CN113437635A - Laser device - Google Patents
Laser device Download PDFInfo
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- CN113437635A CN113437635A CN202010209905.5A CN202010209905A CN113437635A CN 113437635 A CN113437635 A CN 113437635A CN 202010209905 A CN202010209905 A CN 202010209905A CN 113437635 A CN113437635 A CN 113437635A
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- laser
- collimating lens
- light
- light emitting
- laser chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Condensed Matter Physics & Semiconductors (AREA)
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- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The application discloses laser belongs to the technical field of photoelectricity. The laser includes: bottom plate, tube and a plurality of light-emitting component, light-emitting component includes: the device comprises a heat sink, a laser chip, a collimating lens and a reflecting prism; the tube shell and the bottom plate form an accommodating space, for each light-emitting component, a heat sink, a collimating lens and a reflecting prism are sequentially arranged in the accommodating space and attached to the bottom plate, and the laser chip is attached to the surface of the heat sink, which is far away from the bottom plate; for each light-emitting component, the laser chip is used for emitting light to the collimating lens, the collimating lens is used for collimating the light emitted by the laser chip and then emitting the light to the reflecting prism, and the reflecting prism is used for emitting the light emitted by the collimating lens in the direction far away from the bottom plate. The problem of the difficult miniaturization that realizes the laser instrument has been solved to this application. The application is used for light emission.
Description
Technical Field
The application relates to the field of photoelectric technology, in particular to a laser.
Background
With the development of the optoelectronic technology, the laser is widely used, and the requirement for miniaturization of the laser is higher and higher.
The laser comprises a bottom plate, a tube shell, a plurality of heat sinks, a plurality of laser chips, a plurality of reflecting prisms and a collimating lens layer, wherein the collimating lens layer comprises a plurality of integrally formed collimating lenses. The tube shell, the heat sinks and the reflecting prisms are all located on the bottom plate, each laser chip is located on one heat sink, the tube shell is annular and surrounds the heat sinks, the laser chips and the reflecting prisms, and the collimating lens layer is located on one side, far away from the bottom plate, of the tube shell; the plurality of laser chips correspond to the plurality of reflection prisms and the plurality of collimating lenses one by one, each reflection prism is located on the light emitting side of the corresponding laser chip, the reflection prisms are used for reflecting light emitted by the corresponding laser chip to the collimating lenses corresponding to the laser chips, and then the collimating lenses adjust the light into parallel light.
Since the number of structures in the laser is large, the thickness of the laser is large, and miniaturization of the laser is difficult.
Disclosure of Invention
The application provides a laser, can solve the difficult miniaturized problem that realizes the laser. The laser includes: a base plate, a package and a plurality of light emitting assemblies, the light emitting assemblies comprising: the device comprises a heat sink, a laser chip, a collimating lens and a reflecting prism;
the tube shell and the bottom plate form an accommodating space, for each light-emitting component, the heat sink, the collimating lens and the reflecting prism are sequentially arranged in the accommodating space and attached to the bottom plate, and the laser chip is attached to the surface of the heat sink, which is far away from the bottom plate;
for each light-emitting component, the laser chip is used for emitting light to the collimating lens, the collimating lens is used for collimating the light emitted by the laser chip and then emitting the light to the reflecting prism, and the reflecting prism is used for emitting the light emitted by the collimating lens in the direction far away from the bottom plate.
The beneficial effect that technical scheme that this application provided brought includes at least:
in the laser provided by the application, the collimating lens in each light-emitting component is attached to the bottom plate, so that the collimating lens does not need to be arranged on one side of the tube shell far away from the bottom plate, the thickness of the laser can be reduced, and the miniaturization of the laser is facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a laser provided in the related art;
fig. 2 is a schematic structural diagram of a laser provided in an embodiment of the present application;
FIG. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of another laser provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of another laser provided in an embodiment of the present application.
Detailed Description
To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
With the development of the optoelectronic technology, the application of the laser is wider and wider, for example, the laser can be applied to the aspects of welding process, cutting process, laser projection, etc., and the requirements for miniaturization, thinning and light emitting efficiency of the laser are higher and higher at present.
