CN113291530A - Vacuum packaging equipment and method for silicon wafer - Google Patents
Vacuum packaging equipment and method for silicon wafer Download PDFInfo
- Publication number
- CN113291530A CN113291530A CN202110712996.9A CN202110712996A CN113291530A CN 113291530 A CN113291530 A CN 113291530A CN 202110712996 A CN202110712996 A CN 202110712996A CN 113291530 A CN113291530 A CN 113291530A
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- equipment
- air
- discharge
- particles
- vacuum packaging
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- 238000009461 vacuum packaging Methods 0.000 title claims abstract description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 33
- 239000010703 silicon Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000002245 particle Substances 0.000 claims abstract description 29
- 238000005192 partition Methods 0.000 claims abstract description 7
- 238000001914 filtration Methods 0.000 claims abstract description 5
- 238000007599 discharging Methods 0.000 claims abstract description 3
- 238000004806 packaging method and process Methods 0.000 claims description 45
- 235000012431 wafers Nutrition 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 26
- 238000012856 packing Methods 0.000 claims description 2
- 230000003749 cleanliness Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 4
- 239000008187 granular material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
- B65B31/04—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
- B65B31/046—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied the nozzles co-operating, or being combined, with a device for opening or closing the container or wrapper
- B65B31/048—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied the nozzles co-operating, or being combined, with a device for opening or closing the container or wrapper specially adapted for wrappers or bags
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
- B65B51/146—Closing bags
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The embodiment of the invention discloses vacuum packaging equipment and a method for a silicon wafer, wherein the equipment comprises the following components: the air supply device is arranged at the top of the shell and used for filtering outside air, conveying filtered clean air to the interior of the equipment and driving particles in the equipment to move downwards by utilizing airflow generated by the clean air; a plurality of first discharge holes provided on the partition plate and a plurality of second discharge holes provided at a bottom position of the housing, wherein the plurality of first discharge holes and the plurality of second discharge holes are used to discharge the particles inside the apparatus to the bottom of the apparatus; and the exhaust device is arranged outside the equipment and is connected with the second discharge hole through a first discharge pipeline, wherein the exhaust device is used for discharging the particles at the bottom of the equipment to the outside of the equipment.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductors, in particular to vacuum packaging equipment and a vacuum packaging method for silicon wafers.
Background
Since silicon wafers are the basic material for manufacturing semiconductor chips, the cleanliness of the silicon wafer surface has a very important influence on the quality of the semiconductor chips. In order to ensure that the silicon wafers are not damaged or polluted in the process of transporting the silicon wafers, a three-layer packaging technology is often adopted to package cleaned clean silicon wafers, and the second step in the three-layer packaging technology is to put a wafer box containing the clean silicon wafers into a plastic film packaging bag and carry out vacuum sealing treatment on the packaging bag. At present, the vacuum sealing treatment method for the packaging bag generally adopts an air extraction nozzle to extract air in the packaging bag, and the air extraction nozzle is withdrawn when an operator judges that the vacuum environment in the packaging bag is achieved. However, the method cannot ensure that the pollution particles inside the vacuum packaging equipment cannot pollute the environment in the packaging bag. Meanwhile, a plurality of vacuum packaging devices on the current market cannot control the cleanliness of the interior of the vacuum packaging devices.
Disclosure of Invention
In view of the above, embodiments of the present invention are directed to providing a vacuum packaging apparatus and method for silicon wafers; the cleanliness of the interior of the vacuum packaging equipment can be controlled so as to reduce the probability of polluting clean silicon wafers.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a vacuum packaging apparatus for silicon wafers, where the apparatus includes:
the air supply device is arranged at the top of the shell and used for filtering outside air, conveying filtered clean air to the interior of the equipment and driving particles in the equipment to move downwards by utilizing airflow generated by the clean air;
a plurality of first discharge holes provided on the partition plate and a plurality of second discharge holes provided at a bottom position of the housing, wherein the plurality of first discharge holes and the plurality of second discharge holes are used to discharge the particles inside the apparatus to the bottom of the apparatus;
and the exhaust device is arranged outside the equipment and is connected with the second discharge hole through a first discharge pipeline, wherein the exhaust device is used for discharging the particles at the bottom of the equipment to the outside of the equipment.
