CN208240644U - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
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- CN208240644U CN208240644U CN201820985559.8U CN201820985559U CN208240644U CN 208240644 U CN208240644 U CN 208240644U CN 201820985559 U CN201820985559 U CN 201820985559U CN 208240644 U CN208240644 U CN 208240644U
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Abstract
The utility model relates to a kind of substrate board treatments.If operating personnel inside the substrate board treatment filled with non-active gas and oxygen concentration enters inside substrate board treatment in the case where be lower than specified value, have the danger of asphyxia.Substrate board treatment has: the process container being heat-treated and with opening portion is carried out to substrate；The load chamber being connected to process container via opening portion, the load chamber have transport mechanism, the carrying-in/carrying-out mouth of wafer and the door opening for operating personnel's discrepancy；The first switching mechanism that carrying-in/carrying-out mouth is opened and closed；The second switching mechanism that the opening portion of process container is opened and closed；The third switching mechanism that door opening is opened and closed；And cooling cooling body is carried out using non-active gas.By the substrate board treatment of the utility model, a kind of substrate board treatment of safety when considering maintenance maintenance is provided.
Description
Technical field
The utility model relates to substrate board treatment field more particularly to it is a kind of consider maintenance maintenance when safety
Substrate board treatment.
Background technique
The environmental conditions such as atmosphere in substrate board treatment are required in semiconductor fabrication process very strict, had
When use non-active gas as full of storage substrate and the space that substrate handle etc. gas.
In addition, it is necessary to periodically or as needed repair maintenance to substrate board treatment, make repairing maintenance
When industry, it is sometimes desirable to which operating personnel, which enters, carries out maintenance and inspection etc. inside substrate board treatment.
As described above, there are many case where substrate board treatment inner space is full of by non-active gas, if operation people
Member is full of or is not excluded clean and substrate board treatment inner space in non-active gas and be in oxygen concentration lower than providing
Enter inside substrate board treatment in the case where being worth (such as oxygen concentration 18% in atmosphere), then has the danger of asphyxia.
Utility model content
Technical problem
In view of this, the technical problems to be solved in the utility model is to provide a kind of safety when considering maintenance maintenance
The substrate board treatment of property.
Solution
In order to solve the above-mentioned technical problem, an embodiment according to the present utility model, provides a kind of substrate board treatment,
It is characterized in that, process container, is used to be heat-treated the substrate for being held in substrate holder tool, has opening portion；
Load chamber is connected to the process container via the opening portion, is provided with for holding in the load chamber and the processing
Carried out between device the carrying-in/carrying-out of the substrate holder tool transport mechanism, for outside the load chamber with the load chamber it
Between carry out wafer carrying-in/carrying-out carrying-in/carrying-out mouth and for operating personnel enter and leave door opening；First switching mechanism,
It is configured to open and close the carrying-in/carrying-out mouth of the load chamber；Second switching mechanism, consisting of can incite somebody to action
The opening portion of the process container opens and closes；Third switching mechanism, consists of that have can be by the load chamber
The door that opens and closes of the door opening, and the door lock can be scheduled on to the position for closing door opening and release the locking
Sticking department；And cooling body, using non-active gas to being moved out after being heat-treated to described in the load chamber
Substrate holder has kept substrate and is cooled down.
For aforesaid substrate processing unit, in one possible implementation, also there is oxygen concentration testing portion, to institute
The indoor oxygen concentration of loading is stated to measure.
For aforesaid substrate processing unit, in one possible implementation, second switching mechanism has: lid
Body can close the opening portion of the process container；First driving portion makes the lid relative to the opening portion
Lifting；And second driving portion, rotate the lid on the face parallel relative to the opening portion.
For aforesaid substrate processing unit, in one possible implementation, the carrying-in/carrying-out mouth is to be arranged above and below
Mode be arranged there are two, first switching mechanism and the carrying-in/carrying-out mouth are correspondingly provided with two, and described first opens
Closing mechanism includes the driving portion that can be closed the door of the carrying-in/carrying-out mouth and slide laterally the door.
For aforesaid substrate processing unit, in one possible implementation, the cooling body includes circulating cooling
Mechanism, the cooling body are cooled down using circulation of the non-active gas in circulating path, which includes:
Suction line has and sucks the suction inlet for loading indoor gas；Gas supply pipeline has across in the loading
Substrate holder tool and the opposite ejiction opening of the suction inlet of room；And connection pipeline, by the suction line and
The gas supply pipeline connection connection, the chemical filtering that thermal insulation board is disposed on the circulating path, gas is filtered
Device, the wind pushing mechanism for carrying out cooling heat exchanger to gas and sending out gas after cooling.