Fig. 1 is a schematic structural diagram of a laser provided in the related art. As shown in fig. 1, the laser 00 includes a base plate 001, a case 002, a plurality of heat sinks 003, a plurality of laser chips 004, a plurality of reflection prisms 005, and a collimator lens layer 006 including a plurality of collimator lenses T integrally formed. Wherein the tube shell 002, the plurality of heat sinks 003 and the plurality of reflection prisms 004 are all located on the bottom plate 001, and each laser chip 004 is located on one heat sink 003. The tube shell 002 is annular and surrounds the plurality of heat sinks 003, the plurality of laser chips 004 and the plurality of reflection prisms 005, and the collimating lens layer 006 is located on one side of the tube shell 002 away from the bottom plate 001. This a plurality of laser instrument chips 004 and these a plurality of reflecting prism 005 and these a plurality of collimating lens T one-to-one, every reflecting prism 005 is located the light-emitting side of the laser instrument chip 004 that corresponds, and reflecting prism 005 is used for reflecting the light that the laser instrument chip 004 that corresponds jetted out to the collimating lens T that this laser instrument chip 004 corresponds, and then collimating lens T collimates this light.
Since the thickness of the laser 00 shown in fig. 1 is at least the sum of the thicknesses of the substrate 001, the package 002 and the collimator lens layer 006, the thickness of the laser 00 is large, and it is difficult to miniaturize the laser. The following embodiment of this application provides a laser, can be so that the thickness of laser is less, is convenient for realize the miniaturization of laser.
Fig. 2 is a schematic structural diagram of a laser according to an embodiment of the present disclosure. As shown in fig. 2, the laser 10 includes: a base plate 101, a package 102, and a plurality of light emitting components F including a heat sink 103, a laser chip 104, a collimating lens 105, and a reflecting prism 106.
The case 102 may be annular, and the case 102 and the bottom plate 101 may form an accommodating space. For each light emitting component F, a heat sink 103, a collimating lens 105 and a reflecting prism 106 are sequentially arranged in the accommodating space and attached to the bottom plate 101, and a laser chip 104 is attached to the surface of the heat sink 103 away from the bottom plate 101. For each light emitting component F, the laser chip 104 is configured to emit light to the collimating lens 105, the collimating lens 105 is configured to collimate the light emitted from the laser chip 104 and emit the light to the reflecting prism 106, and the reflecting prism 106 is configured to emit the light emitted from the collimating lens 105 in a direction away from the base plate 101.
It should be noted that, collimating the light, that is, converging the light, makes the divergence angle of the light smaller, and is closer to the parallel light. Each light emitting assembly in the embodiments of the present application may include one laser chip, and fig. 2 shows only four light emitting assemblies in the laser. Alternatively, the number of light emitting components in the laser may be six, ten, twenty or more, and the embodiment of the present application is not limited. When the number of the light emitting assemblies in the laser is large, the plurality of light emitting assemblies may be arranged in a matrix, or may also be arranged in other arrangement modes, such as staggered arrangement or arrangement in a circle, which is not limited in the embodiments of the present application.
In summary, in the laser provided by the embodiment of the present application, the collimating lens in each light emitting component is attached to the bottom plate, so that there is no need to further arrange a collimating lens on the side of the tube shell away from the bottom plate, and the thickness of the laser can be further reduced, which is beneficial to realizing the miniaturization of the laser.
Optionally, in each light emitting assembly in the embodiment of the present application, a surface of the collimating lens 105 close to the laser chip 104 is a flat surface, and a surface close to the reflecting prism 106 is a convex arc surface. Alternatively, the convex curved surface may be aspherical. Optionally, an orthographic projection of the convex arc surface on the plane may be a circle, or may also be another shape, such as a rectangle, and the embodiment of the present application is not limited.
Optionally, the thermal conductivity of the heat sink in the embodiment of the present application may be relatively large, so that the heat may be quickly conducted out when the laser chip generates heat by emitting light, thereby avoiding damage of the heat to the laser chip. Materials such as heat sinks may include one or more of aluminum nitride and silicon carbide.
Optionally, the material of the enclosure and the floor may include one or more of oxygen-free copper and kovar. When the material of the bottom plate comprises oxygen-free copper, the bottom plate can assist the heat sink to conduct heat generated by the laser chip at the moment because the thermal conductivity coefficient of the oxygen-free copper is also larger.
