JP7081119B2 - Load port device - Google Patents

Description

The present invention relates to a load port device on which a wafer transfer container can be placed.

In the semiconductor manufacturing process, a wafer transfer container is placed on a mounting table of a load port device, and the semiconductor wafer is delivered to an effem or a processing chamber. At this time, the internal gas in the wafer transfer container may flow out from the connection portion of the load port device with the wafer transfer container and stay around the wafer transfer container around the load port device.

The gas flowing out of the wafer transfer container may include an inert gas such as nitrogen or a chemically active gas (chlorine-based gas or the like) generated from the treated wafer or the like. If a gas containing a large amount of active gas locally stays in a specific area of the load port device, there is a possibility that the corrosion of the mechanical parts constituting the load port device may be accelerated or the life of the electronic parts may be shortened. Further, even if the gas is inert, if a relatively large amount of the gas flows out to the outside of the wafer transfer container and the efem, the problem of a decrease in oxygen concentration may occur around the wafer transfer container.

Further, when the pressure inside the wafer transfer container installed in the load port device is positive, particularly when the cleaning gas is supplied from the load port device into the wafer transfer container to clean the wafer transfer container, the wafer is wafer. The amount of internal gas outflow in the transport container tends to increase.

Japanese Unexamined Patent Publication No. 2002-170876

The present invention has been made in view of such an actual situation, and an object of the present invention is to provide a load port device capable of preventing damage to peripheral members due to gas flowing out of a wafer transfer container.

In order to achieve the above object, the load port device according to the present invention is
A mounting unit on which the wafer transfer container is mounted, and
A frame portion having a frame opening to which the container opening of the wafer transfer container is connected, and a frame portion.
A gas that excludes at least one of the gas in the first space below the wafer transfer container placed in the above-mentioned place and above the above-mentioned place and in the second space surrounding the outer periphery of the frame opening. It has an exclusion means.

Since the load port device according to the present invention has a gas removing means for removing gas from the first space and the second space where the gas flowing out from the wafer transport container tends to stay, the machines constituting the load port device. It is possible to prevent the problem of accelerating the corrosion of parts, shortening the life of electronic parts, and the problem of lowering the oxygen concentration around the wafer transfer container.

Further, for example, the load port device according to the present invention may further have a gas supply means for supplying the inert gas into the wafer transfer container.

When the gas supply means supplies the inert gas into the wafer transfer container, the amount of gas flowing out from the inside of the wafer transfer container tends to increase. However, in the load port device according to the present invention, the gas exclusion means is the wafer. Since the gas that has flowed out of the transport container can be eliminated, the inside of the wafer transport container can be cleaned while preventing problems caused by the outflowing gas.

Further, for example, the load port device according to the present invention may further have a gas discharging means for discharging the internal gas in the wafer transport container.

Since such a load port device has a gas discharging means, it is possible to suppress the outflow of internal gas, and for the gas flowing out from the wafer transfer container, the first space and the first space and the first by the gas removing means. Since it can be excluded from the two spaces, the problem caused by the outflow gas can be effectively prevented.

Further, for example, the gas removing means may have a suction nozzle that sucks and removes at least one of the gas in the first space and the second space.

Since the gas removing means has a suction nozzle, the gas removing means sucks and removes the gas flowing out from the wafer transport container from the first space and the second space to prevent corrosion of mechanical parts and shorten the life of electronic parts. Prevention can be achieved.

Further, for example, the gas exhausting means may have a gas discharge nozzle that pushes out and exhausts at least one of the gas in the first space and the second space.

Since the gas removing means has a gas discharging nozzle, the gas removing means pushes out and eliminates the gas that flows out of the wafer transfer container and stays in the first space and the second space, and prevents corrosion of mechanical parts and electronic parts. It is possible to prevent the life from being shortened.

Further, for example, the gas exhausting means may have a mounting portion gas eliminating means provided in the above-mentioned mounting portion to eliminate gas in at least the first space.

Since the mounting portion is in contact with the first space, the mounting portion gas removing means can efficiently remove the gas flowing out of the wafer transport container and staying in the first space.

Further, for example, the gas exhausting means may have a frame side gas exhausting means provided on the side of the frame opening in the frame portion to exhaust gas at least in the second space.

Since the side portion of the frame opening in the frame portion is in contact with the second space, the frame side gas removing means can efficiently remove the gas flowing out of the wafer transfer container and staying in the second space.