In a second aspect, an embodiment of the present invention provides a vacuum packaging method for silicon wafers, which can be applied to the vacuum packaging apparatus of the first aspect, and the method includes:
loading silicon wafers to be packaged into a packaging bag in a box, placing the packaging bag on a workbench, and opening an air supply device in the sealing process of the packaging bag to enable clean air filtered from the outside to be transmitted into vacuum packaging equipment;
the air flow generated by the clean air drives the particles in the vacuum packaging equipment to be discharged to the bottom of the vacuum packaging equipment through a first discharge hole and a second discharge hole in sequence;
and driving the particles at the bottom of the vacuum packaging equipment to be discharged out of the vacuum packaging equipment through an exhaust device.
The embodiment of the invention provides vacuum packaging equipment and a method for a silicon wafer; through the top installation air supply arrangement in equipment inside, and a plurality of first discharge hole that set up, a plurality of second discharge hole and exhaust apparatus, when providing clean air for equipment inside, make the inside granule of equipment can loop through first discharge hole and the bottom of second discharge hole motion to equipment, and make the granule of equipment bottom discharge to the equipment outside through exhaust apparatus, thereby the inside cleanliness factor of equipment has been guaranteed, and then the existence that does not have the pollution granule in the wrapping bag surrounding environment has also been guaranteed, can guarantee the inside cleanliness factor of wrapping bag like this, the pollution rate of silicon chip product has been reduced, and the production benefit is improved.
Drawings
Fig. 1 is a schematic diagram illustrating a vacuum packaging apparatus for silicon wafers according to a conventional embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a medium pressure rod in a conventional technical solution according to an embodiment of the present invention.
Fig. 3 is a schematic diagram illustrating a vacuum packaging apparatus for silicon wafers according to an embodiment of the present invention.
FIG. 4 is a schematic structural diagram of a second slider and a second slide rail connected to a suction nozzle according to an embodiment of the present invention.
Fig. 5 is a schematic flow chart of a vacuum packaging method for silicon wafers according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, there is shown a schematic view of a vacuum packing apparatus 100 for silicon wafers in the conventional art. As shown in fig. 1, the apparatus 100 may include: a housing 101, a partition 102, a table 103, a suction nozzle 104, a slide cylinder 105, a vacuum pump 106, a heating sheet 107, and a sealing tape 108; the workbench 103 is mainly used for placing silicon wafers to be packaged, packaging bags and the air suction nozzle 104; the nozzle opening of the air suction nozzle 104 is placed in the packaging bag, the other end of the air suction nozzle 104 is connected with the sliding machine cylinder 105, and the other end of the sliding machine cylinder 105 is connected with the vacuum pump 106; in practice, the vacuum pump 106 pumps all or part of the air in the package through the slide cylinder 105 and the air pump nozzle 104 to make the vacuum degree in the package reach the requirement.
Meanwhile, it is shown in fig. 1 that the heat patch 107 may include an upper heat patch 1071 and a lower heat patch 1072 which are oppositely inclined; wherein, the lower heating plate 1072 is fixed on the partition plate 102 and close to the edge of the partition plate 102; an operation area is formed between the upper heating sheet 1071 and the lower heating sheet 1072; the sealing bar 108 may include an upper sealing bar 1081 and a lower sealing bar 1082 disposed at an opposite inclination, as shown in fig. 1, the upper sealing bar 1081 being disposed at one side of the upper heating sheet 1071 to be movable with respect to the upper heating sheet 1071; the lower seal bar 1082 is provided on one side of the lower heat sheet 1072 so as to be movable relative to the lower heat sheet 1072.
