CN106684023A - Fully-sealed SMIF system - Google Patents
Fully-sealed SMIF system Download PDFInfo
- Publication number
- CN106684023A CN106684023A CN201710192002.9A CN201710192002A CN106684023A CN 106684023 A CN106684023 A CN 106684023A CN 201710192002 A CN201710192002 A CN 201710192002A CN 106684023 A CN106684023 A CN 106684023A
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- 239000007789 gas Substances 0.000 claims abstract description 33
- 238000013507 mapping Methods 0.000 claims description 33
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000012360 testing method Methods 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
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- 238000012423 maintenance Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 description 20
- 238000012545 processing Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
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- HJCMDXDYPOUFDY-WHFBIAKZSA-N Ala-Gln Chemical compound C[C@H](N)C(=O)N[C@H](C(O)=O)CCC(N)=O HJCMDXDYPOUFDY-WHFBIAKZSA-N 0.000 description 2
- 108010044940 alanylglutamine Proteins 0.000 description 2
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- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
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- 230000002040 relaxant effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710150391 | 2017-03-14 | ||
CN2017101503919 | 2017-03-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106684023A true CN106684023A (en) | 2017-05-17 |
Family
ID=58828509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710192002.9A Pending CN106684023A (en) | 2017-03-14 | 2017-03-28 | Fully-sealed SMIF system |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106684023A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109969594A (en) * | 2017-12-28 | 2019-07-05 | 沈阳新松机器人自动化股份有限公司 | A kind of foup box retaining mechanism, foup device and its locking method |
CN109969595A (en) * | 2017-12-28 | 2019-07-05 | 沈阳新松机器人自动化股份有限公司 | A kind of foup box automatically-controlled door and foup box automatically turns on and encapsulating method |
CN109969593A (en) * | 2017-12-28 | 2019-07-05 | 沈阳新松机器人自动化股份有限公司 | A kind of foup box auto-unlocking device and foup box |
CN110491812A (en) * | 2019-09-25 | 2019-11-22 | 沈阳芯达半导体设备有限公司 | A kind of high-cleanness, high semiconductor crystal wafer automatic loading device |
CN110809820A (en) * | 2017-06-23 | 2020-02-18 | 应用材料公司 | Side storage compartment, equipment front end module and method for processing substrate |
CN112018007A (en) * | 2019-05-31 | 2020-12-01 | 芯恩(青岛)集成电路有限公司 | Connecting cover for SMIF and machine table, semiconductor equipment and manufacturing method |
CN112912999A (en) * | 2018-10-26 | 2021-06-04 | 应用材料公司 | High flow rate, gas purged side storage tank apparatus, assembly and method |
CN114194776A (en) * | 2021-12-15 | 2022-03-18 | 上海世禹精密机械有限公司 | Apparatus for transferring wafer transport box |
CN115295460A (en) * | 2022-09-27 | 2022-11-04 | 无锡邑文电子科技有限公司 | Wafer bearing cavity equipment and control method thereof |
TWI807746B (en) * | 2022-03-31 | 2023-07-01 | 華景電通股份有限公司 | Gas-inlet module and gas-inlet nozzle |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168727A (en) * | 2001-11-30 | 2003-06-13 | Dainichi Shoji Kk | Exchanger and gas replacing method |
US20050095098A1 (en) * | 2003-10-23 | 2005-05-05 | Tdk Corporation | Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit |
JP2009252780A (en) * | 2008-04-01 | 2009-10-29 | Yaskawa Electric Corp | Load port |
JP2010040912A (en) * | 2008-08-07 | 2010-02-18 | Tdk Corp | System for opening and closing sealed container lid, and method for opening and closing lid |
US20150221538A1 (en) * | 2014-01-31 | 2015-08-06 | Sinfonia Technology Co., Ltd. | Load port and efem |
WO2016035675A1 (en) * | 2014-09-05 | 2016-03-10 | ローツェ株式会社 | Loading port and loading port atmoshpere substitution method |