The gas exhausting means may have a frame lower gas exhausting means provided below the frame opening in the frame portion to exhaust gas in the first space and the second space.

Since the lower portion of the frame opening in the frame portion is in contact with the portion where the first space and the second space overlap, the frame lower gas exhausting means flows out of the wafer transfer container and stays in the first space and the second space. Gas can be efficiently eliminated.

FIG. 1 is a schematic view showing an EFEM including a load port device and a load port device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a main part of the load port device shown in FIG. 1 from the side, and shows a state in which the door of the load port device is closed. FIG. 3 is a cross-sectional view of a main part of the load port device shown in FIG. 1 from the side, and shows a state in which the door of the load port device is open. FIG. 4 is a cross-sectional view of a main part of the load port device shown in FIG. 1 from above. FIG. 5 is a cross-sectional view of a main part of the load port device according to the second embodiment from the side. FIG. 6 is a cross-sectional view of a main part of the load port device according to the third embodiment from the side.

Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

As shown in FIG. 1, the load port device 10 according to the embodiment of the present invention is provided in the EFEM 60 that connects the semiconductor processing device (not shown) and the wafer transfer container 2. The load port device 10 includes a mounting portion 12 on which the wafer transfer container 2 is mounted, a frame portion 11 erected so as to project upward from the mounting portion 12, and a frame opening 11a formed in the frame portion 11. It has a door 16 and the like for opening and closing. In the drawings, the Y-axis indicates the moving direction of the movable table 14, the Z-axis indicates the vertical vertical direction, and the X-axis indicates the directions perpendicular to these Y-axis and Z-axis.

A wafer transfer container 2 that seals, stores, and conveys a plurality of wafers 1 as accommodations is detachably mounted on the mounting portion 12 of the load port device 10. Examples of the wafer transfer container 2 include a hoop (FOPU) and a fosbi (FOSB), but the wafer transfer container 2 is not particularly limited, and another pod or the like that conveys the wafer 1 may be used as the wafer transfer container 2.

The load port device 10 is an interface device for transferring the wafer 1 housed inside the wafer transfer container 2 to the inside of the EFEM 60 while maintaining a clean state. As will be described later, the inside of the wafer transfer container 2 is airtightly connected to the inside of the EFem 60 by the load port device 10, and the wafer 1 in the wafer transfer container 2 is effemed by using a robot arm or the like in the EFem 60. It is transported to the inside of the 60 and the semiconductor processing apparatus to which the Efem 60 is connected.

FIG. 2 is a cross-sectional view of a main part of the load port device 10 on which the wafer transfer container 2 is mounted on the mounting portion 12 as viewed from the side, and shows the load port device 10 in a state before the door 16 is opened. Represents. As shown in FIG. 2, the sealed transport container 2 has a box-shaped outer shape, and a container opening 2c for loading and unloading the wafer 1 is formed inside the wafer transport container 2 on one of the side surfaces. ..

The wafer transfer container 2 has a lid 4 that opens and closes the container opening 2c. As will be described later, the door 16 of the load port device 10 can communicate with the container opening 2c of the wafer transfer container 2 and the frame opening 11a of the load port device 10 by engaging with the lid 4 and moving. Yes (see Figure 3).

Further, as shown in FIGS. 2 and 3, a supply port 5a and a discharge port 5b are provided on the bottom surface of the wafer transfer container 2. Purifying gas is introduced into the wafer transfer container 2 from the supply port 5a via the bottom gas supply unit 24 of the load port device 10. On the other hand, the internal gas, which is the gas in the wafer transfer container 2, is discharged from the discharge port 5b via the bottom gas discharge unit 22 of the load port device 10. A valve (not shown) is attached to the supply port 5a and the discharge port 5b. These valves are closed when the bottom gas supply unit 24 or the bottom gas discharge unit 22 of the load port device 10 is not connected, but when the bottom gas supply unit 24 introduces the purified gas or the bottom gas discharge unit 22 is used. It is designed to open when the internal gas is discharged.

In addition, a positioning portion 3 with which the positioning pin 15 is engaged is provided on the bottom surface of the wafer transfer container 2.

As shown in FIGS. 2 and 3, the mounting portion 12 of the load port device 10 has a fixed base 13 and a movable table 14. The movable table 14 is provided on the fixed table 13, and the wafer transfer container 2 is placed on the movable table 14. The positioning pin 15 projects from the upper surface of the movable table 14, and the positioning pin 15 engages with the positioning portion 3 provided on the bottom surface of the wafer transfer container 2, whereby the wafer transfer container 2 is placed on the movable table 13. It is installed in place.

