CN212627918U

CN212627918U - Optical module

Info

Publication number: CN212627918U
Application number: CN202021445540.8U
Authority: CN
Inventors: 杨世海; 陈思涛; 张强; 赵其圣
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2021-02-26
Anticipated expiration: 2030-07-21

Abstract

The application provides an optical module, and a silicon optical chip comprises an optical attenuator, a semiconductor amplifier and a photoelectric detector. The optical attenuator may modulate attenuation of the received light in accordance with the first operating current. The semiconductor amplifier may amplify the received light according to the second operating current. The photodetector converts the received light into an electrical signal. The amplitude limiting amplification chip amplifies the electric signal and outputs a corresponding current monitoring signal. The MCU controls the light attenuator regulator and the semiconductor amplifier regulator to output a first working current and a second working current according to the current monitoring signal, so that an electric signal obtained on the photoelectric detector is stable. The optical attenuator regulator and the semiconductor amplifier regulator provide a first operating current and a second operating current, respectively. The MCU controls the optical attenuator regulator and the semiconductor amplifier regulator to output the first working current and the second working current according to the magnitude of the current monitoring signal, so that an electric signal obtained on the photoelectric detector is stable, namely the optical power of received light detected on the photoelectric detector is stable.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The optical module comprises a silicon optical chip and an optical fiber array, wherein the silicon optical chip comprises a photoelectric detector, and the optical fiber array is electrically coupled with the silicon optical chip. And the silicon optical chip receives the received light from the optical fiber array and demodulates the received light by using the photoelectric detector.

When the optical module works normally, the optical power of the received light detected by the photoelectric detector needs a proper power range. If the optical power of the received light is too large or too small, the quality of signals transmitted by the optical module is deteriorated, and the error rate is increased.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module for the optical power of the received light that the photoelectric detector of optical module detected is stable.

A light module, comprising:

a circuit board;

the light source is electrically connected with the circuit board and is used for emitting the emitted light;

the silicon optical chip is electrically connected with the circuit board and the light source and used for demodulating received light;

one end of the optical fiber ribbon is electrically connected with the optical fiber interface, and the other end of the optical fiber ribbon is electrically connected with the silicon optical chip and is used for transmitting and receiving light;

the silicon optical chip comprises an optical attenuator, a semiconductor amplifier and a photoelectric detector;

the optical attenuator is electrically connected with the optical fiber ribbon;

the semiconductor amplifier is electrically connected with the optical attenuator;

the photoelectric detector is electrically connected with the semiconductor amplifier and is used for converting received light into an electric signal;

the circuit board is provided with an amplitude limiting amplification chip, an MCU, an optical attenuator regulator and a semiconductor amplifier regulator;

the amplitude limiting amplification chip is electrically connected with the photoelectric detector and is used for amplifying the electric signal and outputting a corresponding current monitoring signal;

the MCU is electrically connected with the amplitude limiting amplification chip and is used for controlling the light attenuator regulator and the semiconductor amplifier regulator to output corresponding working currents according to the current monitoring signals;

the optical attenuator regulator is electrically connected with the optical attenuator and is used for providing a first working current for the optical attenuator;

and the semiconductor amplifier regulator is electrically connected with the semiconductor amplifier and is used for providing a second working current for the semiconductor amplifier.

A light module, comprising:

a circuit board;

a light source electrically connected to the circuit board and emitting light;

one end of the optical fiber ribbon is electrically connected with the optical fiber interface, and the other end of the optical fiber ribbon is electrically connected with the silicon optical chip through the optical fiber connector and is used for transmitting and receiving light;

the silicon optical chip comprises an optical attenuator, a light splitter, a semiconductor amplifier, a first photoelectric detector and a second photoelectric detector;

the optical attenuator is electrically connected with the optical fiber ribbon;

the optical splitter is electrically connected with the optical attenuator and is used for splitting received light into first received light and second received light;

the first photoelectric detector is electrically connected with the optical splitter and used for converting the first received light into a first electric signal;

the semiconductor amplifier is electrically connected with the optical splitter;

a second photodetector electrically connected to the semiconductor amplifier for converting the second received light into a second electrical signal;

the circuit board is provided with an MCU, an optical attenuator regulator and a semiconductor amplifier regulator;

the MCU is electrically connected with the first photoelectric detector and is used for controlling the light attenuator regulator and the semiconductor amplifier regulator to output corresponding working currents according to a first electric signal;

