a schematic diagram of an emission principle of an optical emission sub-module 400 in an optical module according to an embodiment of the present application, and fig. 10 is a schematic diagram of a local emission principle of the optical emission sub-module 400 in an optical module according to an embodiment of the present application. As shown in fig. 9 and 10, a plurality of laser resonators 7031 are disposed in the silicon optical chip 703, and each laser resonator 7031 can perform wavelength selection from broad spectrum light emitted from the SOA light source 705 to obtain signal light with a plurality of specific wavelengths. In order to enable the broad spectrum light emitted from the SOA light source 705 to enter each laser resonator 7031, a beam splitter 711 may be disposed between the SOA light source 705 and the silicon optical chip 703, and the beam splitter 711 may be disposed in the light emitting direction of the SOA light source 705 to split the broad spectrum light emitted from the SOA light source 705 into multiple identical beams, each of which may be coupled into each laser resonator 7031 of the silicon optical chip 703, thereby obtaining multiple emission beams.
In an embodiment of the present application, the beam splitter 711 may be 1:2 n A beam splitter forSplitting the broad spectrum light from the SOA source 705 into the same 2 n Beam light, silicon optical chip 703 can be provided with 2 n A plurality of laser resonators 7031, 2 divided by a beam splitter 711 n Beam light is respectively transmitted to 2 n Each laser resonant cavity 7031, each laser resonant cavity 7031 can obtain a beam of light with a specific wavelength, and a beam of signal light with a specific wavelength is obtained after modulation, so that the silicon optical chip 703 can output 2 n Signal light of a specific wavelength, and multi-channel emission of the optical emission sub-module 400 is realized.
In practical cases, because of the golden finger configuration of QSFP-DD, one optical module can support the transmission of 8 transmitting channels at the same time, and therefore, the maximum value of n is 3. The color light module for 5G front-transmission generally needs 6 wave length, so the number of laser resonant cavities 7031 in the silicon optical chip 703 can be less than 2 n The beam splitting quantity of the beam splitters is set according to the actual channel requirements of the optical module.
In the embodiment of the present application, the beam splitter 711 may be disposed on the light engine of the light emitting sub-module 400; the beam splitter 711 may also be integrated within the silicon optical chip 703, such as by integrating the beam splitter 711 near the input port of the silicon optical chip 703 to split the broad spectrum light entering the silicon optical chip 703 into 2 n And (5) beam light.
In the embodiment of the present application, the silicon optical chip 703 includes an input optical port and an output optical port, where the input optical port is disposed in the light emitting direction of the SOA light source 705, so that the broad spectrum light emitted by the SOA light source 705 is split by the splitter 711 and then enters the input optical port of the silicon optical chip 703, so that the silicon optical chip 703 can conveniently perform wavelength selection on the broad spectrum light via the laser resonator.
In order to avoid crosstalk and return loss, the input optical port of the silicon optical chip 703 may be disposed at a certain angle with the end surface of the silicon optical chip 703, that is, the input optical port is disposed at a certain angle with the horizontal plane, so that the exit end surface of the SOA light source 705 is also disposed at a certain angle with the horizontal plane. The arrangement can avoid the light emitted by the SOA light source 705 from reflecting the original path back to the SOA light source 705 at the end face of the input light port, and can also avoid the light emitted by the SOA light source 705 from reflecting at the end face of the input light port, and the reflected light enters the silicon optical chip 703 to influence the signal modulation of the light in the silicon optical chip 703.
The silicon optical chip 703 is also provided with a plurality of modulators 7033, and the input ends of the laser resonant cavities 7031 are respectively connected with the optical splitter 711, so that 2 of the optical splitter 711 outputs n The beam light is respectively transmitted to a plurality of laser resonant cavities 7031, and the wavelength of the light is selected by the laser resonant cavities 7031 to obtain light with specific wavelength; the output end of the laser resonator 7031 is connected to a modulator 7033, and light of a specific wavelength is modulated by a signal of the modulator 7033, so that signal light of a specific wavelength is finally obtained.
