CN113437634A - Laser device - Google Patents

Abstract

The application discloses laser belongs to the technical field of photoelectricity. The laser includes: bottom plate, tube and a plurality of light-emitting component, light-emitting component includes: the device comprises a heat sink, a laser chip and a collimating lens; the tube shell and the bottom plate form an accommodating space, for each light-emitting component, the heat sink is attached to the bottom plate, the laser chip is attached to the surface of the heat sink, which is intersected with the bottom plate, and the collimating lens is positioned on one side of the laser chip, which is far away from the bottom plate; for each light-emitting component, the laser chip is used for emitting light to the collimating lens, and the collimating lens is used for collimating the light emitted by the laser chip and then emitting the light along the direction far away from the bottom plate. The problem of the difficult miniaturization that realizes the laser instrument has been solved to this application. The application is used for light emission.

Description

Laser device

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser.

Background

With the development of the optoelectronic technology, the laser is widely used, and the requirement for miniaturization of the laser is higher and higher.

The laser comprises a bottom plate, a tube shell, a plurality of heat sinks, a plurality of laser chips, a plurality of reflecting prisms and a collimating lens layer, wherein the collimating lens layer comprises a plurality of integrally formed collimating lenses. The tube shell, the heat sinks and the reflecting prisms are all located on the bottom plate, each laser chip is located on the surface, far away from the bottom plate, of one heat sink, the tube shell is annular and surrounds the heat sinks, the laser chips and the reflecting prisms, and the collimating lens layer is located on one side, far away from the bottom plate, of the tube shell; the plurality of laser chips correspond to the plurality of reflection prisms and the plurality of collimating lenses one by one, each reflection prism is located on the light emitting side of the corresponding laser chip, the reflection prisms are used for reflecting light emitted by the corresponding laser chip to the collimating lenses corresponding to the laser chips, and then the collimating lenses adjust the light into parallel light.

Because the laser has more structures, the laser has a larger volume, and the miniaturization of the laser is difficult to realize.

Disclosure of Invention

The application provides a laser, can solve the difficult miniaturized problem that realizes the laser. The laser includes:

a base plate, a package and a plurality of light emitting assemblies, the light emitting assemblies comprising: the device comprises a heat sink, a laser chip and a collimating lens;

the tube shell and the bottom plate form an accommodating space, the heat sink is attached to the bottom plate for each light-emitting component, the laser chip is attached to the surface of the heat sink, which is intersected with the bottom plate, and the collimating lens is positioned on one side of the laser chip, which is far away from the bottom plate;

for each light-emitting component, the laser chip is used for emitting light to the collimating lens, and the collimating lens is used for collimating the light emitted by the laser chip and then emitting the light in the direction far away from the bottom plate.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser that this application provided, laser chip subsides are adorned in heat sink and the crossing surface of bottom plate in every light-emitting component on, and collimating lens is located the one side that the bottom plate was kept away from to the laser chip, so the laser chip can directly send light to collimating lens, and then makes this light along the direction outgoing of keeping away from the bottom plate. Therefore, the laser can emit light without a reflecting prism, so that the laser comprises fewer structures and is beneficial to realizing the miniaturization of the laser.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in the related art;

fig. 2 is a schematic structural diagram of a laser provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of another laser provided in an embodiment of the present application;

FIG. 5 is a schematic structural diagram of another laser provided in an embodiment of the present application;

FIG. 6 is a schematic diagram of another laser according to another embodiment of the present application;

fig. 7 is a schematic structural diagram of another laser provided in another embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is wider and wider, for example, the laser can be applied to the aspects of welding process, cutting process, laser projection, etc., and the requirements for miniaturization, thinning and light emitting efficiency of the laser are higher and higher at present.

Fig. 1 is a schematic structural diagram of a laser provided in the related art. As shown in fig. 1, the laser 00 includes a base plate 001, a case 002, a plurality of heat sinks 003, a plurality of laser chips 004, a plurality of reflection prisms 005, and a collimator lens layer 006 including a plurality of collimator lenses T integrally formed. Wherein the tube shell 002, the plurality of heat sinks 003 and the plurality of reflection prisms 004 are all located on the bottom plate 001, and each laser chip 004 is located on one heat sink 003. The tube shell 002 is annular and surrounds the plurality of heat sinks 003, the plurality of laser chips 004 and the plurality of reflection prisms 005, and the collimating lens layer 006 is located on one side of the tube shell 002 away from the bottom plate 001. This a plurality of laser instrument chips 004 and these a plurality of reflecting prism 005 and these a plurality of collimating lens T one-to-one, every reflecting prism 005 is located the light-emitting side of the laser instrument chip 004 that corresponds, and reflecting prism 005 is used for reflecting the light that the laser instrument chip 004 that corresponds jetted out to the collimating lens T that this laser instrument chip 004 corresponds, and then collimating lens T collimates this light. In the laser 00, a laser chip 004, a corresponding heat sink 003, a reflecting prism 005 and a collimating lens T can form a light emitting assembly.

