CN113291530B - Vacuum packaging equipment and method for silicon wafer - Google Patents
Vacuum packaging equipment and method for silicon wafer Download PDFInfo
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- CN113291530B CN113291530B CN202110712996.9A CN202110712996A CN113291530B CN 113291530 B CN113291530 B CN 113291530B CN 202110712996 A CN202110712996 A CN 202110712996A CN 113291530 B CN113291530 B CN 113291530B
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- air
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- vacuum packaging
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
- B65B31/04—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
- B65B31/046—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied the nozzles co-operating, or being combined, with a device for opening or closing the container or wrapper
- B65B31/048—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied the nozzles co-operating, or being combined, with a device for opening or closing the container or wrapper specially adapted for wrappers or bags
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
- B65B51/146—Closing bags
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The embodiment of the invention discloses vacuum packaging equipment and a method for a silicon wafer, wherein the equipment comprises the following components: the air supply device is arranged at the top of the shell and is used for filtering outside air, transmitting the filtered clean air into the equipment, and utilizing air flow generated by the clean air to drive particles in the equipment to move downwards; a plurality of first discharge holes provided on the partition plate and a plurality of second discharge holes provided at a bottom position of the housing, wherein the plurality of first discharge holes and the plurality of second discharge holes are used for discharging particles inside the apparatus to the bottom of the apparatus; and the exhaust device is arranged outside the equipment and connected with the second exhaust hole through a first exhaust pipeline, wherein the exhaust device is used for exhausting particles at the bottom of the equipment to the outside of the equipment.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductors, in particular to vacuum packaging equipment and method for silicon wafers.
Background
Silicon wafers are basic materials for manufacturing semiconductor chips, so that the cleanliness of the surface of the silicon wafer has a very important influence on the quality of the semiconductor chips. In order to ensure that the silicon wafer cannot be damaged or polluted in the process of transporting the silicon wafer, a three-layer packaging technology is often adopted to package the cleaned silicon wafer, and the second step in the three-layer packaging technology is to put a wafer box filled with the cleaned silicon wafer into a plastic film packaging bag and to carry out vacuum sealing treatment on the packaging bag. Current methods of vacuum sealing packages typically employ a suction nozzle to evacuate the air from the package and the suction nozzle is withdrawn when the operator determines that the package has reached a vacuum environment. However, this method cannot ensure that the contamination particles inside the vacuum packaging apparatus do not pollute the environment inside the package. Meanwhile, many vacuum packaging devices on the market at present cannot control the cleanliness inside the devices.
Disclosure of Invention
In view of the foregoing, embodiments of the present invention desirably provide a vacuum packaging apparatus and method for silicon wafers; the cleanliness inside the vacuum packaging equipment can be controlled so as to reduce the probability of polluting clean silicon chips.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, embodiments of the present invention provide a vacuum packaging apparatus for silicon wafers, the apparatus comprising:
the air supply device is arranged at the top of the shell and is used for filtering outside air, transmitting the filtered clean air into the equipment, and utilizing air flow generated by the clean air to drive particles in the equipment to move downwards;
a plurality of first discharge holes provided on the partition plate and a plurality of second discharge holes provided at a bottom position of the housing, wherein the plurality of first discharge holes and the plurality of second discharge holes are used for discharging particles inside the apparatus to the bottom of the apparatus;
and the exhaust device is arranged outside the equipment and connected with the second exhaust hole through a first exhaust pipeline, wherein the exhaust device is used for exhausting particles at the bottom of the equipment to the outside of the equipment.
In a second aspect, an embodiment of the present invention provides a vacuum packaging method for a silicon wafer, the method being applicable to the vacuum packaging apparatus of the first aspect, the method comprising:
the method comprises the steps of loading a silicon wafer loading box to be packaged into a packaging bag, placing the packaging bag on a workbench, and starting an air supply device in the packaging bag sealing process to enable clean air filtered from the outside to be conveyed into vacuum packaging equipment;
the particles in the vacuum packaging equipment are driven to be discharged to the bottom of the vacuum packaging equipment through the first discharge hole and the second discharge hole in sequence by utilizing air flow generated by the clean air;
and driving the particles at the bottom of the vacuum packaging equipment to be discharged to the outside of the vacuum packaging equipment through an exhaust device.