For aforesaid substrate processing unit, in one possible implementation, be also equipped with: atmosphere suction line is used
In importing clean atmosphere into the load chamber；Soakage adjustment portion is set to the atmosphere suction line, for adjusting
The soakage of the atmosphere suction line sucking atmosphere；Gas exhaust piping is used to be discharged the indoor gas of loading；And row
Tolerance adjustment portion is set to the gas exhaust piping, for adjusting the discharge rate of the gas exhaust piping discharge gas.
For aforesaid substrate processing unit, in one possible implementation, illumination dress is provided in the load chamber
It sets, to being illuminated in the load chamber；And image pickup part, the inner space of the load chamber is imaged.
For aforesaid substrate processing unit, in one possible implementation, temperature survey is provided in the load chamber
Amount portion measures the temperature of the substrate holder tool；Moisture measurement portion measures the indoor humidity of loading；And pressure
Power measurement portion measures the indoor pressure of loading.
For aforesaid substrate processing unit, in one possible implementation, the cooling body includes gas shower
Mechanism, the gas shower mechanism are moved out to the substrate holder tool of the load chamber towards after being heat-treated and are protected
The substrate held sprays non-active gas in a manner of making gas advance along the entire width films shape of substrate surface.
Beneficial effect
By above each mode, according to the utility model be capable of providing it is a kind of consider maintenance maintenance when safety base
Plate processing unit.
According to below with reference to the accompanying drawings to detailed description of illustrative embodiments, the other feature and aspect of the utility model will
It becomes apparent.
Detailed description of the invention
Comprising in the description and constitute the attached drawing of part of specification and specification to together illustrate this practical new
Exemplary embodiment, feature and the aspect of type, and for explaining the principles of the present invention.
Fig. 1 shows the summary explanatory diagram of an example of substrate board treatment involved in the utility model.
Fig. 2 shows the schematic diagrames of the structure of an example of substrate board treatment involved in the utility model.
Fig. 3 shows the schematic diagram of the structure of an example of substrate board treatment involved in the utility model.
Fig. 4 is for illustrating that the wafer of substrate board treatment involved in the utility model moves in the figure of an example of device.
Fig. 5 is the process that wafer is moved in load chamber for illustrating substrate board treatment involved in the utility model
The figure of an example.
Non-active gas when Fig. 6 is for illustrating that substrate board treatment involved in the utility model carries out cooling treatment
Circulation schematic diagram.
The signal of movement when Fig. 7 is the maintenance maintenance for illustrating substrate board treatment involved in the utility model
Figure.
Fig. 8 is for illustrating that the wafer of substrate board treatment involved in the utility model moves in another of device
Figure.
Fig. 9 is used to illustrate the another of the process that wafer is moved in load chamber of substrate board treatment involved in the utility model
The figure of an example.
Figure 10 A is another schematic diagram of the lid of the load chamber of substrate board treatment involved in the utility model.
Figure 10 B is another schematic diagram of the lid of the load chamber of substrate board treatment involved in the utility model.
Description of symbols
1: annealing device；2: process container；21: lid；3: load chamber；31: side wall；32: top plate；33: bottom plate；4: passing
Pass case；41,42: door；43: gas introduction port；44: exhaust outlet；4 ': FIMS；41 ': opening and closing structure；42 ': lid removes portion；43 ':
Air-exchanging structure；5: wafer boat；51: wafer boat elevating mechanism；6: cooling body；61: gas shower mechanism；62: circulating cooling machine
Structure；611: gas nozzle；612: nitrogen supply source；621: connection pipeline；622: gas supply pipeline；623: suction line；624: spray
Outlet；625: nitrogen supply source；7: maintenance door；71: sticking department；8: controller；91: atmosphere suction line；92: gas exhaust piping；
110: Temperature measuring section；111: image pickup part；112: lighting device；113: pressure measurement portion；114: moisture measurement portion；115: oxygen is dense
Spend measurement portion；W: wafer；A: carrying-in/carrying-out region；S: lid.
Specific embodiment
The various exemplary embodiments, feature and aspect of the utility model are described in detail below with reference to attached drawing.In attached drawing
Identical appended drawing reference indicates element functionally identical or similar.Although the various aspects of embodiment are shown in the attached drawings,
It is unless otherwise indicated, it is not necessary to attached drawing drawn to scale.
Dedicated word " exemplary " means " being used as example, embodiment or illustrative " herein.Here as " exemplary "
Illustrated any embodiment should not necessarily be construed as preferred or advantageous over other embodiments.
In addition, in order to better illustrate the utility model, given in specific embodiment below numerous specific
Details.It will be appreciated by those skilled in the art that without certain details, the utility model equally be can be implemented.In some realities
In example, method well known to those skilled in the art, means are not described in detail, in order to highlight the master of the utility model
Purport.
In the following description, in order to facilitate understanding and explanation, with move in side from wafer observation when " front ", " carry on the back
Face ", "upper", "lower", "left", "right", "front", "rear" etc. are illustrated.