Since the laser 00 shown in fig. 1 has many structures attached to the substrate 001, the substrate 001 needs to have a large area, and the laser has a large volume, which makes it difficult to miniaturize the laser. The following embodiment of this application provides a laser, can be so that the volume of laser is less, is convenient for realize the miniaturization of laser.

Fig. 2 is a schematic structural diagram of a laser according to an embodiment of the present disclosure. As shown in fig. 2, the laser 10 includes: a base plate 101, a package 102, and a plurality of light emitting components F including a heat sink 103, a laser chip 104, and a collimating lens 105.

The case 102 may be annular, and the case 102 and the bottom plate 101 may form an accommodating space. For each light-emitting component F, the heat sink 103 and the laser chip 104 are both positioned in the accommodating space, the heat sink 103 is attached to the bottom plate 101, the laser chip 104 is attached to the surface of the heat sink 103 intersecting with the bottom plate 101, and the collimating lens 105 is positioned on the side of the laser chip 104 away from the bottom plate 101. For each light emitting component F, the laser chip 104 is configured to emit light to the collimating lens 105, and the collimating lens 105 is configured to collimate the light emitted by the laser chip 104 and then emit the light in a direction away from the base plate 101.

It should be noted that, collimating the light, that is, converging the light, makes the divergence angle of the light smaller, and is closer to the parallel light. Each light emitting assembly in the embodiments of the present application may include one laser chip, and fig. 2 shows only four light emitting assemblies in the laser. Alternatively, the number of light emitting components in the laser may be six, ten, twenty or more, and the embodiment of the present application is not limited. When the number of the light emitting assemblies in the laser is large, the plurality of light emitting assemblies may be arranged in a matrix, or may also be arranged in other arrangement modes, such as staggered arrangement or arrangement in a circle, which is not limited in the embodiments of the present application.

To sum up, in the laser provided in the embodiment of the present application, the laser chip in each light emitting component is attached to the surface intersecting with the bottom plate in the heat sink, and the collimating lens is located at the side of the laser chip far away from the bottom plate, so that the laser chip can directly emit light to the collimating lens, and the light is emitted along the direction far away from the bottom plate. Therefore, the laser can emit light without a reflecting prism, so that the laser comprises fewer structures and is beneficial to realizing the miniaturization of the laser.

Optionally, in each light emitting assembly in the embodiment of the present application, the surface of the collimating lens 105 close to the base plate 101 is a plane, and the surface far from the base plate 101 has a convex arc surface. Alternatively, the convex curved surface may be aspherical. Optionally, an orthographic projection of the convex arc surface on the plane may be a circle, or may also be another shape, such as a rectangle, and the embodiment of the present application is not limited.

Alternatively, in each light emitting assembly, the surface of the side of the collimating lens away from the base plate may only include a convex arc surface, or the surface of the side of the collimating lens away from the base plate may also include: a planar area near the heat sink, and a convexly curved area away from the heat sink. Illustratively, in the surface of the collimating lens of one light emitting component far away from the bottom plate, the part close to the heat sink is a plane, and the part close to the laser chip is a convex arc surface.

Optionally, the thermal conductivity of the heat sink in the embodiment of the present application may be relatively large, so that the heat may be quickly conducted out when the laser chip generates heat by emitting light, thereby avoiding damage of the heat to the laser chip. Materials such as heat sinks may include one or more of aluminum nitride and silicon carbide. It should be noted that, because the laser chip needs to be disposed on the surface where the heat sink intersects with the bottom plate in the embodiment of the present application, the thickness of the heat sink may be larger, for example, the thickness of the heat sink may be in a range of 0.2-0.3 mm. The thickness of the heat sink is the distance between the end of the heat sink far away from the bottom plate and the bottom plate.

Optionally, the material of the enclosure and the floor may include one or more of oxygen-free copper and kovar. When the material of the bottom plate comprises oxygen-free copper, the bottom plate can assist the heat sink to conduct heat generated by the laser chip at the moment because the thermal conductivity coefficient of the oxygen-free copper is also larger.

