TWI788422B - EFEM and EFEM Gas Replacement Method - Google Patents

EFEM and EFEM Gas Replacement Method Download PDF

Info

Publication number
TWI788422B
TWI788422B TW107133736A TW107133736A TWI788422B TW I788422 B TWI788422 B TW I788422B TW 107133736 A TW107133736 A TW 107133736A TW 107133736 A TW107133736 A TW 107133736A TW I788422 B TWI788422 B TW I788422B
Authority
TW
Taiwan
Prior art keywords
aforementioned
inert gas
holding
transfer chamber
container member
Prior art date
Application number
TW107133736A
Other languages
Chinese (zh)
Other versions
TW201939653A (en
Inventor
河合俊宏
小倉源五郎
Original Assignee
日商昕芙旎雅股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昕芙旎雅股份有限公司 filed Critical 日商昕芙旎雅股份有限公司
Publication of TW201939653A publication Critical patent/TW201939653A/en
Application granted granted Critical
Publication of TWI788422B publication Critical patent/TWI788422B/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements

Abstract

本發明係一種EFEM及EFEM之氣體置換方法,其課題為在使框體內的非活性氣體循環之形式的EFEM中,抑制成本的增大同時,抑制釋放灰塵於搬送室內之情況者。 解決手段係為EFEM(1)係具有:經由除去灰塵的FFU(44)而加以清淨化的氮則流動於特定方向之搬送室(41),和自搬送室(41)之下流側,返回氮至FFU(44)之返還路徑(43),而氮則呈循環地加以構成。EFEM(1)係具備:配置於搬送室(41)內,在保持晶圓的狀態而進行特定的動作之搬送機器手臂(3)。搬送機器手臂(3)係具有:形成有開口之容器構件(61),和配置於容器構件(61)之外側,保持晶圓之手臂機構(70),和支持手臂機構(70),插通於開口之支柱,和收容於容器構件(61),驅動支柱之驅動機構,設置有連接容器構件(61)與前述返還路徑(43)之連接路徑(82a)。The present invention is an EFEM and a gas replacement method for the EFEM. The object of the present invention is to suppress an increase in cost while suppressing the release of dust into the transfer chamber in an EFEM that circulates an inert gas in a frame. The solution is that EFEM (1) has: the nitrogen that is purified through the FFU (44) that removes dust flows in the transfer chamber (41) in a specific direction, and returns to the nitrogen from the downstream side of the transfer chamber (41). The return path (43) to FFU (44), while nitrogen is formed cyclically. The EFEM (1) is provided with: a transfer robot arm (3) arranged in the transfer chamber (41) and performing a specific operation while holding the wafer. The transfer robot arm (3) has: a container member (61) with an opening formed thereon, and an arm mechanism (70) configured outside the container member (61) to hold the wafer, and a support arm mechanism (70), inserted through The prop at the opening and the drive mechanism that is housed in the container member (61) and drives the prop are provided with a connecting path (82a) connecting the container member (61) and the return path (43).

Description

EFEM及EFEM之氣體置換方法EFEM and EFEM Gas Replacement Method

本發明係有關可使非活性氣體循環之EFEM(Equipment Front End Module)。 The present invention relates to EFEM (Equipment Front End Module) which can circulate inert gas.

對於專利文獻1係揭示有:在對於半導體基板(晶圓)施以特定處理之處理裝置,和收容有晶圓之FOUP(Front-Opening Unified Pod)之間,進行晶圓的授授之EFEM。EFEM係具備:形成有進行晶圓的搬送之搬送室的框體,和排列配置於框體的外側,各載置有FOUP之複數的裝載埠,和行走在延伸於搬送室內的軌道上而進行晶圓的搬送之搬送裝置。 Patent Document 1 discloses an EFEM in which wafers are transferred between a processing device that applies specific processing to semiconductor substrates (wafers) and a FOUP (Front-Opening Unified Pod) that houses the wafers. The EFEM system is equipped with a frame with a transfer chamber for transferring wafers, and a plurality of loading ports arranged on the outside of the frame to place FOUPs, and a rail extending in the transfer chamber to carry out the process. A transfer device for wafer transfer.

以往,對於在晶圓上所製造之半導體電路之搬送室內的氧或水分等的影響係為少,但近年,伴隨著半導體電路之更細微化,此等的影響則明顯化。因此,記載於專利文獻1之EFEM係以非活性氣體的氮填充搬送室內地加以構成。具體而言,EFEM係具備:在框體的內部使氮循環,包含搬送室之循環流路,和供給氮於循環流路的氣體供給手段,和自循環流路排出氮之氣體排出手段。氮係因應循環流路內的氧濃度等之變動而加以適宜供給及排 出。經由此,與時常供給及排出氮的構成作比較,成為可抑制氮的供給量之增大同時,將搬送室內保持為氮環境者。 In the past, the influence of oxygen and moisture in the transfer chamber of the semiconductor circuit manufactured on the wafer was small, but in recent years, with the miniaturization of the semiconductor circuit, such influence has become more pronounced. Therefore, the EFEM described in Patent Document 1 is configured to fill the transfer chamber with nitrogen, an inert gas. Specifically, the EFEM is equipped with a circulating flow path including a transfer chamber for circulating nitrogen inside the frame, a gas supply means for supplying nitrogen to the circulating flow path, and a gas discharge means for discharging nitrogen from the circulating flow path. The nitrogen system is properly supplied and exhausted in response to changes in the oxygen concentration in the circulation flow path. out. In this way, compared with the configuration in which nitrogen is constantly supplied and discharged, it becomes possible to maintain the nitrogen atmosphere in the transfer chamber while suppressing an increase in the supply amount of nitrogen.

但,對於為了抑制氮的供給量之增大同時,將搬送室內保持為適當之環境氣,係監視氧濃度或濕度等之感測機器等之設置則成為必要。但單純地設置感測機器等於搬送室內時,有著與行走之搬送裝置產生干擾之虞。因此,本申請發明者係檢討著取代行走在軌道上之搬送裝置,而適用如專利文獻2所記載之固定位置之搬送裝置(搬送機器手臂)。詳細而言,搬送機器手臂係具備:固定於搬送室內之中空的軀幹,和呈自軀幹突出於上方地加以配置之支柱,和上下驅動支柱的驅動機構,和安裝於支柱而加以水平驅動,保持晶圓而進行搬送之多關節柄。如此之搬送機器手臂係由水平驅動多關節柄者,可進出於載置在複數的裝載埠之FOUP。也就是,因搬送室內未有軌道,而軀幹未行走之故,其部分,成為可於搬送室內確保感測機器等之設置空間者。 However, in order to suppress the increase in nitrogen supply and maintain an appropriate atmosphere in the transfer chamber, it is necessary to install a sensor device to monitor the oxygen concentration or humidity. However, when simply installing the sensing device in the conveying room, there is a risk of interference with the moving conveying device. Therefore, the inventors of the present application are examining a conveying device (transfer robot arm) that is applied to a fixed position as described in Patent Document 2 instead of a conveying device that walks on rails. In detail, the transfer robot arm is equipped with: a trunk fixed in the hollow of the transfer chamber, a pillar protruding from the trunk and arranged above, a drive mechanism for driving the pillar up and down, and a drive mechanism installed on the pillar to drive horizontally, maintain Multi-joint handle for transferring wafers. Such a transfer robot arm is driven by a multi-joint handle horizontally, and can enter and exit FOUPs placed in multiple loading ports. That is, since there is no track in the transfer chamber, and the trunk does not walk, its part can ensure the installation space of the sensing device and the like in the transfer chamber.