Embodiment
In the present embodiment, by taking the annealing device being heat-treated in bulk to multi-piece substrate (such as wafer) as an example into
Row explanation.In the following, being illustrated based on FIG. 1 to FIG. 3 to annealing device 1 involved in the present embodiment.
[structure of annealing device]
As shown in Figure 1, annealing device 1 includes process container 2, load chamber 3 and controller 8 etc..
Process container 2 is, for example, the vertical heat treatment furnace etc. to the more wafers W well known batch processing being heat-treated,
The detailed description of the process container 2 is omitted herein.
Load chamber 3 has: four side walls 31 of the left and right sides and front and rear sides that are parallel to each other, and seals by four sides
The top plate 32 and bottom plate 33 of the top and bottom in the space that wall 31 surrounds.
At two to be arranged above and below the position of front side wall 31, multilayer storage multi-disc (such as 36) 200mm can be divided brilliant
The pass box 4 of circle W is through the setting of the state of the carrying-in/carrying-out mouth of front side wall 31.The pass box 4 is by load chamber 3 and load-bearing part
Carrying-in/carrying-out region A can be connected communicatively, have between carrying-in/carrying-out region A and load chamber 3 carry out wafer W exchange connect
The function of mouth.Pass box 4 is formed as being provided in the opening by 3 side of load chamber in both ends open for opening and closing opening
The door 41 of mouth is provided with the door 42 for opening and closing opening in the opening of opposite side, and pass box 4 has to inside
The air-exchanging structure that gas is replaced.Door 41,42 is each provided with independent driving portion (not shown), will be moved in by driving portion
The door 42 of the side region A slides laterally opening out, is able to carry out load-bearing part the removing relative to pass box 4 of the carrying-in/carrying-out region side A
Enter to move out, the door 41 of 3 side of load chamber slid laterally by opening by driving portion, be able to carry out wafer W in pass box 4 relative to
The carrying-in/carrying-out of load chamber 3.Here, what door 41 and driving portion composition opened and closed the carrying-in/carrying-out mouth of load chamber 3
First switching mechanism.
Be provided with process container 2 above the top plate 32 of load chamber 3, load chamber 3 top plate 32, with process container 2
The corresponding position in downward opening portion at be provided with opening portion, the inside of process container 2 and the inside of load chamber 3 can pass through
The opening portion is interconnected, and wafer boat 5 (being equivalent to substrate holder tool) can be carried out by the opening portion to process container 2
Carrying-in/carrying-out.In addition, the top plate 32 in the load chamber 3 is provided with the lid 21 that the opening portion is opened and closed freely.It should
Lid 21 for example by being translated along horizontal a direction and being moved along the vertical direction by motor drive, thus open and
Close above-mentioned opening portion.By opening the lid 21, process container 2 is connected to load chamber 3, by the way that lid 21 is closed,
Process container 2 and load chamber 3 are spaced as mutual disconnected space.Here, lid 21 and the pairs of process container 2 of motor drive mechanism
The second switching mechanism for being opened and closed of opening portion.
Load chamber 3 top plate 32, the position between front side wall 31 and process container 2 is provided with for aftermentioned row
The opening that air pipe 92 passes through, load chamber 3 top plate 32, position between rear wall 31 and process container 2 is arranged
There is the opening passed through for aftermentioned atmosphere suction line 91.In addition, load chamber 3 top plate 32, in rear wall 31 and place
Position between reason container 2 is provided with the opening passed through for non-active gas feeding pipe (not shown).
The rear wall 31 of load chamber 3 is provided with door opening, the door opening can be opened and closed by being provided with to the opening
Maintenance door 7.Sticking department 71 is provided near maintenance door 7, which is controlled by control unit 8 and can be by maintenance door 7
It is locked in specified position and releases the locking.When sticking department 71 is locked, maintenance door 7 can not be opened, in sticking department 71
When latch-release, maintenance door 7 is free to open and close.It is opened by the maintenance door 7, operating personnel is able to enter dress
Carry the inside of room 3.
In door 41, lid 21, maintenance door 7, it is set to major gas suction line 91, gas exhaust piping 92 and (not shown) non-
In the case that the valve of active gases feeding pipe is closed, load chamber 3 becomes airtight space.
In Fig. 1, it is illustrated with the setting of gas exhaust piping 92 in the case where top plate 32, but not limited to this, it can also be as
As shown in Figure 3, gas exhaust piping 92 is arranged in bottom plate 33.
As shown in FIG. 1 to 3, load chamber 3 be internally provided with wafer boat 5, cooling body 6, atmosphere suction line 91,
Gas exhaust piping 92, Temperature measuring section 110, image pickup part 111, lighting device 112, pressure measurement portion 113, moisture measurement portion 114, oxygen
Measurement of concetration portion 115 and transport mechanism (not shown), wafer boat elevating mechanism etc..