Optionally, in the embodiment of the present application, the height of the collimating lens may be less than or equal to the height of the reflecting prism, or the height difference between the collimating lens and the reflecting prism may be less than a height threshold. The height of the collimating lens is the distance between one end of the collimating lens far away from the bottom plate and the bottom plate, and the height of the reflecting prism is the distance between one end of the reflecting prism far away from the bottom plate and the bottom plate.
In the related art, the collimating lens layer formed by integrally molding the plurality of collimating lenses is located on the side of the package far from the base plate, so that the thickness of the laser is at least the sum of the thicknesses of the base plate, the package and the collimating lens layer. And the thickness of the collimating lens layer is usually 4 mm, and the thickness of the collimating lens layer is larger. In the embodiment of the application, a collimating lens layer is not required to be arranged on one side of the tube shell, which is far away from the bottom plate, and the difference between the height of the collimating lens arranged on the bottom plate and the thickness of the reflecting prism is smaller, so that the height of the tube shell is not required to be additionally increased; therefore, the thickness of the laser can be only the sum of the thicknesses of the base plate and the tube shell, and the thickness of the laser can be greatly reduced. And in the embodiment of the application, the collimating lens is arranged in the accommodating space formed by enclosing the tube shell and the bottom plate, so that the abrasion of the collimating lens can be avoided, and the collimating effect of the collimating lens on light rays emitted by the laser chip is ensured.
It should be further noted that, because the light emitted from the laser chip has a divergence angle, in the related art, the laser chip emits light to the reflection prism, and then the reflection prism reflects the light to the collimating lens for collimation. Therefore, the light spot formed by the reflection of the reflection prism to the corresponding collimating lens is larger, and there may be a part which is emitted to the outside of the collimating lens, so that the collimating lens cannot collimate the part of the light, the collimating effect of the collimating lens on the light is poor, and the light is wasted. In the embodiment of the application, the collimating lens is positioned between the laser chip and the reflecting prism, and the laser chip can directly irradiate light rays to the collimating lens for collimation and then irradiate the light rays to the reflecting prism. Therefore, light spots formed when the laser chip shoots at the collimating lens are small, so that the collimating lens can be ensured to collimate all light rays emitted by the laser chip, and the waste of the light rays is avoided; and the light emitted by the laser chip can be emitted to the central position of the collimating lens more, so that the collimating effect of the collimating lens on the light is ensured.
Alternatively, as shown in fig. 2, for each light emitting assembly F, one end of the laser chip 104 close to the collimating lens 105 protrudes from one end of the heat sink 103 close to the collimating lens 105. Alternatively, the length of the portion of the laser chip 104 protruding from the heat sink 103 in the direction in which the laser chip 104 approaches the collimator lens 105 (e.g., the y direction in fig. 2) may be less than 15 μm.
It should be noted that, because the light emitted by the laser chip has a divergence angle, the laser chip protrudes out of the heat sink to further enable the distance between the laser chip and the collimating lens to be short, thereby ensuring that the light emitted by the laser chip is emitted to the collimating lens more, avoiding the light waste caused by the emission of the light emitted by the laser chip to the bottom plate, and thus the brightness of the light emitted by the laser chip can be high.
Optionally, there may also be a portion of the laser in which one end of the laser chip in the light emitting assembly close to the collimating lens is flush with one end of the heat sink close to the collimating lens, or one end of the laser chip in each light emitting assembly in the laser close to the collimating lens is flush with one end of the heat sink close to the collimating lens, which is not limited in the embodiment of the present application. When the one end that the laser chip is close to collimating lens all with the heat sink when being close to the one end parallel and level of collimating lens, the area of contact of laser chip and heat sink is great, and then increased by the regional area that the heat sink supported in the laser chip, improved the setting steadiness of laser chip. In addition, the heat generated in each area of the laser chip can be directly conducted through the heat sink, so that the heat dissipation effect of the laser chip is improved.
Optionally, the spacing between the laser chip and the collimating lens ranges from 0.1 mm to 0.2 mm for each light emitting assembly.
Optionally, in the laser provided in the embodiment of the present application, the light emitting angles of the laser chips in at least two light emitting assemblies are different. The plurality of light emitting components in the laser may include: the laser chip comprises a first laser chip for emitting red light, a second laser chip for emitting green light and a third laser chip for emitting blue light. The light emitting angle of the first laser chip may be greater than the light emitting angle of the second laser chip and greater than the light emitting angle of the third laser chip. The light emitted from the laser chip is a cone light, and the light emission angle of the laser chip is the cone angle of the cone. For example, the light emitting angle of the first laser chip may be 70 degrees, and the light emitting angles of the second and third laser chips may be 50 degrees. Optionally, the laser provided by the embodiment of the application can be used in a laser television.
