CN113325658A

CN113325658A - Heat dissipation box and multimedia projector comprising same

Info

Publication number: CN113325658A
Application number: CN202110749543.3A
Authority: CN
Inventors: 顾伟
Original assignee: Guangzhou Rigal Electronics Co ltd; Suzhou Huadong Tuojiang Temperature Control Technology Co ltd
Current assignee: Guangzhou Rigal Electronics Co ltd; Suzhou Huadong Tuojiang Temperature Control Technology Co ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2021-08-31

Abstract

The invention discloses a heat dissipation box and a multimedia projector comprising the same, wherein the heat dissipation box comprises a box body, the heat dissipation box can cool an object positioned in the box body, a cold air inlet and a hot air outlet which can be mutually communicated are arranged on the box body, the heat dissipation box also comprises a cold guide block communicated with the hot air outlet and the cold air inlet, a plurality of air outlet channels are arranged on the cold guide block, air exhausted from the hot air outlet can enter the cold air inlet through the air outlet channels, and the cold air inlet and the hot air outlet are positioned on the same side of the box body. A cooling part is arranged at least one position of the cold air inlet and the hot air outlet. The first cooling part comprises a first semiconductor refrigeration piece and a first cold conduction plate, and the refrigeration end of the first semiconductor refrigeration piece can be in contact with hot air in the inner cavity of the box body. The multimedia projector ensures the sealing performance of the box body, has high cooling efficiency, compact internal structure of the box body and small overall occupied space.

Description

Heat dissipation box and multimedia projector comprising same

Technical Field

The invention relates to the technical field of projection optical machines, in particular to a heat dissipation box and a multimedia projector comprising the same.

Background

The multimedia projector integrates various expression forms such as videos, images, sounds and the like, so that the multimedia projector plays an important role in occasions such as teaching and commercial demonstration activities, and the application range of the multimedia projector is increasingly wide.

In order to reduce the influence of dust on the working performance of the multimedia projector, it is necessary to ensure the sealing performance of the cabinet. However, since most of the optical components are integrated in the multimedia box, the heat dissipation effect is an important factor affecting the operational stability of the multimedia projector. Especially, other display screens such as LCD or LED, which are currently applied in multimedia projectors, are important sources of heat generation. Therefore, how to realize effective cooling of the multimedia projector is a problem to be solved urgently in the industry.

At present, a multimedia projector for realizing cooling by arranging a heat dissipation channel along the circumferential direction of a box body is provided, but the heat dissipation effect is still not ideal; if cool down through simple increase cooling channel or the mode that sets up a plurality of cooling units, then can cause the space utilization in the box not high to make the whole volume of multimedia heat dissipation case great.

Disclosure of Invention

To overcome the above disadvantages, an object of the present invention is to provide a heat dissipation case and a multimedia projector including the same. The heat dissipation box has the advantages that the sealing performance is ensured, the cooling efficiency is high, the internal structure of the box body is compact, and the overall occupied space of the heat dissipation box is small.

The heat dissipation box comprises a box body, wherein the box body is used for cooling an object in the box body, a cold air inlet and a hot air outlet which can be mutually communicated are arranged on the box body, and a cooling part is arranged at least one position of the cold air inlet and the hot air outlet. Therefore, when hot air flows from the hot air outlet to the cold air inlet, the heat dissipation box of the invention realizes high-efficiency cooling under the action of the cooling part, and has high cooling efficiency.

Furthermore, the cold air inlet and the hot air outlet are both positioned on the same side of the box body. Therefore, the hot air can quickly flow back to the box body from the cold air inlet, and the cooling speed of the hot air is high.

Furthermore, the cooling part arranged at the hot air outlet is a first cooling part which comprises a first semiconductor refrigeration piece, and one side of the first semiconductor refrigeration piece can be in contact with hot air in the inner cavity of the box body. Therefore, the hot air in the hot air outlet area can be cooled by the first semiconductor cooling sheet.

Furthermore, an air guide fan for discharging hot air in the box body to the hot air outlet is arranged at the hot air outlet. Therefore, the hot air in the box body can be quickly discharged outwards through the hot air outlet.

Furthermore, the air conditioner also comprises a cold guide block communicated with the cold air inlet and the hot air outlet, wherein the cold guide block is provided with a plurality of air outlet channels, and air flow enters the air outlet channels in the cold guide block through the air guide fan.

Furthermore, the first cooling part further comprises a radiator connected with the first semiconductor refrigeration piece. Therefore, the radiator can cool the first semiconductor refrigeration piece, and the cooling effect of the first semiconductor refrigeration piece on hot air in the box body is ensured.

Furthermore, the cooling portion arranged at the cold air inlet is a second cooling portion, the second cooling portion comprises a second semiconductor refrigeration piece, and the second semiconductor refrigeration piece is used for dissipating heat of air flowing to the cold air inlet.

The invention also provides a multimedia projector which comprises the heat dissipation box, an optical assembly is arranged in the box body, the optical assembly comprises a display screen, a cold air inlet is arranged in the area, close to the display screen, of the box body, a hot air outlet is further arranged on the box body, a first cooling unit is arranged at the hot air outlet, and the multimedia projector also comprises an air channel communicated with the hot air outlet and the cold air inlet. According to the multimedia projector, the cold air inlet is arranged corresponding to the area of the display screen which generates more heat, so that the effect of quickly cooling the display screen can be realized.

