CN216052580U

CN216052580U - Multimedia heat dissipation box and multimedia projector comprising same

Info

Publication number: CN216052580U
Application number: CN202122705729.7U
Authority: CN
Inventors: 顾伟
Original assignee: Guangzhou Rigal Electronics Co ltd; Suzhou Huadong Tuojiang Temperature Control Technology Co ltd
Current assignee: Guangzhou Rigal Electronics Co ltd; Suzhou Huadong Tuojiang Temperature Control Technology Co ltd
Priority date: 2021-11-05
Filing date: 2021-11-05
Publication date: 2022-03-15
Anticipated expiration: 2031-11-05

Abstract

The utility model discloses a multimedia heat dissipation box and a multimedia projector comprising the same. The cooling shell is arranged outside the box body, a refrigeration channel communicated with the cold air inlet and the hot air outlet is formed in the cooling shell, cold guide fins and a turbofan are arranged in the refrigeration channel, the turbofan provides power for air circulation of the refrigeration channel and the inner cavity of the box body, and the cooling shell is further connected with a cooling device for cooling the cold guide fins. Realize the inside air cycle of box to cool down the air at the circulation in-process, satisfy the accuse temperature demand of box.

Description

Multimedia heat dissipation box and multimedia projector comprising same

Technical Field

The utility model relates to the field of multimedia projectors, in particular to a multimedia heat dissipation box and a multimedia projector comprising the same.

Background

The multimedia projector integrates various expression forms such as videos, images, sounds and the like, so that the multimedia projector plays an important role in occasions such as teaching and commercial demonstration activities, and the application range of the multimedia projector is increasingly wide. In order to reduce the influence of dust on the operation performance of the media projector, it is necessary to ensure the sealing performance of the cabinet. However, since most of the optical components are integrated in the multimedia box, the heat dissipation effect is an important factor affecting the operational stability of the multimedia projector. Especially, other display screens such as LCD or LED, which are currently applied in multimedia projectors, are important sources of heat generation. Therefore, how to realize effective cooling of the multimedia projector is a problem to be solved urgently in the industry. At present, a cold air inlet and a hot air outlet are directly formed in a box body, air with reduced external temperature is directly blown into the box body from the cold air inlet through a fan, high-temperature air of the box body is discharged from the hot air outlet, circulation of the box body and the external air is achieved, and cooling in the box body is achieved. However, such a cooling method introduces foreign matters such as dust into the housing, which affects the optical module.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects, the utility model aims to provide a multimedia heat dissipation box, which realizes air circulation in a box body, cools air in a circulation process and meets the temperature control requirement of the box body.

In order to achieve the above purposes, the utility model adopts the technical scheme that: the utility model provides a multi-media heat dissipation case, includes the box, is used for being located object in the box is cooled down be provided with cold wind entry and hot air exitus on the box, a serial communication port, be provided with the cooling casing outside the box, form the refrigeration passageway of intercommunication cold wind entry and hot air exitus in the cooling casing, be provided with in the refrigeration passageway and lead cold fin and turbofan, turbofan provides power for the circulation of air of refrigeration passageway and box inner chamber, the cooling casing still is connected with and carries out the cooling device who cools down to leading cold fin.

The cavity and the refrigerating channel in the box body form a sealed circulating channel, hot air in the box body acts on the guide-in refrigerating channel through the turbofan, the cooling device cools the cold guide fins (namely the hot air in the refrigerating channel), and the cooled hot air is guided into the box body. The cooling efficiency is improved, and meanwhile, the sealing performance of the box body is improved.

Further, the cooling device comprises a semiconductor refrigeration piece, a heat conduction pipe and a heat dissipation fin, wherein the cold surface of the semiconductor refrigeration piece can be abutted against the cold conduction fin, the heat conduction pipe conducts heat of the hot surface of the semiconductor refrigeration chip to the heat dissipation fin, and the heat dissipation fin is located on one side of the box body. The cooling device is used for cooling air in the refrigerating channel, the radiating fins are arranged on one side of the box body, the space is saved, and the whole structure is more compact.

Furthermore, a plurality of heat dissipation channels which are arranged in parallel are formed in the heat dissipation fins, the heat dissipation fins are located on one side of the box body, and meanwhile, the heat dissipation channels are horizontally arranged, so that the space is saved.