It will be appreciated that, in addition to the structure and components set forth above, the vacuum packaging apparatus 100 further comprises a retractable plate 109 for connecting the upper seal 1081 with the housing 101, wherein the retractable plate 109 is adapted to carry the upper seal 1081 to move relative to the lower seal 1082.
In addition, referring to fig. 2, a pressing rod 110 is connected to an upper surface of the upper heat plate 1071, wherein the pressing rod 110 is used to move the upper heat plate 1071. Of course, it is understood that the vacuum packaging apparatus 100 may further include an opening and closing portion 201, and the opening and closing portion 201 is connected to the pressing rod 110 and the vacuum pump 106 respectively for controlling the operations of the pressing rod 110 and the vacuum pump 106.
As can be understood, when the vacuum packaging apparatus 100 is used for vacuum packaging of a packaging bag containing silicon wafers, the expansion plate 109 drives the upper sealing strip 1081 to move, and when the upper sealing strip 1081 and the lower sealing strip 1082 are tightly attached, the upper sealing strip 1081 and the lower sealing strip 1082 are tightly and hermetically disposed on the packaging bag; meanwhile, the air suction nozzle 104 placed in the opening of the packaging bag sucks out all or part of the air in the packaging bag under the action of the vacuum pump 106; after the air-extracting operation is completed, the upper heating sheet 1071 is driven by the pressing rod 110 to move toward the lower heating sheet 1072, and the heat-sealing operation of the packaging bag is started until the upper heating sheet 1071 and the lower heating sheet 1072 are tightly attached.
When the air suction operation of the packaging bag is performed, as shown in fig. 1, the air suction nozzle 103 can move left and right along the bag opening direction through the sliding cylinder 105 to suck air at each spatial position in the packaging bag, so that the air in the packaging bag is completely or partially sucked out, and the vacuum packaging of the silicon wafer is realized.
It should be noted that, when the apparatus 100 is used to vacuum-pack a packaging bag, it cannot be avoided that the environment and particles inside the apparatus 100 enter the packaging bag to pollute the environment inside the packaging bag, and further cause unclean silicon wafers, so that customers complain about the silicon wafers, and thus the economic benefit is reduced.
Based on the above, in order to prevent particles in the environment and inside the apparatus from entering into the packaging bag, referring to fig. 3, which shows a schematic structural diagram of a vacuum packaging apparatus 300 for silicon wafers according to an embodiment of the present invention, the apparatus 300 may include:
an air supply device 301 built in the top of the casing 101, wherein the air supply device 301 is used for filtering outside air, delivering filtered clean air to the inside of the equipment 300, and driving particles in the inside of the equipment 300 to move downwards by using air flow generated by the clean air;
a plurality of first discharge holes 302 provided on the partition plate 102 and a plurality of second discharge holes 303 provided at a bottom position of the casing 101, wherein the plurality of first discharge holes 302 and the plurality of second discharge holes 303 are used to discharge particles inside the apparatus 300 to the bottom of the apparatus 300;
an exhaust device 304 disposed outside the apparatus 300, wherein the exhaust device 304 is connected to the second exhaust hole 303 through a first exhaust line 305, and wherein the exhaust device 304 is configured to exhaust particles at the bottom of the apparatus 300 to the outside of the apparatus 300.
It should be noted that, in an embodiment of the present invention, the air supply device 301 may be an air blower Filter Unit (EFU), which is generally installed on the top of the apparatus. In a specific implementation process, the EFU blower device 301 can suck Air from the top of the equipment, Filter the sucked Air through a High Efficiency Air Filter (HEPA), and send out clean Air from an Air outlet surface after the filtration is completed, so as to provide clean Air for a clean equipment environment.
Preferably, the exhaust device 304 may be a blower or a plant exhaust line.