Further, the air duct is located on the outer side of the box body.

Furthermore, the cold air inlet is arranged along the length direction of the display screen.

Drawings

Fig. 1 is a schematic perspective view of a first embodiment of the present invention;

fig. 2 is a schematic view illustrating the arrangement positions of a cold air inlet and a hot air outlet according to a first embodiment of the present invention;

FIG. 3 is a schematic view of a cooling portion according to a first embodiment of the present invention;

fig. 4 is a schematic perspective view illustrating a first cooling portion of the first cooling portion according to the first embodiment of the present invention when no wind guiding fan is installed;

fig. 5 is a schematic view illustrating an arrangement structure of heat dissipation fins of a first heat sink according to a first embodiment of the present invention;

fig. 6 is a schematic view of a connection relationship between the second semiconductor chilling plate and the second heat-insulating cotton according to the first embodiment of the present invention.

In the figure:

1. a box body; 11. a cold air inlet; 12. a hot air outlet; 2. a cold conducting block; 3. a first cooling section; 31. a first semiconductor refrigeration chip; 32. a first cold conduction plate; 33. an air guide fan; 34. first heat insulation cotton; 35. a first heat sink; 351. a first heat dissipation plate; 352. a heat dissipation rod; 353. heat dissipation fins; 36. a first heat dissipation fan; 4. a second cooling section; 41. a second semiconductor refrigeration chip; 42. second heat preservation cotton; 43. a second heat sink; 5. and a projection lens.

Detailed Description

The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.

The first embodiment is as follows:

referring to fig. 1 and 2, the present embodiment is a heat dissipation box, which includes a box body 1, the heat dissipation box of the present invention can cool an object located in the box body 1, the box body 1 is provided with a cold air inlet 11 and a hot air outlet 12, which can be communicated with each other, the heat dissipation box of the present embodiment further includes a cold guide block 2 communicating the hot air outlet 12 and the cold air inlet 11, the cold guide block 2 is provided with a plurality of air outlet channels, and air exhausted from the hot air outlet 12 can enter the cold air inlet 11 through the air outlet channels. The cold air inlet 11 and the hot air outlet 12 of the present embodiment are both located on the same side of the cabinet 1.

A cooling portion is provided at least one of the cold air inlet 11 and the hot air outlet 12, so that the hot air passing through the hot air outlet 12 can be cooled while flowing from the cold air inlet 11 to the hot air outlet 12, thereby ensuring that the air entering the cabinet 1 is at a low temperature. The cooling part of the present embodiment includes a first cooling part 3 provided at the hot air outlet 12 and a second cooling part 4 provided at the cold air inlet 11. It is apparent that the number of the cooling portions may be adjusted to one or more as necessary, and the positions of the cooling portions may be adjusted to regions other than the positions exemplified in the present embodiment as necessary.

The first cooling portion 3 comprises a first semiconductor refrigeration piece 31 and a first cold conduction plate 32, the refrigeration end of the first semiconductor refrigeration piece 31 can be in contact with hot air in the inner cavity of the box body 1, and the first cold conduction plate 32 is used for transferring heat in the box body 1 to the first semiconductor refrigeration piece 31. An air guide fan 33 for discharging the hot air in the case 1 to the hot air outlet 12 is further provided at the hot air outlet 12. A fan cover is further provided outside the air guide fan 33, and the fan cover is connected to the first heat insulating cotton 34. The first semiconductor refrigeration piece 31 is embedded in the middle area of the first cold conducting plate 32, the area of the first semiconductor refrigeration piece 31 is smaller than that of the first cold conducting plate 32, and the air guiding fan 33 is located on one side of the first cold conducting plate 32. The air guide fan 33 is coaxially provided with the hot air outlet 12. The airflow passes through the air guiding fan 33 and enters the air outlet channel in the air guiding block. A first insulating cotton 34 is arranged on one side of the first semiconductor refrigeration sheet 31 far away from the inner cavity of the box body 1. The middle part of the first heat-preservation cotton 34 is provided with a gap for arranging the first semiconductor refrigeration piece 31, the first heat-preservation cotton 34 is integrally in a cover shape, the first cold conduction plate 32 is arranged adjacent to the first heat-preservation cotton 34, and the first heat-preservation cotton 34 can cover the first cold conduction plate 32.

