CN113498259A - Embedded circuit board and preparation method thereof - Google Patents
Embedded circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN113498259A CN113498259A CN202010271164.3A CN202010271164A CN113498259A CN 113498259 A CN113498259 A CN 113498259A CN 202010271164 A CN202010271164 A CN 202010271164A CN 113498259 A CN113498259 A CN 113498259A
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- China
- Prior art keywords
- circuit board
- metal base
- main body
- signal transmission
- board main
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
The application discloses bury formula circuit board and preparation method thereof, this bury formula circuit board includes: a circuit board main body; the signal transmission layers are arranged on two opposite sides of the circuit board main body; the bonding layer is arranged between at least one signal transmission layer and the circuit board main body and is used for bonding the signal transmission layer to the circuit board main body; the metal base is embedded in the circuit board main body and is electrically connected with the signal transmission layers positioned on the two opposite sides of the circuit board main body; the conductive piece is arranged at the position corresponding to the metal base in the bonding layer and electrically connected with the signal transmission layer and the metal base; and the magnetic core is embedded in the circuit board main body. The embedded circuit board provided by the application can ensure that the metal base arranged in the embedded circuit board realizes a large current-carrying function.
Description
Technical Field
The present disclosure relates to circuit board technologies, and in particular, to an embedded circuit board and a method for manufacturing the same.
Background
With the continuous improvement of electronic product performance, a design of embedding a metal base into a circuit board for heat dissipation is now available.
The inventors of the present application have found that, when embedding a metal matrix in a circuit board for heat dissipation, it is also possible to transmit current using the metal matrix, that is, current carrying, the metal base needs to be electrically connected with the signal transmission layer on the surface of the circuit board, and when such a circuit board is prepared, a groove is usually formed on the circuit board with the signal transmission layer on the surface, then putting the metal base into the circuit board and pressing the metal base, then plating copper on the surface of the metal base to electrically connect the metal base with the signal transmission layer on the surface of the circuit board, in the process of putting the metal base into the circuit board and pressing, materials such as prepreg and the like in the circuit board flow into the groove of the circuit board to fix the metal base, and then the fixing material higher than the surface of the metal base exists at the junction of the circuit board and the metal base, so that the copper layer at the junction of the circuit board and the metal base is thinner than other areas, and the realization of a large current-carrying function of the metal base is not facilitated finally.
Disclosure of Invention
The technical problem mainly solved by the application is to provide an embedded circuit board and a preparation method thereof, which can ensure that a metal base arranged in the embedded circuit board realizes a large current-carrying function.
In order to solve the technical problem, the application adopts a technical scheme that: provided is an embedded circuit board including: a circuit board main body; the signal transmission layers are arranged on two opposite sides of the circuit board main body; the bonding layer is arranged between at least one signal transmission layer and the circuit board main body and is used for bonding the signal transmission layer to the circuit board main body; the metal base is embedded in the circuit board main body and is electrically connected with the signal transmission layers positioned on two opposite sides of the circuit board main body; the conductive piece is arranged in the bonding layer corresponding to the metal base and electrically connected with the signal transmission layer and the metal base; and the magnetic core is embedded in the circuit board main body.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a method for manufacturing an embedded circuit board, the method including: preparing a circuit board main body; forming a containing groove on the circuit board main body, placing a metal base in the containing groove, and embedding a magnetic core into the circuit board main body; forming an adhesive layer on one side of the circuit board main body, which is exposed out of the metal base; embedding a conductive piece at the position of the bonding layer corresponding to the metal base; and forming a signal transmission layer on one side of the bonding layer, which is far away from the circuit board main body, and electrically connecting the signal transmission layer with the metal base through the conductive piece.