Further, the cooling device further comprises a heat dissipation fan, the heat dissipation fan is located on one side of the heat dissipation fins and cools the heat dissipation fins, and airflow blown by the heat dissipation fan is bent through the heat dissipation channel. The cooling fan blows air towards the cooling fins to cool the cooling fins, and meanwhile, due to the fact that the position of the cooling fan is matched with the cooling channel, the air of the cooling fan is bent with an angle instead of being blown out in parallel, the structure is more compact, and the space of the cooling fins is saved.

Further, the heat pipe comprises a first heat conduction section attached to the hot surface of the semiconductor refrigeration piece and a second heat conduction section inserted into the heat dissipation fins, and the second heat conduction section is perpendicular to the air outlet direction of the heat dissipation fan. Because the semiconductor and the radiating fins are positioned on two vertical surfaces in order to save space, the heat transmission between the semiconductor and the radiating fins is realized through the bent heat conduction pipe, the first heat conduction section and the second heat conduction section are vertical, and the whole radiating device is more compact.

Further, the air inlet of the turbofan is positioned right above the hot air outlet, and the cold guide fins are positioned in the cooling shell between the cold air inlet and the hot air outlet.

Further, the cooling guide fins are provided with a plurality of cooling guide fins, airflow gaps for air to flow through are formed between the adjacent cooling guide fins, and air at the hot air outlet enters the cold air inlet through the airflow gaps under the action of the turbofan.

Furthermore, the cold air inlet and the hot air outlet are both arranged on the same side of the horizontal plane of the box body, so that the size of the cooling shell can be reduced, and the phenomenon that the cold air inlet and the hot air outlet are too far away from each other to cause the overlong refrigerating channel is avoided.

The utility model also provides a multimedia projector which comprises a machine shell and the multimedia heat dissipation box arranged in the machine shell, wherein the machine shell is provided with an air inlet fence and an air outlet fence which are communicated with the inner cavity and the outside air, the air inlet fence is arranged corresponding to the air inlet of the heat dissipation fan of the multimedia heat dissipation box, and the air outlet fence is arranged corresponding to the air outlet of the heat dissipation fins of the multimedia heat dissipation box.

Further, the inner cavity of the casing is divided into a first cavity and a second cavity by a heat insulation sheet, and the multimedia heat dissipation box is arranged in the first cavity. The heat insulating sheet separates the inner cavity of the casing, and avoids the heat interference in the two cavities.

Drawings

Fig. 1 is a schematic perspective view of embodiment 1 of the present invention;

FIG. 2 is a top view of example 1 of the present invention;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;

fig. 4 is a schematic structural view of a cooling shell in embodiment 1 of the present invention;

fig. 5 is a schematic structural diagram of embodiment 2 of the present invention.

In the figure:

1. a box body; 11. a cold air inlet; 12. a hot air outlet; 2. cooling the housing; 21. a refrigeration channel; 22. a cold-conducting fin; 221. an air flow gap; 23. a turbo fan; 3. a semiconductor refrigeration sheet; 4. a heat conducting pipe; 41. A first heat conducting section; 42. a second heat conducting section; 5. heat dissipation fins; 6. a heat radiation fan; 7. a housing; 71. An air inlet fence; 72. an air outlet fence; 8. a heat insulating sheet.

Detailed Description

The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.

The multimedia heat dissipation box generally comprises a box body 1 and is used for cooling an object located in the box body 1. Optical components are placed in the box body 1, and the optical components easily generate a large amount of heat in the working process, so that the temperature of the air in the box body 1 needs to be reduced. Normally, a cold air inlet 11 and a hot air outlet 12 are directly formed in the box body 1, air with reduced external temperature is directly blown into the box body 1 from the cold air inlet 11 through a fan, and high-temperature air in the box body 1 is discharged from the hot air outlet 12, so that circulation of the box body 1 and the external air is realized, and the temperature reduction in the box body 1 is realized. However, such a cooling method introduces foreign matters such as dust into the housing, which affects the optical module.