Wafer boat 5 is supported on process container 2 in load chamber 3, through wafer boat elevating mechanism 51 with plumbness
The underface of downward opening portion.The wafer boat 5, as lid 21 is opened, passes through in the state of being accommodated with multiple wafers W
Wafer boat elevating mechanism and rise, to be inserted into process container 2, or on the contrary, pass through wafer boat elevating mechanism
Decline, to decline out of process container 2 and be fetched to load chamber 3.Rise in wafer boat 5 and is inserted into process container 2
When interior, the flange for being set to the lower part of wafer boat 5 replaces the downward opening portion of 21 Seal treatment container 2 of lid, to make to locate
Managing becomes air-tight state in container 2.
Cooling body 6 includes gas shower mechanism 61 and cooling body 62, and the gas shower mechanism 61 and circulation are cold
But mechanism 62 is respectively controlled, come to being fetched into loading from process container 2 after having carried out heat treatment in process container 2
Wafer W in room 3 carries out cooling treatment.
The downward opening portion close beneath of process container 2 is arranged in gas shower mechanism 61, through not shown valve and
Adjuster and non-active gas supply source (not shown) (such as nitrogen N2Supply source) connection, have than faster speed (example
Such as 0.75m/sec) and such as 50L/min~100L/min flow injection non-active gas come blow away by multilayer keep multi-disc
The gas nozzle 611 of wafer W mutual impurity, heat etc..The gas nozzle 611 holds towards with wafer boat 5 relative to processing
The vertical direction of the moving direction of device 2 (being in the present embodiment horizontal direction) spray gas, and so that gas along wafer W table
The mode that the substantially entire width films shape in face is advanced sprays non-active gas.
Cooling body 62 is arranged in than at the position on the lower of gas shower mechanism 61, through not shown valve and tune
Section device is connect with non-active gas source (not shown), and non-active gas such as nitrogen is imported into load chamber 3 via circulating path
N2.The circulating path includes: suction line 623, and the right side side in load chamber 3 is extended in a vertical manner, is being inhaled
Air pipe 623 is provided in sucking load chamber 3 (not shown) with from the opposite position of the wafer boat 5 that process container 2 declines
The suction inlet of gas；Gas supply pipeline 622, the left lateral sides in load chamber 3 are extended in a vertical manner, in gas supply pipeline
622 wafer boat 5 across decline and the position opposite with suction inlet is provided with the ejiction opening that gas is sprayed into load chamber 3
624；Link pipeline 621, is set to the bottom plate 33 of load chamber 3, is connected to the lower end of suction line 623 and gas supply pipeline 622
Connection supplies body circulation；And cooling end (not shown), it is arranged in from suction inlet to the circulating path between ejiction opening 624
On, successively have the chemical filter for carrying out high efficiency filter to the gas sucked from suction inlet side, be used for gas
It carries out cooling heat exchanger such as radiator and forms the wind pushing mechanism of forced convertion for sending out gas after cooling
Such as fan, the cooling end cool down the gas of the heat from load chamber 3, return to the gas after being cooled to load chamber 3.
Here, chemical filter can be covered at least one thermal insulation board towards the surface of suction inlet side to it, be come to reflect
The heat of wafer simultaneously protects chemical filter.
Atmosphere suction line 91 (air exchange pipe) is used for by clean air introduction to load chamber 3, in atmosphere suction line
It is provided on road 91 for opening and closing atmosphere suction line 91 and the 93 (phase of air door that the soakage of atmosphere is adjusted
When in soakage adjustment portion).
Gas exhaust piping 92 (air exchange pipe) is used for the gas being discharged in load chamber 3, is provided with and is used on gas exhaust piping 92
It opens and closes gas exhaust piping 92 and (capacity tune is equivalent to the air door 94 that the discharge rate for the gas to be discharged is adjusted
Section portion).
Temperature measuring section 110 is arranged at the specified position below the downward opening portion of process container 2, to wafer boat 5
Temperature measure, measurement data is sent to controller 8, to control cooling body, to make to complete heat treatment
And by from process container 2 moved out to the wafer boat 5 of load chamber 3 temperature become predetermined temperature, that is, make the temperature of wafer W at
For predetermined temperature.
Image pickup part 111 be arranged in load chamber 3 at the position on top, the inner space of load chamber 3 is imaged, and
The data that camera shooting obtains are sent to controller 8 or display equipment to monitor with the situation of the inner space to load chamber 3.
The front side wall 31 of load chamber 3 is arranged in lighting device 112, uses when for example repairing upkeep operation, from outside
Start in the case where being illuminated when video camera shoots the inside of load chamber 3 etc. come to being illuminated in load chamber 3.