The embodiment of the invention provides vacuum packaging equipment and a method for a silicon wafer; through at the inside top installation air supply arrangement of equipment to and a plurality of first discharge holes, a plurality of second discharge holes and the exhaust apparatus of setting, when providing clean air for the equipment is inside, make the inside granule of equipment can pass through first discharge hole and second discharge hole in proper order and move to the bottom of equipment, and make the granule of equipment bottom discharge to the equipment outside through exhaust apparatus, thereby guaranteed the inside cleanliness factor of equipment, and then also guaranteed the existence of no pollution particle in the wrapping bag surrounding environment, can guarantee the inside cleanliness factor of wrapping bag like this, reduced the pollution rate of silicon chip product, improved the productivity effect.
Drawings
Fig. 1 is a vacuum packaging apparatus for silicon wafers in a conventional technical scheme provided by an embodiment of the present invention.
Fig. 2 is a schematic diagram of a structure of a pressing rod in a conventional technical scheme provided by an embodiment of the present invention.
Fig. 3 is a vacuum packaging apparatus for silicon wafers according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a second slider and a second sliding rail connected to an air suction nozzle according to an embodiment of the present invention.
Fig. 5 is a schematic flow chart of a vacuum packaging method for a silicon wafer according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, there is shown a schematic view of a vacuum packing apparatus 100 for silicon wafers in a conventional technical scheme. As shown in fig. 1, the apparatus 100 may include: a housing 101, a partition 102, a table 103, an air suction nozzle 104, a slide cylinder 105, a vacuum pump 106, a heating sheet 107, and a sealing strip 108; the workbench 103 is mainly used for placing silicon wafers to be packaged, packaging bags and air suction nozzles 104; the mouth of the suction nozzle 104 is placed in the packaging bag, the other end of the suction nozzle 104 is connected with the sliding machine cylinder 105, and the other end of the sliding machine cylinder 105 is connected with the vacuum pump 106; in practice, vacuum pump 106 draws all or part of the air from the bag through slide cylinder 105 and through suction nozzle 104 to achieve the desired vacuum level in the bag.
Meanwhile, it is shown in fig. 1 that the heating sheet 107 may include an upper heating sheet 1071 and a lower heating sheet 1072 disposed to be inclined with respect to each other; wherein the lower heating plate 1072 is fixed on the partition 102 and is close to the edge of the partition 102; an operation region is formed between the upper heating plate 1071 and the lower heating plate 1072; the sealing bar 108 may include an upper sealing bar 1081 and a lower sealing bar 1082 disposed to be inclined with respect to each other, and as shown in fig. 1, the upper sealing bar 1081 is disposed at one side of the upper heating plate 1071 to be movable with respect to the upper heating plate 1071; the lower seal 1082 is provided on one side of the lower heating plate 1072 and is movable relative to the lower heating plate 1072.
It will be appreciated that in addition to the structure and components set forth above, the vacuum packaging device 100 further comprises a telescoping plate 109 for connecting the upper seal 1081 with the housing 101, wherein the telescoping plate 109 is adapted to move the upper seal 1081 relative to the lower seal 1082.
Further, referring to fig. 2, a pressing bar 110 is connected to the upper surface of the upper heating plate 1071, wherein the pressing bar 110 is used to move the upper heating plate 1071. Of course, it is understood that the vacuum packaging apparatus 100 may further include a switch portion 201, wherein the switch portion 201 is connected to the pressure lever 110 and the vacuum pump 106, respectively, for controlling the operation of the pressure lever 110 and the vacuum pump 106.