[先前技術文獻] [Prior Art Literature] [專利文獻] [Patent Document]

[專利文獻1]日本特開2015-146349號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2015-146349

[專利文獻2]日本特開2012-169691號公報 [Patent Document 2] Japanese Unexamined Patent Publication No. 2012-169691

在專利文獻2所記載之搬送機器手臂中,由上下驅動支持多關節柄的支柱者,亦對於上下方向搬送晶圓。適用如此之搬送機器手臂於專利文獻1所記載之EFEM之情況,產生有如以下的問題。即,為了除去在驅動機構的動作時會產生於軀幹內之灰塵,呈將軀幹內的氣體(非活性氣體)排出於EFEM框體外之外部空間地構成時,藉由於軀幹與支柱之間空出之間隙,供給於搬送室內的氮則被吸引於軀幹內,並且排出於外部空間。因此,產生有補充其部分的氮之必要,而氮的供給成本則有增大之虞。雖為如此,當呈未自軀幹排出氮於外部地構成時,下回係在呈引入於下方地驅動支柱(軀幹的內部容積變小)時,軀幹內之氣體(非活性氣體)則伴隨於支柱的移動而推出於周邊。因此,含有灰塵之氣體(非活性氣體)則有藉由上述間隙而釋放於搬送室內之虞。 In the transfer robot arm described in Patent Document 2, the pillar supporting the multi-joint handle is driven up and down, and the wafer is also transferred in the up and down direction. When such a transfer robot arm is applied to the EFEM described in Patent Document 1, the following problems arise. That is, in order to remove the dust generated in the torso during the operation of the driving mechanism, when the gas (inert gas) in the torso is discharged to the external space outside the EFEM frame, the space between the torso and the support Nitrogen supplied to the transfer chamber is sucked into the trunk and discharged to the outside space. Therefore, it is necessary to replenish part of the nitrogen produced, and the supply cost of nitrogen may increase. Even so, when the nitrogen is not discharged from the trunk to the outside, the next time the pillar is driven downward (the internal volume of the trunk becomes smaller), the gas (inert gas) in the trunk is accompanied by The movement of the pillar pushes out the perimeter. Therefore, there is a possibility that dust-containing gas (inert gas) may be released into the transfer chamber through the above-mentioned gap.

本發明之目的係在使框體內的非活性氣體循環之形式的EFEM中,抑制成本的增大同時,抑制釋放灰塵於搬送室內之情況者。 The object of the present invention is to suppress the release of dust in the transfer chamber while suppressing an increase in cost in an EFEM that circulates an inert gas in a frame.

第1發明之EFEM係具有:經由除去灰塵的風扇過濾單元而加以清淨化之非活性氣體則流動於特定方向之搬送室,和自前述搬送室之前述特定方向的下游側,返回前述非活性氣體至前述風扇過濾單元之返還路徑,前述 非活性氣體則呈循環地加以構成之EFEM,其特徵為具備:以配置前述搬送室內,保持基板的狀態而進行特定的動作之自動裝置;前述自動裝置係具有:形成有開口的容器構件,和配置於前述容器構件之外側,保持前述基板之保持部,和支持前述保持部,插通於前述開口的支持部,和收容於前述容器構件,驅動前述支持部的驅動機構,設置有連接前述容器構件與前述返還路徑的連接路徑者。 The EFEM of the first invention has: the inert gas that is purified by the fan filter unit for removing dust flows in the transfer chamber in a specific direction, and returns to the inert gas from the downstream side of the transfer chamber in the specific direction. Return path to the aforementioned fan filter unit, the aforementioned The EFEM in which the inert gas is formed in a circulating manner is characterized by: an automatic device configured in the transfer chamber to maintain the state of the substrate and perform a specific action; the automatic device has: a container member formed with an opening, and Arranged on the outer side of the aforementioned container member, a holding portion for holding the aforementioned substrate, a supporting portion for supporting the aforementioned holding portion, and inserted into the aforementioned opening, and a driving mechanism for being accommodated in the aforementioned container member and driving the aforementioned supporting portion, provided with a device connected to the aforementioned container The connection path between the component and the aforementioned return path.

由經由自動裝置所具有之驅動機構而驅動支持部者,在容器構件的內部空間中會產生有灰塵。含有灰塵之非活性氣體則自容器構件的開口與支持部之間的間隙洩漏時,有著搬送室內經由灰塵而污染之虞。在本發明中,因設置有連接容器構件與返還路徑之連接路徑之故,假設即使在容器構件的內部空間產生有灰塵,此灰塵係亦經由連接路徑而排出於返還路徑之故,可抑制灰塵洩漏至搬送室內者。更且,排出於返還路徑的灰塵係經由配置於返還路徑的下游側之風扇過濾單元而加以除去。隨之,可抑制經由在容器構件的內部空間所產生的灰塵而污染搬送室之情況。另外,在如此之構成中,因容器構件內的非活性氣體則未直接排出於外部之故,無須補充自容器構件內所排出部分之非活性氣體,而可抑制非活性氣體之供給量的增大之故,可抑制成本的增大。隨之,在使框體內的非活性氣體循環之形式的EFEM中,可抑制成本的增大同時,抑制釋放灰塵於搬送室內之情況者。 When the supporting part is driven by the driving mechanism of the automatic device, dust is generated in the inner space of the container member. When the inert gas containing dust leaks from the gap between the opening of the container member and the support portion, the transfer chamber may be contaminated by dust. In the present invention, since the connection path connecting the container member and the return path is provided, even if dust is generated in the inner space of the container member, the dust is discharged to the return path through the connection path, and the dust can be suppressed. Those who leak into the transfer room. Furthermore, the dust discharged in the return path is removed through the fan filter unit arranged on the downstream side of the return path. Accordingly, contamination of the transfer chamber via dust generated in the inner space of the container member can be suppressed. In addition, in such a configuration, since the inert gas in the container member is not directly discharged to the outside, it is not necessary to replenish the inert gas discharged from the container member, and the increase in the supply amount of the inert gas can be suppressed. Therefore, the increase in cost can be suppressed. Accordingly, in the EFEM in which the inert gas in the frame is circulated, it is possible to suppress an increase in cost and suppress release of dust into the transfer chamber.

第2發明之EFEM係其特徵為在前述第1發明 中,更具備:藉由前述連接路徑而將前述容器構件內的非活性氣體送出至前述返還路徑之風扇者。 The EFEM of the second invention is characterized in that the above-mentioned first invention Among them, it further includes: a fan for sending the inert gas in the container member to the return path through the connection path.