WO2017022432A1 (en) * | 2015-08-04 | 2017-02-09 | シンフォニアテクノロジー株式会社 | Load port |
CN206711879U (en) * | 2017-03-14 | 2017-12-05 | 上海大族富创得科技有限公司 | Totally enclosed type SMIF systems |
-
2017
- 2017-03-28 CN CN201710192002.9A patent/CN106684023A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168727A (en) * | 2001-11-30 | 2003-06-13 | Dainichi Shoji Kk | Exchanger and gas replacing method |
US20050095098A1 (en) * | 2003-10-23 | 2005-05-05 | Tdk Corporation | Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit |
JP2009252780A (en) * | 2008-04-01 | 2009-10-29 | Yaskawa Electric Corp | Load port |
JP2010040912A (en) * | 2008-08-07 | 2010-02-18 | Tdk Corp | System for opening and closing sealed container lid, and method for opening and closing lid |
US20150221538A1 (en) * | 2014-01-31 | 2015-08-06 | Sinfonia Technology Co., Ltd. | Load port and efem |
WO2016035675A1 (en) * | 2014-09-05 | 2016-03-10 | ローツェ株式会社 | Loading port and loading port atmoshpere substitution method |
WO2017022432A1 (en) * | 2015-08-04 | 2017-02-09 | シンフォニアテクノロジー株式会社 | Load port |
CN206711879U (en) * | 2017-03-14 | 2017-12-05 | 上海大族富创得科技有限公司 | Totally enclosed type SMIF systems |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11621182B2 (en) | 2017-06-23 | 2023-04-04 | Applied Materials, Inc. | Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing |
CN110809820A (en) * | 2017-06-23 | 2020-02-18 | 应用材料公司 | Side storage compartment, equipment front end module and method for processing substrate |
CN116469814A (en) * | 2017-06-23 | 2023-07-21 | 应用材料公司 | Side storage pod, equipment front end module and method for processing substrate |
CN109969595A (en) * | 2017-12-28 | 2019-07-05 | 沈阳新松机器人自动化股份有限公司 | A kind of foup box automatically-controlled door and foup box automatically turns on and encapsulating method |
CN109969593A (en) * | 2017-12-28 | 2019-07-05 | 沈阳新松机器人自动化股份有限公司 | A kind of foup box auto-unlocking device and foup box |
CN109969594A (en) * | 2017-12-28 | 2019-07-05 | 沈阳新松机器人自动化股份有限公司 | A kind of foup box retaining mechanism, foup device and its locking method |
CN109969594B (en) * | 2017-12-28 | 2021-01-26 | 沈阳新松机器人自动化股份有限公司 | Locking mechanism for foup box, foup device and locking method thereof |
CN112912999A (en) * | 2018-10-26 | 2021-06-04 | 应用材料公司 | High flow rate, gas purged side storage tank apparatus, assembly and method |
CN112018007A (en) * | 2019-05-31 | 2020-12-01 | 芯恩(青岛)集成电路有限公司 | Connecting cover for SMIF and machine table, semiconductor equipment and manufacturing method |
CN110491812A (en) * | 2019-09-25 | 2019-11-22 | 沈阳芯达半导体设备有限公司 | A kind of high-cleanness, high semiconductor crystal wafer automatic loading device |
CN114194776A (en) * | 2021-12-15 | 2022-03-18 | 上海世禹精密机械有限公司 | Apparatus for transferring wafer transport box |
TWI807746B (en) * | 2022-03-31 | 2023-07-01 | 華景電通股份有限公司 | Gas-inlet module and gas-inlet nozzle |
CN115295460A (en) * | 2022-09-27 | 2022-11-04 | 无锡邑文电子科技有限公司 | Wafer bearing cavity equipment and control method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171108 Address after: 201100 Shanghai city Minhang District million Fang Building Room 202 No. 555 1 Applicant after: SHANGHAI FORTREND TECHNOLOGY Co.,Ltd. Address before: 201114 Shanghai Minhang Su Zhaolu No. 1628 Building 2 room 1034 Applicant before: SHANGHAI BRANCH OF HAN'S LASER TECHNOLOGY INDUSTRY GROUP CO.,LTD. |
|
TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: Room 202, Building 1, 555 Wanfang Road, Minhang District, Shanghai, 201100 Applicant after: Shanghai Han's Fuchuang Technology Co.,Ltd. Address before: Room 202, Building 1, 555 Wanfang Road, Minhang District, Shanghai, 201100 Applicant before: SHANGHAI FORTREND TECHNOLOGY Co.,Ltd. |
|
CB02 | Change of applicant information | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170517 |
|
WD01 | Invention patent application deemed withdrawn after publication |