It should be noted that each light emitting assembly in the related art laser needs to include at least a heat sink and a reflecting prism attached to the base plate. The laser chip is attached to the surface, far away from the bottom plate, of the heat sink, the light emitting direction of the laser chip is parallel to the bottom plate, the heat sink and the laser chip are both prismatic, the light emitting direction of the laser chip is parallel to the surface with the larger area, the laser chip is attached to the heat sink through the surface with the larger area, the area, used for attaching the laser chip, of the heat sink needs to be larger, and the orthographic projection area of the heat sink on the bottom plate needs to be larger. Therefore, the area of the base plate occupied by each light-emitting component is large, the area of the base plate is large, and the size of the laser is large.

In the embodiment of the application, only the heat sink in each light-emitting assembly needs to be attached to the bottom plate, the laser chip is attached to the surface where the heat sink and the bottom plate are intersected, and the laser chip emits light rays towards the direction far away from the bottom plate, so that the surface where the heat sink is intersected with the bottom plate is large, the surface where the heat sink is attached to the bottom plate or far away from the bottom plate can be small, and the orthographic projection area of the heat sink on the bottom plate can also be small. Therefore, the area of the base plate occupied by each light-emitting component is smaller, the area of the base plate can be smaller, and the size of the laser is smaller. And because the area of the bottom plate that every light emitting component needs to occupy is less, so to with the laser instrument of the same volume in the correlation technique, can set up more light emitting component in the laser instrument that this application embodiment provided, and then can make the laser instrument of less volume send the light of higher luminance, improved the luminous effect of laser instrument.

Alternatively, as shown in fig. 2, for each light emitting assembly F, an end of the laser chip 104 away from the base plate 101 protrudes from an end of the heat sink 10 away from the base plate 101. Alternatively, the length of the laser chip 104 in the direction away from the base plate 101 may be less than 15 micrometers at the portion of the laser chip 104 protruding from the heat sink 103.

It should be noted that, because the light emitted by the laser chip has a divergence angle, the laser chip protrudes out of the heat sink to further enable the distance between the laser chip and the collimating lens to be short, thereby ensuring that the light emitted by the laser chip is emitted to the collimating lens more, avoiding the light waste caused by the light emitted by the laser chip being emitted to the outside of the collimating lens, and thus the brightness of the light emitted by the laser can be high.

Optionally, there may also be a portion of the laser in which one end of the laser chip away from the bottom plate is flush with one end of the heat sink away from the bottom plate, or one end of the laser chip away from the bottom plate in each light emitting assembly in the laser is flush with one end of the heat sink away from the bottom plate, which is not limited in this embodiment of the application. When the one end that the bottom plate was kept away from to the laser instrument chip all with the heat sink when keeping away from the one end parallel and level of bottom plate, the area of contact of laser instrument chip and heat sink is great, and then has increased the regional area that is supported by the heat sink in the laser instrument chip, has improved the setting steadiness of laser instrument chip. In addition, the heat generated in each area of the laser chip can be directly conducted through the heat sink, so that the heat dissipation effect of the laser chip is improved.

Alternatively, the spacing between the laser chip and the collimating lens may be less than 0.3 mm for each light emitting assembly, e.g., the spacing may range from 0.1 mm to 0.2 mm.

In the embodiment of the present application, there may be a plurality of optional implementation structures for the collimating lens, and three of the optional implementation structures are explained as an example below.

In a first alternative implementation structure, the structure of the collimating lens may be the same as that of the collimating lens in the related art. For example, the collimating lenses in the light emitting components in the laser may be integrally formed to form a collimating lens layer, and the collimating lens layer may refer to the collimating lens layer 006 shown in fig. 1, which is not described in detail in this embodiment of the present application.

In a second alternative implementation structure, please refer to the laser shown in fig. 3, fig. 2 may be a schematic diagram of a section a-a' of the laser shown in fig. 3, and fig. 3 may be a top view of the laser shown in fig. 2. As shown in fig. 3, the collimating lenses 105 in the respective light emitting elements F of the laser 10 are independent of each other.