在本發明中,因可經由風扇所生成之氣流,確實地傳送容器構件內的非活性氣體於返還路徑之故,抑制容器構件內的非活性氣體自開口與支持部之間的間隙洩漏之情況,而可更確實地抑制釋放灰塵於搬送室內者。 In the present invention, since the inert gas in the container member can be reliably sent to the return path through the airflow generated by the fan, the leakage of the inert gas in the container member from the gap between the opening and the support portion is suppressed. , and can more reliably suppress the release of dust in the transfer room.

第3發明之EFEM係其特徵為在前述第2發明中,更具備:旋轉驅動前述風扇的風扇驅動裝置,和控制前述風扇驅動裝置之控制部;前述控制部係在前述驅動機構動作時,與前述驅動機構未動作時作比較,加速前述風扇的旋轉速度情況者。 The EFEM of the third invention is characterized in that in the above-mentioned second invention, it is further equipped with: a fan driving device that rotates and drives the aforementioned fan, and a control unit that controls the aforementioned fan driving unit; Compared with the time when the aforementioned driving mechanism is not in action, the case where the rotational speed of the aforementioned fan is accelerated.

在容器構件內中,在驅動機構動作而驅動支持部時,有容易產生有灰塵之虞。在本發明中,在驅動機構動作時,由加速風扇的旋轉速度而加速風速者,可確實地將容器構件內的非活性氣體傳送至返還路徑者。另外,對於驅動機構未動作時,由減緩風扇的旋轉速度者,可使為了驅動風扇之消耗電力降低。 In the container member, when the drive mechanism operates to drive the support portion, there is a possibility that dust is likely to be generated. In the present invention, when the drive mechanism operates, the wind speed is accelerated by increasing the rotation speed of the fan, so that the inert gas in the container member can be reliably sent to the return path. In addition, when the driving mechanism is not in operation, by slowing down the rotational speed of the fan, the power consumption for driving the fan can be reduced.

第4發明之EFEM係其特徵為在前述第1~第3任一之發明中,作為前述自動裝置,設置有搬送前述基板之搬送機器手臂,前述容器構件係加以固定於前述搬送室內,作為前述保持部,設置有保持前述基板而搬送於水平方向之手臂機構,作為前述支持部,設置有支持前述手臂機構之支柱,前述支柱係經由前述驅動機構而加以上下驅動者。 The EFEM of the fourth invention is characterized in that in any one of the aforementioned first to third inventions, as the aforementioned automatic device, a transport robot arm for transporting the aforementioned substrate is provided, and the aforementioned container member is fixed in the aforementioned transport chamber, as the aforementioned The holding part is provided with an arm mechanism for holding the substrate and transporting it in the horizontal direction, and the supporting part is provided with a pillar supporting the arm mechanism, and the pillar is driven up and down by the driving mechanism.

在本發明中,搬送機器手臂之容器構件則固定於搬送室內。也就是,容器部本身係因未移動在搬送室內之故,其部分,可確保為了設置各種機器於搬送室內之空間者。另一方面,在上下驅動支持手臂機構之支柱的構成中,特別是在呈引入至下方地驅動支柱時,含有產生於容器構件內的灰塵之非活性氣體則伴隨者支柱的移動而推出於上方,而有穿過容器構件與支柱之間的間隙而釋放至搬送室內之虞。在本發明中,即使在如此之構成中,因容器構件則經由連接路徑而與返還路徑加以連接之故,灰塵係亦藉由連接路徑而排出於返還路徑。隨之,可有效果地抑制含有灰塵之非活性氣體流入至搬送室內者。 In the present invention, the container component of the conveying robot arm is fixed in the conveying chamber. That is, the container part itself is not moved in the transfer chamber, and its part can ensure the space for installing various devices in the transfer chamber. On the other hand, in the configuration of driving the pillar supporting the arm mechanism up and down, especially when the pillar is driven downward, the inert gas containing the dust generated in the container member is pushed out upward along with the movement of the pillar. , but there is a risk of passing through the gap between the container member and the pillar and being released into the transfer chamber. In the present invention, even in such a configuration, since the container member is connected to the return path through the connection path, dust is also discharged to the return path through the connection path. Accordingly, it is possible to effectively suppress inflow of inert gas containing dust into the transfer chamber.

第5發明之EFEM係其特徵為在前述第4發明中,前述手臂機構係具備:具有保持前述基板的機械手,和在保持前述基板的保持狀態,與解除前述保持狀態之解除狀態之間,切換前述機械手的狀態之切換部,經由自灰塵除去用的非活性氣體供給源所供給之前述非活性氣體的流動而吸引在前述切換部之動作時所產生的灰塵,更且,將所供給之前述非活性氣體,與灰塵同時排出於前述返還路徑之噴射器者。 The EFEM of the fifth invention is characterized in that in the aforementioned fourth invention, the aforementioned arm mechanism includes: a manipulator for holding the aforementioned substrate, and between the holding state of holding the aforementioned substrate and the releasing state of releasing the aforementioned holding state, The switching unit for switching the state of the manipulator sucks the dust generated during the operation of the switching unit through the flow of the inert gas supplied from the inert gas supply source for dust removal, and furthermore, the supplied The above-mentioned inert gas is discharged from the injector of the above-mentioned return path at the same time as the dust.

在經由切換部而在保持狀態與解除狀態之間切換機械手時,當產生有灰塵時,有著附著灰塵於基板之虞。在此,為了除去灰塵,而成為進行真空排氣之構成時,自搬送室內排出非活性氣體之故,產生必須補充其部分之非活性氣體,而有成本增大之虞。在本發明中,經由 噴射器而吸引灰塵,自非活性氣體的供給源所供給之非活性氣體則與灰塵同時加以排出於返還路徑之故,該非活性氣體係直接進行循環。更且,灰塵係經由風扇過濾單元而加以除去。隨之,與進行真空排氣的構成作比較,可抑制經由非活性氣體的補充之成本的增大者。 When the manipulator is switched between the holding state and the releasing state via the switching unit, if dust is generated, there is a possibility that the dust may adhere to the substrate. Here, in the case of a configuration for vacuum evacuation in order to remove dust, the inert gas is exhausted from the transfer chamber, and a part of the inert gas that must be replenished is generated, which may increase the cost. In the present invention, via The ejector attracts dust, and the inert gas supplied from the inert gas supply source is discharged to the return path at the same time as the dust, so that the inert gas system is directly circulated. Moreover, dust is removed through a fan filter unit. Accordingly, it is possible to suppress an increase in cost by supplementing the inert gas, compared with a configuration in which vacuum evacuation is performed.

第6發明之EFEM係其特徵為在前述第4或第5之發明中,前述手臂機構係具有中空的手臂構件,對於前述手臂構件,係形成有為了使自淨化用之非活性氣體供給源所供給之前述非活性氣體,流入至前述手臂構件之內部空間的流入口,和為了自前述手臂構件之前述內部空間,使前述非活性氣體流出之流出口者。 The EFEM of the 6th invention is characterized in that in the aforementioned 4th or 5th invention, the aforementioned arm mechanism has a hollow arm member, and the aforementioned arm member is formed with an inert gas supply source for self-purification. An inflow port for the supplied inert gas to flow into the inner space of the arm member, and an outflow port for the inert gas to flow out from the inner space of the arm member.