The front side wall 31 of load chamber 3 and the lower part of lighting device 112 is arranged in pressure measurement portion 113, loads for measuring
Pressure in room 3, measurement data are sent to controller 8, will to be controlled in wafer W carrying-in/carrying-out, whens cooling etc.
Positive pressure is remained in load chamber 3.By the way that positive pressure will be remained in load chamber 3, can prevent in atmosphere intrusion load chamber 3.
The front side wall 31 of load chamber 3 and the lower part in pressure measurement portion 113 is arranged in moisture measurement portion 114, for measuring dress
The humidity in room 3 is carried, moisture measurement data are sent to controller 8, whether are lowered far enough to the humidity confirmed in load chamber 3
It is capable of the degree of carrying-in/carrying-out wafer W.When the indoor humidity of loading is high, wafer W oxidation will lead to.
The top in load chamber 3 is arranged in oxygen concentration testing portion 115, for measuring the oxygen concentration inside load chamber 3, and will
Measurement data is sent to controller 8, with to sticking department 71 locking and latch-release control.
Controller 8 receives the data that send from each portion integrally to control substrate board treatment.For example, controller
8 receive the measurement data of Temperature measuring sections 110, and are controlled cooling device based on the measurement data, with to wafer boat 5 into
Row cooling treatment receives the measurement data in oxygen concentration testing portion 115, and locking and lock based on the measurement data to sticking department 71
Fixed release is controlled.
[processing of annealing device]
In the following, an example that referring to Fig.1~Fig. 6 handles the annealing device 1 constituted as described above is illustrated.
Regulation temperature is adjusted to firstly, the wafer W that the load-bearing part for being placed in carrying-in/carrying-out region A is carried is moved to
The non-active gas such as nitrogen N of degree and authorized pressure2The load chamber 3 of atmosphere.As shown in Fig. 1, Fig. 5, Fig. 6, in conveying wafer W
When, first the door 42 of the carrying-in/carrying-out region side A of pass box 4 is opened, utilizes (not shown) the removing for being set to carrying-in/carrying-out region A
It send mechanism to move in load-bearing part to pass box 4, later closes door 42.Then, using the air-exchanging structure of pass box 4, from ventilation
The gas introduction port 43 of structure imports non-active gas such as nitrogen N to pass box 42, it is discharged from the exhaust outlet 44 of air-exchanging structure
Thus gas displacement in pass box 4 is non-active gas by the gas in pass box 4.After gas displacement, transmitting is opened
The door 41 of 3 side of load chamber of case 4 is transported wafer W in pass box 4 using the transport mechanism (not shown) for being set to load chamber 3
To the wafer boat 5 of the position of readiness in load chamber 3.
After the wafer W in pass box 4 is all equipped on wafer boat 5, the door 41 of 3 side of load chamber of pass box 4 is closed,
Increase wafer boat 5 using wafer boat elevating mechanism 51 in load chamber 3 to be loaded onto process container 2, start to wafer W into
Heat treatment as defined in row.
After the completion of heat treatment, the decline of wafer boat 5 is unloaded in load chamber 3 using wafer boat elevating mechanism, is started
Cooling body 6 to carry out cooling treatment to the wafer W after the completion of heat treatment.As shown in fig. 6, for example from non-active gas supply source
Nitrogen supply source 612 supplies nitrogen N to gas shower mechanism 612, from the gas nozzle 611 of gas shower mechanism 61 to wafer boat
5 injection nitrogen Ns2Mutual impurity, the heat etc. of more wafers W kept by multilayer is blown away, to be cooled down.In addition,
Nitrogen N is supplied from nitrogen supply source 625 to cooling body 622, nitrogen N2To link pipeline 621, gas supply pipeline 622, load
The circulating path of space and suction line 623 recycle and cool down to wafer boat 5 in room 3.
In progress cooling treatment, wafer boat 5 is cooled to defined temperature, and the pressure in load chamber 3 becomes regulation
Pressure after, open the door 41 of 3 side of load chamber of pass box 4, by wafer W from wafer boat 5 be transported to pass box 4 completely after by door
41 close.Later, the gas in pass box 4 is replaced with into atmosphere using the ventilation mechanism of pass box 4, later by pass box 4
The door 42 of the carrying-in/carrying-out region side A is opened, and wafer W is transported to carrying-in/carrying-out region A, to complete to handle.
[maintenance maintenance of annealing device]
In above-mentioned annealing device 1, need to tie up the wafer boat elevating mechanism etc. being housed in inside load chamber 3
Shield carries out cleaning removal etc. to the produced film for being attached to quartzy jig such as wafer boat 5.In this case, it is safeguarded
Operating personnel need to enter in load chamber 3 wafer boat declined etc. moved out into load chamber 3.If operating personnel is loading
Filled with load chamber 3 is entered in the case where non-active gas in room 3, then worst situation be possible to make operating personnel suffocate and
Generation accident.