As can be appreciated, when the vacuum packaging device 100 is used for vacuum packaging of the packaging bag filled with silicon wafers, the expansion plate 109 drives the upper sealing strip 1081 to move, and when the upper sealing strip 1081 and the lower sealing strip 1082 are tightly adhered, the upper sealing strip 1081 and the lower sealing strip 1082 tightly seal the packaging bag; at the same time, the air suction nozzle 104 placed in the mouth of the packaging bag sucks out all or part of air in the packaging bag under the action of the vacuum pump 106; after the air extraction operation is completed, the upper heating plate 1071 is driven by the compression bar 110 to move toward the lower heating plate 1072 until the upper heating plate 1071 and the lower heating plate 1072 are tightly adhered, and the heat sealing operation is started to carry out on the packaging bag.
In the case of performing the air suction operation of the package, as shown in fig. 1, the air suction nozzle 103 may be moved to the left and right along the direction of the package mouth by the slide cylinder 105, so as to suck air in each spatial position in the package, thereby completely or partially sucking out the air in the package, and realizing vacuum packaging of the silicon wafer.
It should be noted that, when the apparatus 100 is used for vacuum packaging the packaging bag, it is not possible to avoid that the environment and the particles inside the apparatus 100 enter the packaging bag to pollute the environment inside the packaging bag, and thus the silicon wafer is unclean, so that the customer generates complaints, and the economic benefit is reduced.
Based on the foregoing, in order to avoid the entry of particles into the packaging bag from the environment and the interior of the apparatus, referring to fig. 3, a schematic structural diagram of a vacuum packaging apparatus 300 for silicon wafers according to an embodiment of the present invention is shown, where the apparatus 300 may include:
an air supply device 301 built in the top of the housing 101, wherein the air supply device 301 is used for filtering external air and delivering filtered clean air into the device 300, and utilizing air flow generated by the clean air to drive particles in the device 300 to move downwards;
a plurality of first discharge holes 302 provided on the partition 102 and a plurality of second discharge holes 303 provided at a bottom position of the housing 101, wherein the plurality of first discharge holes 302 and the plurality of second discharge holes 303 are used to discharge particles inside the apparatus 300 to a bottom of the apparatus 300;
and a discharging device 304 arranged outside the apparatus 300, wherein the discharging device 304 is connected with the second discharging hole 303 through a first discharging pipeline 305, and the discharging device 304 is used for discharging particles at the bottom of the apparatus 300 to the outside of the apparatus 300.
It should be noted that, in an embodiment of the present invention, the air supply device 301 may be a fan filter device (Equipment Fan Filter Unit, EFU), which is generally installed on top of the apparatus. In particular implementations, the EFU blower 301 is capable of drawing air in from the top of the device and filtering the drawn air through a high efficiency air filter (High Efficiency Particulate Air Filter, HEPA) to deliver clean air from the air outlet after the filtration is complete to provide clean air for a clean device environment.
Preferably, the exhaust device 304 may be a blower or a plant exhaust line.
In addition, in the implementation process of the embodiment of the present invention, by installing the EFU fan apparatus 301 in the device 300, the pressure inside the device 300 can be made to be greater than the external pressure, so that external particles can be prevented from entering the device 300 from the position of the heating sheet 107.
For the vacuum packaging apparatus 300 shown in fig. 3, by installing the EFU fan device 301 at the top of the inside of the apparatus 300 and providing the plurality of first exhaust holes 302, the plurality of second exhaust holes 303 and the exhaust device 304, while clean air is provided for the inside of the apparatus 300, particles in the inside of the apparatus 300 can move to the bottom of the apparatus 300 through the first exhaust holes 302 and the second exhaust holes 303, and particles in the bottom of the apparatus 300 can be discharged to the outside of the apparatus 300 through the exhaust device 304, thereby ensuring the cleanliness of the inside of the apparatus 300, and further ensuring the presence of no polluted particles in the environment around the packaging bag, thus ensuring the cleanliness of the inside of the packaging bag, reducing the pollution rate of silicon wafer products, and improving the production efficiency.