The first cooling portion 3 of the present embodiment further includes a first heat sink 35 for cooling the first semiconductor chilling plate 31. The first heat sink 35 includes a first heat radiation plate 351 attached to the first semiconductor cooling sheet 31. The first heat sink 35 further includes a heat dissipating bar 352 connected to the first heat dissipating plate 351, and the heat dissipating bar 352 penetrates the plurality of heat dissipating fins 353. The first heat sink 35 further includes a first heat dissipation fan 36 for cooling the first heat sink 35. The first heat dissipation fan 36 is disposed opposite to the heat dissipation fins 353, and the direction of the plate body of the heat dissipation fins 353 of the present embodiment is parallel to the air outlet direction of the first heat dissipation fan 36. Therefore, the first heat dissipation fan 36 can cool the heat dissipation rod 352 passing through the heat dissipation fins 353, and further cool the first heat dissipation plate 351 under the action of the first heat dissipation fan 36. The number of the heat dissipation rods 352 in this embodiment is four, and the heat dissipation rods 352 and the first heat dissipation plate 351 are two by one and penetrate through the heat dissipation fins 353, the heat dissipation rods 352 and the first heat dissipation plate 351 are both made of a material with good heat conductivity, the width of the first heat dissipation plate 351 in this embodiment is smaller than the arrangement width of the heat dissipation fins 353, and the heat dissipation rods 353 are arranged in a splayed manner on the whole of the middle parts of the first heat dissipation plate 351 and the heat dissipation fins 353. Therefore, the cooling efficiency of the first semiconductor refrigerating sheet 31 can be guaranteed, the whole structure is compact, and the space utilization rate is high.

The second cooling portion 4 includes a second semiconductor chilling plate 41, and the second semiconductor chilling plate 41 is used to dissipate heat of air flowing to the cold air inlet 11. The second semiconductor chilling plate 41 is located at a region of the cold guide block 2 adjacent to the cold wind inlet 11. And second heat-preservation cotton 42 is arranged around the second semiconductor refrigeration sheet 41. The second cooling portion 4 includes a second heat sink 43 for cooling the second semiconductor cooling plate 41, and the structure of the second heat sink 43 is similar to that of the first heat sink 35, and is not described herein again.

The heat dissipation fins 353 of the first heat sink 35 and the second heat sink 43 in this embodiment are disposed near the top wall of the box, and may be disposed near the bottom wall of the box or near the side wall of the box. Accordingly, the first heat dissipation fan 36 may be disposed close to the top wall, the bottom wall, or the side wall simultaneously with the heat dissipation fins 353.

Example two:

the embodiment is a multimedia projector, which comprises the heat dissipation box of the first embodiment and further comprises an optical assembly, wherein the optical assembly comprises a display screen and a reflector which are arranged in the box body 1, and a projection lens 5 is further arranged on the box body 1. The cold air inlet 11 is provided at an area of the cover plate of the cabinet 1 near the display screen having the highest heat generation, and the hot air outlet 12 is also provided at the same side of the cover plate of the cabinet 1 as the cold air inlet 11.

The cold wind entry 11 of the multimedia heat dissipation case of this embodiment sets up along the length direction of display screen, therefore can ensure to its rapid cooling, improves the cooling effect. The multimedia heat dissipation box of this embodiment has both avoided the cooling unit to occupy great space through setting up hot air outlet 12 and the cold wind entry 11 that communicate each other in the homonymy of box 1 to through the corresponding first cooling portion 3 and the second cooling portion 4 that is provided with respectively in hot air outlet 12 and the region of cold wind entry 11, therefore greatly improved the cooling effect to the optical element in the multimedia, and the noise of multimedia projector during operation is little.

The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a heat dissipation case, includes the box, is used for being located object in the box cools down, its characterized in that be provided with cold wind entry and the hot air exitus that can communicate each other on the box at least one of cold wind entry and hot air exitus two is provided with the cooling portion.

2. The heat dissipation box of claim 1, wherein the cold air inlet and the hot air outlet are located on the same side of the box body.

3. The heat dissipation box of claim 2, wherein the cooling portion disposed at the hot air outlet is a first cooling portion, the first cooling portion includes a first semiconductor cooling sheet, and one side of the first semiconductor cooling sheet is capable of contacting with hot air in an inner cavity of the box body.

4. The heat dissipating box as claimed in claim 3, wherein a wind guiding fan is further provided at the hot wind outlet for discharging the hot air in the box body to the hot wind outlet.

5. The heat dissipation box of claim 4, further comprising a cold guide block communicating the cold air inlet and the hot air outlet, wherein the cold guide block is provided with a plurality of air outlet channels, and the air flow enters the air outlet channels in the cold guide block through the air guide fan.

6. The heat dissipation box of claim 3, wherein the first cooling portion further comprises a first heat sink for cooling the first semiconductor chilling plate.

7. The heat dissipation box of claim 2, wherein the cooling portion disposed at the cold air inlet is a second cooling portion, the second cooling portion includes a second semiconductor cooling fin, and the second semiconductor cooling fin is configured to cool air flowing to the cold air inlet.

8. A multimedia projector is characterized by comprising the heat dissipation box as claimed in any one of claims 1 to 7, wherein an optical assembly is arranged in the box body, the optical assembly comprises a display screen, a cold air inlet is arranged in an area, close to the display screen, of the box body, a hot air outlet is further arranged on the box body, a first cooling unit is arranged at the hot air outlet, and the multimedia projector further comprises an air duct communicated with the hot air outlet and the cold air inlet.

9. The multimedia projector of claim 8, wherein the air duct is located outside the cabinet.

10. The multimedia projector as claimed in claim 8, wherein the cool air inlet is provided along a length direction of the display screen.