It should be noted that, in the related art, the collimating lenses corresponding to the laser chips in the laser are integrally formed, and the position of each collimating lens in the collimating lens layer is designed according to the theoretical irradiation position of the light reflected by the corresponding reflecting prism. If the laser chip, the heat sink and the reflecting prism in the laser are all arranged according to the corresponding theoretical positions, the light reflected by the reflecting prism can be emitted to the central position of the corresponding collimating lens. However, since the heat sink, the laser chip, and the reflecting prism inevitably have positional deviations during assembly, the irradiation position of the light beam actually reflected by the reflecting prism and the theoretical irradiation position have positional deviations, and the positional deviations corresponding to different reflecting prisms are different. Therefore, it is difficult to ensure that the light reflected by each reflecting prism is emitted to the center of the corresponding collimating lens, the brightness difference of the light emitted by each collimating lens is large, and the collimation degree of the light emitted by the laser is low.

In the embodiment of the present application, each light emitting element may include an independent collimating lens, and the collimating lens may be mounted after the heat sink and the laser chip are mounted. For each light-emitting component, even if the setting positions of the laser chip and the heat sink are deviated from the theoretical position, the setting position of the collimating lens can be correspondingly adjusted when the collimating lens is mounted, so that light emitted by the laser chip can be accurately emitted to the central position of the collimating lens; and further, the collimation effect of each collimating lens on light rays can be ensured, and the collimation degree of the light rays emitted by the laser is ensured. Since individual adjustment can be made for each light emitting element, the position of each component does not need to be designed based on the entirety of all light emitting elements, so that the degree of freedom in designing the optical path of the laser is increased. And each light-emitting component can be independently adjusted to ensure that the light with smaller brightness difference is emitted by each light-emitting component.

In a third alternative implementation structure, please refer to the laser shown in fig. 4, fig. 2 may be a schematic diagram of a section b-b' of the laser shown in fig. 4, and fig. 4 may be a top view of the laser shown in fig. 2. As shown in fig. 4, the collimating lenses 105 in at least two adjacent light emitting assemblies F in the laser 10 may be integrally formed. For example, fig. 4 illustrates that the laser 10 includes 20 light emitting elements F, and the 20 light emitting elements F are arranged in an array, and fig. 4 illustrates that the collimating lenses 105 in each row of the light emitting elements F in the x direction are integrally molded. Alternatively, the collimating lenses of two adjacent light emitting assemblies in each row of light emitting assemblies F may be integrally formed, or the collimating lenses of three adjacent light emitting assemblies may be integrally formed. Optionally, the collimating lens may be integrally formed into a strip-shaped collimating lens structure, the extending directions of the collimating lens structures may be the same or different, and the embodiment of the present application is not limited. It should be noted that, when there are a plurality of collimating lenses integrally formed, the collimating lenses can be mounted on the bottom plate only for a few times, so that the mounting process of the collimating lenses can be simplified, and the assembly process of the laser can be further simplified.

Optionally, each collimating lens structure in the embodiments of the present application may have a plurality of convex curved surfaces on a side away from the base plate. The part covered by each convex cambered surface in the collimating lens structure can be used as a collimating lens in a light-emitting component and is used for collimating light rays emitted by a laser chip in the light-emitting component.

It should be noted that fig. 4 only illustrates an example in which the collimating lens in the laser can be integrally formed, and the heat sink and the reflecting prism in different light emitting assemblies are still independent of each other. Alternatively, the heat sinks in at least two adjacent light emitting assemblies can be integrally formed. For the way of integrally forming the heat sink, reference may be made to the way of integrally forming the collimating lens in fig. 4, and an embodiment of the present application is not separately illustrated.

Optionally, the second and third optional implementation structures of the collimating lens can be arranged in an accommodating space surrounded by the tube shell and the bottom plate, so that the tube shell can protect the collimating lens, the laser is prevented from being worn by the collimating lens in the use process, and the collimating effect of the collimating lens on light rays emitted by the laser chip is ensured.

Optionally, the light emitting angles of the laser chips in at least two light emitting assemblies in the laser provided by the embodiment of the present application may be different. The plurality of light emitting components in the laser may include: the laser chip comprises a first laser chip for emitting red light, a second laser chip for emitting green light and a third laser chip for emitting blue light. The light emitting angle of the first laser chip may be greater than the light emitting angle of the second laser chip and greater than the light emitting angle of the third laser chip. The light emitted from the laser chip is a cone light, and the light emission angle of the laser chip is the cone angle of the cone. For example, the light emitting angle of the first laser chip may be 70 degrees, and the light emitting angles of the second and third laser chips may be 50 degrees. Optionally, the laser provided by the embodiment of the application can be used in a laser television.