Has the advantages that: the application provides an optical module, which comprises a circuit board, a light source, a silicon optical chip and an optical fiber ribbon. And the light source is electrically connected with the circuit board and is used for emitting the emitted light. And the silicon optical chip is electrically connected with the circuit board and the light source and used for demodulating received light. One end of the optical fiber ribbon is electrically connected with the optical fiber interface, and the other end of the optical fiber ribbon is electrically connected with the silicon optical chip and used for transmitting and receiving light. The silicon optical chip comprises an optical attenuator, a semiconductor amplifier electrically connected with the optical attenuator and a photoelectric detector electrically connected with the semiconductor amplifier. The optical attenuator may modulate attenuation of the received light in accordance with the first operating current. The semiconductor amplifier may amplify the received light according to the second operating current. The photodetector is used to convert the received light into an electrical signal. The circuit board is provided with an amplitude limiting amplification chip electrically connected with the photoelectric detector, an MCU electrically connected with the amplitude limiting amplification chip, an optical attenuator regulator electrically connected with the optical attenuator and a semiconductor amplifier regulator electrically connected with the semiconductor amplifier. The amplitude limiting amplification chip is used for amplifying the electric signal and outputting a corresponding current monitoring signal. The MCU is used for controlling the attenuator regulator and the semiconductor amplifier regulator to output corresponding working currents according to the current monitoring signals. The optical attenuator regulator is used for providing a first working current for the optical attenuator. The semiconductor amplifier regulator is configured to provide a second operating current to the semiconductor amplifier. When the optical module works normally, the received optical power detected by the photoelectric detector needs a proper power range. When the received light power is too high, the photoelectric detector obtains a large current, the amplitude limiting amplification chip outputs a corresponding large current monitoring signal, and the MCU respectively controls the optical attenuator regulator and the semiconductor amplifier to output a large first working current and a small second working current (or the second working current is 0) according to the large current monitoring signal. The larger first working current acts on two sides of the optical attenuator, the amount of carriers in the optical attenuator which are focused in the optical attenuator is controlled to be increased, and the attenuation of received light is improved. And the smaller second working current (or the second working current is 0) acts on the semiconductor amplifier, controls the semiconductor amplifier not to work, and does not amplify the attenuated received light. Under the combined action of the larger first working current and the smaller second working current (or the second working current is 0), the received light reaching the photoelectric detector is reduced, and the electric signal obtained by the photoelectric detector is stable. When the light power of the received light is too small, the photoelectric detector obtains a small current, the amplitude limiting amplification chip outputs a corresponding small current monitoring signal, and the MCU respectively controls the optical attenuator regulator and the semiconductor amplifier to output a small first working current (or the first working current is 0) and a large second working current according to the small current monitoring signal. And the first working current is smaller, acts on two sides of the optical attenuator, controls the amount of carriers in the optical attenuator, which are focused in the optical attenuator, to be smaller, and reduces the attenuation of received light. The first working current is 0, acts on two sides of the optical attenuator, and cannot control carriers in the optical attenuator to focus in the optical attenuator so that received light is not attenuated. The larger second operating current acts on the semiconductor amplifier to control the operation of the semiconductor amplifier, and amplifies the attenuated received light (or the non-attenuated received light). Under the combined action of the smaller first working current (or the first working current is 0) and the larger second working current, the received light reaching the photoelectric detector is increased, and the electric signal obtained by the photoelectric detector is stable. In this application, MCU controls optical attenuator regulator and the corresponding operating current of semiconductor amplifier regulator output according to the size of the electric current monitoring signal of amplitude limiting amplifier chip output for the last electric signal that obtains of photoelectric detector is stable, and the last light power of receiving light that detects of photoelectric detector promptly is stable.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 4 is an exploded view of an optical module according to an embodiment of the present disclosure;

