CN113498250A - Embedded circuit board and preparation method thereof - Google Patents

Abstract

The application discloses bury formula circuit board and preparation method thereof, this bury formula circuit board includes: a circuit board main body; and the magnetic core and the metal base are embedded in the circuit board main body. The embedded circuit board provided by the application can reduce the size of the circuit board and improve the heat dissipation performance of the circuit board.

Description

Embedded circuit board and preparation method thereof

Technical Field

The present disclosure relates to circuit board technologies, and in particular, to an embedded circuit board and a method for manufacturing the same.

Background

With the increase of the integration level of electronic products, the miniaturization requirement of the power module is higher and higher, so that the layout space of the device must be reduced, and the magnetic device, as a core device of the power module, occupies a lot of space of a printed circuit board, and becomes a key factor restricting the miniaturization development of the power module.

In view of the above circumstances, a design manner of embedding a magnetic device into a circuit board has been proposed, but the inventors of the present application found that the heat dissipation performance of a circuit board embedded with a magnetic device needs to be improved.

Disclosure of Invention

The technical problem mainly solved by the application is to provide an embedded circuit board and a preparation method thereof, which can reduce the volume of the circuit board and improve the heat dissipation performance of the circuit board.

In order to solve the technical problem, the application adopts a technical scheme that: provided is an embedded circuit board including: a circuit board main body; and the magnetic core and the metal base are embedded in the circuit board main body.

In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a method for manufacturing an embedded circuit board, the method including: preparing a first sub circuit board main body; forming a first accommodating groove on the first sub circuit board main body, and placing a magnetic core in the first accommodating groove; forming a second sub circuit board body on a side of the first sub circuit board body where the magnetic core is exposed to cover the magnetic core; and forming a second accommodating groove, and placing the metal base in the second accommodating groove.

In order to solve the above technical problem, the present application adopts another technical solution: provided is a method for manufacturing an embedded circuit board, the method including: preparing a first sub circuit board main body; forming a first accommodating groove on the first sub-circuit board main body, and placing a metal base in the first accommodating groove; forming a second accommodating groove on the first sub circuit board main body, and placing a magnetic core in the second accommodating groove; and forming a second sub circuit board main body on one side of the first sub circuit board main body, which exposes the magnetic core, so as to cover the magnetic core.

The beneficial effect of this application is: in the embedded circuit board of the application, the magnetic core and the metal base are embedded in the circuit board main body, so that the size of the circuit board can be reduced, and the heat dissipation performance of the circuit board can be improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic cross-sectional view of an embodiment of an embedded circuit board according to the present application;

FIG. 2 is a schematic top view of the embedded circuit board of FIG. 1;

fig. 3 is a schematic cross-sectional view of the embedded circuit board of fig. 1 in an application scenario;

fig. 4 is a schematic cross-sectional view of the embedded circuit board of fig. 1 in another application scenario;

fig. 5 is a schematic cross-sectional view of the embedded circuit board of fig. 1 in another application scenario;

FIG. 6 is a schematic cross-sectional view of another embodiment of an embedded circuit board of the present application;

FIG. 7 is a schematic flow chart diagram illustrating an embodiment of a method for fabricating an embedded circuit board according to the present application;

FIG. 8 is a diagram of a manufacturing process corresponding to the manufacturing method of FIG. 7;

FIG. 9 is a partial process diagram of the preparation method of FIG. 7 in another application scenario;

FIG. 10 is a schematic flow chart illustrating a method for manufacturing an embedded circuit board according to another embodiment of the present disclosure;

FIG. 11 is a diagram of a manufacturing process corresponding to the manufacturing method of FIG. 10;

fig. 12 is a partial production process diagram of the production method of fig. 10 in another application scenario.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1 to 2, fig. 1 is a schematic cross-sectional structure of an embodiment of the embedded circuit board of the present application, and fig. 2 is a schematic top view of the embedded circuit board of fig. 1. The embedded circuit board 1000 includes: circuit board body 1100, magnetic core 1200 and metal matrix 1300.

The circuit board main body 1100 plays a main supporting role in the whole embedded circuit board 1000, and the magnetic core 1200 and the metal matrix 1300 are embedded in the circuit board main body 1100 at the same time. The material of the magnetic core 1200 may be manganese zinc iron, nickel zinc iron, or amorphous magnetic material, and the material of the metal base 1300 may be copper, aluminum, or an alloy including copper and aluminum, or other conductive material.