In an alternative embodiment of the present application, for each light emitting assembly, at least one of the following conditions may be satisfied: the aperture of the collimating lens can be positively correlated with the light-emitting angle of the laser chip; the radius of curvature of the convex curved surface may be inversely related to the light emission angle of the laser chip. It should be noted that the aperture of the collimating lens refers to the diameter of the collimating lens, the diameter of the collimating lens may be the diameter of a convex arc surface, and the larger the aperture of the collimating lens is, the larger the orthographic projection area of the collimating lens on the base plate is. The aperture of the collimating lens as in the embodiments of the present application may be the distance between the two ends of its convex arc surface in the direction parallel to the base plate.

Since the larger the light emitting angle of the laser chip, the larger the spot formed by the light emitted from the laser chip on the structure (such as the collimating lens) to which the light is directed. In the embodiment of the application, when laser chip light-emitting angle is great in certain light-emitting component, collimating lens's aperture is great, and then the light that laser chip sent can all shoot to collimating lens, and collimating lens can shoot out after all light that laser chip jetted out all collimates, has avoided the waste of light. When the light emitting angle of the laser chip in a certain light emitting component is small, the aperture of the collimating lens is small, the collimating lens with the small aperture can still realize that all light rays emitted by the laser chip are emitted after being collimated, and the waste of the collimating lens material due to the arrangement of the collimating lens with the large aperture is avoided.

The larger the curvature of the convex cambered surface in the collimating lens is, the better the converging effect of the collimating lens on light rays is. In the embodiment of the application, when the light-emitting angle of the laser chip is large in a certain light-emitting component, the curvature of the convex cambered surface in the collimating lens is large, and then the collimating lens can converge the light emitted by the laser chip to a greater extent, so that the collimating effect of the light emitted by the laser chip is ensured. When the light emitting angle of the laser chip in a certain light emitting component is small, the curvature of the convex cambered surface in the collimating lens is small, and the collimating effect of light rays emitted to the laser chip can be guaranteed through the convex cambered surface with the small curvature.

In another alternative embodiment of the present application, the parameters of the collimating lenses in the plurality of light emitting elements of the laser are the same. The parameters of the collimating lens may include one or more of an aperture and a radius of curvature of a convex curve of the collimating lens. In the light emitting module in which the laser chip having the largest light emitting angle among the plurality of light emitting modules is located, the collimating lens is used for collimating and emitting all light rays emitted by the laser chip. For example, the laser chip with the largest light emission angle may be the first laser chip for emitting red light. Because this collimating lens can jet out after collimating to the whole light that the laser chip that luminous angle is the biggest, so to the light-emitting component at the laser chip place that luminous angle is less, collimating lens also can jet out after collimating to the whole light that the laser chip that luminous angle is less sent, has guaranteed that the light that laser chip sent all has not wasted in the laser instrument. And only one specification of collimating lens is needed in the laser, so that the complex process of designing different collimating lenses for different laser chips is avoided.

Optionally, the aperture of the collimating lens in the embodiment of the present application may range from 0.6 mm to 1 mm. Alternatively, the radius of curvature of the collimating lens (i.e., the radius of curvature of the convex curve in the collimating lens) may be less than 5 millimeters. Such as 3 mm, 4 mm or 4.5 mm. Optionally, the curvature radius may also be adjusted according to the thickness of the collimating lens and the difference between the collimating lens and the laser chip, which is not limited in the embodiment of the present application. It should be noted that the thickness of the collimating lens is the distance between the center of the convex arc surface in the collimating lens and the plane opposite to the convex arc surface.

It should be noted that, in the related art, since the light emitting angle of the first laser chip (i.e., the laser chip for emitting red light) is large, the light spot formed on the collimating lens by the red light emitted by the first laser chip is large. In order to ensure the miniaturization of the laser, all the collimating lenses are designed according to the parameters of the collimating lens capable of collimating all the light rays emitted by the second laser chip or the third laser chip, so that the collimating lens for collimating the red light can only collimate part of the red light emitted by the laser chip. If only the light of the middle part of a beam of red light emitted by the first laser chip is utilized, the light of the edge part cannot be utilized, so that more red light is wasted, and the brightness of the red light emitted by the laser is lower.

In the embodiment of the application, the collimating lens with corresponding parameters can be adopted according to the light emitting angle of the laser chip, or all the collimating lenses are designed according to the parameters of the collimating lens for collimating all the light rays emitted by the first laser chip, so that the light rays emitted by all the laser chips can be utilized, the waste of red light is avoided, and the higher brightness of the red light emitted by the laser is ensured.

