CN113299741A - 薄膜晶体管器件、背光模组和显示面板 - Google Patents
薄膜晶体管器件、背光模组和显示面板 Download PDFInfo
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
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- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
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- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
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Abstract
本发明提供了薄膜晶体管器件、背光模组和显示面板;该薄膜晶体管器件包括:源极部、位于源极部上的有源层、和源极部分离设置的漏极部、位于所述有源层上并延伸至所述漏极部的上的导体部;其中,本发明通过将有源层设于源极部上,并且通过导体部电性连接漏极部和有源层,使得电流可以通过导体部由漏极部传输至有源层,进一步的,电流沿着有源层的厚度方向传输至源极部,以缩短电流的传输路径,增加了该薄膜晶体管器件的驱动电流,提高了背光模组的背光强度和显示面板的发光强度。
Description
技术领域
本发明涉及显示技术领域,尤其涉及薄膜晶体管器件、背光模组和显示面板。
背景技术
Mini LED(Mini Light-Emitting Diode,微型发光二极管)背光相比较传统的LED(Light-Emitting Diode,发光二极管)背光,可以实现百万级的对比度以提高显示画质。
目前,Mini LED背板采用电流驱动,但是用于驱动Mini LED的薄膜晶体管器件受限于迁移率、稳定性或者工艺精度等原因,最终薄膜晶体管器件的输出电流较低,导致MiniLED无法获得足够大的驱动电流,降低了Mini LED背板的背光强度。
因此,有必要提供可以提高薄膜晶体管器件的驱动电流的薄膜晶体管器件、背光模组和显示面板。
发明内容
本发明的目的在于提供薄膜晶体管器件、背光模组和显示面板,解决了现有技术中Mini LED的驱动电流较小,从而导致Mini LED背板的背光强度较低的问题。
本发明实施例提供薄膜晶体管器件,所述薄膜晶体管器件包括:
栅极部;
源极部;
有源层,所述有源层位于所述源极部上;
漏极部,所述漏极部和所述源极部分离设置,且所述漏极部和所述有源层分离设置;
导体部,所述导体部位于所述有源层上并延伸至所述漏极部。
在一实施例中,所述漏极部和所述源极部同层设置。
在一实施例中,所述栅极部位于所述有源层的上方或者下方,所述栅极部包括与所述有源层相对设置的有效栅极区;
其中,所述导体部与所述有效栅极区相对设置的区域或者所述源极部与所述有效栅极区相对设置的区域包括镂空区域。
在一实施例中,所述镂空区域设置有金属网格、交错排布的多条金属线两者中的至少一种。
在一实施例中,所述栅极部位于所述导体部中远离所述有源层的表面,所述导体部的组成材料包括金属纳米线。
在一实施例中,还包括:
阻挡部,所述阻挡部覆盖所述源极部靠近所述漏极部的一侧。
在一实施例中,所述源极部靠近所述漏极部的一侧突出于所述有源层,所述阻挡部还覆盖所述源极部靠近所述漏极部的一侧突出于所述有源层的部分。
在一实施例中,所述导体部覆盖所述有源层并且延伸至所述阻挡部上。
本发明实施例还提供背光模组,包括背板、多个如上文任一所述的薄膜晶体管器件和多个发光器件,多个所述薄膜晶体管器件和多个所述发光器件位于所述背板上,每一所述薄膜晶体管器件和对应的所述发光器件电性连接以控制对应的所述发光器件的发光情况。
本发明实施例还提供显示面板,包括液晶盒和如上文所述的背光模组,所述液晶盒设置于所述背光模组的出光面。
本发明实施例还提供显示面板,包括:
基板;
薄膜晶体管层,所述薄膜晶体管层位于所述基板上,所述薄膜晶体管层包括多个如上文任一所述的薄膜晶体管器件;
发光层,所述发光层位于所述薄膜晶体管层上,所述发光层包括多个发光部和多个像素定义部,每一所述发光部和对应的所述薄膜晶体管器件电性连接,每一所述像素定义部位于相邻的两个所述发光部之间。