fig. 5 is a schematic structural view of an optical module with an upper shell and a lower shell removed according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of an optical module corresponding to a first silicon optical chip according to an embodiment of the present application;

fig. 8 is a schematic diagram of an optical module corresponding to a second silicon optical chip according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the interconversion between the optical signal and the electrical signal is realized inside the optical module 200, so that the establishment of the information connection between the optical fiber 101 and the optical network terminal 100 is realized; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 has an optical module 200 interface 102, which is used for accessing the optical module 200 and establishing bidirectional electrical signal connection with the optical module 200; the optical network terminal 100 has a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electrical signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal 100 transmits a signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, and the optical network terminal 100 monitors the operation of the optical module 200 as an upper computer of the optical module 200.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal 100 is a host computer of the optical module 200, and provides a data signal to the optical module 200 and receives a data signal from the optical module 200, and a common host computer of the optical module 200 also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for being connected with an electric port of the optical module 200 such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module 200 is inserted into an electrical connector inside the cage 106, and an optical port of the optical module 200 is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board 105, and the electric connector on the circuit board 105 is wrapped in the cage 106, so that the electric connector is arranged inside the cage 106; the optical module 200 is inserted into the cage 106, the optical module 200 is held by the cage 106, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by the heat sink 107 on the cage 106.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application. Fig. 4 is an exploded view of an optical module structure according to an embodiment of the present disclosure. Fig. 5 is a schematic structural view of an optical module with an upper shell and a lower shell removed according to an embodiment of the present application. As shown in fig. 3 to 5, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a substrate, a silicon optical chip 400, a light source 500, an optical fiber ribbon 600, and an optical fiber interface 700, where the silicon optical chip 400 and the light source 500 are respectively disposed on the same side surface of the circuit board 300.

The upper shell and the lower shell form a packaging cavity with two openings, specifically two openings (204, 205) in the same direction, or two openings in different directions; one of the openings is an electrical port 204 for inserting into an upper computer such as an optical network unit, the other opening is an optical port 205 for connecting an external optical fiber to an internal optical fiber, and the photoelectric devices such as the circuit board 300, the silicon optical chip 400 and the light source 500 are positioned in the packaging cavity.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper casing, lower casing to combine is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

The unlocking handle 203 is positioned on the outer wall of the packaging cavity/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the unlocking handle fixes the optical module in the cage of the upper computer, and the clamping relation between the optical module and the upper computer is released by pulling the unlocking handle, so that the optical module can be drawn out from the cage of the upper computer.

The bottom surface of the silicon optical chip and the bottom surface of the light source are respectively arranged on the substrate, the silicon optical chip is optically connected with the light source, the light path is very sensitive to the position relation between the silicon optical chip and the light source, and materials with different expansion coefficients can cause deformation in different degrees, so that the realization of a preset light path is not facilitated; in the embodiment of the application, the silicon optical chip and the light source are arranged on the same substrate, the substrate made of the same material deforms, the positions of the silicon optical chip and the light source are affected equivalently, and the relative position of the silicon optical chip and the light source is prevented from being greatly changed; the expansion coefficient of the substrate material is preferably similar to that of the silicon optical chip and/or the light source material, the main material of the silicon optical chip is silicon, the light source can adopt kovar metal, and the substrate is generally selected from silicon or glass and the like.

The relationship between the substrate and the circuit board is various, one of the ways is as shown in fig. 4, the circuit board is provided with an opening penetrating through the upper surface and the lower surface, the silicon optical chip and/or the light source are arranged in the opening, thus the silicon optical chip and/or the light source can simultaneously radiate heat towards the upper surface direction of the circuit board and the lower surface direction of the circuit board, the substrate is arranged at one side of the circuit board, the silicon optical chip and/or the light source penetrates through the opening of the circuit board and then is placed on the radiating substrate, and the substrate plays roles of supporting and radiating; in another mode, the circuit board is not provided with an opening, the substrate is arranged on the circuit board, specifically, the substrate is arranged on the surface of the circuit board or embedded in the circuit board, and the silicon optical chip and the light source are arranged on the surface of the substrate.