搬送機器手臂之手臂構件係一般而言,為了內藏驅動用的機構而具有中空構造。手臂構件的內部空間則對於搬送室而言如為完全地加以密閉即可,但在非為如此之構成中,例如在維護時,搬送室被大氣解放之情況,手臂構件之內部空間亦被大氣解放,而有氧或水分等進入至內部空間之虞。此情況,維護後之再稼動時,當對於手臂構件內的非活性氣體之置換耗費時間時,而有生產效率下降之虞。在本發明中,形成有流入口與流出口於手臂構件之故,與未形成有此等之情況作比較,可縮短對於手臂構件之內部空間的氣體置換耗費時間,而可抑制生產效率之下降。 The arm member of the transfer robot arm generally has a hollow structure in order to incorporate a driving mechanism. The internal space of the arm member can be completely sealed as far as the transfer chamber is concerned, but in other configurations, such as when the transfer chamber is released from the atmosphere during maintenance, the internal space of the arm member is also covered by the atmosphere. Liberation, and there is a risk of oxygen or moisture entering the inner space. In this case, it takes time to replace the inert gas in the arm member during reoperation after maintenance, and there is a possibility that the production efficiency may be lowered. In the present invention, since the inflow port and the outflow port are formed in the arm member, compared with the case where they are not formed, the time required for gas replacement in the inner space of the arm member can be shortened, and the decrease in production efficiency can be suppressed. .

在第7發明之EFEM的氣體置換方法係具有:經由除去灰塵之風扇過濾單元而加以清淨化的非活性氣體 則流入至特定方向之搬送室,和自前述搬送室之前述特定方向的下游側,返回前述非活性氣體至前述風扇過濾單元之返還路徑,在前述非活性氣體呈循環地加以構成之EFEM中,置換氣體的氣體置換方法,其特徵為前述EFEM係具備:配置於前述搬送室內,在保持基板之狀態,進行特定動作之自動裝置,而前述自動裝置係具有:形成有開口之容器構件,和收容於前述容器構件之驅動裝置者,由自前述非活性氣體之供給源,供給前述非活性氣體至前述容器構件之內部,自前述容器構件的內部送出氣體至前述返還路徑者,置換前述容器構件的內部之氣體者。 The gas replacement method of EFEM in the seventh invention has: the inert gas that is purified through the fan filter unit that removes dust Then flow into the transfer chamber in a specific direction, and return the inert gas from the downstream side of the transfer chamber in the specific direction to the return path of the fan filter unit. In the EFEM in which the inert gas is circulated, The gas replacement method for replacing gas is characterized in that the EFEM is equipped with: an automatic device that is arranged in the transfer chamber and performs a specific operation while holding the substrate, and the automatic device has: a container member with an opening formed therein; In the driving device of the aforementioned container member, the aforementioned inert gas is supplied from the aforementioned inert gas supply source to the inside of the aforementioned container member, and the gas is sent from the inside of the aforementioned container member to the aforementioned return path, replacing the part of the aforementioned container member the gas inside.

在本發明中,例如在EFEM之啟動時等,由積極性地自供給源供給非活性氣體者,可迅速地置換容器構件內的氣體。另外,為了將氣體,自容器構件的內部送出於返還路徑,在EFEM之啟動時等,可抑制釋放容器構件內的灰塵至搬送室內等。 In the present invention, the gas in the container member can be quickly replaced by actively supplying the inert gas from the supply source, for example, when the EFEM is activated. In addition, in order to send the gas from the inside of the container member to the return path, it is possible to suppress the release of dust in the container member to the transfer chamber, etc. when the EFEM is activated.

在第8發明之EFEM之氣體置換方法係其特徵為在前述第7發明中,前述搬送室內之前述氣體環境則成為不足特定的氧濃度之後,停止來自前述供給源之前述非活性氣體的供給,之後,將前述搬送室內的氣體導入於前述容器構件的內部而送出至前述返還路徑者。 The gas replacement method of EFEM in the eighth invention is characterized in that in the seventh invention, after the gas atmosphere in the transfer chamber becomes less than a specific oxygen concentration, the supply of the inert gas from the supply source is stopped, Thereafter, the gas in the transfer chamber is introduced into the inside of the container member and sent out to the return path.

在本發明中,對於通常時未進行自供給源對於容器構件之非活性氣體的供給,而由將氣體,自搬送室導入於容器構件內而送出至搬送路徑者,可抑制成本之增大。另外,因可抑制自容器構件對於搬送室內的氣體之逆 流之故,可抑制釋放容器構件內的灰塵至搬送室內者。 In the present invention, an increase in cost can be suppressed by introducing the gas from the transfer chamber into the container member and sending it out to the transfer path without normally supplying the inert gas from the supply source to the container member. In addition, since the gas in the transfer chamber from the container member can be suppressed from being reversed, Because of the flow, the release of the dust in the container member to the transfer chamber can be suppressed.

1:EFEM 1: EFEM

3:搬送機器手臂(自動裝置) 3: Transfer robot arm (automatic device)

12:風扇控制部(控制部) 12: Fan control part (control part)

43:返還路徑 43: Return path

44:FFU(風扇過濾單元) 44:FFU (fan filter unit)

54:對準器(自動裝置) 54: Aligner (automatic device)

61:容器構件 61:Container components

61a:開口 61a: opening

62:支柱(支持部) 62: Pillar (support part)

63:驅動機構 63: Driving mechanism

70:手臂機構(保持部) 70: Arm mechanism (holding part)

71、72、73:手臂構件 71, 72, 73: Arm components

71a、72a、73a:內部空間 71a, 72a, 73a: inner space

71b、72b、73b:流入口 71b, 72b, 73b: inflow ports

71c、72c、73c:流出口 71c, 72c, 73c: outlets

74:機械手 74: Manipulator

77:可動部(切換部) 77: Movable part (switching part)

82a:連接路徑 82a: Connection path

83:風扇 83: fan

87:噴射器 87: Injector

92:容器構件 92:Container components

93:保持部 93: Keeping Department

94:支持部 94: Support Department

95:馬達(驅動機構) 95: Motor (drive mechanism)

98a:連接路徑 98a: Connection path

W:晶圓(基板) W: wafer (substrate)

圖1係有關本實施形態之EFEM及其周邊的概略性平面圖。 Fig. 1 is a schematic plan view of EFEM and its surroundings according to the present embodiment.

圖2係顯示EFEM之電性構成的圖。 Figure 2 is a diagram showing the electrical configuration of the EFEM.

圖3係框體之正面圖。 Figure 3 is the front view of the frame.

圖4係圖3之IV-IV剖面圖。 Fig. 4 is a sectional view of IV-IV in Fig. 3 .

圖5係圖3之V-V剖面圖。 Fig. 5 is a V-V sectional view of Fig. 3 .

圖6係顯示搬送機器手臂之構造的圖。 Fig. 6 is a diagram showing the structure of the transfer robot arm.

圖7係顯示對於循環路徑的氮之供給路徑及排出路徑的模式圖。 Fig. 7 is a schematic diagram showing a nitrogen supply path and a discharge path for a circulation path.

