CN113405029B - 注射式led灯组件 - Google Patents
注射式led灯组件 Download PDFInfo
- Publication number
- CN113405029B CN113405029B CN202110287053.6A CN202110287053A CN113405029B CN 113405029 B CN113405029 B CN 113405029B CN 202110287053 A CN202110287053 A CN 202110287053A CN 113405029 B CN113405029 B CN 113405029B
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- layer
- lamp
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- thermoplastic
- mold cavity
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- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
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- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
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- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
- F21S43/195—Details of lamp holders, terminals or connectors
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- F21V15/00—Protecting lighting devices from damage
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- F21V19/00—Fastening of light sources or lamp holders
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- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H05K1/00—Printed circuits
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
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- B60Q3/70—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose
- B60Q3/74—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose for overall compartment lighting; for overall compartment lighting in combination with specific lighting, e.g. room lamps with reading lamps
- B60Q3/745—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose for overall compartment lighting; for overall compartment lighting in combination with specific lighting, e.g. room lamps with reading lamps using lighting panels or mats, e.g. electro-luminescent panels, LED mats
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
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- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
本发明涉及注射式LED灯组件。一种灯组件和形成灯组件的方法包括柔性灯层、热塑性壳体和IMC层。柔性灯层具有柔性基底、印刷电路和从柔性基底向外延伸的多个LED。IMC层相对于柔性灯层与热塑性壳体相对地形成,并且覆盖LED。形成可包括:将柔性灯层放置在模腔内;在柔性灯层的一侧上注射热塑性结构;以及在柔性灯层的与热塑性结构相对的一侧上注射IMC层。将热塑性结构注射到模腔中可改变柔性灯层的形状。柔性灯层的基准特征可使热塑性结构相对于基准特征对齐。
Description
技术领域
本公开涉及受保护的LED灯组件和机构及其制造方法。
发明内容
提供了灯组件和形成灯组件的方法。灯组件包括柔性灯层、热塑性壳体和模内涂覆(IMC)层。柔性灯层具有:柔性基底;印刷在柔性基底上的电路;以及多个LED,其操作性地附接到印刷电路并从柔性基底向外延伸。热塑性壳体形成在柔性灯层的与所述多个LED相对的一侧上,并且IMC层形成为相对于柔性灯层与热塑性壳体相对。IMC层覆盖并保护LED。
形成灯组件可包括将柔性灯层放置在模腔内;以及在柔性灯层的一侧上将热塑性结构注射到模腔内。IMC层被注射到柔性灯层的与热塑性结构相对的一侧上。柔性灯层在被放置到模腔中时可具有第一形状,使得将热塑性结构注射到模腔中将柔性灯层的形状改变为不同于第一形状的第二形状。可将柔性灯层的基准特征在模腔内对齐,使得热塑性结构的部分相对于基准特征对齐。
在一些构型中,模腔包括可移动壁。在可移动壁处于第一位置中时,发生注射热塑性结构,使得柔性灯层与可移动壁相邻,并且在可移动壁处于第二位置中时,发生注射IMC层,使得热塑性结构和IMC层两者都被注射到同一个模腔中。
在一些构型中,在旋转式模制机中形成灯组件。在旋转式模制机的第一工位(station)处发生注射热塑性结构;并且在第二工位处发生注射IMC层。因此,旋转式模制机将热塑性结构从第一工位移动到第二工位。
在一些构型中,在将柔性灯层放置在模腔内之前,将柔性灯层热成型。IMC层可由氨基甲酸乙酯、硅酮或PMMA中的一者形成,并且柔性基底可由聚酰胺、PEEK或透明聚酯膜中的一者形成。
本发明还包括以下技术方案:
方案1.一种灯组件,其包括:
灯层,其包括:
柔性基底;
电路,其被印刷在所述柔性基底上,以在其上形成印刷电路;以及
多个LED,其操作性地附接到所述印刷电路并从所述柔性基底向外延伸;
热塑性壳体,其在所述灯层的与所述多个LED相对的一侧上;以及
模内涂覆(IMC)层,其相对于所述灯层与所述热塑性壳体相对,使得所述IMC层覆盖所述LED。
方案2.根据方案1所述的灯组件,
其中,所述灯层的柔性基底是透明的,并且
其中,所述IMC层是透明的,使得所述热塑性壳体能够通过所述IMC层和所述柔性基底观察到。
方案3.根据方案2所述的灯组件,其还包括:
多个附接特征,其形成在所述热塑性壳体中。
方案4.根据方案3所述的灯组件,其还包括:
形成在所述灯层的柔性基底上的多个基准特征,其中,所述基准特征相对于所述热塑性壳体的附接特征定向所述灯层。
方案5.根据方案4所述的灯组件,
其中,所述IMC层由氨基甲酸乙酯、硅酮或PMMA中的一者形成,并向所述多个LED提供划痕保护和紫外线保护。
方案6.根据方案1所述的灯组件,其中,所述印刷电路从所述柔性基底向外延伸,使得所述印刷电路是三维的。
方案7.根据方案1所述的灯组件,还包括:
多个附接特征,其形成在所述热塑性壳体中;以及
形成在所述灯层的柔性基底上的多个基准特征,使得所述基准特征使所述灯层相对于所述热塑性壳体的附接特征对齐。
方案8.一种形成灯组件的方法,所述方法包括:
将柔性灯层放置在模腔内;
在所述柔性灯层的一侧上将热塑性结构注射到所述模腔中,其中,所述柔性灯层符合所述模腔的一部分的形状;以及
将模内涂覆(IMC)层注射到所述柔性灯层的与所述热塑性结构相对的一侧上。
方案9.根据方案8所述的方法,其中,所述柔性灯层包括:
柔性基底;
印刷电路,其形成在所述柔性基底的一侧上;以及
多个LED,其操作性地附接到所述印刷电路并与所述热塑性结构相对地从所述柔性基底延伸,且被所述IMC层覆盖。
方案10.根据方案9所述的方法,还包括:
使形成在所述柔性灯层上的多个基准特征在所述模腔内对齐,使得所述热塑性结构的部分相对于所述基准特征对齐。
方案11.根据方案10所述的方法,其中,所述模腔包括可移动壁,并且还包括:在所述可移动壁处于第一位置中时,注射所述热塑性结构,使得所述柔性灯层与所述可移动壁相邻;以及