The surface of the end part of the circuit board is provided with a golden finger, the golden finger consists of one pin which is mutually independent, the circuit board is inserted into an electric connector in the cage, and the golden finger is in conductive connection with a clamping elastic sheet in the electric connector; the golden fingers can be arranged on the surface of one side of the circuit board, and the golden fingers are generally arranged on the upper surface and the lower surface of the circuit board in consideration of the large requirement on the number of pins; the golden finger is used for establishing electrical connection with the upper computer, and the specific electrical connection can be power supply, grounding, I2C signals, communication data signals and the like.

The bottom surface of the light source 500 is disposed on the substrate, and the light source 500 emits light through the side surface, and the emitted light enters the silicon photonics chip 400. Silicon is used as a main substrate of the silicon optical chip, and silicon is not an ideal luminescent material, so that a light source cannot be integrated in the silicon optical chip, and an external light source is required to provide the light source. The light provided by the light source to the silicon optical chip is emitted light with single wavelength and stable power, and does not carry data, and the silicon optical chip modulates the emitted light so as to load the data into the emitted light.

The bottom surface of the silicon photonics chip 400 is disposed on a substrate, and the side surface of the silicon photonics chip receives emitted light from a light source; the modulation of emitted light and the demodulation of received light are completed by a silicon optical chip, and a bonding pad electrically connected with a circuit board in a routing way is arranged on the surface of the silicon optical chip; specifically, the circuit board provides a data signal from the upper computer to the silicon optical chip, the silicon optical chip modulates the data signal into emitted light, and received light from the outside is demodulated into an electric signal through the silicon optical chip and then is output to the upper computer through the circuit board. The plurality of optical fibers of the silicon optical chip are consolidated into optical fiber ribbon 600. The optical fiber ribbon 600 has one end electrically connected to the optical fiber interface 700 and the other end electrically connected to the silicon optical chip 500 through the optical fiber connector 800, and is used for transmitting and receiving light. Specifically, the silicon optical chip is electrically connected to the optical fiber connector 800, the optical fiber connector 800 is electrically connected to the optical fiber ribbon 600, the optical fiber ribbon 600 is electrically connected to the optical fiber interface 700, and the optical fiber interface is electrically connected to the external optical fiber. The optical fiber connector 800 is configured to transmit the emitted light transmitted from the silicon optical chip to the optical fiber interface 700, and the optical fiber connector 800 is configured to transmit the received light transmitted from the optical fiber interface 700 to the silicon optical chip 400, so as to transmit the emitted light and receive the light.

Since the optical fiber ribbon 600 and the optical fiber splice 800 each include two. When light emitted by the light source enters the silicon optical chip, the light is modulated by the silicon optical chip and then transmitted to the optical fiber interface 700 through the optical fiber connector 800, so that the light emission of the optical module is realized; external light is transmitted to the silicon optical chip through the optical fiber interface 700 and the other optical fiber connector 800, and an electric signal is demodulated by the silicon optical chip and then output to an upper computer.

Fig. 6 is a schematic structural diagram of a circuit board according to an embodiment of the present application. Fig. 7 is a schematic diagram of an optical module corresponding to a first silicon optical chip according to an embodiment of the present application. As shown in fig. 5 to 7, the first silicon optical chip 400 in the embodiment of the present application includes an optical attenuator, a semiconductor amplifier, and a photodetector, and the circuit board 300 is provided with a limiting amplifier chip 302, an MCU301, an optical attenuator regulator 303, and a semiconductor amplifier regulator 304. In particular, the method comprises the following steps of,

an optical attenuator is electrically connected to the optical fiber ribbon 600 for modulating attenuation of received light in accordance with the first operating current. Specifically, the optical attenuator is electrically connected to the optical fiber ribbon 600 through the optical fiber connector 800. The optical attenuator includes an optical waveguide and an electrode.

The optical waveguide is used for transmitting and receiving light. The optical waveguide is not a pure silicon optical waveguide, but a silicon optical waveguide internally doped with a P-type N-type material.