In addition, in the implementation of the embodiment of the present invention, by installing the EFU blower device 301 in the apparatus 300, the pressure inside the apparatus 300 can be made higher than the external pressure, so that the particles outside can be blocked from entering the inside of the apparatus 300 from the position of the heating sheet 107.
With the vacuum packaging apparatus 300 shown in fig. 3, by installing the EFU blower device 301 on the top inside the apparatus 300, and providing the first exhaust hole 302, the second exhaust hole 303 and the exhaust device 304, while providing clean air inside the apparatus 300, particles inside the apparatus 300 can move to the bottom of the apparatus 300 through the first exhaust hole 302 and the second exhaust hole 303, and the particles at the bottom of the apparatus 300 are exhausted outside the apparatus 300 through the exhaust device 304, so that the cleanliness inside the apparatus 300 is ensured, and further, the existence of no contamination particles in the environment around the packaging bag is ensured, thus the cleanliness inside the packaging bag can be ensured, the contamination rate of silicon wafer products is reduced, and the production efficiency is improved.
For the vacuum packaging apparatus 300 shown in fig. 3, the apparatus 300 further comprises:
an air extraction nozzle 104, said air extraction nozzle 104 being connected to said exhaust 304 by a gas line 306;
the heating plate 107, the heating plate 107 includes an upper heating plate 1071 and a lower heating plate 1072 symmetrically disposed at both sides of the air suction nozzle 104;
and the sealing strip 108 comprises an upper sealing strip 1081 and a lower sealing strip 1082 which are symmetrically arranged at two sides of the air suction nozzle 104.
It will be appreciated that in the packaging apparatus 100, the heat patch 107 and the sealing strip 108 are disposed obliquely on both sides of the suction nozzle 104, so that the sealing position on the packaging bag is not flat enough when the packaging bag is vacuum-packaged; in the packaging apparatus shown in fig. 3, the heating sheet 107 and the sealing strip 108 are symmetrically disposed on both sides of the suction nozzle 104, so that the flatness of the sealing position of the packaging bag can be ensured when the packaging bag is vacuum-packaged.
It should be noted that, when there are contaminating particles on the packaging bag, in the process of heating the packaging bag, the molecular motion is accelerated due to the temperature rise, so that the contaminating particles on the packaging bag can move to the inside of the apparatus 300 through the position of the heating plate 107, so that the inside environment of the apparatus 300 is contaminated, and the product environment of the packaging bag is affected.
Based on the above explanation, in some implementations of the embodiment of the present invention, referring to fig. 3, the back of the heating sheet 107 is provided with a third exhaust hole 307, and the third exhaust hole 307 is connected to the exhaust device 304 through a second exhaust pipe 308, so that the particles on the packing bag can be exhausted to the exhaust device 304 through the third exhaust hole 307 and the second exhaust pipe 308.
In some implementations of the embodiment of the invention with respect to the apparatus 300 shown in fig. 3, referring to fig. 3, the heating plate 107 is connected to the first slider 310 through a support bar 309, and the first slider 310 can slide along a first slide rail 311.
It should be noted that fig. 3 shows the upper supporting rod 3091 and the lower supporting rod 3092, and meanwhile, the other end of the upper supporting rod 3091 is connected to the first slider 310, the other end of the lower supporting rod 3092 is also connected to the first slider 310, and the first slider 310 can slide on the first slide rail 311, so that when the vacuum packaging of the packaging bag is performed, the movement of the first slider 310 can drive the heating plate 107 to move towards the direction close to the mouth of the packaging bag, and after the heat packaging is completed, the movement of the first slider 310 can drive the heating plate 107 to move towards the direction away from the mouth of the packaging bag.
With respect to the apparatus 300 shown in fig. 3, in some implementations of the embodiment of the present invention, a solenoid valve 312 is disposed on the gas pipe 306, and the solenoid valve 312 is used to control whether the air inside the package is exhausted to the air exhaust device 304 through the gas pipe 306.