Specifically, the circuit board 300 is provided with a plurality of wavelength tuning control chips 301, and the plurality of wavelength tuning control chips 301 are electrically connected with the circuit board 300 respectively and are used for sending out wavelength tuning control signals; the laser resonator 7031 is connected to the wavelength tuning control chip 301, and receives the broad spectrum light transmitted from the beam splitter 711, and selects light of a specific wavelength from the broad spectrum light according to the wavelength tuning control signal; the modulator 7033 is connected to the laser resonator 7031, and is configured to modulate a data carrier with light having a specific wavelength to obtain signal light having a specific wavelength. Accordingly, the laser resonator 7031, the wavelength tuning control chip 301, and the modulator 7033 perform wavelength selection and modulation on the plurality of broad spectrum lights transmitted from the beam splitter 711, respectively, to thereby obtain a plurality of signal lights having specific wavelengths.
In the embodiment of the present application, in order to couple the light output from the beam splitter 711 into the laser resonator 7031, a lens L2 is disposed between the beam splitter 711 and the laser resonator 7031, and the broad spectrum light transmitted from the beam splitter 711 is coupled into the laser resonator 7031 through the lens L2 to perform wavelength selection on the broad spectrum light.
The laser resonator 7031 includes a plurality of micro-ring waveguides, each of which is connected to the wavelength tuning control chip 301 for selecting light of a specific wavelength from the broad spectrum light according to the wavelength tuning control signal. The laser resonant cavity 7031 further comprises a plurality of heating resistors, the micro-ring waveguides are arranged in one-to-one correspondence with the heating resistors, and the micro-ring waveguides are arranged on the heating resistors, so that heating of the heating resistors can be controlled according to the wavelength tuning control signals to change the refractive index of the micro-ring waveguides, and the wavelength of emergent light of the micro-ring waveguides is changed by adjusting the refractive index of the micro-ring waveguides.
Specifically, the laser resonant cavity 7031 includes a first micro-ring waveguide a and a second micro-ring waveguide B, where the first micro-ring waveguide a and the second micro-ring waveguide B are both connected to the wavelength tuning control chip 301, and are configured to select, according to the wavelength tuning control signal, a wavelength with a wavelength satisfying the spectral ranges of the first micro-ring waveguide a and the second micro-ring waveguide B. The first micro-ring waveguide a and the second micro-ring waveguide B are disposed in front of each other, that is, broad spectrum light coupled into the laser resonator 7031 via the lens L2 sequentially passes through the first micro-ring waveguide a and the second micro-ring waveguide B, so as to select wavelengths that simultaneously satisfy the spectral range FSR1 of the first micro-ring waveguide a and the spectral range FSR2 of the second micro-ring waveguide B, thereby selecting specific wavelengths.
The laser resonant cavity 7031 further includes a first heating resistor C and a second heating resistor D, where the first micro-ring waveguide a is disposed on the first heating resistor C, and the refractive index of the first micro-ring waveguide a can be changed when the first heating resistor C heats, so that the FSR1 of the first micro-ring waveguide a is displaced as a whole, and the period is unchanged, so that the wavelength of the FSR1 is changed.
Similarly, the second micro-ring waveguide B is arranged on the second heating resistor D, and the refractive index of the second micro-ring waveguide B can be changed when the second heating resistor D heats, so that the FSR2 of the second micro-ring waveguide B is wholly displaced, the period is unchanged, and the wavelength of the FSR2 is changed.
In the embodiment of the present application, the wavelength tuning control chip 301 may output a control signal to adjust the current values flowing through the first heating resistor C and the second heating resistor D, so as to control the heating of the first heating resistor C and the second heating resistor D, thereby changing the refractive indexes of the first micro-ring waveguide a and the second micro-ring waveguide D, so as to select a specific wavelength.