在所述可移动壁处于第二位置中时,注射所述IMC层,使得所述热塑性结构和所述IMC层两者都被注射到同一模腔中。
方案12.根据方案10所述的方法,其中,在旋转式模制机中形成所述灯组件,并且还包括:
在所述旋转式模制机的第一工位处注射所述热塑性结构;以及
在第二工位处注射所述IMC层,其中,所述旋转式模制机将所述热塑性结构从所述第一工位移动到所述第二工位。
方案13.根据方案10所述的方法,还包括:
在将所述柔性灯层放置在所述模腔内之前,将所述柔性灯层热成型。
方案14.根据方案10所述的方法,
其中,所述IMC层由氨基甲酸乙酯、硅酮或PMMA中的一者形成;并且
其中,所述柔性基底由聚酰胺、PEEK或透明聚酯膜中的一者形成。
方案15.根据方案8所述的方法,
其中,所述柔性灯层在被放置到所述模腔中时具有第一形状,并且
其中,将所述热塑性结构注射到所述模腔中将所述柔性灯层的形状改变为不同于所述第一形状的第二形状。
方案16.根据方案15所述的方法,还包括:
在将所述柔性灯层放置在所述模腔内之前,将所述柔性灯层热成型到所述第一形状。
当结合附图理解时,本公开的以上特征和优点以及其他特征和优点容易从用于实施本公开的最佳模式的以下详细描述中显而易见到。
附图说明
图1是LED灯组件的示意性侧视图解视图。
图2是一段柔性LED灯层的示意性等距视图。
图3A是图示形成LED灯组件的第一部分、移动或步骤(诸如图中所示的那些)的示意图。
图3B是图示形成LED灯组件的第二部分、移动或步骤(诸如图中所示的那些)的示意图。
图3C是图示形成LED灯组件的第三部分、移动或步骤(诸如图中所示的那些)的示意图。
具体实施方式
参考附图,在可能的情况下,相似的附图标记指代类似的部件。图1示意性地图示了灯组件10,该灯组件10大体作为侧视图或平面相交视图示出以图示其内部部件。
如图1中所观察到的,灯组件具有灯层12、在灯层12的一侧上的热塑性壳体14或热塑性结构,以及在灯层12的另一侧上的模内涂覆(IMC)层16。热塑性壳体14形成在灯层12的第一侧上并附接到该第一侧,并且IMC层16形成在灯层12的第二侧上并附接到该第二侧,IMC层16与热塑性壳体14相对。
灯组件10可用在车辆上或用于其他结构上的展示照明。当用于车辆时,灯组件10可用作例如但不限于内部或外部照明,并且可用于展示或通信照明(诸如,滚动文本或图片),或者用于常用照明(primary lighting)(诸如,前照灯、刹车灯或信号指示器)。如本文中所描述的,灯层12提供产生或投射光的结构元件。
热塑性壳体14可被称为灯组件10的B侧,并且包括用于使灯组件10相对于车辆对齐的结构元件和特征。热塑性壳体14大体经由注射模制形成。如图1中所示,多个附接特征20形成在热塑性壳体14中。热塑性壳体14可由以下各项形成,例如但不限于:众多类型的热塑性塑料、其他硬塑料或其组合。
注意,热塑性壳体14被高度示意性地图示。在许多构型中,热塑性壳体14将包括结构肋和其他特征,这些结构肋和其他特征减小了热塑性壳体14的总重量,同时提供足够的强度和结构以相对于附接特征20和灯组件10附接于其的结构来支撑灯组件10。
本文中呈现的附图和图示未按比例绘制,并且仅出于指导目的而提供。附图中所示的任何具体和相对尺寸将不被解释为限制性的。例如,图1和其他图中所示的IMC层16可能尺寸过大以便图示。
IMC层16可被称为灯组件10的A侧,并且包括美学特征和功能。IMC层16还保护灯层12免受光损害(诸如,免受紫外线光损害)、腐蚀和划痕损害。IMC层16可由以下各项形成,例如但不限于:氨基甲酸乙酯、硅酮、聚甲基丙烯酸甲酯(PMMA)或其组合。
柔性灯层12、注射式热塑性壳体14和保护性IMC层16的组合允许灯组件10具有复杂的A侧,同时仍然能够经由标准器件制造和附接到车辆。下文特别地参考图3A-C来更详细地讨论灯组件10的制造。注意,灯组件10能够形成有多个弯曲部(curve),包括小半径弯曲部(小于10毫米)和紧密接近的多个弯曲部或元件。
对车辆的任何引用都可代表任何滚动平台,包括但不限于:摩托、拖拉机、公共汽车、活动房屋、露营车和坦克。此外,本文中所描述的部件也可用在多种其他行业和应用中,包括但不限于:航空航天应用、消费品、工业和建筑装备、农用装备、重型机械或展示照明。
尽管可关于特定的应用或行业来说明本公开,但是本领域技术人员将认识到本公开的更广泛的适用性。本领域普通技术人员将认识到,诸如“上方”、“下方”、“向上”、“向下”等的术语被用于描述附图,并且不表示对本公开的范围进行限制。诸如“第一”或“第二”的任何数字标号仅是说明性的,并且不旨在以任何方式限制本公开的范围。