In an alternative embodiment of the present application, for each light emitting assembly, at least one of the following conditions may be satisfied: the aperture of the collimating lens can be positively correlated with the light-emitting angle of the laser chip; the radius of curvature of the convex curved surface may be inversely related to the light emission angle of the laser chip. It should be noted that the aperture of the collimating lens refers to the diameter of the collimating lens, and the diameter of the collimating lens may be the diameter of a convex arc surface, and the larger the aperture of the collimating lens is, the larger the area of the collimating lens is. The aperture of the collimating lens as in the embodiments of the present application may be the distance between its first end near the base plate and its second end far from the base plate.
Since the larger the light emitting angle of the laser chip, the larger the spot formed by the light emitted from the laser chip on the structure (such as the collimating lens) to which the light is directed. In the embodiment of the application, when laser chip light-emitting angle is great in certain light-emitting component, collimating lens's aperture is great, and then the light that laser chip sent can all shoot to collimating lens, and collimating lens can shoot out after all light that laser chip jetted out all collimates, has avoided the waste of light. When the light emitting angle of the laser chip in a certain light emitting component is small, the aperture of the collimating lens is small, the collimating lens with the small aperture can still realize that all light rays emitted by the laser chip are emitted after being collimated, and the waste of the collimating lens material due to the arrangement of the collimating lens with the large aperture is avoided.
The smaller the curvature radius of the convex cambered surface in the collimating lens is, the better the converging effect of the collimating lens on light rays is. In the embodiment of the application, when the light-emitting angle of the laser chip is large in a certain light-emitting component, the curvature radius of the convex cambered surface in the collimating lens is small, and then the collimating lens can converge the light emitted by the laser chip to a greater extent, so that the collimating effect of the light emitted by the laser chip is ensured. When the light emitting angle of the laser chip in a certain light emitting component is small, the curvature radius of the convex cambered surface in the collimating lens is large, and the collimating effect of light rays emitted by the laser chip can be guaranteed through the convex cambered surface with the large curvature radius.
In another alternative embodiment of the present application, the parameters of the collimating lenses in the plurality of light emitting elements of the laser are the same. The parameters of the collimating lens may include one or more of an aperture and a radius of curvature of a convex curve of the collimating lens. In the light emitting module in which the laser chip having the largest light emitting angle among the plurality of light emitting modules is located, the collimating lens is used for collimating and emitting all light rays emitted by the laser chip. For example, the laser chip having the largest light emission angle may be a laser chip for emitting red light. Because this collimating lens can jet out after collimating to the whole light that the laser chip that luminous angle is the biggest, so to the light-emitting component at the laser chip place that luminous angle is less, collimating lens also can jet out after collimating to the whole light that the laser chip that luminous angle is less sent, has guaranteed that the light that laser chip sent all has not wasted in the laser instrument. And only one specification of collimating lens is needed in the laser, so that the complex process of designing different collimating lenses for different laser chips is avoided.
Optionally, the aperture of the collimating lens in the embodiment of the present application may range from 0.6 mm to 1 mm. Alternatively, the range of the radius of curvature of the collimating lens (i.e., the radius of curvature of the convex curve in the collimating lens) may be less than 5 millimeters. Such as 3 mm, 4 mm or 4.5 mm. Optionally, the curvature radius may also be adjusted according to the thickness of the collimating lens and the difference between the collimating lens and the laser chip, which is not limited in the embodiment of the present application. It should be noted that the thickness of the collimating lens is the distance between the center of the convex arc surface in the collimating lens and the plane opposite to the convex arc surface.
It should be noted that, in the related art, since the light emitting angle of the first laser chip (i.e., the laser chip for emitting red light) is large, the light spot formed on the collimating lens by the red light emitted by the first laser chip is large. In order to ensure the miniaturization of the laser, all the collimating lenses are designed according to the parameters of the collimating lens capable of collimating all the light rays emitted by the second laser chip or the third laser chip, so that the collimating lens for collimating the red light can only collimate part of the red light emitted by the laser chip. If only the light of the middle part of a beam of red light emitted by the first laser chip is utilized, the light of the edge part cannot be utilized, so that more red light is wasted, and the brightness of the red light emitted by the laser is lower.