It should be noted that the collimator lens can be fixed in various ways, and the following two fixing ways are exemplified in the embodiments of the present application.

In a first alternative fixing, continuing to refer to fig. 2, for each light emitting assembly F, a collimating lens 105 is attached to the surface of the heat sink 103 remote from the base plate 101.

Alternatively, the collimating lens 105 may be attached to the surface of the heat sink 103 remote from the base plate 101 by an adhesive J. Optionally, the adhesive may include a glue without a volatile property, for example, the adhesive may include an ultraviolet curing glue, or may also be other glues, and the embodiment of the present application is not limited. The orthographic projection of each collimating lens on the bottom plate can at least cover the partial orthographic projection of the corresponding heat sink on the bottom plate, so that the pasting of the collimating lens and the heat sink is facilitated.

For example, after the heat sinks and the laser chips are mounted on the base plate, each collimating lens may be moved (e.g., by the coupling stage) to a side of the corresponding heat sink away from the base plate, and a gap may exist between the corresponding heat sink and the corresponding heat sink. Optionally, the laser chip can be made to emit light to be debugged in alignment with the setting position of the collimating lens, so that it is ensured that the collimating lens is arranged at a position where light emitted by the laser chip can be completely collimated and the collimating effect is good. And then filling adhesive in the gap between the collimating lens and the heat sink so as to bond the collimating lens and the heat sink through the adhesive, and further curing the adhesive, thereby completing the mounting of the collimating lens. If the size of the gap is smaller than 0.3 mm, the size of the gap is the distance between the collimating lens and the heat sink.

Optionally, fig. 5 is a schematic structural diagram of another laser provided in an embodiment of the present application. As shown in fig. 5, in each light emitting assembly, the surface of the side of the collimating lens 105 away from the base plate 101 includes: a planar area a near the heat sink, and a convexly curved area B far from the heat sink. Alternatively, at least a portion of the collimator lens 105 where the planar area a is located may be bonded to the heat sink 103 by an adhesive J.

It should be noted that, because the central position of the convex arc surface is better to the collimation effect of light, the surface far away from the bottom plate in the collimating lens includes the plane area near the heat sink, and when the convex arc surface is far away from the heat sink, the central position of the convex arc surface area can be closer to the laser chip, and then the collimating effect of the collimating lens to the laser chip can be better. And the part of the plane area in the collimating lens can be bonded with the heat sink through the adhesive, so that the situation that light is wasted due to the fact that the part of the convex arc surface is bonded with the heat sink and light emitted by the laser chip is blocked by the adhesive when the light is emitted to the convex arc surface area can be avoided.

It should be noted that, in the related art, the edge of the collimating lens layer may only be coated with the adhesive to adhere the collimating lens layer to the surface of the tube shell away from the base plate, the area of the adhering region is small, and the collimating lens layer generally includes more collimating lenses; therefore, the bonding firmness of the collimating lens layer is poor, the collimating lens layer is easy to loosen in the using process, and the requirement on the bonding effect of the adhesive is high. In the embodiment of the application, each collimating lens can be attached to the heat sink independently, and each collimating lens can be fixed by the adhesive, so that the adhesion firmness of the collimating lens is ensured; and the paste agent is only used for pasting the collimating lens with smaller volume, and the requirement on the pasting effect of the paste agent is lower.

In a second alternative fixing manner, fig. 6 is a schematic structural diagram of another laser provided in the embodiment of the present application, and as shown in fig. 6, the laser 10 may further include: a carrier structure 106, the carrier structure 106 is located on a side of the laser chip 104 away from the base plate 101, and an edge of the carrier structure 106 can be fixed on the package 102, the carrier structure 106 is used for carrying the collimating lens 105 and for transmitting light emitted from the laser chip 104 in the laser 10.

Illustratively, as shown in fig. 6, the interior wall of the housing 102 may have a boss Q, and the edge of the carrier structure 106 may be secured to the housing 102 by overlapping the boss Q. The boss may support at least the edges of the opposite sides of the load bearing structure, e.g., the boss may be annular to support the peripheral edge of the load bearing structure. Alternatively, the inner wall of the housing may have a recess, and the carrier structure may be fixed to the housing by snapping the edge into the recess. Alternatively, the edge of the support structure can also be fastened to the surface of the housing remote from the base plate.