The beneficial effect of this application is: the embedded circuit board in the application is electrically connected with the signal transmission layer through the conductive member by the metal base arranged therein, so that during preparation, after the metal base is placed in the circuit board main body, an adhesive layer can be formed on the side of the circuit board main body, which is exposed from the metal base, then, the bonding layer is dug and provided with a conductive piece corresponding to the metal base (or, the conductive piece is arranged corresponding to the metal base first, then the bonding layer is formed), then the whole conductive layer is formed on one side of the bonding layer far away from the circuit board main body, and then the signal transmission layer is formed by utilizing the whole conductive layer, thereby ensuring that the thickness of any position of the signal transmission layer for transmitting current is equal, finally ensuring that the metal base arranged in the signal transmission layer can realize large current-carrying function, in addition, the magnetic core and the metal base are embedded into the circuit board main body, so that the size of the circuit board can be reduced, and the heat dissipation performance of the circuit board can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic cross-sectional view of an embodiment of an embedded circuit board according to the present application;
fig. 2 is a schematic cross-sectional view of the embedded circuit board of fig. 1 in an application scenario;
fig. 3 is a schematic cross-sectional view of the embedded circuit board of fig. 1 in another application scenario;
fig. 4 is a schematic cross-sectional view of the embedded circuit board of fig. 1 in another application scenario;
FIG. 5 is a schematic cross-sectional view of another embodiment of an embedded circuit board of the present application;
FIG. 6 is a schematic flow chart diagram illustrating an embodiment of a method for fabricating an embedded circuit board according to the present application;
fig. 7 is a diagram of a manufacturing process corresponding to the manufacturing method of fig. 6.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of an embodiment of an embedded circuit board according to the present application. The embedded circuit board 1000 includes: circuit board main part 1100, signal transmission layer 1200, adhesive layer 1300, metal base 1400, electrically conductive member 1500 and magnetic core 1600.
The circuit board main body 1100 plays a main supporting role in the whole embedded circuit board 1000, the metal base 1400 is embedded in the circuit board main body 1100 and electrically connected to the signal transmission layers 1200 located at two opposite sides of the circuit board main body 1100, that is, the metal base 1400 plays a current-carrying role, wherein the material of the metal base 1400 may be copper, aluminum, or an alloy including copper and aluminum, or other conductive materials, and the cross section of the metal base 1400 along the thickness direction thereof is rectangular, T-shaped or other shapes. Specifically, the circuit board main body 1100 is provided with a through groove 1101, and the metal base 1400 is disposed in the through groove 1101, wherein the size of the through groove 1101 is slightly larger than the size of the metal base 1400, or the size of the through groove 1101 is equivalent to the size of the metal base 1400.
The signal transmission layer 1200 is made of a conductive material, such as copper, aluminum, or the like, for realizing transmission of signals. An adhesive layer 1300 is disposed between at least one signal transmission layer 1200 and the circuit board main body 1100, and the adhesive layer 1300 is used for adhering the signal transmission layer 1200 to the circuit board main body 1100, wherein the material of the adhesive layer 1300 may be a prepreg or epoxy resin, and the like, which is not limited herein. Specifically, an adhesive layer 1300 is disposed between both the signal transmission layers 1200 and the circuit board main body 1100, or the adhesive layer 1300 is disposed between only one signal transmission layer 1200 and the circuit board main body 1100, and the other signal transmission layer 1200 directly contacts with the circuit board main body 1100, for example, in an application scenario, the circuit board main body 1100 includes a core board (not shown), and the signal transmission layer 1200 directly contacting with the circuit board main body 1100 is a conductive layer on the surface of the core board.
The conductive member 1500 is disposed in the adhesive layer 1300 at a position corresponding to the metal base 1400, and electrically connects the signal transmission layer 1200 and the metal base 1400.
In particular, since the metal matrix 1400 is electrically connected to the signal transmission layer 1200 through the conductive member 1500, at the time of manufacturing, after the metal base 1400 is placed in the circuit board body 1100, the adhesive layer 1300 may be formed on the exposed side of the circuit board body 1100 where the metal base 1400 is exposed, then, a groove is dug at the position of the bonding layer 1300 corresponding to the metal base 1400 and the conductive member 1500 is arranged (or, the conductive member 1500 is arranged at the position corresponding to the metal base 1400, then the bonding layer 1300 is formed), then, a whole conductive layer is formed on the side of the adhesive layer 1300 away from the circuit board body 1100, and then the signal transmission layer 1200 is formed using the whole conductive layer, further, the thickness of any position of the signal transmission layer 1200 for transmitting current can be ensured to be equal, the defect that the signal transmission layer 1200 corresponding to the junction of the metal base 1400 and the circuit board main body 1100 is thin in the prior art is avoided, and finally the metal base 1400 arranged in the signal transmission layer can realize a large current-carrying function.
In an application scenario, as shown in fig. 1, a plurality of blind holes 1310 are disposed at the bonding layer 1300 corresponding to the metal base 1400, and the conductive member 1500 includes a conductive pillar 1510 disposed in the blind hole 1310, where the conductive pillar 1510 may be made of a conductive material such as copper, aluminum, or the like. Specifically, at least one blind hole 1310 (for example, 1, 3 or more) is disposed between one end of the metal base 1400 and the signal transmission layer 1200, and a conductive pillar 1510 electrically connecting the signal transmission layer 1200 and the metal base 1400 is disposed in each blind hole 1310.