In order to achieve closed-loop control, the laser resonant cavity 7031 further includes a plurality of detectors, the detectors are disposed in one-to-one correspondence with the micro-ring waveguides, and the detectors are close to the micro-ring waveguides to detect light emitted from the micro-ring waveguides, convert the light to analog current signals, output the analog current signals to the wavelength tuning control chip 301, and adjust a current value flowing through the heating resistor through the wavelength tuning control chip 301. Specifically, the laser resonant cavity 7031 further includes a first detector E and a second detector F, where the first detector E is disposed near the first micro-ring waveguide a, and the second detector F is disposed near the second micro-ring waveguide B, and is respectively configured to detect light emitted by the first micro-ring waveguide a and the second micro-ring waveguide B, convert the light to an analog current signal, output the analog current signal to the MCU, and control the wavelength tuning control chip 301 to adjust current values flowing through the first heating resistor C and the second heating resistor D according to the detected analog quantity through a software algorithm, so as to implement closed loop control.
Fig. 11 is a schematic wavelength selection diagram of a laser resonator 7031 in an optical module according to an embodiment of the present application. As shown in fig. 11, the working principle of wavelength selection of the laser resonator is as follows: the spectrum emitted by the SOA light source 705 is a broad spectrum light source, the wavelength range covers 1260-1360 m, the wavelength is recorded as lambda 1, the broad spectrum light is split by the splitter 711 and then enters the laser resonant cavity 7031 of the silicon optical chip 703, after passing through the first micro-ring waveguide a, the wavelength with the wavelength meeting FSR1 is selected to pass through the first micro-ring waveguide a, at the moment, the wavelength is screened as lambda 2, and the wavelength period meets FSR1; then, the screened light passes through the second micro-ring waveguide B, the wavelength which meets the FSR2 is selected to pass through the second micro-ring waveguide B, the wavelength is screened to be lambda 3, the wavelength period meets the FSR2, and only the wavelengths which meet the FSR1 and the FSR2 simultaneously can be output by the second micro-ring waveguide B; a half-reflecting half-lens M2 is arranged in the emergent direction of the second micro-ring waveguide B, the half-reflecting half-lens M2 transmits light with the wavelength of lambda 3 to form laser, the wavelength of lambda 3B is the wavelength of the laser, and the laser enters a modulator 7033 for modulation; part of light with the wavelength of lambda 3 can be reflected at the semi-reflecting semi-transparent mirror M2, the wavelength of the reflected light is lambda 3a, and the reflected light lambda 3a passes through the second micro-ring waveguide B and the first micro-ring waveguide A again and is emitted back to the output end of the beam splitter 711; the output end of the beam splitter 711 is provided with a mirror M1, and the reflected light λ3a is reflected again at the mirror M1, so that the light with the wavelength λ3 forms a resonant cavity between the mirror M1 and the half mirror M2, and a specific wavelength can be selected by changing the cavity length of the resonant cavity.
When the current value flowing through the first heating resistor C or the second heating resistor D is adjusted, the FSR1 of the first micro-ring waveguide A and the FSR2 of the second micro-ring waveguide B can be changed to be displaced integrally, the period is unchanged, wavelengths meeting the requirements of the FSR1 and the FSR2 are emitted by the second micro-ring waveguide B at the same time, multiple different wavelengths are obtained through tuning, the whole O-wave band can be covered in a tuning wavelength range, the tuning granularity is controllable, and the requirement of a 100GHz wavelength interval can be met.
The wavelength selection of the emitted optical signals is realized by combining the devices, and the specific process is as follows: for a transmitting channel, an external SOA light source receives Bias current provided by an MCU control circuit to emit light, the emitted light signal is wide-spectrum direct current light, the wavelength range of the emitted light signal covers an O wave band (1260-1360 nm), the SOA light source is split by a beam splitter, the beam splitter is optically coupled with a laser resonant cavity in a silicon optical chip by a lens L2, and the beam splitter is split by 2 n The beam light is coupled into a plurality of laser resonators, respectively, and wavelength selection is performed in the laser resonators.
The laser resonant cavity is provided with a first micro-ring waveguide A, a second micro-ring waveguide B, a first heating resistor C, a second heating resistor, a first detector E and a second detector F, and a DAC of the MCU outputs control signals to adjust current values flowing through the first heating resistor C and the second heating resistor D and control the first heating resistor C and the second heating resistor D to generate heat, so that refractive indexes of the first micro-ring waveguide A and the second micro-ring waveguide B are changed, the cavity length of the resonant cavity is changed, and specific wavelengths are selected. The optical signal output by the laser resonator is also direct current light, but the wavelength after wavelength selection, specifically, a specific wavelength in the C-band, and the wavelength interval is preferably 100GHz.