圖8係顯示在搬送機器手臂之氮的送出口的圖。 Fig. 8 is a diagram showing a nitrogen delivery port of a transfer robot arm.

圖9係顯示有關變形例的搬送機器手臂的圖。 FIG. 9 is a diagram showing a transfer robot arm according to a modified example.

圖10係顯示有關其他的變形例之對準器的圖。 FIG. 10 is a diagram showing an aligner related to another modified example.

以下,對於本發明之實施形態,參照圖1~圖8之同時加以說明。然而,說明的方便上,將圖1所示之方向作為前後左右方向。即,將排列EFEM(Equipment Front End Module)1與基板處理裝置6的方向作為前後方向。將EFEM1側作為前方,而將基板處理裝置6側作為後方。與前後方向正交,排列複數之裝載埠4之方向作為左右方 向。另外,與前後方向及左右方向的雙方正交之方向作為上下方向。 Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 8 . However, for convenience of description, the directions shown in FIG. 1 are referred to as front, rear, left, and right directions. That is, the direction in which the EFEM (Equipment Front End Module) 1 and the substrate processing apparatus 6 are arranged is defined as the front-rear direction. Let the EFEM1 side be the front, and the substrate processing apparatus 6 side be the rear. Orthogonal to the front-rear direction, the direction in which multiple loading ports 4 are arranged as the left-right direction Towards. In addition, the direction perpendicular to both the front-back direction and the left-right direction is defined as the up-down direction.

(EFEM及周邊的概略構成) (Schematic composition of EFEM and its surroundings)

首先,對於EFEM1及其周邊的概略構成,使用圖1及圖2而加以說明。 First, the schematic configuration of EFEM1 and its surroundings will be described using FIGS. 1 and 2 .

圖1係有關本實施形態之EFEM1及其周邊的概略性平面圖。圖2係顯示EFEM1之電性構成的圖。如圖1所示,EFEM1係具備:框體2,和搬送機器手臂3,和複數的裝載埠4,和控制裝置5。對於EFEM1之後方係配置有對於晶圓W(本發明之基板)施以特定處裡之基板處理裝置6。EFEM1係經由配置於框體2內之搬送機器手臂3,在載置於裝載埠4之FOUP(Front-Opening Unified Pod)100與基板處理裝置6之間,進行晶圓W的授受。FOUP100係排列複數之晶圓W於上下方向而可收容之容器,而安裝有蓋101於後端部(在前後方向之框體2側的端部)。FOUP100係例如垂釣於設置在裝載埠4上方之未圖示之軌道而行走,經由未圖示之OHT(天頂行走式無人搬送車)而加以搬送。在OHT與裝載埠4之間,進行FOUP100之授受。 Fig. 1 is a schematic plan view of EFEM 1 and its surroundings according to the present embodiment. FIG. 2 is a diagram showing the electrical configuration of EFEM1. As shown in FIG. 1 , the EFEM 1 is equipped with a frame body 2 , a transfer robot arm 3 , a plurality of loading ports 4 , and a control device 5 . Behind the EFEM 1 is arranged a substrate processing device 6 for applying specific treatment to the wafer W (the substrate of the present invention). The EFEM 1 transfers and receives the wafer W between the FOUP (Front-Opening Unified Pod) 100 placed on the loading port 4 and the substrate processing device 6 through the transfer robot arm 3 arranged in the housing 2 . The FOUP 100 is a container capable of accommodating a plurality of wafers W arranged in the vertical direction, and a cover 101 is attached to the rear end (the end on the frame body 2 side in the front-rear direction). For example, the FOUP 100 runs on a rail not shown installed above the loading port 4 , and is transported via an OHT (Unmanned Transport Vehicle) not shown. Between the OHT and the loading port 4, the transfer of FOUP 100 is performed.

框體2係為了連接複數的裝載埠4與基板處理裝置6之構成。對於框體2之內部係形成有對於外部空間而言作為略密閉,搬送晶圓W的搬送室41。當EFEM1稼動時,搬送室41係以氮(本發明之非活性氣體)而加以填滿。框體2係呈氮循環在包含搬送室41之內部空間地加以構成 (對於詳細係後述之)。另外,對於框體2之後端部係安裝有門2a,而搬送室41係隔著門2a而與基板處理裝置6連接。 The housing 2 is configured to connect a plurality of loading ports 4 and a substrate processing apparatus 6 . Inside the frame body 2 is formed a transfer chamber 41 which is slightly airtight with respect to the external space, and transfers the wafer W. As shown in FIG. When the EFEM 1 is in operation, the transfer chamber 41 is filled with nitrogen (the inert gas of the present invention). The frame body 2 is constructed so that nitrogen circulates in the inner space including the transfer chamber 41 (details are described later). Moreover, the door 2a is attached to the rear end part of the housing|casing 2, and the transfer chamber 41 is connected to the substrate processing apparatus 6 through the door 2a.

搬送機器手臂3係配置於搬送室41內,進行晶圓W的搬送。搬送機器手臂3係具有:固定位置之基台部60(參照圖3),和配置於基台部60之上方,保持晶圓W而進行搬送的手臂機構70(參照圖3),和機器手臂控制部11(參照圖2)。搬送機器手臂3係主要進行取出FOUP100內之晶圓W而交付至基板處理裝置6之動作,或接受經由基板處理裝置6所處理之晶圓W而返回至FOUP100之動作。 The transfer robot arm 3 is arranged in the transfer chamber 41 to transfer the wafer W. The transfer robot arm 3 is provided with: a base portion 60 (see FIG. 3 ) at a fixed position, and an arm mechanism 70 (see FIG. 3 ) that is arranged above the base portion 60 to hold and transfer the wafer W, and a robot arm The control unit 11 (refer to FIG. 2 ). The transfer robot arm 3 mainly performs the operation of taking out the wafer W in the FOUP 100 and delivering it to the substrate processing device 6 , or receiving the wafer W processed by the substrate processing device 6 and returning it to the FOUP 100 .

裝載埠4係為了載置FOUP100(參照圖5)之構成。複數之裝載埠4係各後端部則呈沿著框體2之前側的隔壁地,排列配置於左右方向。裝載埠4係可置換FOUP100內之環境氣為氮等之非活性氣體地加以構成。對於裝載埠4之後端部係設置有門4a。門4a係經由未圖示的門開閉機構而加以開閉。門4a係可解除FOUP100的蓋101的鎖,且可保持蓋101地加以構成。在門4a保持解除鎖的蓋101之狀態,由門移動機構則開啟門4a者,開啟蓋101。經由此,FOUP100內之晶圓W則成為可經由搬送機器手臂3而取出。 The loading port 4 is configured to load the FOUP 100 (see FIG. 5 ). The plurality of loading ports 4 are arranged in a row in the left-right direction along the partition wall on the front side of the frame body 2 at their respective rear ends. The loading port 4 is configured to replace the ambient gas in the FOUP 100 with an inert gas such as nitrogen. A door 4a is provided for the rear end of the loading port 4 . The door 4a is opened and closed by an unillustrated door opening and closing mechanism. The door 4a is configured so that the cover 101 of the FOUP 100 can be unlocked and the cover 101 can be held. When the door 4a remains in the state of unlocking the cover 101, and the door 4a is opened by the door moving mechanism, the cover 101 is opened. Through this, the wafer W in the FOUP 100 can be taken out via the transfer robot arm 3 .