Specifically, the magnetic core 1200 is embedded in the circuit board body 1100, so that the volume of the embedded circuit board 1000 can be reduced compared to the volume of the embedded circuit board 1000 embedded on the surface of the circuit board body 1100, and the metal base 1300 is made of a conductive material, so that heat can be transferred from a region with a higher temperature to a region with a lower temperature, so that the heat dissipation performance of the embedded circuit board 1000 can be improved, that is, in this embodiment, the magnetic core 1200 and the metal base 1300 are embedded in the circuit board body 1100, so that the volume of the embedded circuit board 1000 can be reduced, and the heat dissipation performance of the embedded circuit board 1000 can be improved.

In an application scenario, an electronic component (not shown), such as a chip, is disposed on the metal base 1300, and the metal base 1300 is used for dissipating heat of the electronic component thereon.

With reference to fig. 1, in the present embodiment, signal transmission layers 1110 are disposed on two opposite sides of the circuit board body 1100.

The signal transmission layer 1110 is made of a conductive material, such as copper, aluminum, etc., for realizing transmission of signals. The metal base 1300 is electrically connected to the signal transmission layers 1110 located at two opposite sides of the circuit board body 1100 to realize signal transmission between the two signal transmission layers 1110, that is, at this time, the metal base 1300 not only has a heat dissipation function, but also can realize a current carrying function.

It should be noted that, in other embodiments, the circuit board main body 1100 may further include the signal transmission layers 1110 disposed inside, that is, the embedded circuit board 1000 is a multilayer board, in this case, the metal base 1300 for achieving the electrical connection between any two signal transmission layers 1110 may be disposed between any two signal transmission layers 1110, or, in other embodiments, only one side surface and inside of the circuit board main body 1100 is disposed with the signal transmission layers 1110, and the metal base 1300 electrically connects the signal transmission layers 1110 on the surface of the circuit board main body 1100 and the signal transmission layers 1110 inside the circuit board main body 1100, and in summary, the application does not limit the number of layers and specific positions of the signal transmission layers 1110.

Meanwhile, in the present embodiment, the thickness of the magnetic core 1200 is smaller than that of the metal base 1300, the cross section of the magnetic core 1200 may be in a circular ring shape, a racetrack shape, a square ring shape, or the like, and the cross section of the metal base 1300 along the thickness direction thereof is rectangular or T-shaped, which is not limited herein.

With continued reference to fig. 1 and 2, in an application scenario, the number of the metal bases 1300 is more than two, for example, 2, 4 or more, wherein the number of the metal bases 1300 is schematically illustrated as two in fig. 1 and 2. Meanwhile, the two or more metal bases 1300 include a first metal base 1310 and a second metal base 1320, wherein the first metal base 1310 penetrates through the magnetic core 1200, and the second metal base 1320 is located at the periphery of the magnetic core 1200.

The signal transmission layer 1110 includes a conductive wire pattern 1111, and the conductive wire pattern 1111 is disposed between the first metal base 1310 and the second metal base 1320 in a bridging manner, so as to form a coil loop capable of transmitting current around the magnetic core 1200, that is, in this application, the first metal base 1310 and the second metal base 1320 cooperate with each other to form a coil loop capable of transmitting current around the magnetic core 1200.

It should be noted that, when the number of the metal bases 1300 is more than two, the remaining metal bases 1300 except the first metal base 1310 and the second metal base 1320 may be distributed at any wiring position or heat dissipation position of the circuit board body 1100 where large current carrying is required, and is not limited herein.

With reference to fig. 1 and fig. 2, in the application scenario, the circuit board body 1100 is further provided with a first via hole 1400, and a conductive material is disposed in the first via hole 1400 for electrically connecting the conductive wire patterns 1111 at two sides of the circuit board body 1100, that is, the conductive wire patterns 1111 are not electrically connected by the metal base 1300. Wherein the conductive material can be, for example, copper, aluminum, etc., and the conductive material is disposed on the inner wall of the first via 1400 or fills the first via 1400 (as shown in fig. 1).

The number of the first via holes 1400 is at least one, such as 1, 2, 5, etc., and the at least one first via hole 1400 may be distributed at any position of the circuit board body 1100, which is not limited herein.