Example 1

Referring to fig. 1 and 2, in the multimedia heat dissipation box of the present invention, the cold air inlet 11 and the hot air outlet 12 are disposed on the same side of the box body 1, and are typically disposed on the lower end surface or the upper end surface of the box body 1 for saving space. Referring to fig. 3, a cooling case 2 is provided outside the cabinet 1, and a cooling passage 21 communicating the cold air inlet 11 and the hot air outlet 12 is formed inside the cooling case 2. The cooling housing 2 is fixed to the outside of the cabinet 1 on the side where the cold air inlet 11 and the hot air outlet 12 are opened. Referring to fig. 4, the cooling case 2 includes a first case horizontally disposed and a bent pipe for guiding air in the first case downward to the cold air inlet 11.

Referring to fig. 3 and 4, the cooling channel 21 is provided with cooling guide fins 22 and a turbofan 23, and the cooling guide fins 22 and the turbofan 23 are integrated in the first housing. The air inlet of the turbofan 23 is positioned right above the hot air outlet 12, and draws out air in the shape vertically and upwards and horizontally introduces the air into the refrigerating passage 21. The cold guide fins 22 are located in the cooling housing 2 between the cold air inlet 11 and the hot air outlet 12. The process of air circulation can be seen in the outline arrows in fig. 4.

The turbo fan 23 provides power for the air circulation of the refrigerating channel 21 and the inner cavity of the box body 1, and the cooling shell 2 is also connected with a cooling device for cooling the cooling guide fins 22. That is, the turbofan 23 draws the air in the box body 1 out from the hot air outlet 12, and after entering the cooling channel for cooling, the air enters the box body 1 through the cold air inlet 11. This application has realized the inner loop of box 1 internal air through refrigeration passageway 21's setting to when passing through refrigeration passageway 21, cool down the air of inner loop, in order to take away the heat in the box 1.

Referring to fig. 1, the cooling device includes a semiconductor refrigeration piece 3, a heat pipe 4 and a heat dissipation fin 5, the cold surface of the semiconductor refrigeration piece 3 can abut against a cooling guide fin 22, a yielding groove is formed in the first shell, the cold surface of the semiconductor refrigeration piece 3 can abut against the cooling guide fin 22 through the yielding groove, and the low temperature generated by the semiconductor refrigeration piece 3 can penetrate through the cooling guide fin 22 and enter into a refrigeration channel 21. The cooling fins 22 are provided in a plurality, and are aluminum substrates with a length longer for improving the heat conduction effect. And airflow gaps 221 through which air flows are formed between adjacent cooling guide fins 22, and the airflow gaps 221 are arranged along the length direction of the cooling passage 21. The air from the hot air outlet 12 enters the cold air inlet 11 through the air flow gap 221 by the turbo fan 23.

The heat conduction pipe 4 conducts the heat of the hot surface of the semiconductor refrigeration chip to the heat dissipation fins 5, and in order to save the space for placing the heat dissipation fins 5, the heat dissipation fins 5 are positioned on one side of the box body 1. A plurality of heat dissipation channels arranged in parallel are formed in the heat dissipation fins 5. The radiating fins 5 are combined at intervals of a plurality of right-angled triangles, the inclined edges are matched with and abutted against the inclined edges of the box body 1 (the box body 1 is generally triangular), and two vertical parts of the radiating fins 5 are matched with the right-angled edges of the shell 7 for placing the multimedia radiating box. And a heat radiation fan 6 for cooling the heat radiation fins 5 is also arranged on one side of the heat radiation fins 5, and the heat radiation fan 6 is positioned on one side of the right-angle side of the heat radiation fins 5. The airflow blown out by the heat dissipation fan 6 is bent through the heat dissipation channel and blown out from the other right-angle side of the heat dissipation fins 5. The heat conduction pipe 4 comprises a first heat conduction section 41 attached to the hot surface of the semiconductor chilling plate 3 and a second heat conduction section 42 inserted into the heat dissipation fin 5, and the second heat conduction section 42 is perpendicular to the air outlet direction of the heat dissipation fan 6.