The modulator 7033 is connected to the laser resonator 7031, and then receives the data driving signal provided by the modulation driver 7034 on the optical module internal circuit board 300, and modulates the data carrier on the light with the specific wavelength output by the laser resonator 7031, thereby obtaining the signal light with the specific wavelength.
In the embodiment of the present application, the silicon optical chip 703 is provided with a plurality of laser resonators 7031 and a plurality of modulators 7033, so that the silicon optical chip 703 can output a plurality of signal lights with specific wavelengths, and in order to facilitate transmission of the signal lights with specific wavelengths, the optical module provided in the embodiment of the present application further includes a wavelength division multiplexer 800, where the wavelength division multiplexer 800 is connected to the silicon optical chip 703, so as to receive the signal lights with specific wavelengths output by the silicon optical chip 703, and multiplex the signal lights with specific wavelengths into a beam of signal light, so that the signal lights with specific wavelengths can be transmitted through the same optical fiber.
The output optical port and the input optical port of the silicon optical chip 703 have a preset angle, and are used for outputting signal lights with a plurality of specific wavelengths, and the signal lights are converged and coupled into the wavelength division multiplexer 800, so that the output optical port of the silicon optical chip 703 is located in the light incident direction of the wavelength division multiplexer 800. In order to couple the signal light output by the output optical port to the wavelength division multiplexer 800, a collimating lens 707 and a converging lens 709 are sequentially arranged between the output optical port and the wavelength division multiplexer 800, the collimating lens 707 and the converging lens 709 are adhered to the upper surface of the semiconductor refrigerator 701, and the output optical port, the collimating lens 707, the converging lens 709 and the wavelength division multiplexer 800 are positioned on the same optical path. After the signal light output from the output light port enters the collimator lens 707, the collimator lens 707 converts the signal light into a collimated light beam, the collimated light beam enters the converging lens 709, the converging lens 709 converts the collimated light beam into a converging light beam, and the converging light beam is coupled to the wavelength division multiplexer 800.
The converging light beam is coupled into the wavelength division multiplexer 800, and is easily reflected on the optical input end face of the wavelength division multiplexer 800, and the reflected light beam is easily emitted into the output optical port of the silicon optical chip 703 through the converging lens 709 and the collimating lens 707, so as to affect the signal modulation of the silicon optical chip 703. In this way, an isolator 708 may be disposed between the collimating lens 707 and the converging lens 709, after the signal light is output from the optical output port of the silicon optical chip 703, the signal light is sent into the collimating lens 707, the collimating lens 707 converts the signal light into a collimated beam, the collimated beam is sent into the converging lens 709 after passing through the isolator 708, the converging lens 709 converts the collimated beam into a converging beam, and the converging beam is coupled to the wavelength division multiplexer 800; the light beam reflected by the converging light beam on the light input end face of the wavelength division multiplexer 800 is transmitted through the converging lens 709 and then enters the isolator 708, and the isolator 708 filters the reflected light beam, so that the reflected light beam cannot enter the silicon optical chip 703, and the return loss of light is avoided.
In the embodiment of the present application, the wavelength division multiplexer 800 may be disposed on the circuit board 300, and the wavelength division multiplexer and the output optical port of the silicon optical chip 703 are located on the same optical path, so that a plurality of signal lights with specific wavelengths output by the silicon optical chip 703 are coupled into the same optical fiber through the wavelength division multiplexer 800; the wavelength division multiplexer 800 may also be integrated in the silicon optical chip 703, for example, after the wavelength division multiplexer 800 is integrated in an output optical port of the silicon optical chip 703, signals with a plurality of specific wavelengths output by the plurality of modulators 7033 are optically coupled into one signal optical output through the wavelength division multiplexer 800, that is, the silicon optical chip 703 outputs one composite beam including a plurality of signal lights with specific wavelengths.