When the number of the first via holes 1400 is plural, at least two first via holes 1400 are bridged with a conductive wire pattern 1111 for transmitting signals.

Referring to fig. 3, fig. 3 is a schematic cross-sectional structure diagram of the embedded circuit board of fig. 1 in an application scenario. Unlike the application scenario of fig. 1, in the present embodiment, the number of the metal bases 1300 is more than one, for example, 1, 2 or more. Wherein the number of metal bases 1300 is schematically illustrated as one in fig. 3. The one or more metal bases 1300 include a first metal base 1310, and the first metal base 1310 penetrates through the magnetic core 1200.

Meanwhile, the circuit board body 1100 is provided with a second via hole 1500 located at the periphery of the magnetic core 1200, the signal transmission layer 1110 includes a conductive wire pattern 1111, the conductive wire pattern 1111 is bridged between the first metal base 1310 and the second via hole 1500, and a conductive material is disposed in the second via hole 1500 for electrically connecting the conductive wire patterns 1111 on the two signal transmission layers 1110, so as to form a coil loop capable of transmitting current around the magnetic core 1200, that is, different from the above application scenario, the application scenario utilizes the first metal base 1310 and the second via hole 1500 to cooperate with each other to form a coil loop capable of transmitting current around the magnetic core 1200.

The structure of the second via hole 1500 is similar to the structure of the first via hole 1400, as can be seen in the above embodiments. Meanwhile, similar to the above application scenario, the metal base 1300 other than the first metal base 1310 may be embedded at any position of the circuit board main body 1100, which is not limited herein.

Referring to fig. 4, fig. 4 is a schematic cross-sectional structure diagram of the embedded circuit board of fig. 1 in another application scenario. Similar to the application scenario of fig. 3, in the application scenario, the number of the metal bases 1300 is also more than one, for example, 1, 2 or more. However, different from the structure shown in fig. 3, the first metal base 1310 is located at the periphery of the magnetic core 1200, the second via hole 1500 penetrates through the magnetic core 1200, and at this time, the first metal base 1310 and the second via hole 1500 are matched with each other to form a coil loop for transmitting current around the magnetic core 1200, that is, the conductive wire pattern 1111 is also bridged between the first metal base 1310 and the second via hole 1500, and the second via hole 1500 is also provided with a conductive material.

In the above application scenarios, the metal base 1300 is used for the coil loop for transmitting current around the magnetic core 1200, but in other application scenarios, the coil loop for transmitting current around the magnetic core 1200 may be formed without using the metal base 1300, for example, the coil loop for transmitting current is formed by using via holes (not shown) disposed inside and outside the magnetic core 1200, specifically, the conductive wire pattern 1111 is bridged between the via holes disposed inside and outside the magnetic core 1200, and the conductive material is disposed in the via holes, so that the coil loop for transmitting current around the magnetic core 1200 is formed by the mutual cooperation between the via holes.

Meanwhile, in an application scenario, as shown in fig. 5, the circuit board main body 1100 includes a core board 1120 and a prepreg 1130 for bonding the adjacent core board 1120, wherein the number of the core boards 1120 and the prepregs 1130 is not limited, and at this time, the signal transmission layer 1110 is a conductive layer disposed on the surface of the core board 1120, but in other application scenarios, the signal transmission layer 1110 may not be a conductive layer on the surface of the core board 1120, and is bonded to a conductive layer on a dielectric material layer through a bonding layer, in short, the structure of the circuit board main body 1100 is not specifically limited by the present application.

Referring to fig. 6, fig. 6 is a schematic cross-sectional structure diagram of another embodiment of the embedded circuit board of the present application. In the present embodiment, the embedded circuit board 2000 includes more than two circuit board bodies 2100, for example, 2, 3 or more, the more than two circuit board bodies 2100 are stacked, and each circuit board body 2100 is embedded with a magnetic core 2110 and a metal base 2120.

The adjacent two circuit board main bodies 2100 are bonded by the adhesive layer 2200, and the material of the adhesive layer 2200 may be a prepreg or an epoxy resin.

In summary, the present application does not limit the number of layers of the circuit board body 2100.

Referring to fig. 7, fig. 7 is a schematic flow chart of an embodiment of a method for manufacturing an embedded circuit board according to the present application. With reference to fig. 8, the preparation method includes:

s110: a first sub circuit board main body 6100 is prepared.