When the air-extracting operation is performed on the packaging bag by the air-extracting device 304, the Controller of the solenoid valve 312 is a Programmable Logic Controller (PLC). It will be appreciated that when the suction nozzle 104 begins to draw air from within the package, the solenoid valve 312 is opened by the PLC controller to allow the air within the package to vent through the gas line 306 to the exhaust 304; after all the air in the bag is exhausted, the solenoid valve 312 can be closed by the PLC controller, so that the air exhauster 304 can not exhaust air from the bag any more, thereby affecting the vacuum degree in the bag.
It should be noted that, for the apparatus 300 shown in fig. 3, in some specific implementations of the embodiment of the present invention, referring to fig. 4, the suction nozzle 104 is connected to a second slider 401 at an end away from the nozzle opening, and the second slider 401 is capable of sliding along a second sliding rail 402.
With respect to the apparatus 300 shown in fig. 3, preferably, referring to fig. 3, in some implementations of embodiments of the present invention, the apparatus 300 further includes a plurality of feet 313, and the feet 313 are uniformly spaced on the outer edge of the casing 101 to facilitate movement of the apparatus 300.
Referring to fig. 5, there is shown a vacuum packing method for silicon wafers according to an embodiment of the present invention, which can be applied to the vacuum packing apparatus 300 described above, the method including:
s501, after silicon wafers to be packaged are loaded in a packaging bag and placed on the workbench 103, the air supply device 301 is started in the sealing process of the packaging bag, so that the outside filtered clean air is conveyed into the vacuum packaging equipment 300;
s502, driving the particles inside the vacuum packaging apparatus 300 to be discharged to the bottom of the vacuum packaging apparatus 300 through the first discharge hole 302 and the second discharge hole 303 in sequence by using the airflow generated by the clean air;
and S503, driving the particles at the bottom of the vacuum packaging equipment 300 to be discharged outside the vacuum packaging equipment 300 through an exhaust device 304.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A vacuum packaging apparatus for silicon wafers, the apparatus comprising:
the air supply device is arranged at the top of the shell and used for filtering outside air, conveying filtered clean air to the interior of the equipment and driving particles in the equipment to move downwards by utilizing airflow generated by the clean air;
a plurality of first discharge holes provided on the partition plate and a plurality of second discharge holes provided at a bottom position of the housing, wherein the plurality of first discharge holes and the plurality of second discharge holes are used to discharge the particles inside the apparatus to the bottom of the apparatus;
and the exhaust device is arranged outside the equipment and is connected with the second discharge hole through a first discharge pipeline, wherein the exhaust device is used for discharging the particles at the bottom of the equipment to the outside of the equipment.
2. The apparatus of claim 1, wherein the exhaust is a blower or a plant exhaust line.
3. The apparatus of claim 1, further comprising:
the air suction nozzle is connected with the exhaust device through an air pipeline;
the sealing strips comprise an upper sealing strip and a lower sealing strip which are symmetrically arranged at two sides of the air suction nozzle;
the heating plate comprises an upper heating plate and a lower heating plate which are symmetrically arranged on two sides of the air suction nozzle.
4. The apparatus of claim 3, wherein the heating sheet and the back portion are each provided with a third discharge hole connected to the exhaust means through a second discharge line, so that the particles on the packing bag can be discharged to the exhaust means through the third discharge hole and through the second discharge line.
5. The apparatus of claim 4, wherein the heating blade is coupled to the first slider via a support bar, and the first slider is capable of sliding along a first sliding track.
6. The apparatus of claim 3, wherein a solenoid valve is disposed on the gas line for controlling whether the air in the package is exhausted to the exhaust device through the gas line.
7. The apparatus of claim 6, wherein the controller of the solenoid valve is a PLC controller.
8. The apparatus of claim 3, wherein the suction nozzle is coupled to a second slide at an end remote from the nozzle opening, and the second slide is slidable along a second slide track.