一幅图中所示的特征可与任何图中所示的特征相组合、代替任何图中所示的特征、或被任何图中所示的特征修改。除非另有其它陈述,否则没有特征、要素或限制与任何其他特征、要素或限制相互排除。此外,没有特征、要素或限制对于操作而言是绝对需要的。在图中示出的任何具体构型仅仅是说明性的,并且所示的具体构型并不限制说明书。
当在本文中使用时,术语“大致”指代理想地完美或完整的关系,但是制造现实阻碍了绝对完美的情况。因此,大致表示与完美的典型差异。例如,如果高度A大致等于高度B,则可能优选的是两个高度为100.0%相等,但是制造现实很可能导致与这种完美相偏差的距离。技术人员将认识到可接受的差异的量。例如且不限于,针对大致等同,覆盖范围、面积或距离大体可在完美的10%以内。类似地,相对的对齐(诸如,平行或垂直)大体可被认为在5-10%以内。
参考图2,并且继续参考图1,示出了灯层12的一部分的示意性等距视图,该灯层12可形成灯组件10的一部分。灯层12大体由柔性基底22、印刷电路24和多个发光二极管(LED)26形成。
柔性基底22可由以下各项形成,例如但不限于:聚酰胺、PEEK或透明聚酯膜。印刷电路24被印刷在柔性基底22上,并且LED 26操作性地附接到印刷电路24,使得印刷电路24向LED 26提供电并因此提供对LED 26的控制。例如,可利用例如但不限于导电粘合剂或焊料将LED 26附接到印刷电路24。注意,未详细示出印刷电路24,并且除了遮蔽(masking)或非导电迹线之外,还可存在印刷在柔性基底22上的由导电或介电油墨迹线形成的附加导线。
在许多构型中,LED 26将从柔性基底22向外延伸,如图1中最佳地图示的,不过附图未按比例绘制。在所示的构型中,LED 26与热塑性壳体14相对地延伸,使得热塑性壳体14被注射在灯层12的与LED 26相对的一侧上并附接到该侧。
技术人员将认识到用于形成柔性灯层12的众多技术。例如但不限于,可经由直接印刷或3D印刷技术将印刷电路24施加到柔性基底22。尽管在附图中未图示,但是印刷电路24可从柔性基底22向外延伸。
可使用增材制造过程将导电油墨或导电膏施加到柔性基底22。例如但不限于,可将导电和非导电(遮蔽或过孔)材料的交替层印刷到柔性基底22上,使得为印刷电路24形成三维电路布局。
可利用例如但不限于粘合剂或导电膏将LED 26附接到印刷电路24。此外,可经由移除过程(诸如,蚀刻)或其他微加工过程在柔性基底22上形成印刷电路24。相对于灯层12与热塑性壳体14相对地注射IMC层16,使得该IMC层16覆盖远离柔性基底22和印刷电路24延伸的LED 26。
在附图中未图示用于灯组件10的控制和操作的连接。然而,灯层12可具有例如但不限于从其延伸的线束或连接器。合适的控制系统或控制器结构可操作性地附接到灯层12以便灯组件10的操作。在一些构型中,与灯层12对接的连接器或插头可或者在形成期间或者经由后处理而被并入热塑性壳体14中。
在灯组件10的许多构型中,灯层12的柔性基底22可以是透明的。因此,如果IMC层16也是透明的,则热塑性壳体14可通过IMC层16和柔性基底22观察到。因此,热塑性壳体14可通过使其着色(coloration)或特征透过灯组件10的A侧来为整个灯组件10提供美感。此外,注意,在LED 26从柔性基底22大致向外延伸的情况下,延伸的LED 26将能够通过IMC层16观察到,这可向灯组件10提供有趣的美学特征。
如本文中所讨论的,可通过围绕灯层12嵌件模制热塑性壳体14来形成灯组件10。因此,多个基准特征28可形成在灯层12的柔性基底22上,如图2中所图示的那样。这些基准特征28可使灯层12相对于热塑性壳体14的附接特征20在注射模制设备内定向。基准特征28在图2中被图示为孔或槽,但是技术人员将认识到可用于对齐灯层12的若干类型的基准特征28。
还参考图3A、图3B和图3C,并且继续参考图1-2,存在用于制造灯组件(诸如图1中示意性地示出的灯组件10)的所图示的结构、机构和方法。图3A、图3B和图3C中的每一者示意性地示出注射模制设备50的不同的移动、部分、构型或变型。例如但不限于,注射模制设备50可以是:旋转式注射系统、可移动腔系统或拾取和放置式模制系统。
如图3A中所图示的,形成灯组件10可包括将柔性灯层12放置在模腔52内,该模腔52大体由第一压板(platen)54和第二压板56限定。第一压板54和第二压板56中的任一者可以是相对于彼此和模腔52可移动的或固定的。