As can be understood from the comparison between FIGS. 1 and 2, the movable table 14 can reciprocate along the Y-axis direction. As shown in FIG. 1, when the movable table 14 is stopped at a position away from the frame portion 11, the wafer transfer container 2 is conveyed onto the movable table 14 by using OHT or the like. Further, as shown in FIG. 2, when the movable table 14 approaches the frame portion 11, the lid 4 can be engaged with the door 16 that closes the frame opening 11a.

As shown in FIG. 1, the frame portion 11 of the load port device 10 constitutes a part of the wall of the EFEM 60. As shown in FIGS. 2 and 3, the container opening 2c of the wafer transfer container 2 is connected to the frame opening 11a formed in the frame portion 11. That is, as shown in FIG. 2, the lid 4 of the wafer transfer container 2 moves to the frame opening 11a as the movable table 14 moves, and thus engages with the door 16 that closes the frame opening 11a. Further, as shown in FIG. 3, the door 16 engaged with the lid 4 moves into the effem 60, thereby pulling the lid 4 into the effem 60. By such an operation, the load port device 10 communicates the container opening 2c with the inside of the EFem 60 as shown in FIG. As a result, the robot arm in the EFem 60 can access the wafer 1 of the wafer transfer container 2, and the operation of carrying out the wafer 1 from the wafer transfer container 2 and the operation of carrying the wafer 1 into the wafer transfer container 2 can be performed. It is possible to let the robot arm in the wafer 60 perform the operation.

As shown in FIGS. 2 and 3, the load port device 10 includes a front gas supply unit 20, a bottom gas supply unit 24, a bottom gas discharge unit 22, and a gas exhaust means in addition to the mounting unit 12, the frame unit 11, and the door 16. Has 30. As shown in FIG. 3, the front gas supply unit 20 supplies the cleaning gas to the wafer transfer container 2 communicated with the EFem 60 through the frame opening 11a and the container opening 2c.

As shown in FIGS. 3 and 4, the front gas supply unit 20 has a front gas discharge nozzle provided on the frame inner surface 11b of the frame unit 11. Purifying gas is supplied to the front gas discharge nozzle from a gas tank (not shown). Front gas discharge nozzles are provided on both sides of the frame opening 11a along the Z-axis direction. However, the front gas discharge nozzle included in the front gas supply unit 20 is not limited to this, and the front gas discharge nozzle may be provided along the upper side or the lower side of the inner surface 11b of the frame.

As shown in FIG. 2, the bottom gas supply unit 24 is a gas supply means for supplying the inert gas into the wafer transfer container 2, and has a bottom gas supply nozzle provided in the mounting unit 12. The bottom gas nozzle of the bottom gas supply unit 24 is connected to the supply port 5a of the wafer transfer container 2 and supplies the cleaning gas into the wafer transfer container 2 via the supply port 5a. Purifying gas is supplied to the bottom gas supply nozzle from a gas tank (not shown).

If the wafer transfer container 2 is placed on the mounting unit 12, the bottom gas supply unit 24 of the wafer transfer container 2 can be in an andock state (FIG. 2) in which the lid 4 of the wafer transfer container 2 is closed. The cleaning gas can be supplied into the wafer transfer container 2 even in the dock state (FIG. 3) in which the lid 4 is opened and communicates with the Efem 60. However, when the cleaning gas is supplied from the bottom gas supply unit 24 in the Andock state (FIG. 2), it is efficient to discharge a part of the internal gas from the bottom gas discharge unit 22 to avoid an excessive increase in internal pressure. It is preferable from the viewpoint of introducing a normalizing gas.

The bottom gas discharge unit 22 is a gas discharge means for discharging the internal gas in the wafer transfer container 2, and has a bottom gas discharge nozzle provided in the mounting unit 12. The bottom gas discharge nozzle of the bottom gas discharge unit 22 is connected to the discharge port 5b of the wafer transfer container 2, and the bottom gas in the wafer transfer container 2 is discharged via the discharge port 5b. The exhaust of the internal gas from the bottom gas discharge unit 22 may be forced exhaust or natural exhaust.

The gas exhausting means 30 of the load port device 10 has a mounting portion gas exhausting means 32 shown in FIG. 2 and a frame side gas exhausting means 36 shown in FIG. As shown in FIG. 2, the mounting portion gas removing means 32 has a suction nozzle 32a provided in the mounting portion 12, and is at least below the wafer transfer container 2 mounted on the mounting portion 12. The gas in the first space P1 (the shaded portion in FIG. 2) above the mounting portion 12 is sucked and removed.