9. The apparatus of claim 3, further comprising a plurality of feet evenly spaced on an outer edge of the housing.
10. A vacuum packing method for silicon wafers, which can be applied to the vacuum packing apparatus of any one of claims 1 to 9, comprising:
loading silicon wafers to be packaged into a packaging bag in a box, placing the packaging bag on a workbench, and opening an air supply device in the sealing process of the packaging bag to enable clean air filtered from the outside to be transmitted into vacuum packaging equipment;
the air flow generated by the clean air drives the particles in the vacuum packaging equipment to be discharged to the bottom of the vacuum packaging equipment through a first discharge hole and a second discharge hole in sequence;
and driving the particles at the bottom of the vacuum packaging equipment to be discharged out of the vacuum packaging equipment through an exhaust device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110712996.9A CN113291530B (en) | 2021-06-25 | 2021-06-25 | Vacuum packaging equipment and method for silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110712996.9A CN113291530B (en) | 2021-06-25 | 2021-06-25 | Vacuum packaging equipment and method for silicon wafer |
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| Publication Number | Publication Date |
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| CN113291530A true CN113291530A (en) | 2021-08-24 |
| CN113291530B CN113291530B (en) | 2023-06-09 |
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Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030110741A1 (en) * | 2001-12-14 | 2003-06-19 | Danglei Wang | Vacuum bag-sealing machine |
| CN1531498A (en) * | 2001-04-17 | 2004-09-22 | ά | Apparatus and method for vacuum packing products |
| KR100582176B1 (en) * | 2005-04-25 | 2006-05-23 | (주)씨에스이 | Vacuum sealer equipped with side hinge and multiplex sealing method using that |
| CN103863586A (en) * | 2012-12-14 | 2014-06-18 | 瓦克化学股份公司 | Packing polycrystalline silicon |
| CN104253076A (en) * | 2013-06-26 | 2014-12-31 | 株式会社大福 | Storage facility |
| WO2015079214A1 (en) * | 2013-11-26 | 2015-06-04 | Alveier Ltd | Animal bedding waste bag sealing apparatus |
| CN105083635A (en) * | 2015-09-12 | 2015-11-25 | 华联机械集团有限公司 | Full-automatic unmanned vacuum air-conditioning sealing packing machine with dust extraction function |
| CN105509197A (en) * | 2015-12-30 | 2016-04-20 | 天津市巨展机房装备有限公司 | Air self-circulation type refrigeration machine room |
| CN106931514A (en) * | 2017-03-14 | 2017-07-07 | 山东佳星环保科技有限公司 | A kind of indoor air-purification device |
| CN207346166U (en) * | 2017-11-03 | 2018-05-11 | 杨珮珮 | A kind of vacuum packing machine for lines bag |
| CN108045657A (en) * | 2017-12-18 | 2018-05-18 | 合肥超凡快递咨询有限公司界首营业部 | A kind of logistics packaging bag closing device |
| CN207510848U (en) * | 2017-12-05 | 2018-06-19 | 江西伟普科技有限公司 | Anti-pollution vacuum packing machine |
| CN108298123A (en) * | 2018-01-24 | 2018-07-20 | 安徽顺和生物科技有限公司 | The exhaust apparatus of packing machine |
| CN108750183A (en) * | 2018-07-19 | 2018-11-06 | 佛山迅奥捷自动化科技有限公司 | Logistics warehouse vacuum packing machine |