The electrodes are respectively positioned on two sides of the optical waveguide and are used for modulating attenuation of received light according to the first working current. In particular, the first operating current at the electrode affects a change in the carrier concentration within the optical waveguide. When the first operating current is larger, the carrier concentration inside the optical waveguide becomes larger and larger, and the attenuation amount of received light increases as the transmission capability of the optical waveguide is worse. When the first operating current is small (or the first operating current is 0), the carrier concentration inside the optical waveguide becomes smaller and smaller, and the transmission capability of the optical waveguide becomes better, so that the attenuation amount of received light decreases.

And the semiconductor amplifier is electrically connected with the optical attenuator and is used for amplifying the received light according to the second working current. Specifically, the semiconductor amplifier amplifies the received light. The received light amplified by the semiconductor amplifier may be either the received light attenuated by the optical attenuator or the received light not attenuated by the optical attenuator. When the second operating current is small (or the second operating current is 0), the semiconductor amplifier does not operate and cannot amplify the received light. When the second operating current is large, the semiconductor amplifier operates to amplify the received light.

And the photoelectric detector is electrically connected with the semiconductor amplifier and is used for converting the amplified received light into an electric signal. The principle of the photodetector is that radiation causes a change in the conductivity of the irradiated material. The photodetector can convert the optical signal into an electrical signal. The amplified received light is converted into an electrical signal in the embodiments of the present application.

And the amplitude limiting amplification chip 302 is electrically connected with the photodetector and is used for amplifying the electric signal and outputting a corresponding current monitoring signal.

When the power of the received light detected by the photodetector is within a proper power range, the electrical signal obtained by the photodetector is stable. When the optical power of the received light detected by the photodetector is too large or too small, the resulting electrical signal on the photodetector is not stable.

The MCU301 is electrically connected to the limiting amplifier chip 302, and is configured to control the optical attenuator regulator 303 and the semiconductor amplifier regulator 304 to output corresponding working currents according to the current monitoring signal, so that the electrical signal obtained from the photodetector is stable. Specifically, when the received optical power is too high, the photodetector obtains a large current, the limiting amplification chip 302 outputs a corresponding large current monitoring signal, and the MCU301 controls the optical attenuator regulator 303 and the semiconductor amplifier 304 to output a large first working current and a small second working current (or the second working current is 0) according to the large current monitoring signal. The larger first working current acts on two sides of the optical attenuator, the amount of carriers in the optical attenuator which are focused in the optical attenuator is controlled to be increased, and the attenuation of received light is improved. And the smaller second working current (or the second working current is 0) acts on the semiconductor amplifier, controls the semiconductor amplifier not to work, and does not amplify the attenuated received light. Under the combined action of the larger first working current and the smaller second working current (or the second working current is 0), the received light reaching the photoelectric detector is reduced, and the electric signal obtained by the photoelectric detector is stable. When the received light power is too small, the photodetector obtains a small current, the amplitude limiting amplification chip 302 outputs a corresponding small current monitoring signal, and the MCU303 controls the optical attenuator regulator and the semiconductor amplifier to output a small first working current (or the first working current is 0) and a large second working current according to the small current monitoring signal. And the first working current is smaller, acts on two sides of the optical attenuator, controls the amount of carriers in the optical attenuator, which are focused in the optical attenuator, to be smaller, and reduces the attenuation of received light. The first working current is 0, acts on two sides of the optical attenuator, and cannot control carriers in the optical attenuator to focus in the optical attenuator so that received light is not attenuated. The larger second operating current acts on the semiconductor amplifier, controls the semiconductor amplifier to operate, and amplifies the attenuated received light (non-attenuated received light). Under the combined action of the smaller first working current (or the first working current is 0) and the larger second working current, the received light reaching the photoelectric detector is increased, and the electric signal obtained by the photoelectric detector is stable.