In an application scenario, the first sub-circuit board main body 6100 is formed by stacking the core 6101 and the prepreg 6102 at intervals. In other application scenarios, the structure of the first sub-circuit board main body 6100 may be other, and is not limited herein.

S120: a first receiving groove 6110 is formed on the first sub-circuit board main body 6100, and the magnetic core 6200 is placed in the first receiving groove 6110.

The size of the first receiving groove 6110 is slightly larger than the size of the magnetic core 6200, or is equivalent to the size of the magnetic core 6200.

S130: a second sub-circuit board body 6300 is formed on the side of the first sub-circuit board body 6100 exposing the magnetic core 6200 to cover the magnetic core 6200.

In an application scenario, the structure of the second sub-circuit board main body 6300 is similar to that of the first sub-circuit board main body 6100, specifically, the board prepreg 6102 is placed on the side of the first sub-circuit board main body 6100 where the magnetic core 6200 is exposed, then the core board 6101 is placed, and the process is repeated, wherein the number of layers of the core board 6101 and the prepreg 6102 in the second sub-circuit board main body 6300 is determined according to specific situations in different application scenarios.

It can be understood that if the first receiving groove 6110 is a through groove, both sides of the first sub-circuit board main body 6100 expose the magnetic core 6200, so that the second sub-circuit board main body 6300 is formed by double-sided build-up, and if the first receiving groove 6110 is not a through groove, only one side of the first sub-circuit board main body 6100 exposes the magnetic core 6200, so that the second sub-circuit board main body 6300 is formed by single-sided build-up.

S140: a second receiving slot 6120 is formed, and the metal base 6400 is placed in the second receiving slot 6120.

The size of the second receiving groove 6120 is slightly larger than the size of the metal base 6400, or is equivalent to the size of the metal base 6400.

As can be seen from the above, in the present embodiment, magnetic core 6200 is embedded first, and then metal matrix 6400 is embedded.

In an application scenario, a signal transmission layer 6130 is formed on a side of the second sub circuit board main body 6300 away from the first sub circuit board main body 6100. At this time, in order to allow the metal matrix 6400 to function as a current carrying function, the metal matrix 6400 and the signal transmission layer 6130 may be electrically connected, and in particular, referring to fig. 9, the manufacturing method further includes:

a conductive layer 6500 covering the metal base 6400 is formed on the exposed side of the second sub-circuit board 6300 of the metal base 6400, and the conductive layer 6500 is electrically connected to the signal transmission layer 6130 on the same side of the second sub-circuit board 6300, so that the metal base 6400 is electrically connected to the signal transmission layer 6130, and then the signal transmission layer 6130 and the conductive layer 6500 are patterned to form a conductive pattern (not shown).

The embedded circuit board prepared by the preparation method in this embodiment is the same as or similar to the embedded circuit board in any of the above embodiments, and specific structures can be referred to the above embodiments, and are not described herein again.

Referring to fig. 10, fig. 10 is a schematic flow chart of another embodiment of the embedded circuit board of the present application. Unlike the above embodiment, in the present embodiment, the metal matrix is embedded first, and then the magnetic core is embedded, specifically, referring to fig. 11, the preparation method includes:

s210: the first sub circuit board main body 8100 is prepared.

The first sub circuit board main body 8100 has the same structure as the first sub circuit board main body 6100 in the above embodiment, and is not described again here.

S220: a first receiving slot 8110 is formed on the first sub circuit board main body 8100, and the metal base 8200 is placed in the first receiving slot 8110.

In an application scenario, the thickness of the metal base 8200 is greater than the thickness of the first sub circuit board main body 8100, and step S220 specifically includes: a first end 8210 of the metal base 8200 is protruded from the first surface 8101 of the first sub circuit board body 8100, and a second end 8220 of the metal base 8200 is disposed in the first sub circuit board body 8100. Of course, in other application scenarios, both ends of the metal base 8200 may protrude out of the surface of the first sub circuit board main body 8100.

S230: a second receiving groove 8120 is formed on the first sub circuit board main body 8100, and the magnetic core 8300 is placed in the second receiving groove 8120.