In the embodiment of the present application, the adapting ceramic plate 702 may be arranged on the upper surface of the semiconductor refrigerator 701 in parallel with the silicon optical chip 703, and the silicon optical chip 703 is directly connected to the bonding pad on the adapting ceramic block 402 through the gold wire bonding wire, so as to receive the power-on signal and the high-frequency signal transmitted by the circuit board 300 through the adapting ceramic block 402; the SOA light source 705 is connected to the adapting ceramic plate 702 by a gold wire bonding wire, and the adapting ceramic plate 702 is connected to a bonding pad on the inner wall of the adapting ceramic block 402 by a gold wire bonding wire to receive the power-on signal transmitted from the circuit board 300 through the adapting ceramic block 402; the semiconductor refrigerator 701 is electrically connected to the relay ceramic block 402 through the support of the base plate 404 to receive the power-on signal transmitted from the circuit board 300 through the relay ceramic block 402. In this way, the SOA light source 705 emits light with multiple wavelengths under the signal effect, the semiconductor refrigerator 701 adjusts the temperature in the housing 401 under the signal effect, the silicon optical chip 703 modulates the light with the wavelength selected under the signal effect to obtain signal light with multiple specific wavelengths, and the signal light with multiple specific wavelengths is coupled into the wavelength division multiplexer 800.
Fig. 12 is a schematic diagram of a receiving principle of an optical receiving sub-module 500 in an optical module according to an embodiment of the present application. As shown in fig. 12, the optical receiving sub-module 500 includes a wavelength division demultiplexer 501 and a plurality of photodetectors 502, one end of the wavelength division demultiplexer 501 is connected to the optical fiber adapter 600, and the other end is connected to the plurality of photodetectors 502, respectively, and the wavelength division demultiplexer 501 receives the composite signal light transmitted from the optical fiber adapter 600 and demodulates the composite signal light into a plurality of signal lights, that is, into a plurality of signal lights of specific wavelengths, respectively. The plurality of photodetectors 502 are configured to receive a plurality of signal lights, that is, a plurality of signal lights with specific wavelengths demodulated by the wavelength division demultiplexer 501 are respectively transmitted to the corresponding photodetectors 502, and the signal lights are converted into electrical signals by the photodetectors 502.
The optical receiving sub-module 500 further includes a plurality of limiting amplifiers 503, where the limiting amplifiers 503 are disposed in one-to-one correspondence with the photodetectors 502, and an input end of each limiting amplifier 503 is connected to an output end of each photodetector 502, and is configured to amplify an electrical signal output by each photodetector 502 for subsequent electrical signal application.
The optical module provided by the embodiment of the application outputs a plurality of signal lights with different wavelengths through the silicon optical chip, realizes the integration of multi-path optical emission signals, receives the signals through multi-path optical receiving channels, realizes the integration of multi-path emission and receiving, can cover the 6-wave requirement required by 5G front transmission, reduces the use quantity of the optical modules in 5G networking, can flexibly set the wavelength of each emission channel according to software configuration, does not need to mark each optical wavelength, avoids the complexity of constructors for identifying the wavelength of the optical module, and solves the problem of complex management of the color optical module; meanwhile, a plurality of wavelength modulation regions are integrated in the silicon optical chip, so that compact integration of the optical module is realized, and the miniaturization development of the optical module is facilitated.
It should be noted that, in this specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the statement "comprises" or "comprising" a … … "does not exclude that an additional identical element is present in a circuit structure, article or apparatus that comprises the element.
Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure of the application herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
The embodiments of the present application described above do not limit the scope of the present application.