And an optical attenuator regulator 303 electrically connected to the optical waveguide for providing a first operating current to the optical attenuator. The optical attenuator regulator 303 is a variable current source that can be controlled by the MCU to output a variable current. Specifically, the MCU controls the optical attenuator regulator 303 to output a first working current according to the current monitoring signal. When the current monitoring signal is larger, the first operating current is smaller (or the first operating current is 0). When the current monitoring signal is small, the first working current is large.

And a semiconductor amplifier regulator 304 electrically connected to the semiconductor amplifier for providing a second operating current to the semiconductor amplifier. The semiconductor amplifier regulator 304 is a variable current source that can be controlled by the MCU to output a variable current. Specifically, the MCU controls the semiconductor amplifier regulator 304 to output the second operating current according to the current monitoring signal. When the current monitoring signal is larger, the second working current is larger. When the current monitoring signal is small, the second operating current is small (or the second operating current is 0).

As shown in fig. 5 and 6, the light module further includes a buffer 305.

And the buffer 305 is arranged on the circuit board 300, one end of the buffer is electrically connected with the amplitude limiting amplification chip 302, and the other end of the buffer is electrically connected with the golden finger, and is used for converting the amplified electric signal flowing into the golden finger into an electric signal meeting the requirement of the golden finger. Since the amplified electrical signal output by the limiting amplification chip 302 is not fixed, and may be larger or smaller, but the electrical signal meeting the requirement of the golden finger is fixed, a buffer 305 needs to be disposed between the limiting amplification chip 302 and the golden finger. The buffer 305 converts the amplified electrical signal flowing into the gold finger into an electrical signal that meets the requirements of the gold finger.

Fig. 8 is a schematic diagram of an optical module corresponding to a second silicon optical chip according to an embodiment of the present application. As shown in fig. 5, 6 and 8, the second silicon optical chip 400 in the embodiment of the present application includes an optical attenuator, an optical splitter, a semiconductor amplifier, a first photodetector and a second photodetector, and the circuit board 300 is provided with a limiting amplification chip 302, an MCU301, an optical attenuator regulator 303, a semiconductor amplifier regulator 304 and a buffer 305. In particular, the method comprises the following steps of,

an optical attenuator is electrically connected to the optical fiber ribbon 600 for modulating attenuation of received light in accordance with the first operating current.

And the optical splitter is electrically connected with the optical attenuator and is used for splitting the received light into first received light and second received light. The optical splitter splits the attenuated received light into first received light and second received light, wherein the received light may be the received light attenuated by the optical attenuator or the received light not attenuated by the optical attenuator, and the optical power ratio of the first received light to the second received light is 2: 98.

And the first photoelectric detector is electrically connected with the optical splitter and used for converting the first received light into a first electric signal. The first photoelectric detector converts the first received light into a first electric signal and transmits the first electric signal to the MCU.

And the semiconductor amplifier is electrically connected with the optical splitter and used for amplifying the second receiving light according to the second working current. The second received light is transmitted to a semiconductor amplifier. The semiconductor amplifier amplifies the second received light. When the second operating current is small, the semiconductor amplifier does not operate and cannot amplify the second received light. When the second operating current is large, the semiconductor amplifier operates to amplify the second received light.

And the second photoelectric detector is electrically connected with the semiconductor amplifier and used for converting the amplified second received light into a second electric signal. The amplified second received light is converted into a second electrical signal in the embodiment of the present application.