In the annealing device 1 of the utility model, when repairing maintenance, first under the control of control unit 8, lead to
For excessive gas suction line 91 and gas exhaust piping 92 (air exchange pipe) replace the non-active gas discharge in load chamber 3
Such as atmosphere.While being taken a breath, the oxygen concentration in load chamber 3 is measured using oxygen concentration testing portion 115, by oxygen concentration testing
Data are sent to controller 8, and controller 8 is based on oxygen concentration testing data, when oxygen concentration is lower than specified value such as 18%, carry out
Control reaches so that maintenance door 7 cannot be opened in oxygen concentration to continue to take a breath and control the locking maintenance door 7 of sticking department 71
When specified value, is controlled to stop taking a breath and the locking in the portion 71 that unlocks, make it possible to open maintenance door 7 freely.
By the substrate board treatment of the utility model, operating personnel can be in load chamber 3 safety atmosphere under into
Enter load chamber 3 to carry out maintenance and repair operation.
In addition, the basic handling device of the utility model can carried out by having image pickup part 111 in load chamber 3
It is monitored when operating personnel's operation of maintenance maintenance, can further ensure that the safety of operating personnel.
More than, an example of the utility model is illustrated, but the utility model is without being limited thereto.
In a kind of possible mode, oxygen concentration testing portion 115 is not arranged in the top in load chamber 3, but is arranged
At the position than person height in load chamber 3, such as near middle and lower part or exhaust outlet.It is arranged in this way, Neng Gougeng
The oxygen concentration in load chamber 3 is reliably measured, can further ensure that the safety in load chamber 3.
In a kind of possible mode, maintenance door 7 is not arranged on the right side of the rear surface of load chamber 3, but can basis
Need to be arranged in any position of any one side.
In a kind of possible mode, in maintenance maintenance, oxygen concentration testing portion 115 be not measure oxygen concentration always, and
It is to be measured with predetermined time interval.
In a kind of possible mode, lid 21 as shown in figs. 10 a and 10b, be formed as with process container 2 to
Under the roughly the same circle in opening portion, driven by cylinder and be able to carry out lifting moving and rotation.When opening lid 21, first
Driven using cylinder so that lid 21 declines, when dropping to specified position, driven using cylinder so that lid 21 with periphery or
It is rotated in the horizontal direction centered on the certain point of periphery, opens lid 21 thus to open opening for process container 2
Oral area.When closing lid 21 on the contrary, first making lid 21 turn to the position for capableing of the opening portion of covering treatment container 2, later
Lid 21 is set to rise the opening portion for carrying out Seal treatment container 2.
In a kind of possible mode, the wafer of 300mm is handled, at this time the pass box 4 of load chamber 3 such as Fig. 8 institute
Show the FIMS 4 ' being replaced by for transporting FOUP (front-opening unified pod: front open type wafer box)
(front-opening interface mechanical standard: preceding to open Interface Mechanical Standard system equipment), and wafer
W changes from carrying-in/carrying-out region A to the conveying process of load chamber 3, is briefly described referring to Fig. 9.FIMS 4 ' has tool
Have from the opening of front side wall 31 backward side space outstanding, moveable opening and closing structure 41 ', have use in opening and closing structure 41 '
The lid for removing lid, which is released, in the engaging by the lid S of FOUP with main body removes portion 42 ' and to the gas of space interior
Displaced air-exchanging structure 43 '.
Using such structure conveying wafer, firstly, by FOUP with the edge of lid and opening and closing structure 41 '
The mode of abutting is placed, and is later non-active gas by the air displacement in the space of opening and closing structure 41 ' using air-exchanging structure 43 '
Such as nitrogen, portion 42 ', which is removed, using lid after the completion of gas displacement removes the lid S of FOUP, it is mobile later to open opening and closing knot
Wafer W in FOUP is transported to load chamber 3 using the transport mechanism (not shown) in load chamber 3 by structure 41 '.
In a kind of possible mode, be arranged in the front side wall 31 of load chamber 3 pass box 4 be one or two with
On.
In a kind of possible mode, control unit 8 is not the comprehensive control controlled the entirety of annealing device
Device processed, but by multiple control modules come the function of shared controller 8.