本发明提供了薄膜晶体管器件、背光模组和显示面板,所述薄膜晶体管器件包括:源极部、有源层、漏极部以及导体部,所述有源层位于所述源极部上,所述漏极部和所述源极部分离设置,所述导体部位于所述有源层上并延伸至所述漏极部,所述漏极部通过所述导体部与所述有源层电性连接。本发明通过将所述有源层设于所述源极部上,并且通过所述导体部电性连接所述漏极部和所述有源层,使得电流可以通过所述导体部由所述漏极部传输至所述有源层,进一步的,电流可以沿着所述有源层的厚度方向传输至所述源极部,缩短了电流的传输路径,增加了该所述薄膜晶体管器件的驱动电流,提高了所述背光模组的背光强度和所述显示面板的发光强度。
附图说明
下面通过附图来对本发明进行进一步说明。需要说明的是,下面描述中的附图仅仅是用于解释说明本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种薄膜晶体管器件的剖面示意图。
图2为本发明实施例提供的另一种薄膜晶体管器件的剖面示意图。
图3为本发明实施例提供的又一种薄膜晶体管器件的剖面示意图。
图4为本发明实施例提供的薄膜晶体管器件的三维示意图。
图5为本发明实施例提供的发光单元的电路图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整的描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。在本发明的描述中,需要理解的是,术语“上”、“下”、“靠近”等指示的方位或位置关系为基于附图所示的方位或位置关系,例如,“上”只是表面在物体上方,具体指代正上方、斜上方、上表面都可以,只要居于物体水平之上即可;“两侧”是指代图中可以体现出的物体的相对的两个位置,所述两个位置可以和物体直接/间接接触,以上方位或位置关系仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。另外,还需要说明的是,附图提供的仅仅是和本发明关系比较密切的结构和步骤,省略了一些与发明关系不大的细节,目的在于简化附图,使发明点一目了然,而不是表明实际中装置和方法就是和附图一模一样,不作为实际中装置和方法的限制。
本发明提供薄膜晶体管器件,所述薄膜晶体管器件包括但不限于以下实施例以及以下实施例的组合。
在一实施例中,如图1至图4所示,所述薄膜晶体管器件100包括:栅极部70;源极部10;有源层20,所述有源层20位于所述源极部10上;漏极部30,所述漏极部30和所述源极部10分离设置,且所述漏极部30和所述有源层20分离设置;导体部40,所述导体部40位于所述有源层20上并延伸至所述漏极部30。
需要注意的是,对于所述薄膜晶体管器件100而言,所述漏极部30和所述源极部10分离设置,本实施例中的连接设置的所述有源层20和所述导体部40将所述漏极部30连接于所述源极部10,当所述薄膜晶体管器件100开启,并且所述漏极部30和所述源极部10间具有电压差时,驱动电流可以从所述源极部10依次经由所述有源层20和所述导体部40传输至所述漏极部30,或者从所述漏极部30依次经由所述有源层20和所述导体部40传输至所述源极部10。其中,所述漏极部30和所述源极部10可以同层或者异层设置,只要保证两者之间绝缘,并且所述漏极部30和所述有源层20被所述导体部40连接即可。
可以理解的,由于所述导体部40可以电性连接所述漏极部30和所述有源层20,即所述导体部40的组成材料为导体,而所述有源层20的组成材料为半导体,此处所述导体部40的电阻相对于所述有源层20而言可以忽略不计,即此处阻碍驱动电流的主要因素为所述有源层20的有效电阻。可以理解的,由于所述有源层20位于所述源极部10上方,驱动电流可以从所述源极部10出发沿着所述有源层20的纵向所处方向进行传输,或者从所述有源层20的纵向所处方向传输至所述源极部10,即驱动电流的传输长度可以近似等于所述有源层20的厚度,也即所述有源层20在纵向的电阻为所述有源层20的有效电阻,而所述有源层20的厚度远小于所述有源层20的长度,故驱动电流的传输长度较短,所述有源层20的有效电阻也较小,以上两个方面均可以使得所述薄膜晶体管器件100的驱动电流较大,提高了所述薄膜晶体管器件100的驱动能力。
其中,所述薄膜晶体管器件100还包括:基板50,所述基板50位于所述源极部10远离所述有源层20的一侧,所述基板50至少用于承载所述源极部10、所述有源层20、所述漏极部30和所述导体部40。具体的,所述基板50可以为刚性基板或者柔性基板,所述刚性基板可以为玻璃或者硅片,所述刚性基板的组成材料可以包括石英粉、碳酸锶、碳酸钡、硼酸、硼酐、氧化铝、碳酸钙、硝酸钡、氧化镁、氧化锡、氧化锌中的至少一种,所述柔性基板可以为聚合物材料衬底、金属箔片衬底、超薄玻璃衬底、聚合物/无机物衬底或者聚合物/有机物/无机物衬底,其中所述聚合物材料可以包括聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇酯、聚对萘二甲酸乙二醇酯、聚酰亚胺中的至少一种。