In the embodiment of the application, the collimating lens with corresponding parameters can be adopted according to the light emitting angle of the laser chip, or all the collimating lenses are designed according to the parameters of the collimating lens for collimating all the light rays emitted by the first laser chip, so that the light rays emitted by all the laser chips can be utilized, the waste of red light is avoided, and the higher brightness of the red light emitted by the laser is ensured.
Fig. 3 is a schematic structural diagram of a laser according to an embodiment of the present disclosure, fig. 2 may be a schematic diagram of a section a-a' of the laser shown in fig. 3, and fig. 3 may be a top view of the laser shown in fig. 2. As shown in fig. 3, each light emitting assembly F in the laser 10 may include a heat sink 103, a laser chip 104, a collimating lens 105 and a reflecting prism 106, and the components in the different light emitting assemblies F are independent from each other.
It should be noted that, in the related art, the collimating lenses corresponding to the laser chips in the laser are integrally formed, and the position of each collimating lens in the collimating lens layer is designed according to the theoretical irradiation position of the light reflected by the corresponding reflecting prism. If the laser chip, the heat sink and the reflecting prism in the laser are all arranged according to the corresponding theoretical positions, the light reflected by the reflecting prism can be emitted to the central position of the corresponding collimating lens. However, since the heat sink, the laser chip, and the reflecting prism inevitably have positional deviations during assembly, the irradiation position of the light beam actually reflected by the reflecting prism and the theoretical irradiation position have positional deviations, and the positional deviations corresponding to different reflecting prisms are different. Therefore, it is difficult to ensure that the light reflected by each reflecting prism is emitted to the center of the corresponding collimating lens, the brightness difference of the light emitted by each collimating lens is large, and the collimation degree of the light emitted by the laser is low.
In the embodiment of the present application, each light emitting element may include an independent collimating lens, and the collimating lens and the reflecting prism may be attached after the heat sink and the laser chip are attached to the base plate. For each light-emitting component, even if the setting positions of the laser chip and the heat sink are deviated from the theoretical position, the setting position of the collimating lens can be correspondingly adjusted when the collimating lens is mounted, so that light emitted by the laser chip can be accurately emitted to the central position of the collimating lens; and further, the collimation effect of each collimating lens on light rays can be ensured, and the collimation degree of the light rays emitted by the laser is ensured. Since individual adjustment can be made for each light emitting element, the position of each component does not need to be designed based on the entirety of all light emitting elements, so that the degree of freedom in designing the optical path of the laser is increased. And each light-emitting component can be independently adjusted to ensure that the light with smaller brightness difference is emitted by each light-emitting component.
Optionally, fig. 4 is a schematic structural diagram of another laser provided in an embodiment of the present application, where fig. 4 may be a top view of fig. 2, and fig. 2 may also be a schematic diagram of a section b-b' in the laser shown in fig. 4. As shown in fig. 4, the collimator lenses 105 of at least two light emitting elements F adjacent in the target direction perpendicular to the arrangement direction of the heat sink 103, the collimator lenses 105, and the reflecting prism 106 in the laser 10 may be integrally formed. Illustratively, the x direction as shown in fig. 4 is the target direction, and the y direction is the arrangement direction of the heat sink 103, the collimator lens 105, and the reflection prism 106. It should be noted that fig. 4 illustrates an example in which the laser 10 includes 20 light emitting elements F, and the 20 light emitting elements F are arranged in an array, and fig. 4 illustrates an example in which the collimating lenses 105 in each row of the light emitting elements F in the x direction are integrally formed. Optionally, the collimating lenses in two adjacent light emitting assemblies in each row of light emitting assemblies F may also be integrally formed, or the collimating lenses in three adjacent light emitting assemblies may also be integrally formed, and this embodiment of the present application is not limited. It should be noted that, when there are a plurality of collimating lenses integrally formed, the collimating lenses can be mounted only a few times when the collimating lenses are mounted on the base plate, so that the mounting process of the collimating lenses can be simplified, and the assembly process of the laser can be further simplified.