As shown in fig. 6, the supporting structure 106 may have a hollow-out region K for transmitting the light emitted from the laser chip 104. If the carrying structure 106 has a plurality of hollow areas K, each hollow area K corresponds to at least one laser chip 104, and the laser chips 104 corresponding to different hollow areas K are different, an orthographic projection of each hollow area K on the bottom plate 101 at least covers an orthographic projection of the corresponding laser chip 104 on the bottom plate 101, and each hollow area K is used for transmitting light emitted by the corresponding laser chip 104. Alternatively, the material of the carrying structure may be an opaque material, such as a metal, kovar material or alloy.

For example, the collimating lens in the light emitting component where each laser chip is located may cover the hollow area corresponding to the laser chip, and then the light emitted by the laser chip may pass through the hollow area and shoot at the collimating lens, and then the collimating lens may shoot out the light after collimating the light. Alternatively, the edge of the collimating lens can be adhered to the peripheral structure of the hollow area covered by the collimating lens by an adhesive.

It should be noted that fig. 6 illustrates an example in which each hollow area corresponds to one laser chip. Optionally, when there are a plurality of integrally formed collimating lenses in the laser, the hollow areas corresponding to the laser chips in the light emitting assembly where the plurality of collimating lenses are located may be used to transmit the light emitted by the laser chips.

In the embodiment of the application, after the heat sink and the laser chip are attached to the bottom plate, the bearing structure can be fixed on the tube shell. And then coating an adhesive on the periphery of the hollow area in the bearing structure, arranging each collimating lens or collimating lens structure on the corresponding hollow area, enabling the laser chip to emit light at the moment, and finely adjusting the setting position of the collimating lens, so as to ensure that the collimating lens is arranged at a position where the light emitted by the laser chip can be completely collimated and the collimating effect is better. And then, curing the adhesive to finish the mounting of the collimating lens.

Optionally, the material of the bearing structure may also be a transparent material, and at this time, the bearing structure does not have a hollow area. Alternatively, the bearing structure may also be a supporting frame fixed on the bottom plate, or other forms of structures, and the embodiments of the present application are not limited.

Optionally, the laser may further include: and a light-transmitting sealing layer. The light-transmitting sealing layer, the tube shell and the bottom plate can form a sealed space, and each light-emitting component can be positioned in the sealed space. Alternatively, the edge of the light-transmitting sealing layer may be glued to the surface of the envelope remote from the base plate. Alternatively, the material of the light-transmissive sealing layer may include glass.

Alternatively, the light-transmitting sealing layer can also be fastened to the envelope by other means. Fig. 7 is a schematic structural diagram of another laser provided in another embodiment of the present application, and fig. 7 may be a schematic diagram of a section a-a 'in the laser shown in fig. 3, or a schematic diagram of a section b-b' in the laser shown in fig. 4. Referring to fig. 3, 4 and 7, the laser 10 may further include an upper cover 107, a light-transmissive sealing layer 108 and conductive leads 109. The upper cover 107 is located on a side of the laser chip 104 away from the base plate 101, and the upper cover 107 may have a ring shape, and a middle region of the upper cover 107 is recessed toward the base plate 101. The edge region of the upper cover 107 is fixed to the surface of the housing 102 remote from the base plate 101. The light-transmissive sealing layer 108 is located in the middle area of the cover on the side remote from the base plate 101, so that the light-transmissive sealing layer 108 is fixed to the envelope 102 via the cover 107. The conductive pins 109 extend through the side walls of the package 102. The upper cover 107, the light-transmissive encapsulant 108, the conductive pins 109, the package 102, and the base 101 may form a sealed space in which the light emitting assembly F is located.

It should be noted that the conductive pins 109 are electrically connected to the electrodes of the laser chip 104, so as to transmit an external power to the laser chip 104, and further excite the laser chip 104 to emit light. For example, the conductive pins may be connected to electrodes of the laser chips in the adjacent light emitting assemblies through wires, and the electrodes of the laser chips in the adjacent light emitting assemblies may be connected to each other through wires to transmit power to each laser chip. Alternatively, the conductive wire may be a gold wire, that is, the material of the conductive wire may be gold.

Alternatively, the number of gold wires connected between the conductive pins and the electrodes of the laser chips, and between the electrodes of different laser chips, may be inversely related to the diameter of the gold wires. If the diameter of the gold wire is 24 microns, two parts needing to be connected through the gold wire can be connected through 16 gold wires; if the diameter of the gold wire is 24 microns, two components needing to be connected through the gold wire can be connected through 4 gold wires.