In preparation, the adhesive layer 1300 is formed on the exposed side of the metal base 1400 of the circuit board body 1100, and then at least one blind via 1310 is formed at the position of the adhesive layer 1300 corresponding to the metal base 1400 by laser drilling or mechanical drilling, and then the conductive post 1510 is formed in the blind via 1310.
In another application scenario, as shown in fig. 2, an opening 1320 is formed at the position of the adhesion layer 1300 corresponding to the metal base 1400, and the conductive member 1500 includes a conductive paste 1520 or a conductive paste 1530 disposed in the opening 1320, in this case, during the preparation, the adhesion layer 1300 is formed at the position of the circuit board body 1100 where the metal base 1400 is exposed, then the opening 1320 is formed at the position of the adhesion layer 1300 corresponding to the metal base 1400, and then the conductive paste 1520 or the conductive paste 1530 is formed in the opening 1320, or the conductive paste 1520/the conductive paste 1530 is formed at the position of the circuit board body 1100 where the metal base 1400 is exposed, and then the adhesion layer 1300 is formed at the other part of the surface of the circuit board body 1100 where the conductive paste 1520/the conductive paste 1530 is disposed.
Of course, in other application scenarios, the conductive member 1500 may also be other conductive elements such as a conductive copper block (not shown) disposed in the bonding layer 1300 corresponding to the metal base 1400, and details thereof are not described herein.
In short, the specific structure of the conductive member 1500 is not limited herein as long as the conductive member 1500 is disposed at the position where the adhesive layer 1300 corresponds to the metal base 1400 and can electrically connect the signal transmission layer 1200 and the metal base 1400.
The embedded circuit board 1000 of the present embodiment can be applied to electronic devices such as a transformer and a power module.
With reference to fig. 1, in an application scenario, the number of the metal bases 1400 is more than two, for example, 2, 4 or more, wherein fig. 1 schematically illustrates that the number of the metal bases 1400 is two. Meanwhile, the two or more metal bases 1400 include a first metal base 1410 and a second metal base 1420, wherein the first metal base 1410 is disposed through the magnetic core 1600, and the second metal base 1420 is disposed at the periphery of the magnetic core 1600.
The signal transmission layer 1200 includes a conductive line pattern 1210, and the conductive line pattern 1210 is a whole conductive layer that is patterned, wherein the conductive line pattern 1210 is disposed between the first metal base 1410 and the second metal base 1420 in a bridging manner, so as to form a coil loop capable of transmitting current around the magnetic core 1600, that is, in this application scenario, the first metal base 1410 and the second metal base 1420 cooperate with each other to form a coil loop capable of transmitting current around the magnetic core 1600.
It should be noted that, when the number of the metal bases 1400 is more than two, the rest metal bases 1400 except the first metal base 1410 and the second metal base 1420 may be distributed at any wiring positions of the circuit board body 1100 where large current carrying is required, and the invention is not limited herein.
Referring to fig. 3, fig. 3 is a schematic cross-sectional view of the embedded circuit board of fig. 1 in another application scenario. Unlike the application scenario of fig. 1, in the present embodiment, the number of the metal bases 1400 is more than one, for example, 1, 2 or more. Wherein the number of metal bases 1400 is schematically illustrated as one in fig. 3. The one or more metal bases 1400 include a first metal base 1410, and the first metal base 1410 is disposed through the magnetic core 1600.
Meanwhile, the circuit board body 1100 is provided with a via hole 1102 located at the periphery of the magnetic core 1600, a conductive wire pattern 1210 is bridged between the first metal base 1410 and the via hole 1102, and a conductive material is disposed in the via hole 1102 and used for electrically connecting the conductive wire patterns 1210 on the two signal transmission layers 1200, so as to form a coil loop capable of transmitting current around the magnetic core 1600, that is, different from the above application scenario, the application scenario utilizes the first metal base 1410 and the via hole 1102 to cooperate with each other to form a coil loop capable of transmitting current around the magnetic core 1600.
The conductive material in the via hole 1102 may be coated only on the inner wall of the via hole 1102 (as shown in fig. 3), or may fill the via hole 1102, which is not limited herein.
Referring to fig. 4, fig. 4 is a schematic cross-sectional structure diagram of the embedded circuit board of fig. 1 in another application scenario. Similar to the application scenario of fig. 3, in the application scenario, the number of the metal bases 1400 is also more than one, for example, 1, 2 or more. However, different from the structure shown in fig. 3, the first metal base 1410 is located at the periphery of the magnetic core 1600, and the via hole 1102 penetrates through the magnetic core 1600, so that a coil loop for transmitting current around the magnetic core 1600 is formed by the mutual cooperation of the first metal base 1410 and the via hole 1102, that is, the circuit pattern 1210 is also bridged between the first metal base 1410 and the via hole 1102, and the conductive material is also disposed in the via hole 1102.