Claims (8)
1. An optical module, comprising:
a circuit board;
the light emission sub-module is electrically connected with the circuit board; wherein the light emitting sub-module includes:
a housing;
a light emitting device disposed within the housing;
one end of the switching ceramic block is inserted into the shell and is connected with the shell in a sealing way; the other end is positioned outside the shell and is electrically connected with the circuit board;
wherein the light emitting device includes:
the SOA light source is electrically connected with the circuit board and is used for emitting wide-spectrum light with various wavelengths;
The light splitter is connected with the SOA light source and is used for splitting the wide-spectrum light emitted by the SOA light source into a plurality of identical light beams;
the plurality of wavelength tuning control chips are electrically connected with the circuit board and are used for sending out wavelength tuning control signals;
the silicon optical chip is electrically connected with the switching ceramic block, a plurality of laser resonant cavities and a plurality of modulators are arranged in the silicon optical chip, and the laser resonant cavities are respectively connected with the optical splitter and are used for respectively receiving a plurality of beams of split light output by the optical splitter; the laser resonant cavity comprises a first micro-ring waveguide, a second micro-ring waveguide and a half-reflecting half-lens, wherein the second micro-ring waveguide is positioned in the light-emitting direction of the first micro-ring waveguide, and the half-reflecting half-lens is positioned in the light-emitting direction of the second micro-ring waveguide; the output end of the beam splitter is provided with a reflecting mirror, the first micro-ring waveguide and the second micro-ring waveguide are positioned between the reflecting mirror and the semi-reflecting semi-transmitting mirror, and a resonant cavity is formed between the reflecting mirror and the semi-reflecting semi-transmitting mirror; the light splitting sequentially passes through the first micro-ring waveguide and the second micro-ring waveguide to perform wavelength selection so as to output specific wavelength optical signals which simultaneously meet the wavelength period of the first micro-ring waveguide and the second micro-ring waveguide; the laser resonant cavity is connected with the wavelength tuning control signal and is used for changing the refractive indexes of the first micro-ring waveguide and the second micro-ring waveguide according to the wavelength tuning control signal so as to output a plurality of specific wavelength optical signals by changing the cavity length of the resonant cavity; the modulator is connected with the laser resonant cavity and is used for modulating a data carrier wave on the optical signal with the specific wavelength to obtain signal light with the specific wavelength;
And the wavelength division multiplexer is electrically connected with the silicon optical chip and is used for receiving a plurality of signal lights with specific wavelengths output by the silicon optical chip and multiplexing the signal lights with the specific wavelengths into a beam of signal lights.
2. The optical module of claim 1, wherein the optical splitter is 1:2 n A beam splitter for splitting the wide spectrum light output by the SOA light source into 2 n Beam light, and putting said 2 n The beam light is transmitted to the plurality of laser resonators, respectively.
3. The optical module of claim 2, wherein the number of laser resonators in the silicon optical chip is equal to or less than 2 n 。
4. The optical module of claim 1, wherein the optical splitter is integrated within the silicon optical chip for splitting the broad spectrum light output by the SOA light source into multiple beams of light.
5. The optical module according to claim 1, wherein the wavelength division multiplexer is integrated in the silicon optical chip, and is configured to multiplex a plurality of signal lights of specific wavelengths output from the plurality of modulators into a single signal light and output the single signal light.
6. The optical module of claim 1, further comprising an optical receiving sub-module comprising a wavelength-division-multiplexer and a plurality of photodetectors, the wavelength-division-multiplexer receiving the composite signal light transmitted by the fiber optic adapter and demultiplexing the composite signal light into a plurality of signal lights; and the plurality of photodetectors are respectively connected with the wavelength division demultiplexer and are used for respectively receiving the plurality of signal lights.
7. The optical module of claim 1, wherein the laser resonator further comprises a first heating resistor and a second heating resistor, the first micro-ring waveguide being disposed on the first heating resistor, the second micro-ring waveguide being disposed on the second heating resistor; the wavelength tuning control chip is connected with the first heating resistor and the second heating resistor and is used for controlling the first heating resistor and the second heating resistor to generate heat so as to change the refractive indexes of the first micro-ring waveguide and the second micro-ring waveguide.
8. The optical module according to claim 7, wherein the laser resonator further comprises a plurality of detectors, the detectors are arranged in one-to-one correspondence with the micro-ring waveguides, and the detectors are close to the micro-ring waveguides, and are used for detecting light emitted by the micro-ring waveguides, converting the light into an analog current signal, and outputting the analog current signal to the wavelength tuning control chip, and the wavelength tuning control chip adjusts a current value flowing through the heating resistor.
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