The suction nozzle 32a is connected to a negative pressure forming means (not shown), and sucks and eliminates the gas in the first space P1. The suction nozzle 32a opens on the upper surface of the movable table 14 in the mounting portion 12, and the opening of the suction nozzle 32a faces the bottom surface of the wafer transfer container 2. Further, since the suction nozzle 32a is arranged closer to the frame portion 11 than the central portion in the Y-axis direction of the mounting portion 12, the suction nozzle 32a flows out from the connection portion between the container opening 2c and the frame opening 11a of the wafer transfer container 2. Internal gas can be efficiently eliminated.

However, the arrangement of the suction nozzle 32a included in the mounting portion gas removing means 32 is not limited to the example shown in FIG. 2, and a suction nozzle that opens on the upper surface of the fixing base 13 may be provided. Further, the suction nozzle 32a of the mounting portion gas removing means 32 may have a plurality of openings. Further, the suction nozzle 32a of the mounting portion gas removing means 32 is not limited to having a circular opening, and may have a slit-shaped opening extending in the X-axis direction or the Y-axis direction.

As shown in FIG. 2, the mounting portion gas eliminating means 32 is a first space P1 sandwiched between the bottom surface of the wafer transport container 2 mounted on the mounting portion 12 and the upper surface of the mounting portion 12. Since the suction nozzle 32a for sucking the gas into the pipe in the mounting portion 12 below is provided, the internal gas that flows out from the wafer transport container 2 and stays in the first space P1 is collected in the first space. It can be efficiently excluded from P1. Therefore, it is possible to prevent the problem that the mounting portion 12 and the drive mechanism and sensors provided around the mounting portion 12 are damaged by the internal gas.

As shown in FIG. 4, the frame side gas exhausting means 36 has a suction nozzle 36a provided on the side of the frame opening 11a in the frame portion 11, and at least a second space surrounding the outer periphery of the frame opening 11a. Eliminate the gas in P2 (the shaded area in FIG. 4 (see also FIG. 5)). The suction nozzles 36a are provided on both sides of the frame opening 11a in the horizontal direction (X-axis direction), and are provided in the gaps of the lid 4 that closes the container opening 2c of the wafer transfer container 2 and the wafer transfer container 2 and the frame opening 11a. The internal gas flowing out from the connecting portion B1 with the can be efficiently eliminated.

Further, the suction nozzle 36a shown in FIG. 4 has an opening facing the side surface of the wafer transfer container 2, and sucks and eliminates the gas in the second space P2 to both sides. However, the arrangement and shape of the suction nozzle 36a included in the frame side gas removing means 36 is not limited to the example shown in FIG. The suction nozzle 36a may have a plurality of openings, and the suction nozzle 36a may have a slit-shaped opening extending in the Z-axis direction.

Since the gas evacuating means 30 shown in FIGS. 2 and 4 has suction nozzles 32a and 36a that suck and eliminate at least one of the gases of the first space P1 and the second space P2, the first space P1 and the second space P1 and the second space. It is possible to prevent damage to mechanical parts and electronic parts due to the chemically active gas leaked to P2. Further, the gas flowing out from the mini-environment formed in the EFEM 60 is prevented from staying, and a region having a low oxygen concentration is locally formed around the load port device 10, and the inside of the mini-environment is formed. It is possible to prevent the gas flowing out from the above from diffusing into the semiconductor factory.

The gas exhausting means 30 included in the load port device 10 may be capable of exhausting at least one of the gas in the first space P1 and the second space P2. However, like the load port device 10, the gas exhaust means 30 having both the mounting portion gas exhaust means 32 and the frame side gas exhaust means 36 is effective for the gas flowing out from the wafer transfer container 2 and the mini-environment. It is possible to prevent the outflowing gas from staying around the load port device 10 and diffusing into the semiconductor factory.

Further, the suction nozzles 32a and 36a included in the load port device 10 are open to the space outside the wafer transfer container 2 and the mini-environment, and suck at least one gas of the first space P1 and the second space P2. Anything may be used, but gas in both the first space P1 and the second space P2 may be sucked. For example, the suction nozzle 32a of the mounting portion gas removing means 32 can suck the gas in both the first space P1 and the second space P2.