In the above application scenarios, the metal base 1400 is used for the coil loop for transmitting current around the magnetic core 1600, but in other application scenarios, the metal base 1400 may not be used to form the coil loop for transmitting current around the magnetic core 1600, for example, the via holes 1102 arranged inside and outside the magnetic core 1600 are used to form the coil loop for transmitting current, specifically, the conductive wire pattern 1210 is bridged between the via holes 1102 arranged inside and outside the magnetic core 1600, and the conductive material is arranged in the via holes 1102, so that the coil loop for transmitting current around the magnetic core 1600 is formed by the mutual cooperation between the via holes 1102. The metal base 1400 may be disposed at any position of the circuit board body 1100 where a large current carrying capacity is required.
With reference to fig. 1, in the present embodiment, the conductive patterns 1210 on the signal transmission layers 1200 on both sides of the circuit board body 1100 may be electrically connected through the through holes 1700 having the conductive material disposed therein, in addition to the metal base 1400. The number of the through holes 1700 may be 1, 2 or more, and is not limited herein.
Referring to fig. 5, fig. 5 is a schematic cross-sectional structure diagram of another embodiment of the embedded circuit board of the present application. In the present embodiment, the embedded circuit board 2000 includes two or more circuit board bodies 2100, for example, 2, 3 or more, and the two or more circuit board bodies 2100 are stacked, and the number of the signal transmission layer 2200, the adhesive layer 2300, the metal base 2400, the conductive member 2500, the magnetic core 2600, and the like are increased correspondingly as compared to the above-described embodiments.
Specifically, the present application does not limit the type of the structure of the embedded circuit board 2000, and modifications made on the core structure of the present application are within the scope of the present application.
Referring to fig. 6, fig. 6 is a schematic flow chart of an embodiment of a method for manufacturing an embedded circuit board according to the present application. With reference to fig. 7, the preparation method includes:
s110: a circuit board main body 8100 is prepared.
S120: a receiving groove 8101 is formed on the circuit board main body 8100, and a metal base 8400 is placed in the receiving groove 8101 while a magnetic core 8600 is embedded in the circuit board main body 8100.
In an application scenario, the accommodating groove 8101 is a through groove, and the thickness of the metal base 8400 is substantially the same as the thickness of the circuit board main body 8100.
In an application scenario, after the metal base 8400 is placed in the accommodating groove 8101, the circuit board main body 8100 and the metal base 8400 are pressed to form a fixing structure.
S130: an adhesive layer 8300 is formed on the side of the circuit board main body 8100 where the metal base 8400 is exposed.
S140: a conductive member 8500 is embedded in the adhesive layer 8300 corresponding to the metal base 8400.
S150: a signal transmission layer 8200 is formed on the side of the adhesive layer 8300 far away from the circuit board main body 8100, and the signal transmission layer 8200 is electrically connected with the metal base 8400 through a conductive member 8500.
In an application scenario, step S150 specifically includes: a copper foil (not shown) is covered on a side of the adhesive layer 8300 away from the circuit board body 8100, so that the copper foil is adhered to the circuit board body 8100 through the adhesive layer 8300 and is electrically connected with the metal base 8400 through the conductive member 8500, and then the copper foil is patterned to form the signal transmission layer 8200 including the lead pattern 8210, that is, the material of the signal transmission layer 8200 is copper at this time.
The embedded circuit board prepared by the preparation method in this embodiment is the same as or similar to the embedded circuit board in any of the above embodiments, and specific structures can be referred to the above embodiments, and are not described herein again.
In summary, the embedded circuit board in the present application is electrically connected to the signal transmission layer through the conductive member by the metal base disposed therein, and thus during the manufacturing process, after the metal base is placed in the circuit board main body, an adhesive layer can be formed on the side of the circuit board main body, which is exposed from the metal base, then, the bonding layer is dug and provided with a conductive piece corresponding to the metal base (or, the conductive piece is arranged corresponding to the metal base first, then the bonding layer is formed), then the whole conductive layer is formed on one side of the bonding layer far away from the circuit board main body, and then the signal transmission layer is formed by utilizing the whole conductive layer, thereby ensuring that the thickness of any position of the signal transmission layer for transmitting current is equal, finally ensuring that the metal base arranged in the signal transmission layer can realize large current-carrying function, in addition, the magnetic core and the metal base are embedded into the circuit board main body, so that the size of the circuit board can be reduced, and the heat dissipation performance of the circuit board can be improved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (12)
1. An embedded circuit board, comprising:
a circuit board main body;
the signal transmission layers are arranged on two opposite sides of the circuit board main body;
the bonding layer is arranged between at least one signal transmission layer and the circuit board main body and is used for bonding the signal transmission layer to the circuit board main body;
the metal base is embedded in the circuit board main body and is electrically connected with the signal transmission layers positioned on two opposite sides of the circuit board main body;
the conductive piece is arranged in the bonding layer corresponding to the metal base and electrically connected with the signal transmission layer and the metal base;
and the magnetic core is embedded in the circuit board main body.