在图3A中,柔性灯层12被示为具有部分地类似于模腔52的壁中的一者的形状的形状,该壁可被称为灯侧壁58。然而,在一些构型中,柔性灯层12在被放置到模腔52中时可能是大致平坦的或未成形的。替代地,在放置于模腔52内之前,柔性灯层12可被预制或预成形(诸如,通过热成型)为大致其最终形状。
如果包括,则基准特征28(在图3A-C中未示出)可被用于使柔性灯层12在模腔52内对齐。也可形成印刷电路24以适应用于基准特征28的空间。
如图3B中示意性地图示的那样,热塑性壳体14通过多个注入口60被注射到模腔52中。因此,热塑性壳体14形成在柔性灯层12的一侧上并附接到该侧。在注射过程期间,柔性灯层12符合模腔52的一部分(诸如灯侧壁58)的形状。柔性灯层12经由基准特征28或模腔52的内部形状中的任一者相对于热塑性壳体14对齐。
注射热塑性壳体14大体形成灯组件10的B侧结构。热塑性壳体14在图3B中以阴影示出,以示意性地图示被注射部分。注意,注射模制设备50可控制被注射的材料的压力以便防止损坏灯层12。附接特征20(在图3A-C中未示出)也可在热塑性壳体14的注射期间形成,或者可在后注射处理期间形成。注射过程迫使柔性灯层12抵靠模腔52。
注意,由于印刷电路24被印刷在柔性基底22上,所以如果柔性灯层12将大致变形,则对印刷电路24的布局的一些修改(如与图2中所图示的侧向栅格相对)可能是有益的。虽然附图中所图示的形状大体是更大半径弯曲部,但是柔性灯层12可被挠曲成具有小半径弯曲部和/或定位成彼此紧密接近的特征的复杂形状。因此,技术人员将认识到,为了维持对各个LED 26的控制,可以用所想的柔性灯层12的最终形状来设计印刷电路24的形状以及形成印刷电路24的各个连接的路径。
如图3C中示意性地图示的那样,IMC层16被注射到模腔52中、到柔性灯层12的与热塑性壳体14相对的一侧上。IMC层16经由IMC注射器62注射,并且在柔性灯层12仍位于模制设备50内时涂覆柔性灯层12。该过程大体形成灯组件10的A侧美观和保护性层。IMC层16在图3C中以阴影示出,以示意性地图示被注射部分。
在图3A-C中示意性地图示的注射模制设备50可表示若干不同的模制系统或结构,包括但不限于:旋转式注射系统、可移动腔系统或拾取和放置式系统。在一些构型中,模腔52可包括可移动壁64,或者由可移动壁64部分地限定,该可移动壁64在图3B和图3C中图示。在这样的可移动腔系统中,可移动壁64可形成灯侧壁58的全部或一部分。
注射模制设备50可使可移动壁64在至少第一位置和第二位置之间滑动。在图3B中图示了可移动壁64的第一位置,并且在图3C中图示了可移动壁64的第二位置。在第二位置中,可移动壁64已相对于图3B和图3C的视图向下移动。
在可移动壁64处于第一位置中时,注射热塑性壳体14,并且注射热塑性壳体14推动柔性灯层12抵靠可移动壁64,如图3B中所示。然后,注射模制设备50可使可移动壁64向外(向下,如图3C中所观察到的那样)滑动,以便为IMC层16创建空间。在可移动壁64处于第二位置中时,注射IMC层16,使得热塑性壳体14和IMC层16两者都被注射到可移动腔系统中的同一模腔52中。
由可移动壁64创建的附加空间允许IMC层16覆盖LED 26,所述LED已在热塑性壳体14的注射期间被压抵模腔52。IMC层16还覆盖并保护印刷电路24和/或柔性基底22的A侧的面。
在其他构型中,注射模制设备50可以是旋转式模制机的一部分,使得图3A、图3B和图3C的视图中的每一者表示旋转模制过程的阶段或工位。柔性灯层12可在与热塑性壳体14的注射相同的工位处被放置到模腔52中,或者可在在前的工位处被放置到模腔52中。
可在旋转式模制机的第一工位处注射热塑性壳体14,并且可在第二工位处注射IMC层16,使得旋转式模制机将热塑性壳体14从第一工位移动到第二工位。取决于旋转式注射模制设备50的构型,热塑性壳体14的移动可在热塑性壳体14的至少部分冷却或凝固之后发生。
例如但不限于,第一压板54的部分可与热塑性壳体14一起从第一工位移动到第二工位。第二工位在模腔52中将具有用于注射IMC层16的额外空间(如通过图3B和图3C之间的比较表示的)。注意,除了注射模制设备50的其余部分之外,第一压板54和第二压板56的尺寸和形状也仅是描述性图示,并且可能不代表旋转式模制系统的结构。
在可能些微类似于旋转式模制机的另一构型中,注射模制设备50可以是拾取和放置式系统的一部分。例如,柔性灯层12可被放置到模腔52中并使热塑性壳体14注射到其B侧上,如图3B中所示。然而,柔性灯层12和热塑性壳体14将然后从模腔52被移除并移入第二腔(具有用于IMC层16的空间的一个腔)中。移动可受到人类操作员或机器人的影响。