在一实施例中,如图1至图4所示,所述漏极部30和所述源极部10同层设置。具体的,所述漏极部30和所述导体部40可以位于所述源极部10的左侧或者右侧,此处以所述漏极部30和所述导体部40位于所述源极部10的右侧为例进行说明。可以理解的,当所述漏极部30和所述源极部10同层且间隔设置时,所述漏极部30和所述源极部10可以采用同样的材料通过相同的制程制作,提高了所述漏极部30和所述源极部10的制作效率。需要注意的是,所述漏极部30和所述源极部10的距离应该满足可以使得所述漏极部30和所述源极部10绝缘设置。
在一实施例中,如图1至图4所示,所述薄膜晶体管器件100还包括:阻挡部60,所述阻挡部60覆盖所述源极部10靠近所述漏极部30的一侧。可以理解的,由于所述阻挡部60位于所述源极部10和所述漏极部30之间,所述阻挡部60可以隔绝所述源极部10和所述漏极部30之间的空气等导电介质,以绝缘所述源极部10和所述漏极部30。其中,所述阻挡部60可以覆盖所述源极部10靠近所述漏极部30的一侧并向所述漏极部30延伸,进一步的,所述阻挡部60的两侧可以分别连接所述源极部10靠近所述漏极部30,以完全隔绝所述源极部10和所述漏极部30之间的空气等导电介质,并且,此时所述源极部10、所述阻挡部60和所述漏极部30三者的上表面可以形成一平坦的表面,所述导体部40可以形成于所述平坦的表面上,避免了所述导体部40掉落至间隙,提高了所述导体部40的导电能力。
具体的,如图1和图4所示,所述阻挡部60可以和所述有源层20同时制备,即可以采用半导体材料至少在所述源极部10的上方以及侧面同时制备所述阻挡部60和所述有源层20,以提高所述阻挡部60和所述有源层20的制作效率;当然,为了便于制备所述阻挡部60以及提高所述阻挡部60的绝缘作用,所述半导体材料还可以形成于所述基板50上,以使所述阻挡部60由所述源极部10的侧面延伸至所述基板50上。具体的,如图2-3所示,所述阻挡部60也可以单独制备,即可以依次形成所述阻挡部60和所述有源层20,所述阻挡部60的组成材料可以为绝缘材料,以进一步绝缘所述源极部10和所述漏极部30。
在一实施例中,如图2-3所示,所述源极部10靠近所述漏极部30的一侧突出于所述有源层20,所述阻挡部60还覆盖所述源极部10靠近所述漏极部30的一侧突出于所述有源层20的部分。需要注意的是,当所述有源层20覆盖所述源极部10中靠近所漏极部30的部分时,由于所述有源层20和所述阻挡部60的存在,可以避免所述漏极部30和所述源极部10接触设置。但是,当所述源极部10靠近所述漏极部30的一侧突出于所述有源层20时,若所述阻挡部60还覆盖所述源极部10靠近所述漏极部30的一侧突出于所述有源层20的部分,即可以隔绝所述漏极部30和所述源极部10连接的路径,以绝缘所述漏极部30和所述源极部10。其中,如图2所示,所述阻挡部60位于所述源极部10上的部分可以和所述有源层20的高度一致,即所述阻挡部60的上表面可以和所述有源层20的上表面平齐;当然,如图3所示,所述阻挡部60的上表面也可以低于所述有源层20的上表面,此时所述有源层20还可以延伸至覆盖所述阻挡部60,并且,此时可以减少所述阻挡部60弯曲的次数,避免所述阻挡部60损伤,提高了所述导体部40的导电能力。需要注意的是,此处需要将所述阻挡部60覆盖所述源极部10靠近所述导体部40的棱边所在区域,保证所述源极部10和所述导体部40绝缘。
在一实施例中,如图1至图4所示,所述导体部40覆盖所述有源层20并且延伸至所述阻挡部60上。可以理解的,所述导体部40覆盖所述有源层20可以最大化所述有源层20的有效电阻,以及最大化所述薄膜晶体管器件100的驱动电流的传输路径的宽度,以最大化所述薄膜晶体管器件100的驱动电流的大小。可以理解的,所述导体部40可以覆盖所述有源层20并且延伸经过所述阻挡部60以和所述漏极部30接触设置,以电性连接所述有源层20和所述漏极部30,当然,所述导体部40可以覆盖或者不覆盖所述漏极部30。
在一实施例中,如图1至图4所示,所述栅极部70位于所述有源层20的上方或者下方,所述栅极部70包括与所述有源层20相对设置的有效栅极区01;其中,所述导体部40与所述有效栅极区01相对设置的区域02或者所述源极部10与所述有效栅极区01相对设置的区域包括镂空区域。其中,如图1至图4所示,此处以所述栅极部70位于所述有源层20远离所述源极部10的一侧为例进行说明,即所述薄膜晶体管器件100可以为顶栅结构;当然,所述栅极部70也可以位于所述源极部10远离所述有源层20的一侧,即所述薄膜晶体管器件100也可以为底栅结构。需要注意的是,所述薄膜晶体管器件100还包括绝缘层80,所述绝缘层80覆盖所述有源层20靠近所述栅极部70的一侧,并且延伸至所述漏极部30上,所述绝缘层80用于绝缘所述有源层20和所述栅极部70。