The gas evacuating means 30 included in the load port device 10 may always exhaust the gas while the wafer transport container 2 is mounted on the mounting portion 12, but the mounting state of the wafer transport container 2 may be performed. Depending on the situation, gas exclusion may be switched between implementation and suspension. For example, as shown in FIG. 2, in the andock state in which the lid 4 of the wafer transfer container 2 is closed, there is a risk of internal gas outflow, especially when the inside of the wafer transfer container 2 has a positive pressure. The gas can be eliminated by 30.

Further, as shown in FIG. 3, in the dock state where the lid 4 of the wafer transport container 2 is opened and the inside of the container communicates with the inside of the EFEM 60, positive pressure is maintained not only for the internal gas but also for the inside of the factory. Since the gas in the mini-environment may flow out, the gas can be eliminated by the gas removing means 30. Further, when the cleaning gas is supplied into the wafer transfer container 2 from the bottom gas supply unit 24, the pressure in the wafer transfer container 2 may increase and the internal gas may flow out. Therefore, the gas removing means 30 is used. Gas can be eliminated.

The second embodiment FIG. 5 is a cross-sectional view of a main part from the side of the load port device 110 according to the second embodiment of the present invention. The load port device 110 according to the first embodiment except that the load port device 110 according to the second embodiment has a frame lower gas exhaust means 132 as a gas exhaust means different from the gas exhaust means 30 shown in FIG. Is similar to. Therefore, in the description of the load port device 110, only the differences from the load port device 10 will be described, and the common points will be omitted.

As shown in FIG. 5, the frame lower gas exhausting means 132 has a suction nozzle 132a provided below the frame opening 11a in the frame portion 11 to exhaust gas in the first space and the second space. The suction nozzle 132a of the frame lower gas removing means 132 is connected to a negative pressure forming means (not shown), and sucks and removes the gas in the first space P1 and the second space P2.

The suction nozzle 132a opens on the surface of the movable table 14 below the frame opening 11a, and the opening of the suction nozzle 132a is arranged in the gap between the wafer transfer container 2 and the mounting portion 12. As shown in FIG. 5, since the suction nozzle 132a is open at the overlapping portion of the first space P1 and the second space P2, the gas flowing out from the wafer transfer container 2 can be efficiently removed. .. The range of the second space P2 in the Y-axis direction can be a range within about 10 cm from the outer periphery of the frame opening 11a, but the suction nozzle 132a may be further arranged at a position further away from the frame opening 11a. It is possible.

The load port device 110 shown in FIG. 5 also has the same effect as the load port device 10 shown in the first embodiment.

Third Embodiment FIG. 6 is a cross-sectional view of a main part from the side of the load port device 110 according to the third embodiment of the present invention. The load port device 110 according to the second embodiment is different from the gas suction nozzle 32a shown in FIG. 2 in that it has a mounting portion gas exhaust means 232 as a gas exhaust means having a gas discharge nozzle 232a. This is the same as the load port device 10 according to the embodiment. Therefore, in the description of the load port device 210, only the differences from the load port device 10 will be described, and the common points will be omitted.

The gas discharge nozzle 232a included in the mounting portion gas removing means 232 shown in FIG. 6 pushes out and removes the gas staying in the first space P1 by discharging gas such as air. Gas is supplied to the gas discharge nozzle 232a from a positive pressure tank, a blower fan, or the like (not shown). The mounting portion gas evacuating means 232 having such a gas discharging nozzle 232a also eliminates the gas staying in the first space P1 in the same manner as the mounting portion gas evacuating means 32 having the suction nozzle 32a (see FIG. 2). , It is possible to prevent corrosion of mechanical parts and prevent shortening of the life of electronic parts. The arrangement of the gas discharge nozzle 232a is the same as that of the suction nozzle 32a shown in FIG.

The mounting portion gas eliminating means 232 shown in FIG. 6 releases gas into the overlapping region of the first space P1 and the second space P2, and eliminates the internal gas staying in the first space P1 and the second space P2. The arrangement of the gas discharge nozzle 232a is not limited to this. The discharge nozzle included in the gas exhaust means may be any as long as it can extrude and eliminate at least one gas of the first space P1 and the second space P2. For example, like the suction nozzle 36a shown in FIG. 5, the frame opening 11a It may be arranged on the side of.