然后,类似于图3C的视图,在第二腔中,IMC层16将被注射在柔性灯层12和热塑性壳体14的A侧上。相对于可移动模具或旋转式系统,拾取和放置式系统可能是更加劳动密集的,但可具有降低的设置成本。
再次,注意,一些构型可在灯组件10的A侧上具有复杂的形状。因此,在注射热塑性壳体14之前,在将柔性灯层12插入模腔52中之前,或作为注射模制设备50内的第一步骤,可将柔性灯层12热成型。这可以是完全或部分热成型步骤,使得柔性灯层12可被成形为大致其最终形状,或者可被部分地成形以允许在热塑性壳体14的注射期间发生最终成形。
例如,图3A中所示的柔性灯层12的形状可已从大体平坦的形状热成型到所示的形状。因此,柔性灯层12与灯侧壁58的形状部分地匹配,并且由于热成型而更好地装备成符合模腔52的该部分的形状。
详细描述和附图或图支持和描述本文中的主题。尽管已详细描述了一些最佳模式和其他实施例,但是存在各种替代性设计、实施例和构型。
此外,在附图中示出的任何实施例或本描述中提到的各种实施例的特性不必然将被理解为彼此独立的实施例。而且,可能的是,在实施例的一个示例中描述的特性中的每一者可以与来自其他实施例的一个或多个期望的特性组合,从而得出未以文字描述或通过参考附图描述的其他实施例。
Claims (12)
1.一种形成灯组件的方法,所述方法包括:
将柔性灯层放置在模腔内;
在所述柔性灯层的一侧上将热塑性结构注射到所述模腔中,其中,所述柔性灯层符合所述模腔的一部分的形状;以及
将模内涂覆层注射到所述柔性灯层的与所述热塑性结构相对的一侧上,
使形成在所述柔性灯层上的多个基准特征在所述模腔内对齐,使得所述热塑性结构的部分相对于所述基准特征对齐,
其中,所述模腔包括可移动壁,并且还包括:
在所述可移动壁处于第一位置中时,注射所述热塑性结构,使得所述柔性灯层与所述可移动壁相邻;以及
在所述可移动壁处于第二位置中时,注射所述模内涂覆层,使得所述热塑性结构和所述模内涂覆层两者都被注射到同一模腔中,
其中,所述柔性灯层在被放置到所述模腔中时具有第一形状,并且
其中,将所述热塑性结构注射到所述模腔中将所述柔性灯层的形状改变为不同于所述第一形状的第二形状。
2.根据权利要求1所述的方法,其中,所述柔性灯层包括:
柔性基底;
印刷电路,其形成在所述柔性基底的一侧上;以及
多个LED,其操作性地附接到所述印刷电路并与所述热塑性结构相对地从所述柔性基底延伸,且被所述模内涂覆层覆盖。
3.根据权利要求1所述的方法,还包括:
在将所述柔性灯层放置在所述模腔内之前,将所述柔性灯层热成型。
4.根据权利要求2所述的方法,
其中,所述模内涂覆层由氨基甲酸乙酯、硅酮或PMMA中的一者形成;并且
其中,所述柔性基底由聚酰胺、PEEK或透明聚酯膜中的一者形成。
5.根据权利要求1所述的方法,还包括:
在将所述柔性灯层放置在所述模腔内之前,将所述柔性灯层热成型到所述第一形状。
6.一种使用根据权利要求1-5中的任一项所述的方法制造的灯组件,其包括:
灯层,其包括:
柔性基底;
电路,其被印刷在所述柔性基底上,以在其上形成印刷电路;以及
多个LED,其操作性地附接到所述印刷电路并从所述柔性基底向外延伸;
热塑性壳体,其在所述灯层的与所述多个LED相对的一侧上;以及
模内涂覆层,其相对于所述灯层与所述热塑性壳体相对,使得所述模内涂覆层覆盖所述LED。
7.根据权利要求6所述的灯组件,
其中,所述灯层的柔性基底是透明的,并且
其中,所述模内涂覆层是透明的,使得所述热塑性壳体能够通过所述模内涂覆层和所述柔性基底观察到。
8.根据权利要求7所述的灯组件,其还包括:
多个附接特征,其形成在所述热塑性壳体中。
9.根据权利要求8所述的灯组件,其还包括:
形成在所述灯层的柔性基底上的多个基准特征,其中,所述基准特征相对于所述热塑性壳体的附接特征定向所述灯层。
10.根据权利要求9所述的灯组件,
其中,所述模内涂覆层由氨基甲酸乙酯、硅酮或PMMA中的一者形成,并向所述多个LED提供划痕保护和紫外线保护。
11.根据权利要求6所述的灯组件,其中,所述印刷电路从所述柔性基底向外延伸,使得所述印刷电路是三维的。
12.根据权利要求6所述的灯组件,还包括:
多个附接特征,其形成在所述热塑性壳体中;以及
形成在所述灯层的柔性基底上的多个基准特征,使得所述基准特征使所述灯层相对于所述热塑性壳体的附接特征对齐。
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