其中,所述栅极部70的组成材料可以包括金属、金属氧化物、金属氮化物、金属氮氧化物等导电材料中的至少一种,其中所述金属可以为不限于铜、铝、钼、钛等金属材料。具体的,所述栅极部70可以为单层膜层或者复合膜层,当所述栅极部70为单层膜层时,所述栅极部70可以为但不限于钼层、铝层、铜层、钛层,当所述栅极部70为复合膜层时,所述栅极部70可以为但不限于钼/铝/钼层、铝/钼层、钼/铜层、钼钛合金/铜层。其中,所述绝缘层80的组成材料可以包括无机介电材料、有机介电材料中的至少一种,其中所述无机介电材料可以包括氧化硅、氮化硅、氮氧化硅中的至少一种,其中所述有机介电材料可以为聚酰亚胺系树脂、环氧系树脂或压克力系树脂等高分子材料。具体的,所述绝缘层80可以为单层膜层或者双层膜层,当所述绝缘层80为单层膜层时,所述绝缘层80可以为但不限于氧化硅层、氮化硅层,当所述绝缘层80为双层膜层时,所述绝缘层80可以为氧化硅/氮化硅层,其中,所述阻挡部60的组成材料可以和所述绝缘层80的组成材料相同。
需要注意的是,当所述栅极部70和所述有源层20之间具有的电压差处于预设范围中,所述栅极部70和所述有源层20之间会产生电场,以实现所述薄膜晶体管器件100的开关及驱动性能。需要注意的是,此时若有金属材料制备的膜层位于所述栅极部70和所述有源层20之间,尤其是与所述有效栅极区01相对设置时,则会干扰所述栅极部70和所述有源层20之间的电场,干扰所述薄膜晶体管器件100的开启,因此,本实施例中针对所述薄膜晶体管器件100为顶栅结构,将所述导体部40和所述有效栅极区01相对设置的区域02设置为包括镂空区域,可以使得所述栅极部70和所述有源层20之间的电场线穿过所述镂空区域以发挥相应的作用,降低对所述栅极部70和所述有源层20之间的电场的干扰。可以理解的,当所述薄膜晶体管器件100也为底栅结构时,所述源极部10位于所述有源层20和所述有效栅极区01之间,同理,可以将所述源极部10和所述有效栅极区01相对设置的区域设置为包括镂空区域。
在一实施例中,所述镂空区域设置有金属网格和交错排布的多条金属线两者中的至少一种。具体的,所述金属网格可以采用刻蚀或者蒸镀的方式制作,所述交错排布的多条金属线可以采用涂布的方式制作。进一步的,所述交错排布的多条金属线可以为采用金属纳米线制备而成的膜层,所述金属纳米线可以为但不限于银纳米线。其中,如图1至图4所示,当所述栅极部70位于所述导体部40中远离所述有源层20的表面时,所述导体部40的组成材料包括金属纳米线,具体的,所述导体部40中的多条金属纳米线可以交错排布并且搭接于所述有源层20、所述阻挡部60和所述漏极部30上。
本发明还提供背光模组,所述背光模组包括背板、多个如上文任一所述的薄膜晶体管器件100和多个发光器件,多个所述薄膜晶体管器件100和多个所述发光器件位于所述背板上,每一所述薄膜晶体管器件100和对应的所述发光器件电性连接以控制对应的所述发光器件的发光情况。其中,所述发光器件可以为但不限于LED或者Mini LED,所述发光器件的一端可以和所述薄膜晶体管器件100的所述漏极部30电性连接,所述发光器件的另一端可以被加载一高电压信号,每一所述薄膜晶体管器件100的所述驱动电流由所述漏极部30输出至对应的所述发光器件,以控制对应的所述发光器件的发光情况。需要注意的是,所述背光模组可以应用于LCD(Liquid Crystal Display,液晶显示屏),即所述背光模组可以为LCD提供背光,以通过液晶分子呈现显示画面。
具体的,所述背光模组包括多条间隔设置的扫描线和多条间隔设置的数据线,如图5所示,每一所述扫描线03和对应的所述数据线04相交以限定出对应的发光单元90,每一所述发光单元90包括一控制晶体管901、一电容902、一所述薄膜晶体管器件100和一所述发光器件903,所述控制晶体管901的栅极和源极分别连接于对应的所述扫描线03和对应的所述数据线04,所述控制晶体管901的漏极连接于所述电容902和所述薄膜晶体管器件100的栅极,所述控制晶体管901在对应的所述扫描线03中的信号和对应的所述数据线04中的信号的控制下向所述电容902输入对应的控制电压,所述电容902用于维持所述薄膜晶体管器件100的栅极的所述控制电压。进一步的,所述发光器件100的两端分别连接一高电压信号源904和所述薄膜晶体管器件100的所述漏极部03,所述高电压信号源904向所述发光器件100提供高电压信号,每一所述薄膜晶体管器件100的所述驱动电流由所述漏极部30输出至对应的所述发光器件100,以控制对应的所述发光器件的发光情况。