And the MCU301 is electrically connected with the first photoelectric detector and is used for controlling the optical attenuator regulator and the semiconductor amplifier regulator to output corresponding working currents according to the first electric signal so as to stabilize a second electric signal obtained on the second photoelectric detector. Specifically, when the received optical power is too high, the first photodetector obtains a large current, and the MCU301 controls the optical attenuator regulator 303 and the semiconductor amplifier 304 to output a first large operating current and a second small operating current (or the second operating current is 0) according to the large current. The larger first working current acts on two sides of the optical attenuator, the amount of carriers in the optical attenuator which are focused in the optical attenuator is controlled to be increased, and the attenuation of received light is improved. And the smaller second working current (or the second working current is 0) acts on the semiconductor amplifier, controls the semiconductor amplifier not to work, and does not amplify the attenuated received light. Under the combined action of the larger first working current and the smaller second working current (or the second working current is 0), the received light reaching the second photoelectric detector is reduced, and the electric signal obtained by the second photoelectric detector is stable. When the received light power is too small, the first photodetector obtains a small current, and the MCU303 controls the optical attenuator regulator and the semiconductor amplifier to output a small first operating current (or the first operating current is 0) and a large second operating current according to the small current. And the smaller first working current acts on two sides of the optical waveguide, so that the quantity of carriers in the optical waveguide which are focused in the optical waveguide is controlled to be smaller, and the attenuation of received light is reduced. The first working current is 0, acts on two sides of the optical attenuator, and cannot control carriers in the optical attenuator to focus in the optical attenuator so that received light is not attenuated. The larger second operating current acts on the semiconductor amplifier to control the operation of the semiconductor amplifier, and amplifies the attenuated received light (or the non-attenuated received light). Under the combined action of the smaller first working current (or the first working current is 0) and the larger second working current, the received light reaching the second photoelectric detector is increased, and the electric signal obtained by the second photoelectric detector is stable.

And the amplitude limiting amplification chip 302 is electrically connected with the second photodetector and is used for amplifying the second electric signal.

The optical attenuator regulator 303 is electrically connected to the optical attenuator and configured to provide a first operating current to the optical attenuator.

And a semiconductor amplifier regulator 304 electrically connected to the semiconductor amplifier for providing a second operating current to the semiconductor amplifier.

And a buffer 305, one end of which is electrically connected with the amplitude limiting amplification chip 304 and the other end of which is electrically connected with the golden finger, for converting the amplified second electrical signal flowing into the golden finger into an electrical signal according with the requirement of the alloy finger.

The application provides an optical module, which comprises a circuit board, a light source, a silicon optical chip and an optical fiber ribbon. And the light source is electrically connected with the circuit board and is used for emitting the emitted light. And the silicon optical chip is electrically connected with the circuit board and the light source and used for demodulating received light. One end of the optical fiber ribbon is electrically connected with the optical fiber interface, and the other end of the optical fiber ribbon is electrically connected with the silicon optical chip and used for transmitting and receiving light. The silicon optical chip comprises an optical attenuator, a semiconductor amplifier electrically connected with the optical attenuator and a photoelectric detector electrically connected with the semiconductor amplifier. The optical attenuator may modulate attenuation of the received light in accordance with the first operating current. The semiconductor amplifier may amplify the received light according to the second operating current. The photodetector is used to convert the received light into an electrical signal. The circuit board is provided with an amplitude limiting amplification chip electrically connected with the photoelectric detector, an MCU electrically connected with the amplitude limiting amplification chip, an optical attenuator regulator electrically connected with the optical attenuator and a semiconductor amplifier regulator electrically connected with the semiconductor amplifier. The amplitude limiting amplification chip is used for amplifying the electric signal and outputting a corresponding current monitoring signal. The MCU is used for controlling the attenuator regulator and the semiconductor amplifier regulator to output corresponding working currents according to the current monitoring signal, so that an electric signal obtained on the photoelectric detector is stable. The optical attenuator regulator is used for providing a first working current for the optical attenuator. The semiconductor amplifier regulator is configured to provide a second operating current to the semiconductor amplifier. When the optical module works normally, the received optical power detected by the photoelectric detector needs a proper power range. When the received light power is too high, the photoelectric detector obtains a large current, the amplitude limiting amplification chip outputs a corresponding large current monitoring signal, and the MCU respectively controls the optical attenuator regulator and the semiconductor amplifier to output a large first working current and a small second working current (or the second working current is 0) according to the large current monitoring signal. The larger first working current acts on two sides of the optical attenuator, the amount of carriers in the optical attenuator which are focused in the optical attenuator is controlled to be increased, and the attenuation of received light is improved. And the smaller second working current (or the second working current is 0) acts on the semiconductor amplifier, controls the semiconductor amplifier not to work, and does not amplify the attenuated received light. Under the combined action of the larger first working current and the smaller second working current (or the second working current is 0), the received light reaching the photoelectric detector is reduced, and the electric signal obtained by the photoelectric detector is stable. When the light power of the received light is too small, the photoelectric detector obtains a small current, the amplitude limiting amplification chip outputs a corresponding small current monitoring signal, and the MCU respectively controls the optical attenuator regulator and the semiconductor amplifier to output a small first working current (or the first working current is 0) and a large second working current according to the small current monitoring signal. And the smaller first working current acts on two sides of the optical waveguide, so that the quantity of carriers in the optical waveguide which are focused in the optical waveguide is controlled to be smaller, and the attenuation of received light is reduced. The first working current is 0, acts on two sides of the optical attenuator, and cannot control carriers in the optical attenuator to focus in the optical attenuator so that received light is not attenuated. The larger second operating current acts on the semiconductor amplifier to control the operation of the semiconductor amplifier, and amplifies the attenuated received light (or the non-attenuated received light). Under the combined action of the smaller first working current (or the first working current is 0) and the larger second working current, the received light reaching the photoelectric detector is increased, and the electric signal obtained by the photoelectric detector is stable. In this application, MCU controls optical attenuator regulator and the corresponding operating current of semiconductor amplifier regulator output according to the size of the electric current monitoring signal of amplitude limiting amplifier chip output for the last electric signal that obtains of photoelectric detector is stable, and the last light power of receiving light that detects of photoelectric detector promptly is stable.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board;