The setting position in each portion in above embodiments is only to be illustrated, and can arbitrarily be become as needed
More.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (20)
1. a kind of substrate board treatment, which is characterized in that have:
Process container is used to be heat-treated the substrate for being held in substrate holder tool, has opening portion；
Load chamber is connected to via the opening portion with the process container, is provided in the load chamber and the place
The transport mechanism of the carrying-in/carrying-out of the substrate holder tool is carried out between reason container, is used for outside the load chamber and the loading
The door opening for carrying out the carrying-in/carrying-out mouth of the carrying-in/carrying-out of wafer between room and being entered and left for operating personnel；
First switching mechanism, the carrying-in/carrying-out mouth of the load chamber can be opened and closed by consisting of；
Second switching mechanism, the opening portion of the process container can be opened and closed by consisting of；
Third switching mechanism consists of the door for having and capable of opening and closing the door opening of the load chamber, and
The door lock can be scheduled on to the position for closing door opening and release the sticking department of the locking；And
Cooling body keeps the substrate moved out after being heat-treated to the load chamber using non-active gas
The substrate that utensil is kept is cooled down.
2. substrate board treatment according to claim 1, which is characterized in that
Also there is oxygen concentration testing portion, the indoor oxygen concentration of loading is measured.
3. substrate board treatment according to claim 2, which is characterized in that
Second switching mechanism has:
Lid can close the opening portion of the process container；
First driving portion goes up and down the lid relative to the opening portion；And
Second driving portion rotates the lid on the face parallel relative to the opening portion.
4. substrate board treatment according to claim 3, which is characterized in that
There are two the carrying-in/carrying-out mouth is arranged in a manner of being arranged above and below,
First switching mechanism and the carrying-in/carrying-out mouth are correspondingly provided with two,
First switching mechanism includes the driving that can be closed the door of the carrying-in/carrying-out mouth and slide laterally the door
Portion.
5. substrate board treatment according to claim 4, which is characterized in that
The cooling body includes cooling body, the cooling body following in circulating path using non-active gas
Ring is cooled down,
The circulating path includes: suction line, has and sucks the suction inlet for loading indoor gas；Gas supply pipeline,
With across substrate holder tool and the opposite ejiction opening of the suction inlet in the load chamber；And connecting piece
The suction line is connected to connection with the gas supply pipeline by road,
It is disposed with thermal insulation board on the circulating path, the chemical filter that gas is filtered, gas is cooled down
Heat exchanger and the wind pushing mechanism of sending out gas after cooling.
6. substrate board treatment according to claim 3, which is characterized in that
The cooling body includes cooling body, the cooling body following in circulating path using non-active gas
Ring is cooled down,
The circulating path includes: suction line, has and sucks the suction inlet for loading indoor gas；Gas supply pipeline,
With across substrate holder tool and the opposite ejiction opening of the suction inlet in the load chamber；And connecting piece
The suction line is connected to connection with the gas supply pipeline by road,
It is disposed with thermal insulation board on the circulating path, the chemical filter that gas is filtered, gas is cooled down
Heat exchanger and the wind pushing mechanism of sending out gas after cooling.
7. substrate board treatment according to claim 2, which is characterized in that
There are two the carrying-in/carrying-out mouth is arranged in a manner of being arranged above and below,
First switching mechanism and the carrying-in/carrying-out mouth are correspondingly provided with two,
First switching mechanism includes the driving that can be closed the door of the carrying-in/carrying-out mouth and slide laterally the door
Portion.
8. substrate board treatment according to claim 7, which is characterized in that
The cooling body includes cooling body, the cooling body following in circulating path using non-active gas
Ring is cooled down,
The circulating path includes: suction line, has and sucks the suction inlet for loading indoor gas；Gas supply pipeline,
With across substrate holder tool and the opposite ejiction opening of the suction inlet in the load chamber；And connecting piece
The suction line is connected to connection with the gas supply pipeline by road,
It is disposed with thermal insulation board on the circulating path, the chemical filter that gas is filtered, gas is cooled down
Heat exchanger and the wind pushing mechanism of sending out gas after cooling.
9. substrate board treatment according to claim 2, which is characterized in that
The cooling body includes cooling body, the cooling body following in circulating path using non-active gas
Ring is cooled down,
The circulating path includes: suction line, has and sucks the suction inlet for loading indoor gas；Gas supply pipeline,
With across substrate holder tool and the opposite ejiction opening of the suction inlet in the load chamber；And connecting piece
The suction line is connected to connection with the gas supply pipeline by road,
It is disposed with thermal insulation board on the circulating path, the chemical filter that gas is filtered, gas is cooled down
Heat exchanger and the wind pushing mechanism of sending out gas after cooling.
10. substrate board treatment according to claim 1, which is characterized in that
Second switching mechanism has:
Lid can close the opening portion of the process container；
First driving portion goes up and down the lid relative to the opening portion；And
Second driving portion rotates the lid on the face parallel relative to the opening portion.
11. substrate board treatment according to claim 10, which is characterized in that
There are two the carrying-in/carrying-out mouth is arranged in a manner of being arranged above and below,
First switching mechanism and the carrying-in/carrying-out mouth are correspondingly provided with two,
First switching mechanism includes the driving that can be closed the door of the carrying-in/carrying-out mouth and slide laterally the door
Portion.