2. The embedded circuit board of claim 1,
the bonding layer is provided with a plurality of blind holes corresponding to the metal base, and the conductive piece comprises a conductive column arranged in the blind holes.
3. The embedded circuit board of claim 1,
the bonding layer is provided with an opening corresponding to the metal base, and the conductive piece comprises conductive adhesive or conductive paste arranged in the opening.
4. The embedded circuit board of claim 1,
the number of the metal bases is more than two, the metal bases comprise first metal bases and second metal bases, the first metal bases penetrate through the magnetic core, and the second metal bases are located on the periphery of the magnetic core;
the signal transmission layer comprises a wire pattern, and the wire pattern is arranged between the first metal base and the second metal base in a bridging mode, so that a coil loop capable of transmitting current around the magnetic core is formed.
5. The embedded circuit board of claim 1,
the number of the metal bases is more than one, the metal bases comprise first metal bases, and the first metal bases penetrate through the magnetic core;
the circuit board main body is provided with a via hole positioned on the periphery of the magnetic core, the signal transmission layer comprises a conductor pattern, and the conductor pattern is bridged between the first metal base and the via hole;
and conductive materials are arranged in the via holes and used for electrically connecting the wire patterns on the two signal transmission layers, so that a coil loop capable of transmitting current around the magnetic core is formed.
6. The embedded circuit board of claim 1,
the number of the metal bases is more than one, the metal bases comprise first metal bases, and the first metal bases are positioned on the periphery of the magnetic core;
the circuit board main body is provided with a via hole penetrating through the magnetic core, the signal transmission layer comprises a conductor pattern, and the conductor pattern is bridged between the first metal base and the via hole;
and conductive materials are arranged in the via holes and used for electrically connecting the wire patterns on the two signal transmission layers, so that a coil loop capable of transmitting current around the magnetic core is formed.
7. The embedded circuit board of claim 1,
the cross section of the metal base along the thickness direction is rectangular or T-shaped.
8. The embedded circuit board of claim 1,
the number of the circuit board main bodies is more than 2, and the circuit board main bodies are stacked more than 2.
9. The embedded circuit board of claim 1,
the metal base is made of at least one of copper and aluminum, or the magnetic core is made of manganese zinc iron, nickel zinc iron or amorphous magnetic materials.
10. The embedded circuit board of claim 1,
the cross section of the magnetic core is in a shape of a circular ring, a runway, a 8 shape or a square ring.
11. A preparation method of an embedded circuit board is characterized by comprising the following steps:
preparing a circuit board main body;
forming a containing groove on the circuit board main body, placing a metal base in the containing groove, and embedding a magnetic core into the circuit board main body;
forming an adhesive layer on one side of the circuit board main body, which is exposed out of the metal base;
embedding a conductive piece at the position of the bonding layer corresponding to the metal base;
and forming a signal transmission layer on one side of the bonding layer, which is far away from the circuit board main body, and electrically connecting the signal transmission layer with the metal base through the conductive piece.
12. The method of claim 11, wherein the step of forming a signal transmission layer on the side of the adhesive layer away from the circuit board main body and electrically connecting the signal transmission layer to the metal base through the conductive member comprises:
covering a copper foil on the bonding layer, which is far away from the circuit board main body, so that the copper foil is bonded on the circuit board main body through the bonding layer and is electrically connected with the metal base through the conductive piece;
and patterning the copper foil to form a conductive line pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010271164.3A CN113498259A (en) | 2020-04-08 | 2020-04-08 | Embedded circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010271164.3A CN113498259A (en) | 2020-04-08 | 2020-04-08 | Embedded circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113498259A true CN113498259A (en) | 2021-10-12 |
Family
ID=77994771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010271164.3A Pending CN113498259A (en) | 2020-04-08 | 2020-04-08 | Embedded circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113498259A (en) |
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2020
- 2020-04-08 CN CN202010271164.3A patent/CN113498259A/en active Pending
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