the light source is electrically connected with the circuit board and is used for emitting emitted light;

one end of the optical fiber ribbon is electrically connected with the optical fiber interface, and the other end of the optical fiber ribbon is electrically connected with the silicon optical chip and is used for transmitting the transmitting light and the receiving light;

the optical attenuator is electrically connected with the optical fiber ribbon;

the photoelectric detector is electrically connected with the semiconductor amplifier and is used for converting the received light into an electric signal;

the semiconductor amplifier regulator is electrically connected with the semiconductor amplifier and used for providing a second working current for the semiconductor amplifier.

2. The optical module of claim 1, wherein the optical attenuator regulator and the semiconductor amplifier regulator are both variable current sources.

3. The light module of claim 1, further comprising a buffer;

the buffer is arranged on the circuit board, one end of the buffer is electrically connected with the amplitude limiting amplification chip, and the other end of the buffer is electrically connected with the golden finger and used for converting the amplified electric signal flowing into the golden finger into an electric signal meeting the requirements of the golden finger.

4. The optical module of claim 1, wherein the optical attenuator comprises an optical waveguide and an electrode;

the optical waveguide for transmitting the received light;

the electrodes are respectively positioned on two sides of the optical waveguide.

5. The optical module of claim 4, wherein the optical waveguide is a silicon optical waveguide doped with a P-type N-type material.

6. A light module, comprising:

a circuit board;

the light source is electrically connected with the circuit board and emits emitting light;

one end of the optical fiber ribbon is electrically connected with the optical fiber interface, and the other end of the optical fiber ribbon is electrically connected with the silicon optical chip through an optical fiber connector and used for transmitting the transmitting light and the receiving light;

the optical attenuator is electrically connected with the optical fiber ribbon;

the optical splitter is electrically connected with the optical attenuator and is used for splitting the received light into first received light and second received light;

the first photoelectric detector is electrically connected with the optical splitter and is used for converting the first received light into a first electric signal;

the second photoelectric detector is electrically connected with the semiconductor amplifier and used for converting the second received light into a second electric signal;

the MCU is electrically connected with the first photoelectric detector and is used for controlling the optical attenuator regulator and the semiconductor amplifier regulator to output corresponding working currents according to the first electric signal;

7. The optical module of claim 6, further comprising a clipping amplification chip and a buffer;

the amplitude limiting amplification chip is electrically connected with the second photoelectric detector and is used for amplifying the second electric signal;

one end of the buffer is electrically connected with the amplitude limiting amplification chip, and the other end of the buffer is electrically connected with the golden finger and used for converting the second electric signal flowing into the golden finger into an electric signal meeting the requirements of the golden finger.