Example 2

Referring to fig. 5, this embodiment is a multimedia projector, which includes the multimedia heat dissipation box of embodiment 1, the multimedia heat dissipation box is disposed in a casing 7, and the casing 7 is a rectangular parallelepiped. The casing 7 is provided with an air inlet fence 71 and an air outlet fence 72 which are communicated with the inner cavity of the casing and the outside air, the air inlet fence 71 is arranged corresponding to the air inlet of the heat dissipation fan 6, and the air outlet fence 72 is arranged corresponding to the air outlet of the heat dissipation fins 5 of the multimedia heat dissipation box. When the cooling fan 6 cools the cooling fins 5, the air moves towards the space arrows in fig. 5.

The inner cavity of the machine shell 7 is divided into a first cavity and a second cavity through a heat insulation sheet 8, and the multimedia heat dissipation box is arranged in the first cavity. And a second cooling device for dissipating heat of the LED lamp is arranged in the second cavity, and the second cooling device includes a second semiconductor cooling plate 3, a second heat pipe 4, a second heat dissipation fin 5 and a second heat dissipation fan 6, which are similar to the structure in embodiment 1 and are not repeated here. The cold surface of the second semiconductor refrigeration piece 3 is directly abutted against the LED lamp. The cavity of casing 7 is divided mainly through heat shield 8 in this example, guarantees that the heat of two cavitys does not switch on, and the reckon is cooled down respectively, has improved the cooling effect.

The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a multi-media heat dissipation case, includes the box, is used for being located object in the box is cooled down be provided with cold wind entry and hot air exitus on the box, a serial communication port, be provided with the cooling casing outside the box, form the refrigeration passageway of intercommunication cold wind entry and hot air exitus in the cooling casing, be provided with in the refrigeration passageway and lead cold fin and turbofan, turbofan provides power for the circulation of air of refrigeration passageway and box inner chamber, the cooling casing still is connected with and carries out the cooling device who cools down to leading cold fin.

2. The multimedia heat dissipation case of claim 1, wherein: the cooling device comprises a semiconductor refrigerating piece, a heat conduction pipe and radiating fins, wherein the cold surface of the semiconductor refrigerating piece can be abutted against the cold conduction fins, the heat conduction pipe conducts heat of the hot surface of the semiconductor refrigerating chip to the radiating fins, and the radiating fins are located on one side of the box body.

3. The multimedia heat dissipation case of claim 2, wherein: a plurality of heat dissipation channels arranged in parallel are formed in the heat dissipation fins.

4. The multimedia heat dissipation case of claim 3, wherein: the cooling device further comprises a cooling fan, the cooling fan is located on one side of the cooling fins and cools the cooling fins, and airflow blown out by the cooling fan is bent through the cooling channel.

5. The multimedia heat dissipation case of claim 4, wherein: the heat conduction pipe comprises a first heat conduction section attached to the hot surface of the semiconductor refrigeration piece and a second heat conduction section inserted into the heat dissipation fins, and the second heat conduction section is perpendicular to the air outlet direction of the heat dissipation fan.

6. The multimedia heat dissipation case of claim 1, wherein: the air inlet of the turbofan is positioned right above the hot air outlet, and the cold guide fins are positioned in the cooling shell between the cold air inlet and the hot air outlet.

7. The multimedia heat dissipation case of claim 6, wherein: the cooling guide fins are provided with a plurality of cooling guide fins, airflow gaps for air to flow through are formed between the adjacent cooling guide fins, and air at the hot air outlet enters the cold air inlet through the airflow gaps under the action of the turbofan.

8. The multimedia heat dissipation case of claim 1, wherein: the cold air inlet and the hot air outlet are both arranged on the same side of the horizontal plane of the box body.

9. A multimedia projector, characterized in that, comprising a casing and a multimedia heat dissipation box of any one of claims 1-8 arranged in the casing, the casing is provided with an air inlet fence and an air outlet fence for communicating the inner cavity of the casing with the outside air, the air inlet fence is arranged corresponding to the air inlet of the heat dissipation fan of the multimedia heat dissipation box, and the air outlet fence is arranged corresponding to the air outlet of the heat dissipation fins of the multimedia heat dissipation box.

10. The multimedia projector of claim 9, wherein: the inner cavity of the shell is divided into a first cavity and a second cavity through a heat insulation sheet, and the multimedia heat dissipation box is arranged in the first cavity.