For the vacuum packaging apparatus 300 shown in fig. 3, the apparatus 300 further comprises:
an extraction nozzle 104, said extraction nozzle 104 being connected to said exhaust 304 by a gas conduit 306;
a heating plate 107, wherein the heating plate 107 comprises an upper heating plate 1071 and a lower heating plate 1072 symmetrically arranged at two sides of the air suction nozzle 104;
the sealing strip 108, the sealing strip 108 comprises an upper sealing strip 1081 and a lower sealing strip 1082 symmetrically arranged at two sides of the air suction nozzle 104.
As can be appreciated, in the packaging apparatus 100, the heater chip 107 and the seal strip 108 are disposed obliquely on both sides of the suction nozzle 104, so that the sealing position on the package is not sufficiently flat when the package is vacuum packed; in the packaging apparatus shown in fig. 3, the heating sheet 107 and the sealing strip 108 are arranged so as to be symmetrically distributed on both sides of the suction nozzle 104, so that the flatness of the sealing position of the packaging bag can be ensured when the packaging bag is vacuum-packed.
It should be noted that, when the contaminating particles exist on the packaging bag, in the process of heating the packaging bag, the molecular movement is accelerated due to the temperature rise, so that the contaminating particles on the packaging bag can move to the inside of the device 300 through the position of the heating plate 107, so that the environment inside the device 300 is polluted, and the product environment of the packaging bag is further affected.
Based on the above, in some specific implementations of the embodiments of the present invention, referring to fig. 3, the back of the heating sheet 107 is provided with a third discharge hole 307, and the third discharge hole 307 is connected to the air discharge device 304 through a second discharge pipe 308, so that the particles on the package can be discharged to the air discharge device 304 through the third discharge hole 307 and through the second discharge pipe 308.
For the apparatus 300 shown in fig. 3, in some embodiments of the present invention, referring to fig. 3, the heating sheet 107 is connected to the first slider 310 through a support rod 309, and the first slider 310 can slide along the first slide rail 311.
It should be noted that, in fig. 3, the upper support rod 3091 and the lower support rod 3092 are shown, and meanwhile, the other end of the upper support rod 3091 is connected to the first slider 310, the other end of the lower support rod 3092 is also connected to the first slider 310, and the first slider 310 can slide on the first slide rail 311, so as to enable the heating sheet 107 to be driven to move towards a direction close to the opening of the packaging bag by using the movement of the first slider 310 when the packaging bag is vacuum packaged, and enable the heating sheet 107 to be driven to move towards a direction far away from the opening of the packaging bag by the movement of the first slider 310 after the heat packaging is completed.
For the apparatus 300 shown in fig. 3, in some implementations of the embodiment of the present invention, a solenoid valve 312 is disposed on the gas line 306, and the solenoid valve 312 is used to control whether the air in the package is exhausted to the air exhaust device 304 through the gas line 306.
In the case of evacuating the package by the evacuation device 304, the controller of the solenoid valve 312 is a programmable logic controller (Programmable Logic Controller, PLC). It will be appreciated that when the suction nozzle 104 begins to draw air from within the package, the solenoid valve 312 is opened by the PLC controller to allow air within the package to be exhausted through the gas line 306 to the exhaust 304; when the air in the package is completely exhausted, the solenoid valve 312 may be closed by the PLC controller so that the air exhaust 304 will not draw air from the package to affect the vacuum in the package.
It should be noted that, for the apparatus 300 shown in fig. 3, in some specific implementations of the embodiment of the present invention, referring to fig. 4, the air suction nozzle 104 is connected to the second slider 401 at an end far from the air nozzle opening, and the second slider 401 can slide along the second sliding rail 402.
For the apparatus 300 shown in fig. 3, preferably, referring to fig. 3, in some specific implementations of the embodiment of the present invention, the apparatus 300 further includes a plurality of ground feet 313, and the plurality of ground feet 313 are uniformly spaced on the outer edge of the housing 101 to facilitate movement of the apparatus 300.