本发明还提供显示面板,所述显示面板包括液晶盒如上文任一所述的背光模组,所述液晶盒设置于所述背光模组的出光面,例如所述显示面板可以为但不限于LCD;或者所述显示面板可以包括:基板;薄膜晶体管层,所述薄膜晶体管层位于所述基板上,所述薄膜晶体管层包括多个如上文任一所述的薄膜晶体管器件;发光层,所述发光层位于所述薄膜晶体管层上,所述发光层包括多个发光部和多个像素定义部,每一所述发光部和对应的所述薄膜晶体管器件电性连接,每一所述像素定义部位于相邻的两个所述发光部之间,例如所述显示面板为但不限于OLED、LED或者Mini LED,此时所述薄膜晶体管层中的多个所述薄膜晶体管器件分别驱动多个所述发光部发光,以呈现显示画面。
本发明提供了薄膜晶体管器件、背光模组和显示面板,所述薄膜晶体管器件包括:源极部、有源层、漏极部以及导体部,所述有源层位于所述源极部上,所述漏极部和所述源极部分离设置,所述导体部位于所述有源层上并延伸至所述漏极部,所述漏极部通过所述导体部与所述有源层电性连接。本发明通过将所述有源层设于所述源极部上,并且通过所述导体部电性连接所述漏极部和所述有源层,使得电流可以通过所述导体部由所述漏极部传输至所述有源层,进一步的,电流可以沿着所述有源层的厚度方向传输至所述源极部,缩短了电流的传输路径,增加了该所述薄膜晶体管器件的驱动电流,提高了所述背光模组的背光强度和所述显示面板的发光强度。
以上对本发明实施例所提供的薄膜晶体管器件、背光模组和显示面板进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的技术方案及其核心思想;本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例的技术方案的范围。
Claims (11)
1.一种薄膜晶体管器件,其特征在于,包括;
栅极部;
源极部;
有源层,所述有源层位于所述源极部上;
漏极部,所述漏极部和所述源极部分离设置,且所述漏极部和所述有源层分离设置;
导体部,所述导体部位于所述有源层上并延伸至所述漏极部。
2.如权利要求1所述的薄膜晶体管器件,其特征在于,所述漏极部和所述源极部同层设置。
3.如权利要求2所述的薄膜晶体管器件,其特征在于,所述栅极部位于所述有源层的上方或者下方,所述栅极部包括与所述有源层相对设置的有效栅极区;
其中,所述导体部与所述有效栅极区相对设置的区域或者所述源极部与所述有效栅极区相对设置的区域包括镂空区域。
4.如权利要求3所述的薄膜晶体管器件,其特征在于,所述镂空区域设置有金属网格、交错排布的多条金属线两者中的至少一种。
5.如权利要求4所述的薄膜晶体管器件,其特征在于,所述栅极部位于所述导体部中远离所述有源层的表面,所述导体部的组成材料包括金属纳米线。
6.如权利要求2所述的薄膜晶体管器件,其特征在于,还包括:
阻挡部,所述阻挡部覆盖所述源极部靠近所述漏极部的一侧。
7.如权利要求6所述的薄膜晶体管器件,其特征在于,所述源极部靠近所述漏极部的一侧突出于所述有源层,所述阻挡部还覆盖所述源极部靠近所述漏极部的一侧突出于所述有源层的部分。
8.如权利要求6所述的薄膜晶体管器件,其特征在于,所述导体部覆盖所述有源层并且延伸至所述阻挡部上。
9.一种背光模组,其特征在于,包括背板、多个如权利要求1-8任一所述的薄膜晶体管器件和多个发光器件,多个所述薄膜晶体管器件和多个所述发光器件位于所述背板上,每一所述薄膜晶体管器件和对应的所述发光器件电性连接。
10.一种显示面板,其特征在于,包括液晶盒和如权利要求9所述的背光模组,所述液晶盒设置于所述背光模组的出光面。
11.一种显示面板,其特征在于,包括:
基板;
薄膜晶体管层,所述薄膜晶体管层位于所述基板上,所述薄膜晶体管层包括多个如权利要求1-8任一所述的薄膜晶体管器件;
发光层,所述发光层位于所述薄膜晶体管层上,所述发光层包括多个发光部和多个像素定义部,每一所述发光部和对应的所述薄膜晶体管器件电性连接,每一所述像素定义部位于相邻的两个所述发光部之间。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160027890A1 (en) * | 2013-03-14 | 2016-01-28 | Karlsruher Institut für Technologie | Electrochemically-gated field-effect transistor and method for its manufacture |