| CN110654658A (en) * | 2019-07-23 | 2020-01-07 | 张琦 | Self-cleaning formula vacuum packaging machine among food package |
| KR200490864Y1 (en) * | 2019-06-14 | 2020-01-14 | 주식회사 엠이씨인터네셔날 | a suppiy apparatus for dust removal and purification air of laundrette |
| CN211025471U (en) * | 2019-09-30 | 2020-07-17 | 广州市新鲜世界电器有限公司 | Air passage filtering device of vacuum packaging machine |
| CN211336580U (en) * | 2019-12-30 | 2020-08-25 | 无锡市锡南减震器有限公司 | Vacuum pumping device |
| CN111792085A (en) * | 2020-05-19 | 2020-10-20 | 芜湖飞元智能装备有限公司 | Vacuum packaging device for food and packaging method thereof |
| CN112918806A (en) * | 2021-01-28 | 2021-06-08 | 西安奕斯伟硅片技术有限公司 | Silicon wafer packing device |
-
2021
- 2021-06-25 CN CN202110712996.9A patent/CN113291530B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1531498A (en) * | 2001-04-17 | 2004-09-22 | ά | Apparatus and method for vacuum packing products |
| US20030110741A1 (en) * | 2001-12-14 | 2003-06-19 | Danglei Wang | Vacuum bag-sealing machine |
| KR100582176B1 (en) * | 2005-04-25 | 2006-05-23 | (주)씨에스이 | Vacuum sealer equipped with side hinge and multiplex sealing method using that |
| CN103863586A (en) * | 2012-12-14 | 2014-06-18 | 瓦克化学股份公司 | Packing polycrystalline silicon |
| CN104253076A (en) * | 2013-06-26 | 2014-12-31 | 株式会社大福 | Storage facility |
| WO2015079214A1 (en) * | 2013-11-26 | 2015-06-04 | Alveier Ltd | Animal bedding waste bag sealing apparatus |
| CN105083635A (en) * | 2015-09-12 | 2015-11-25 | 华联机械集团有限公司 | Full-automatic unmanned vacuum air-conditioning sealing packing machine with dust extraction function |
| CN105509197A (en) * | 2015-12-30 | 2016-04-20 | 天津市巨展机房装备有限公司 | Air self-circulation type refrigeration machine room |
| CN106931514A (en) * | 2017-03-14 | 2017-07-07 | 山东佳星环保科技有限公司 | A kind of indoor air-purification device |
| CN207346166U (en) * | 2017-11-03 | 2018-05-11 | 杨珮珮 | A kind of vacuum packing machine for lines bag |
| CN207510848U (en) * | 2017-12-05 | 2018-06-19 | 江西伟普科技有限公司 | Anti-pollution vacuum packing machine |
| CN108045657A (en) * | 2017-12-18 | 2018-05-18 | 合肥超凡快递咨询有限公司界首营业部 | A kind of logistics packaging bag closing device |
| CN108298123A (en) * | 2018-01-24 | 2018-07-20 | 安徽顺和生物科技有限公司 | The exhaust apparatus of packing machine |
| CN108750183A (en) * | 2018-07-19 | 2018-11-06 | 佛山迅奥捷自动化科技有限公司 | Logistics warehouse vacuum packing machine |
| KR200490864Y1 (en) * | 2019-06-14 | 2020-01-14 | 주식회사 엠이씨인터네셔날 | a suppiy apparatus for dust removal and purification air of laundrette |
| CN110654658A (en) * | 2019-07-23 | 2020-01-07 | 张琦 | Self-cleaning formula vacuum packaging machine among food package |
| CN211025471U (en) * | 2019-09-30 | 2020-07-17 | 广州市新鲜世界电器有限公司 | Air passage filtering device of vacuum packaging machine |
| CN211336580U (en) * | 2019-12-30 | 2020-08-25 | 无锡市锡南减震器有限公司 | Vacuum pumping device |
| CN111792085A (en) * | 2020-05-19 | 2020-10-20 | 芜湖飞元智能装备有限公司 | Vacuum packaging device for food and packaging method thereof |
| CN112918806A (en) * | 2021-01-28 | 2021-06-08 | 西安奕斯伟硅片技术有限公司 | Silicon wafer packing device |
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Address after: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Address before: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. |