12. substrate board treatment according to claim 11, which is characterized in that
The cooling body includes cooling body, the cooling body following in circulating path using non-active gas
Ring is cooled down,
The circulating path includes: suction line, has and sucks the suction inlet for loading indoor gas；Gas supply pipeline,
With across substrate holder tool and the opposite ejiction opening of the suction inlet in the load chamber；And connecting piece
The suction line is connected to connection with the gas supply pipeline by road,
It is disposed with thermal insulation board on the circulating path, the chemical filter that gas is filtered, gas is cooled down
Heat exchanger and the wind pushing mechanism of sending out gas after cooling.
13. substrate board treatment according to claim 10, which is characterized in that
The cooling body includes cooling body, the cooling body following in circulating path using non-active gas
Ring is cooled down,
The circulating path includes: suction line, has and sucks the suction inlet for loading indoor gas；Gas supply pipeline,
With across substrate holder tool and the opposite ejiction opening of the suction inlet in the load chamber；And connecting piece
The suction line is connected to connection with the gas supply pipeline by road,
It is disposed with thermal insulation board on the circulating path, the chemical filter that gas is filtered, gas is cooled down
Heat exchanger and the wind pushing mechanism of sending out gas after cooling.
14. substrate board treatment according to claim 1, which is characterized in that
There are two the carrying-in/carrying-out mouth is arranged in a manner of being arranged above and below,
First switching mechanism and the carrying-in/carrying-out mouth are correspondingly provided with two,
First switching mechanism includes the driving that can be closed the door of the carrying-in/carrying-out mouth and slide laterally the door
Portion.
15. substrate board treatment according to claim 14, which is characterized in that
The cooling body includes cooling body, the cooling body following in circulating path using non-active gas
Ring is cooled down,
The circulating path includes: suction line, has and sucks the suction inlet for loading indoor gas；Gas supply pipeline,
With across substrate holder tool and the opposite ejiction opening of the suction inlet in the load chamber；And connecting piece
The suction line is connected to connection with the gas supply pipeline by road,
It is disposed with thermal insulation board on the circulating path, the chemical filter that gas is filtered, gas is cooled down
Heat exchanger and the wind pushing mechanism of sending out gas after cooling.
16. substrate board treatment according to claim 1, which is characterized in that
The cooling body includes cooling body, the cooling body following in circulating path using non-active gas
Ring is cooled down,
The circulating path includes: suction line, has and sucks the suction inlet for loading indoor gas；Gas supply pipeline,
With across substrate holder tool and the opposite ejiction opening of the suction inlet in the load chamber；And connecting piece
The suction line is connected to connection with the gas supply pipeline by road,
It is disposed with thermal insulation board on the circulating path, the chemical filter that gas is filtered, gas is cooled down
Heat exchanger and the wind pushing mechanism of sending out gas after cooling.
17. substrate board treatment described according to claim 1~any one of 16, which is characterized in that be also equipped with:
Atmosphere suction line is used into the load chamber import clean atmosphere；
Soakage adjustment portion is set to the atmosphere suction line, for adjusting the atmosphere suction line sucking atmosphere
Soakage；
Gas exhaust piping is used to be discharged the indoor gas of loading；And
Capacity adjustment portion is set to the gas exhaust piping, for adjusting the discharge rate of the gas exhaust piping discharge gas.
18. substrate board treatment described according to claim 1~any one of 16, which is characterized in that
It is provided in the load chamber
Lighting device, to being illuminated in the load chamber；And
Image pickup part images the inner space of the load chamber.
19. substrate board treatment described according to claim 1~any one of 16, which is characterized in that
It is provided in the load chamber
Temperature measuring section measures the temperature of the substrate holder tool；
Moisture measurement portion measures the indoor humidity of loading；And
Pressure measurement portion measures the indoor pressure of loading.
20. substrate board treatment described according to claim 1~any one of 16, which is characterized in that
The cooling body includes gas shower mechanism, which moves out towards after being heat-treated to described
The substrate holder of load chamber has the substrate kept, so that entire width films shape of the gas along substrate surface
The mode of traveling sprays non-active gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820985559.8U CN208240644U (en) | 2018-06-21 | 2018-06-21 | Substrate board treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820985559.8U CN208240644U (en) | 2018-06-21 | 2018-06-21 | Substrate board treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208240644U true CN208240644U (en) | 2018-12-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592666A (en) * | 2019-08-27 | 2019-12-20 | 长江存储科技有限责任公司 | Polycrystalline silicon film deposition system and method |
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2018
- 2018-06-21 CN CN201820985559.8U patent/CN208240644U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592666A (en) * | 2019-08-27 | 2019-12-20 | 长江存储科技有限责任公司 | Polycrystalline silicon film deposition system and method |
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