Although the present invention has been described above with reference to embodiments, the present invention is not limited to these embodiments, and the present invention has many modifications in which some of these embodiments are modified. Needless to say, it includes. For example, as shown in FIG. 2, the bottom gas discharging unit 22 and the mounting unit gas exhausting means 32, which are independently arranged from each other, may be connected to a common negative pressure forming means, and may have separate negative pressures. It may be connected to the forming means.

Further, the gas removing means 30 may have only one of the suction nozzles 32a, 36a, 132a and the gas discharge nozzle 232a, but has both the suction nozzles 32a, 36a, 132a and the gas discharge nozzle 232a. You may.

1 ... Wafer 2 ... Wafer transfer container 2c ... Container opening 3 ... Positioning part 4 ... Lid 5a ... Supply port 5b ... Discharge port 10, 110, 210 ... Load port device 11 ... Frame part 11a ... Frame opening 12 ... Mounting part 13 ... Fixed base 14 ... Movable table 15 ... Positioning pin 16 ... Door B1 ... Connecting part P1 ... First space P2 ... Second space 20 ... Front gas supply part 22 ... Bottom gas discharge part 24 ... Bottom gas supply part 30 ... Gas exhaust means 32 ... Placement gas exhaust means 32a ... Suction nozzle 36 ... Frame side gas exhaust means 36a ... Suction nozzle 60 ... Efem 132 ... Frame lower gas exhaust means 132a ... Suction nozzle 232 ... Placement part gas exhaust means 232a ... Gas discharge nozzle

Claims (10)

A mounting unit on which the wafer transfer container is mounted, and
A frame portion having a frame opening to which the container opening of the wafer transfer container is connected, and a frame portion.
Gas exclusion that excludes at least one of the gas in the first space below the wafer transfer container placed in the above-mentioned place and above the above-mentioned place and in the second space surrounding the outer periphery of the frame opening. Means and
Have,
The gas exhausting means is provided in the above-mentioned mounting portion and has a mounting portion gas exhausting means for exhausting gas in at least the first space.
The above-mentioned storage portion gas removing means is a load port device that communicates with the first space sandwiched between the bottom surface of the wafer transfer container connected to the above-mentioned frame portion and the above-mentioned placement portion . A mounting unit on which the wafer transfer container is mounted, and
A frame portion having a frame opening to which the container opening of the wafer transfer container is connected, and a frame portion.
Gas exclusion that excludes at least one of the gas in the first space below the wafer transfer container placed in the above-mentioned place and above the above-mentioned place and in the second space surrounding the outer periphery of the frame opening. Means and
Have,
The gas exhausting means includes a frame side gas exhausting means provided on the side of the frame opening in the frame portion and exhausting gas in at least the second space.
The frame side gas removing means has an opening which is an outflow port for gas, and the opening is a load port device facing the outer peripheral side surface of the wafer transfer container. A mounting unit on which the wafer transfer container is mounted, and
A frame portion having a frame opening to which the container opening of the wafer transfer container is connected, and a frame portion.
Gas exclusion that excludes at least one of the gas in the first space below the wafer transfer container placed in the above-mentioned place and above the above-mentioned place and in the second space surrounding the outer periphery of the frame opening. Means and
Have,
The gas exhausting means includes a frame lower gas exhausting means provided below the frame opening in the frame portion and exhausting gas in the first space and the second space.
The frame lower gas evacuating means has a tubular portion through which gas flows in and out, and has a tubular portion through which gas flows in and out.
The tubular portion is a load port device that penetrates the front surface and the back surface of the frame portion and communicates with the first space and the second space. The load port device according to any one of claims 1 to 3 , further comprising a gas supply means for supplying the inert gas into the wafer transfer container. The load port device according to claim 4 , further comprising a gas discharging means for discharging the internal gas in the wafer transport container. The load according to any one of claims 1 to 5 , wherein the gas removing means has a suction nozzle for sucking and removing at least one of the gas in the first space and the second space. Port device. The load according to any one of claims 1 to 6 , wherein the gas evacuating means has a gas discharge nozzle that pushes out and exhausts at least one of the gas in the first space and the second space. Port device. The invention according to any one of claims 2 to 7 , wherein the gas exhausting means is provided in the above-mentioned mounting portion and has at least a mounting portion gas removing means for exhausting gas in the first space. Load port device. From claims 1 and 3 , wherein the gas exhausting means is provided on the side of the frame opening in the frame portion and has a frame side gas exhausting means for exhausting gas in at least the second space. The load port device according to any one of claims 8 . 1. 2 and the load port device according to any one of claims 4 to 9 .

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