如圖2所示,控制裝置5係與搬送機器手臂3之機器手臂控制部11,裝載埠4之控制部(未圖示),基板處理裝置6之控制部(未圖示)加以電性連接,而進行與此等之控制部的通信。另外,控制裝置5係與設置於框體2內 之氧濃度計55,壓力計56,濕度計57等加以電性連接,將此等之計測機器的計測結果進行收訊,把握有關框體2內之環境氣的資訊。另外,控制裝置5係與供給閥112及排出閥113(後述)加以電性連接,而由調節此等閥的開度者,適宜調節框體2內之環境氣。 As shown in Figure 2, the control device 5 is electrically connected to the robot arm control part 11 of the transfer robot arm 3, the control part (not shown) of the loading port 4, and the control part (not shown) of the substrate processing device 6. , and communicate with these control units. In addition, the control device 5 is arranged in the frame body 2 The oxygen concentration meter 55, the pressure meter 56, the hygrometer 57, etc. are electrically connected, and the measurement results of these measuring devices are received to grasp the information about the ambient air in the frame body 2. In addition, the control device 5 is electrically connected to the supply valve 112 and the discharge valve 113 (described later), and by adjusting the opening of these valves, the ambient air in the frame body 2 is adjusted appropriately.

如圖1所示,基板處理裝置6係例如,具有加載互鎖真空室6a,和處理室6b。加載互鎖真空室6a係隔著框體2的門2a而與搬送室41加以連接,為了暫時使晶圓W待機的室。處理室6b係隔著門6c而與加載互鎖真空室6a加以連接。在處理室6b中,經由未圖示之處理機構,對於晶圓W施以特定的處理。 As shown in FIG. 1 , the substrate processing apparatus 6 includes, for example, a load-lock vacuum chamber 6 a and a processing chamber 6 b. The load lock vacuum chamber 6a is connected to the transfer chamber 41 through the door 2a of the frame body 2, and is a chamber for temporarily holding the wafer W on standby. The processing chamber 6b is connected to the load-lock vacuum chamber 6a via a door 6c. In the processing chamber 6b, specific processing is performed on the wafer W via a processing mechanism not shown.

(框體及其內部的構成) (frame and its internal composition)

接著,對於框體2及其內部的構成,使用圖3~圖5加以說明。圖3係框體2之正面圖。圖4係圖3之IV-IV的剖面圖。圖5係圖3之V-V的剖面圖。然而,在圖3中係省略隔壁的圖示。另外,在圖5中,省略搬送機器手臂3等之圖示。 Next, the frame body 2 and its internal configuration will be described using FIGS. 3 to 5 . FIG. 3 is a front view of the frame body 2 . Fig. 4 is a sectional view of IV-IV in Fig. 3 . Fig. 5 is a cross-sectional view of V-V in Fig. 3 . However, illustration of the partition wall is omitted in FIG. 3 . In addition, in FIG. 5, illustration of the conveyance robot arm 3 etc. is abbreviate|omitted.

框體2係作為全體而為長方體狀。如圖3~圖5所示,框體2係具有:柱21~26,和隔壁31~36。於延伸於上下方向的柱21~26,安裝有隔壁31~36,而框體2之內部空間則對於外部空間而言作為略密閉。 The frame body 2 has a rectangular parallelepiped shape as a whole. As shown in FIGS. 3 to 5 , the frame body 2 has: columns 21 to 26 and partition walls 31 to 36 . Partition walls 31 to 36 are installed on the columns 21 to 26 extending in the up and down direction, and the internal space of the frame body 2 is slightly closed to the external space.

更具體而言,如圖4所示,在框體2之前端部中,柱21~24則自左方至右方依序排列而加以立設配置。 配置於柱21與柱24之間的柱22,23係較柱21及柱24為短。於框體2之後端部的左右兩側,立設配置有柱25,26。 More specifically, as shown in FIG. 4 , in the front end portion of the frame body 2 , columns 21 to 24 are arranged in order from left to right and erected. The columns 22 and 23 disposed between the columns 21 and 24 are shorter than the columns 21 and 24 . Columns 25 and 26 are vertically arranged on the left and right sides of the rear end of the frame body 2 .

如圖3所示,於框體2之底部配置有隔壁31,而於天頂部配置有隔壁32。如圖4所示,各於前端部配置有隔壁33,而於後端部配置有隔壁34,於左端部配置有隔壁35,於右端部配置有隔壁36。對於框體2之右端部係設置有配置有後述之對準器54的載置部53(參照圖3)。對準器54及載置部53亦收容於框體2之內側(參照圖4)。 As shown in FIG. 3 , a partition wall 31 is arranged at the bottom of the frame body 2 , and a partition wall 32 is arranged at the top of the frame. As shown in FIG. 4 , a partition wall 33 is arranged at the front end, a partition wall 34 is arranged at the rear end, a partition wall 35 is arranged at the left end, and a partition wall 36 is arranged at the right end. The mounting part 53 (refer FIG. 3) in which the aligner 54 mentioned later is arrange|positioned is provided in the right end part of the housing|casing 2. As shown in FIG. The aligner 54 and the mounting portion 53 are also accommodated inside the frame body 2 (see FIG. 4 ).

如圖3及圖5所示,對於框體2內之上側部分(柱22,23的上方),係配置有延伸於水平方向之支持板37。經由此,框體2之內部係分為形成於下側之前述的搬送室41,和形成於上側之FFU設置室42。對於FFU設置室42內係配置有後述之FFU(風扇過濾單元)44。對於在支持板37之前後方向的中央部,係形成有連通搬送室41與FFU設置室42之開口37a。然而,框體2之隔壁33~36係分為搬送室41用之下部壁與FFU設置室42用之上部壁(例如,參照在圖5之前端部的隔壁33a,33b及後端部之隔壁34a,34b)。 As shown in FIG. 3 and FIG. 5 , a support plate 37 extending in the horizontal direction is disposed on the upper part (above the columns 22 , 23 ) inside the frame body 2 . Through this, the inside of the housing 2 is divided into the aforementioned transfer chamber 41 formed on the lower side, and the FFU installation chamber 42 formed on the upper side. In the FFU installation chamber 42, an FFU (Fan Filter Unit) 44 which will be described later is disposed. An opening 37a that communicates with the transfer chamber 41 and the FFU installation chamber 42 is formed in the center portion in the front-rear direction of the support plate 37 . However, the partition walls 33 to 36 of the frame body 2 are divided into the lower wall for the transfer chamber 41 and the upper wall for the FFU installation chamber 42 (for example, refer to the partition walls 33a, 33b at the front end of FIG. 5 and the partition at the rear end). 34a, 34b).

接著,對於框體2之內部的構成加以說明。具體而言,對於為了在框體2內使氮循環之構成及其周邊構成,以及配置於搬送室41內之機器等加以說明。 Next, the internal configuration of the housing 2 will be described. Specifically, the configuration for circulating nitrogen in the frame body 2 and its peripheral configuration, as well as devices and the like arranged in the transfer chamber 41 will be described.