Alternatively, in the embodiments of the present application, the plurality of integrally formed collimating lenses are referred to as a collimating lens structure. Each collimating lens structure may have a plurality of convex curved surfaces at a side adjacent to the reflecting prism. The part covered by each convex cambered surface in the collimating lens structure can be used as a collimating lens in a light-emitting component and is used for collimating light rays emitted by a laser chip in the light-emitting component.
It should be noted that fig. 4 only illustrates an example in which the collimating lens in the laser can be integrally formed, and the heat sink and the reflecting prism in different light emitting assemblies are still independent of each other. Alternatively, the reflecting prisms in at least two light emitting assemblies adjacent in the target direction may also be integrally formed. Alternatively, the heat sinks in at least two light emitting assemblies adjacent in the target direction may also be integrally formed. For the way of integrally forming the reflecting prism and the heat sink, reference may be made to the way of integrally forming the collimating lens in fig. 4, and an embodiment of the present application is not separately illustrated.
It should be noted that, in the related art, the edge of the collimating lens layer may only be coated with the adhesive to adhere the collimating lens layer to the surface of the tube shell away from the base plate, the area of the adhering region is small, and the collimating lens layer generally includes more collimating lenses; therefore, the bonding firmness of the collimating lens layer is poor, the collimating lens layer is easy to loosen in the using process, and the requirement on the bonding effect of the adhesive is high. In the embodiment of the application, the collimating lenses are attached to the bottom plate, so that each collimating lens can be fixed by the adhesive, and the adhesion firmness of the collimating lenses is ensured; and the paste agent is only used for pasting the collimating lens with smaller volume, and the requirement on the pasting effect of the paste agent is lower.
Optionally, fig. 5 is a schematic structural diagram of another laser provided in an embodiment of the present application, and fig. 5 may be a schematic diagram of a section a-a 'in the laser shown in fig. 3, or a schematic diagram of a section b-b' in the laser shown in fig. 4. Referring to fig. 3, 4 and 5, the laser 10 may further include: an upper cover 107, a light transmissive encapsulant 108, and conductive leads 109. The upper cover 107 is located on a side of the laser chip 104 away from the base plate 101, and the upper cover 107 may have a ring shape, and a middle region of the upper cover 107 is recessed toward the base plate 101. The edge region of the upper cover 107 is fixed to the surface of the housing 102 remote from the base plate 101. The light transmissive sealing layer 108 is located on a side of the central region of the cover remote from the body 101. The conductive pins 109 extend through the side walls of the package 102. The upper cover 107, the light-transmissive encapsulant 108, the conductive pins 109, the package 102, and the base 101 may form a sealed space in which the light emitting assembly F is located.
In the embodiment of the present invention, the light-transmitting sealing layer 108 is provided on the upper cover 107 and further fixed to the package 102. Alternatively, the edge of the light-transmissive sealing layer 108 may also be directly adhered to the surface of the package 102 remote from the base 101, in which case the laser may not include the cover 107. Alternatively, the material of the light-transmissive sealing layer may include glass.
It should be noted that the conductive pins 109 are electrically connected to the electrodes of the laser chip 104, so as to transmit an external power to the laser chip 104, and further excite the laser chip 104 to emit light. For example, the conductive pins may be connected to electrodes of the laser chips in the adjacent light emitting assemblies through wires, and the electrodes of the laser chips in the adjacent light emitting assemblies may be connected to each other through wires to transmit power to each laser chip. Alternatively, the conductive wire may be a gold wire, that is, the material of the conductive wire may be gold.
In the embodiment of the present application, when assembling the laser, a ring-shaped solder structure may be placed in the opening on the sidewall of the package, and then the conductive pin may be passed through the solder structure and the opening where the solder structure is located. Then, the package is placed on the peripheral edge of the base plate, and the annular solder is placed between the base plate and the package, and then the base plate, the package and the conductive pin structure are placed in a high-temperature furnace for sealing and sintering. The laser chip can then be mounted on a corresponding heat sink using a high precision eutectic bonding machine. And then attaching the heat sink attached with the laser chip on the bottom plate by means of sintering gold paste or sintering silver paste and the like in an environment of 250-280 ℃. Then, wires between the conductive pins and the electrodes of the laser chip and wires between the electrodes of the laser chip can be formed by a wire bonder. Next, the collimating lens and the reflecting prism may be attached to the base plate. Optionally, when the collimating lens and the reflecting prism are adhered, the laser chip can be made to emit light, so that the setting positions of the collimating lens and the reflecting prism are debugged, the collimating lens is further ensured to be arranged at a position where light rays emitted by the laser chip can be totally collimated, the collimating effect is better, and the reflecting prism is ensured to be capable of reflecting all light rays emitted by the collimating lens. And then, the light-transmitting sealing layer can be adhered to the middle area of the upper cover, and the edge area of the upper cover is welded on one side, far away from the bottom plate, of the tube shell by using a parallel sealing and welding technology, so that the laser is assembled.