US20160204267A1 (en) * | 2015-01-12 | 2016-07-14 | Samsung Display Co., Ltd. | Thin film transistor and method of manufacturing the same |
CN110416316A (zh) * | 2019-08-02 | 2019-11-05 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、显示基板及显示装置 |
CN111370496A (zh) * | 2020-03-18 | 2020-07-03 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、显示装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06268220A (ja) | 1993-03-17 | 1994-09-22 | Fujitsu Ltd | 薄膜トランジスタ |
JP4439766B2 (ja) * | 2001-08-02 | 2010-03-24 | シャープ株式会社 | 薄膜トランジスタ装置及びその製造方法 |
JP5886802B2 (ja) * | 2013-08-29 | 2016-03-16 | 株式会社東芝 | 半導体装置 |
TWI519879B (zh) * | 2013-11-08 | 2016-02-01 | 群創光電股份有限公司 | 顯示面板及包含該顯示面板的顯示裝置 |
CN205645823U (zh) * | 2016-05-31 | 2016-10-12 | 京东方科技集团股份有限公司 | 薄膜晶体管、阵列基板、显示面板及显示装置 |
CN109219774B (zh) * | 2016-06-09 | 2021-08-03 | 夏普株式会社 | 有源矩阵基板、带触摸面板的显示装置及液晶显示装置 |
CN106505072B (zh) | 2016-10-31 | 2019-07-26 | 昆山工研院新型平板显示技术中心有限公司 | 柔性显示面板及柔性显示装置 |
JP2018181579A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
TWI662335B (zh) * | 2018-03-22 | 2019-06-11 | 友達光電股份有限公司 | 發光裝置與使用其之背光模組 |
CN108598155A (zh) | 2018-04-18 | 2018-09-28 | 昆山龙腾光电有限公司 | 薄膜晶体管、阵列基板及显示装置 |
-
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- 2021-05-31 WO PCT/CN2021/097525 patent/WO2022233075A1/zh active Application Filing
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160027890A1 (en) * | 2013-03-14 | 2016-01-28 | Karlsruher Institut für Technologie | Electrochemically-gated field-effect transistor and method for its manufacture |
US20160204267A1 (en) * | 2015-01-12 | 2016-07-14 | Samsung Display Co., Ltd. | Thin film transistor and method of manufacturing the same |
CN110416316A (zh) * | 2019-08-02 | 2019-11-05 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、显示基板及显示装置 |
CN111370496A (zh) * | 2020-03-18 | 2020-07-03 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、显示装置 |
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