對於為了在框體2內使氮循環之構成及其周邊構成,使用圖3~圖5加以說明。如圖5所示,對於框體2之內部係形成有為了使氮循環之循環路徑40。循環路徑40 係經由搬送室41,和FFU設置室42,和返還路徑43而加以構成。作為概要,在循環路徑40中,自FFU設置室42,將清淨的氮送出於下方,到達至搬送室41之下端部之後,成為通過返還路徑43而上升,呈返回於FFU設置室42(參照圖5之箭頭)。以下,詳細說明。 The configuration for circulating nitrogen in the housing 2 and its peripheral configuration will be described using FIGS. 3 to 5 . As shown in FIG. 5 , a circulation path 40 for circulating nitrogen is formed inside the frame body 2 . Cycle path 40 It is constituted via a transfer chamber 41 , an FFU installation chamber 42 , and a return path 43 . As a summary, in the circulation path 40, from the FFU installation chamber 42, the clean nitrogen is sent out below, and after reaching the lower end of the transfer chamber 41, it rises through the return path 43 and returns to the FFU installation chamber 42 (refer to Arrow in Figure 5). Hereinafter, it will describe in detail.

對於FFU設置室42係設置有配置於支持板37上之FFU44,和配置於FFU44上之化學過濾器45。FFU44係具有風扇44a與過濾器44b。FFU44係經由風扇44a而將FFU設置室42內的氮送出於下方之同時,經由過濾器44b而除去含於氮之灰塵(未圖示)。化學過濾器45係例如,為了除去自基板處理裝置6帶入於循環路徑40內之活性氣體等之構成。經由FFU44及化學過濾器45所清淨化的氮係自FFU設置室42,藉由形成於支持板37之開口37a而送出於搬送室41。送出於搬送室41的氮係形成層流,流動於下方。 The FFU installation chamber 42 is provided with an FFU 44 arranged on the support plate 37 and a chemical filter 45 arranged on the FFU 44 . The FFU 44 has a fan 44a and a filter 44b. The FFU 44 sends nitrogen in the FFU installation chamber 42 downward through the fan 44a, and removes dust (not shown) contained in nitrogen through the filter 44b. The chemical filter 45 is, for example, configured to remove active gas or the like brought into the circulation path 40 from the substrate processing apparatus 6 . The nitrogen purified by the FFU 44 and the chemical filter 45 is sent out of the transfer chamber 41 from the FFU installation chamber 42 through the opening 37 a formed in the support plate 37 . The nitrogen system sent out of the transfer chamber 41 forms a laminar flow and flows downward.

返還路徑43係形成於配置於框體2之前端部的柱21~24(在圖5中係柱23)及支持板37。即,柱21~24係成為中空,而各形成有氮所通過的空間21a~24a(參照圖4)。也就是,空間21a~24a則各構成返還路徑43。返還路徑43係經由形成於支持板37之前端部的開口37b而與FFU設置室42連通(參照圖5)。 The return path 43 is formed on the columns 21 to 24 (the bollard 23 in FIG. 5 ) and the support plate 37 arranged at the front end of the housing 2 . That is, the columns 21 to 24 are hollow, and spaces 21a to 24a through which nitrogen passes are formed respectively (see FIG. 4 ). That is, the spaces 21 a to 24 a each constitute the return path 43 . The return path 43 communicates with the FFU installation chamber 42 through the opening 37b formed in the front end portion of the support plate 37 (see FIG. 5 ).

對於返還路徑43,參照圖5之同時更具體地加以說明。然而,對於圖5係顯示有柱23,但對於其他的柱21,22,24亦為相同。對於柱23之下端部,係安裝有為 了容易使搬送室41內的氮流入至返還路徑43(空間23a)之導入導管27。對於導入導管27係形成有開口27a,到達至搬送室41之下端部的氮則成為可流入至返還路徑43。對於導入導管27之上部,係形成有越朝向下方越擴散於後方之擴大部27b。對於擴大部27b之下方係配置有風扇46。風扇46係經由未圖示之馬達而加以驅動,將到達至搬送室41之下端部的氮,吸入於返還路徑43(在圖5中係空間23a)而送出至上方,將氮返回至FFU設置室42。返回至FFU設置室42的氮係經由FFU44或化學過濾器45而加以清淨化,再次送出於搬送室41。由以上作為,氮則成為可循環在循環路徑40內。 The return path 43 will be described in more detail with reference to FIG. 5 . However, column 23 is shown in FIG. 5 , but the same applies to the other columns 21 , 22 , 24 . For the lower end of column 23, the system is installed as This facilitates the nitrogen in the transfer chamber 41 to flow into the introduction duct 27 of the return path 43 (space 23a). An opening 27 a is formed in the introduction duct 27 , and the nitrogen that has reached the lower end of the transfer chamber 41 can flow into the return path 43 . On the upper portion of the introduction duct 27, an enlarged portion 27b that spreads backward as it goes downward is formed. A fan 46 is disposed below the enlarged portion 27b. The fan 46 is driven by a motor not shown, sucks the nitrogen that has reached the lower end of the transfer chamber 41 into the return path 43 (space 23a in FIG. 5 ) and sends it out to the top, and returns the nitrogen to the FFU installation. Room 42. The nitrogen system returned to the FFU installation chamber 42 is cleaned by passing through the FFU 44 or the chemical filter 45 , and sent out of the transfer chamber 41 again. From the above, nitrogen can be circulated in the circulation path 40 .

另外,如圖3所示,對於FFU設置室42之側部,係連接有為了供給氮於循環路徑40內之供給管47。供給管47係連接於氮的供給源111。對於供給管47之途中部,係設置有可變更氮的每單位時間之供給量的供給閥112。另外,如圖5所示,對於搬送室41之前端部係連接有為了排出循環路徑40內的氣體的排出管48。排出管48係連結於外部空間。對於排出管48之途中部,係設置有可變更循環路徑40內之氣體之每單位時間之排出量的排出閥113。供給閥112及排出閥113係與控制裝置5電性連接(參照圖2)。經由此,成為可適宜供給及排出氮於循環路徑40之情況。例如,循環路徑40的氧濃度上升之情況,自供給源111,藉由供給管47而暫時性地多供給氮於循環路徑40,藉由排出管48而與氮同時排出氧者,可降低氧濃度。 In addition, as shown in FIG. 3 , a supply pipe 47 for supplying nitrogen into the circulation path 40 is connected to the side of the FFU installation chamber 42 . The supply pipe 47 is connected to a nitrogen supply source 111 . In the middle of the supply pipe 47, a supply valve 112 capable of changing the supply amount of nitrogen per unit time is provided. In addition, as shown in FIG. 5 , a discharge pipe 48 for discharging gas in the circulation path 40 is connected to the front end of the transfer chamber 41 . The discharge pipe 48 is connected to the external space. In the middle of the discharge pipe 48, a discharge valve 113 capable of changing the discharge amount of the gas in the circulation path 40 per unit time is provided. The supply valve 112 and the discharge valve 113 are electrically connected to the control device 5 (see FIG. 2 ). Through this, nitrogen can be appropriately supplied and discharged to the circulation path 40 . For example, when the oxygen concentration in the circulation path 40 rises, nitrogen is temporarily supplied to the circulation path 40 from the supply source 111 through the supply pipe 47, and oxygen is discharged simultaneously with the nitrogen through the discharge pipe 48, thereby reducing the oxygen concentration. concentration.