In an application scenario, when the magnetic core 8300 is required to be surrounded on the periphery of the metal base 8200, the second receiving groove 8120 is formed in the first receiving groove 8110, and when the first end 8210 of the metal base 8200 protrudes from the first surface 8101 of the first sub circuit board main body 8100 and the second end 8220 is disposed in the first sub circuit board main body 8100, the notch of the second receiving groove 8120 is specifically disposed on the first surface 8101 of the first sub circuit board main body 8100.

Optionally, in a specific application scenario, according to the sizes of the metal base 8200 and the magnetic core 8300, in the process of forming the second accommodation groove 8120, the metal base 8200 is milled, and then the cross section of the metal base 8200 along the thickness direction is T-shaped. Optionally, in another specific application scenario, in the process of forming the second accommodation groove 8120, the metal base 8200 is not milled.

S240: a second sub circuit board body 8400 is formed at a side of the first sub circuit board body 8100 where the magnetic core 8300 is exposed, to cover the magnetic core 8300.

In an application scenario, a second sub circuit board body 8400 is formed on the first surface 8101 of the first sub circuit board body 8100 to cover the magnetic core 8300, and a through hole 8401 is formed at the second sub circuit board body 8400 corresponding to the metal base 8200, so that the first end 8210 of the metal base 8200 is disposed in the second sub circuit board body 8400 and the second sub circuit board body 8400 exposes the first end 8210 of the metal base 8200.

In the above description, the metal base 8200 is illustrated as protruding from one surface of the first sub circuit board main body 8100, and the second sub circuit board main body 8400 is formed by single-sided build-up.

It can be understood that in other application scenarios, when both ends of the metal base 8200 protrude out of the surface of the first sub circuit board main body 8100 at the same time, the second sub circuit board main body 8400 needs to be formed in a double-sided layer adding manner, and the specific preparation process is not described herein again.

In an application scenario, a signal transmission layer 8410 is formed on the side of the second sub circuit board body 8400 away from the first sub circuit board body 8100. At this time, in order to allow the metal matrix 8200 to function as a current carrying function, the metal matrix 8200 and the signal transmission layer 8410 may be electrically connected, and specifically, referring to fig. 12, the manufacturing method further includes:

a conductive layer 8500 covering the metal base 8200 is formed on the side of the second sub-circuit board 8400 where the metal base 8200 is exposed, and the conductive layer 8500 is electrically connected to the signal transmission layer 8410 on the same side as the second sub-circuit board 8400, so that the metal base 8200 is electrically connected to the signal transmission layer 8410, and then the signal transmission layer 8410 and the conductive layer 8500 are patterned to form a wiring pattern (not shown).

Similarly, when the first sub circuit board 8100 also includes the signal transmission layer 8410, the same preparation method may also be adopted to electrically connect the metal base 8200 with the signal transmission layer 8410 in the first sub circuit board 8100, and further form a wire pattern, and the specific preparation process is not described herein again.

The embedded circuit board prepared by the preparation method in this embodiment is the same as the embedded circuit board in any of the above embodiments, and specific structures can be referred to the above embodiments, and are not described herein again.

In summary, in the embedded circuit board of the present application, the magnetic core and the metal base are embedded in the circuit board main body at the same time, so that the volume of the circuit board can be reduced, and the heat dissipation performance of the circuit board can be improved.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (15)

1. An embedded circuit board, comprising:

a circuit board main body;

and the magnetic core and the metal base are embedded in the circuit board main body.

2. The embedded circuit board of claim 1, wherein a signal transmission layer is disposed on each of two opposite sides of the circuit board main body, and the metal substrate is electrically connected to the signal transmission layers disposed on the two opposite sides of the circuit board main body.

3. The embedded circuit board of claim 2,

the number of the metal bases is more than two, the metal bases comprise first metal bases and second metal bases, the first metal bases penetrate through the magnetic core, and the second metal bases are located on the periphery of the magnetic core;

the signal transmission layer comprises a wire pattern, and the wire pattern is arranged between the first metal base and the second metal base in a bridging mode, so that a coil loop capable of transmitting current around the magnetic core is formed.

4. The embedded circuit board of claim 2,

the number of the metal bases is more than one, the metal bases comprise first metal bases, and the first metal bases penetrate through the magnetic core;

the circuit board main body is provided with a via hole positioned on the periphery of the magnetic core, the signal transmission layer comprises a conductor pattern, and the conductor pattern is bridged between the first metal base and the via hole;

and conductive materials are arranged in the via holes and used for electrically connecting the wire patterns on the two signal transmission layers, so that a coil loop capable of transmitting current around the magnetic core is formed.