In the embodiment of the present application, when assembling the laser, a ring-shaped solder structure may be placed in the opening on the sidewall of the package, and then the conductive pin may be passed through the solder structure and the opening where the solder structure is located. Then, the package is placed on the peripheral edge of the base plate, and the annular solder is placed between the base plate and the package, and then the base plate, the package and the conductive pin structure are placed in a high-temperature furnace for sealing and sintering. The laser chip can then be mounted on a corresponding heat sink using a high precision eutectic bonding machine. And then attaching the heat sink attached with the laser chip on the bottom plate by means of sintering gold paste or sintering silver paste and the like in an environment of 250-280 ℃. The structure of the backplane, the package, the conductive pins, the heat sink, and the laser chip may then be cleaned, such as with argon. The wires between the conductive pins and the electrodes of the laser chip, and between the electrodes of the laser chip, can then be formed by wire bonders (e.g., broadband automated wire bonders). Next, a collimating lens may be assembled, and for the assembling of the collimating lens, reference may be made to the related descriptions in the above two fixing manners of the collimating lens, and details of the embodiments of the present application are not described again. And then, the light-transmitting sealing layer can be adhered to the middle area of the upper cover, and the edge area of the upper cover is welded on one side, far away from the bottom plate, of the tube shell by using a parallel sealing and welding technology, so that the laser is assembled.

To sum up, in the laser provided in the embodiment of the present application, the laser chip in each light emitting component is attached to the surface intersecting with the bottom plate in the heat sink, and the collimating lens is located at the side of the laser chip far away from the bottom plate, so that the laser chip can directly emit light to the collimating lens, and the light is emitted along the direction far away from the bottom plate. Therefore, the laser can emit light without a reflecting prism, so that the laser comprises fewer structures and is beneficial to realizing the miniaturization of the laser.

It should be noted that, in the above embodiments of the present application, only several optional laser structures are illustrated, and for the mode in which the collimating lens and the heat sink are independently arranged or integrally formed, different fixing modes of the collimating lens and different forms of the bearing structure may all be combined at will, so as to obtain lasers with different structures, and the present application does not limit the combining mode.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A laser, characterized in that the laser comprises: a base plate, a package and a plurality of light emitting assemblies, the light emitting assemblies comprising: the device comprises a heat sink, a laser chip and a collimating lens;

the tube shell and the bottom plate form an accommodating space, the heat sink is attached to the bottom plate for each light-emitting component, the laser chip is attached to the surface of the heat sink, which is intersected with the bottom plate, and the collimating lens is positioned on one side of the laser chip, which is far away from the bottom plate;

for each light-emitting component, the laser chip is used for emitting light to the collimating lens, and the collimating lens is used for collimating the light emitted by the laser chip and then emitting the light in the direction far away from the bottom plate.

2. The laser of claim 1, wherein for each of said light emitting assemblies, said collimating lens is attached to a surface of said heat sink remote from said base plate.

3. The laser of claim 1, further comprising: the bearing structure is positioned on one side, far away from the bottom plate, of the laser chip, the edge of the bearing structure is fixed on the tube shell, and the bearing structure is used for bearing the collimating lens and transmitting light rays emitted by the laser chip in the laser.

4. The laser of claim 3, wherein the carrier structure has a hollowed-out region for transmitting light emitted by the laser chip in the laser.

5. The laser of claim 4, wherein the supporting structure has a plurality of hollowed-out regions, each hollowed-out region corresponds to at least one laser chip, and the laser chips corresponding to different hollowed-out regions are different, and each hollowed-out region is configured to transmit light emitted by the corresponding laser chip.

6. The laser of any one of claims 1 to 5, wherein, for each of the light emitting assemblies, a surface of a side of the collimating lens facing away from the base plate comprises: a planar area proximate to the heat sink, and a convexly curved area distal from the heat sink.

7. The laser of any one of claims 1 to 5, wherein, for each light emitting assembly, the collimating lens is spaced from the laser chip by less than 0.3 mm.

8. The laser of any one of claims 1 to 5, wherein the collimating lenses of at least two adjacent light emitting assemblies are integrally formed.

9. The laser of any one of claims 1 to 5, wherein, for each light emitting assembly, an end of the laser chip away from the base plate protrudes beyond an end of the heat sink away from the base plate.

10. The laser of any one of claims 1 to 5, further comprising a light-transmissive encapsulant, wherein the light-transmissive encapsulant, the package, and the base form a sealed space, and the light-emitting element is located in the sealed space.

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