In summary, in the laser provided by the embodiment of the present application, the collimating lens in each light emitting component is attached to the bottom plate, so that there is no need to further provide a collimating lens on the side of the tube shell away from the bottom plate, and the thickness of the laser can be further reduced, which is beneficial to realizing the miniaturization and thinning of the laser.
It should be noted that, the above embodiments of the present application only illustrate several optional laser structures, and the collimating lens, the heat sink, and the reflecting prism may be independently arranged or integrally formed, and may be combined at will, so as to obtain lasers with different structures. For example, the heat sink and the collimating lens in each light-emitting component of the laser are independently arranged, and the reflecting prisms in at least two light-emitting components are integrally formed; for example, the reflecting prism and the collimating lens in each light-emitting component of the laser are independently arranged, and the heat sinks in at least two light-emitting components are integrally formed; by analogy, the embodiments of the present application are not described again.
The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A laser, characterized in that the laser comprises: a base plate, a package and a plurality of light emitting assemblies, the light emitting assemblies comprising: the device comprises a heat sink, a laser chip, a collimating lens and a reflecting prism;
the tube shell and the bottom plate form an accommodating space, for each light-emitting component, the heat sink, the collimating lens and the reflecting prism are sequentially arranged in the accommodating space and attached to the bottom plate, and the laser chip is attached to the surface of the heat sink, which is far away from the bottom plate;
for each light-emitting component, the laser chip is used for emitting light to the collimating lens, the collimating lens is used for collimating the light emitted by the laser chip and then emitting the light to the reflecting prism, and the reflecting prism is used for emitting the light emitted by the collimating lens in the direction far away from the bottom plate.
2. The laser of claim 1, wherein, for each of the light emitting assemblies, the aperture of the collimating lens is positively correlated with the light emitting angle of the laser chip.
3. The laser of claim 1, wherein for each of the light emitting components, a side of the collimating lens near the reflecting prism has a convex curved surface having a radius of curvature that is inversely related to a light emitting angle of the laser chip.
4. The laser of claim 1, wherein the parameters of the collimating lenses in the plurality of light emitting assemblies are the same;
the light emitting angles of the laser chips in at least two light emitting assemblies are different; in the light emitting assembly where the laser chip with the largest light emitting angle in the plurality of light emitting assemblies is located, the collimating lens is used for collimating all light rays emitted by the laser chip and then emitting the collimated light rays.
5. The laser of any one of claims 1 to 4, wherein the collimating lens has an aperture in the range of 0.6 mm to 1 mm.
6. The laser of any one of claims 1 to 4, wherein for each light emitting assembly, a side of the collimating lens adjacent to the reflecting prism has a convex curved surface having a radius of curvature of less than 5 mm.
7. The laser of any one of claims 1 to 4, wherein the spacing between the laser chip and the collimating lens for each light emitting assembly is in the range of 0.1 mm to 0.2 mm.
8. The laser device according to any one of claims 1 to 4, wherein the collimating lenses of at least two of the light emitting modules adjacent to each other in a target direction perpendicular to the arrangement direction of the heat sink, the collimating lenses, and the reflecting prisms are integrally formed.
9. The laser device according to any one of claims 1 to 4, wherein the reflecting prisms of at least two of the light emitting modules adjacent to each other in a target direction perpendicular to the arrangement direction of the heat sink, the collimating lens, and the reflecting prisms are integrally formed.
10. The laser of any of claims 1 to 4, wherein for each of said light emitting assemblies, an end of said laser chip adjacent to said collimating lens protrudes from an end of said heat sink adjacent to said collimating lens.
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| CN202010209905.5A CN113437635A (en) | 2020-03-23 | 2020-03-23 | Laser device |
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| CN202010209905.5A CN113437635A (en) | 2020-03-23 | 2020-03-23 | Laser device |
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