Referring to fig. 5, there is shown a vacuum packaging method for silicon wafers, which can be applied to the aforementioned vacuum packaging apparatus 300, according to an embodiment of the present invention, the method comprising:
s501, packaging a silicon wafer loading box to be packaged into a packaging bag, placing the packaging bag in a workbench 103, and starting an air supply device 301 in the packaging bag sealing process to enable clean air filtered from the outside to be transmitted into the vacuum packaging equipment 300;
s502, utilizing air flow generated by the clean air to drive particles in the vacuum packaging device 300 to be sequentially discharged to the bottom of the vacuum packaging device 300 through the first discharge hole 302 and the second discharge hole 303;
and S503, driving particles at the bottom of the vacuum packaging device 300 to be discharged outside the vacuum packaging device 300 through an exhaust device 304.
It should be noted that: the technical schemes described in the embodiments of the present invention may be arbitrarily combined without any collision.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. A vacuum packaging apparatus for silicon wafers, the apparatus comprising:
the air supply device is arranged at the top of the shell and is used for filtering outside air, transmitting the filtered clean air into the equipment, and utilizing air flow generated by the clean air to drive particles in the equipment to move downwards;
a plurality of first discharge holes provided on the partition plate and a plurality of second discharge holes provided at a bottom position of the housing, wherein the plurality of first discharge holes and the plurality of second discharge holes are used for discharging particles inside the apparatus to the bottom of the apparatus;
the exhaust device is arranged outside the equipment and connected with the second exhaust hole through a first exhaust pipeline, and the exhaust device is used for exhausting particles at the bottom of the equipment to the outside of the equipment;
wherein the apparatus further comprises:
the air suction nozzle is connected with the air exhaust device through a gas pipeline;
the sealing strips comprise an upper sealing strip and a lower sealing strip which are symmetrically arranged at two sides of the air suction nozzle;
the heating plate comprises an upper heating plate and a lower heating plate which are symmetrically arranged at two sides of the air suction nozzle;
the back of the heating plate is provided with a third discharge hole, and the third discharge hole is connected with the exhaust device through a second discharge pipeline, so that particles on the packaging bag can be discharged to the exhaust device through the third discharge hole and the second discharge pipeline.
2. The apparatus of claim 1, wherein the exhaust is a blower or a plant exhaust.
3. The apparatus of claim 1, wherein the heating plate is connected to a first slide via a support bar, and the first slide is slidable along a first slide rail.
4. The apparatus of claim 1, wherein the gas line is provided with a solenoid valve for controlling whether air in the package is discharged to the air discharge device through the gas line.
5. The apparatus of claim 4, wherein the controller of the solenoid valve is a PLC controller.
6. The apparatus of claim 1, wherein the suction nozzle is connected to a second slider at an end remote from the nozzle opening, and the second slider is slidable along a second slide rail.
7. The apparatus of claim 1, further comprising a plurality of feet uniformly spaced on the outer edge of the housing.
8. A vacuum packaging method applied to the vacuum packaging apparatus as recited in any one of claims 1 to 7, characterized in that the method comprises:
the method comprises the steps of loading a silicon wafer loading box to be packaged into a packaging bag, placing the packaging bag on a workbench, and starting an air supply device in the packaging bag sealing process to enable clean air filtered from the outside to be conveyed into vacuum packaging equipment;
the particles in the vacuum packaging equipment are driven to be discharged to the bottom of the vacuum packaging equipment through the first discharge hole and the second discharge hole in sequence by utilizing air flow generated by the clean air;
and driving the particles at the bottom of the vacuum packaging equipment to be discharged to the outside of the vacuum packaging equipment through an exhaust device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110712996.9A CN113291530B (en) | 2021-06-25 | 2021-06-25 | Vacuum packaging equipment and method for silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110712996.9A CN113291530B (en) | 2021-06-25 | 2021-06-25 | Vacuum packaging equipment and method for silicon wafer |
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| CN113291530A CN113291530A (en) | 2021-08-24 |
| CN113291530B true CN113291530B (en) | 2023-06-09 |
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| CN113291530A (en) | 2021-08-24 |
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