5. The embedded circuit board of claim 2,

the number of the metal bases is more than one, the metal bases comprise first metal bases, and the first metal bases are positioned on the periphery of the magnetic core;

the circuit board main body is provided with a via hole penetrating through the magnetic core, the signal transmission layer comprises a conductor pattern, and the conductor pattern is bridged between the first metal base and the via hole;

and conductive materials are arranged in the via holes and used for electrically connecting the wire patterns on the two signal transmission layers, so that a coil loop capable of transmitting current around the magnetic core is formed.

6. The embedded circuit board of claim 2,

the thickness of the magnetic core is smaller than that of the metal base.

7. The embedded circuit board of claim 1,

the cross section of the metal base along the thickness direction is rectangular or T-shaped.

8. The embedded circuit board of claim 1,

the quantity of circuit board main part is more than 2, more than 2 the range upon range of setting of circuit board main part, every the circuit board main part all inlays and is equipped with the magnetic core and the metal matrix.

9. The embedded circuit board of claim 1,

the metal-based material is at least one of copper and aluminum.

10. The embedded circuit board of claim 1,

the magnetic core is made of manganese zinc iron, nickel zinc iron or amorphous magnetic materials.

11. A preparation method of an embedded circuit board is characterized by comprising the following steps:

preparing a first sub circuit board main body;

forming a first accommodating groove on the first sub circuit board main body, and placing a magnetic core in the first accommodating groove;

forming a second sub circuit board body on a side of the first sub circuit board body where the magnetic core is exposed to cover the magnetic core;

and forming a second accommodating groove, and placing the metal base in the second accommodating groove.

12. The manufacturing method of claim 11, wherein a signal transmission layer is formed on a side of the second sub circuit board main body away from the first sub circuit board main body;

after the second receiving groove is formed and the metal base is placed in the second receiving groove, the method further comprises the following steps:

forming a conducting layer covering the metal base on one side of the second sub circuit board, which is exposed out of the metal base, and electrically connecting the conducting layer with the signal transmission layer on the same side of the second sub circuit board;

patterning the signal transmission layer and the conductive layer to form a conductive line pattern.

13. A preparation method of an embedded circuit board is characterized by comprising the following steps:

preparing a first sub circuit board main body;

forming a first accommodating groove on the first sub-circuit board main body, and placing a metal base in the first accommodating groove;

forming a second accommodating groove on the first sub circuit board main body, and placing a magnetic core in the second accommodating groove;

and forming a second sub circuit board main body on one side of the first sub circuit board main body, which exposes the magnetic core, so as to cover the magnetic core.

14. The manufacturing method according to claim 13, wherein a thickness of the metal base is larger than a thickness of the first sub circuit board main body;

the step of forming a first receiving groove in the first sub-circuit board main body and placing a metal base in the first receiving groove includes:

forming the first accommodating groove on the first sub-circuit board main body, placing the metal base in the first accommodating groove so that the first end of the metal base protrudes out of the first surface of the first sub-circuit board main body and the second end of the metal base is arranged in the first sub-circuit board main body;

the step of forming a second receiving groove in the first sub-circuit board main body and placing the magnetic core in the second receiving groove includes:

forming the second accommodating groove in the first sub circuit board main body, so that a notch of the second accommodating groove is arranged on the first surface of the first sub circuit board main body;

placing the magnetic core in the second accommodating groove;

the step of forming a second sub circuit board body on a side of the first sub circuit board body where the magnetic core is exposed to cover the magnetic core, includes:

and forming a second sub circuit board main body on the first surface of the first sub circuit board main body to cover the magnetic core, wherein a through hole is formed in the second sub circuit board main body corresponding to the metal base, so that the first end of the metal base is arranged in the second sub circuit board main body and the first end of the metal base is exposed by the second sub circuit board main body.

15. The method for manufacturing a printed circuit board according to claim 14, wherein a signal transmission layer is formed on a side of the second sub circuit board main body away from the first sub circuit board main body, and the method further comprises:

forming a conducting layer covering the metal base on one side of the second sub circuit board, which is exposed out of the metal base, and electrically connecting the conducting layer with the signal transmission layer on the same side of the second sub circuit board;

patterning the signal transmission layer and the conductive layer to form a conductive line pattern.

Images