接著,對於配置於搬送室41內的機器等,使用圖3及圖4而加以說明。如圖3及圖4所示,對於搬送室41內係配置有上述之搬送機器手臂3,和控制部收容箱51,和計測機器收容箱52,和對準器54。對於搬送機器手臂3的構造係後述之。控制部收容箱51係例如,設置於搬送機器手臂3之基台部60(參照圖3)的左方,呈未與手臂機構70(參照圖3)干擾地加以配置。對於控制部收容箱51係收容有上述之機器手臂控制部11。計測機器收容箱52係例如,配置於基台部60之右方,呈未與手臂機構70干擾地加以配置。對於計測機器收容箱52係成為收容有上述之氧濃度計55,壓力計56,濕度計57等之計測機器(參照圖2)。 Next, the equipment etc. arrange|positioned in the transfer chamber 41 are demonstrated using FIG.3 and FIG.4. As shown in FIGS. 3 and 4 , the above-mentioned transfer robot arm 3 , control unit storage box 51 , measurement device storage box 52 , and aligner 54 are arranged in the transfer chamber 41 . The structure of the transfer robot arm 3 will be described later. The control unit housing box 51 is, for example, provided on the left side of the base unit 60 (see FIG. 3 ) of the transfer robot arm 3 and arranged so as not to interfere with the arm mechanism 70 (see FIG. 3 ). The above-mentioned robotic arm control unit 11 is accommodated in the control unit housing box 51 . The measuring equipment storage box 52 is, for example, arranged on the right side of the base portion 60 and arranged so as not to interfere with the arm mechanism 70 . The measuring device storage box 52 is a measuring device in which the above-mentioned oxygen concentration meter 55, pressure gauge 56, hygrometer 57, etc. are housed (see FIG. 2).

對準器54係為了檢出保持於搬送機器手臂3之手臂機構70(參照圖3)之晶圓W的保持位置,自目標保持位置偏移多少之構成。例如,在經由上述之OHT(未圖示)所搬送之FOUP100(參照圖1)之內部中,晶圓W則有微妙移動之虞。因此,搬送機器手臂3係將自FOUP100取出之處理前的晶圓W,暫時載置於對準器54。對準器54係計測晶圓W經由搬送機器手臂3而保持在自目標保持位置偏移多少之位置,將計測結果送訊至機器手臂控制部11。機器手臂控制部11係依據上述計測結果,補正經由手臂機構70之保持位置,控制手臂機構70而使晶圓W保持在目標保持位置,搬送至基板處理裝置6之加載互鎖真空室6a。經由此,可正常地進行經由基板處理裝置6之晶圓W的處理。 The aligner 54 is configured to detect how much the holding position of the wafer W held by the arm mechanism 70 (see FIG. 3 ) of the transfer robot arm 3 deviates from the target holding position. For example, in the inside of FOUP 100 (see FIG. 1 ) conveyed via the above-mentioned OHT (not shown), wafer W may move slightly. Therefore, the transfer robot 3 temporarily places the unprocessed wafer W taken out from the FOUP 100 on the aligner 54 . The aligner 54 measures how much the wafer W is held at a position deviated from the target holding position via the transfer robot 3 , and sends the measurement result to the robot control unit 11 . The robot arm control unit 11 corrects the holding position via the arm mechanism 70 based on the above measurement results, controls the arm mechanism 70 to hold the wafer W at the target holding position, and transfers the wafer W to the load lock chamber 6 a of the substrate processing apparatus 6 . Through this, the processing of the wafer W via the substrate processing apparatus 6 can be performed normally.

(搬送機器手臂的構造) (Structure of the transfer robot arm)

接著,對於搬送機器手臂3(本發明之自動裝置)之構造,使用圖6而加以說明。圖6(a)係顯示搬送機器手臂3之內部構造的剖面圖。圖6(b)係後述之機械手74的平面圖。如上述,搬送機器手臂3係具有基台部60,和手臂機構70(本發明之保持部)。 Next, the structure of the transfer robot arm 3 (automatic device of the present invention) will be described using FIG. 6 . FIG. 6( a ) is a cross-sectional view showing the internal structure of the transfer robot arm 3 . Fig. 6(b) is a plan view of a manipulator 74 described later. As mentioned above, the transfer robot arm 3 has the base part 60, and the arm mechanism 70 (holding part of this invention).

如圖6(a)所示,對於基台部60,係設置有容器構件61,和支柱62,和驅動機構63。自容器構件61內突出於上方的支柱62則支持手臂機構70。支柱62係經由驅動機構63而加以上下驅動。 As shown in FIG. 6( a ), the base portion 60 is provided with a container member 61 , a support 62 , and a drive mechanism 63 . The support 62 protruding upward from the container member 61 supports the arm mechanism 70 . The support column 62 is driven up and down via a drive mechanism 63 .

容器構件61係延伸於上下方向之筒狀的構件。容器構件61係固定於搬送室41內。對於容器構件61之上面係形成有為了使支柱62插通之開口61a。支柱62係自容器構件61之內側通過開口61a而突出於上方的柱狀之構件。對於支柱62與開口61a之間係隔有間隙。對於支柱62之上端部係安裝有手臂機構70。 The container member 61 is a cylindrical member extending in the vertical direction. The container member 61 is fixed in the transfer chamber 41 . On the upper surface of the container member 61, an opening 61a for inserting the support 62 is formed. The pillar 62 is a columnar member protruding upward from the inner side of the container member 61 through the opening 61 a. There is a gap between the pillar 62 and the opening 61a. An arm mechanism 70 is installed on the upper end of the pillar 62 .

驅動機構63係作為一例,具有馬達64,和皮帶65,和滾動螺旋軸66,和滑件67。馬達64之動力則藉由皮帶65而傳達至滾動螺旋軸66,而延伸於上下方向的滾動螺旋軸66則旋轉。當滾動螺旋軸66旋轉時,螺合於滾動螺旋軸66之滑件67則上下移動,使支柱62上下移動。 The drive mechanism 63 has a motor 64 , a belt 65 , a rolling screw shaft 66 , and a slider 67 as an example. The power of the motor 64 is transmitted to the rolling screw shaft 66 through the belt 65, and the rolling screw shaft 66 extending in the vertical direction rotates. When the rolling screw shaft 66 rotates, the slide member 67 screwed on the rolling screw shaft 66 moves up and down, so that the pillar 62 moves up and down.

馬達64係具有旋轉軸64a之一般的交流馬達。馬達64係經由機器手臂控制部11(參照圖2)而加以控制。於旋轉軸64a之前端部,安裝有滑輪(未圖示),捲掛有 皮帶65。滾動螺旋軸66係延伸於上下方向。對於滾動螺旋軸66之下端部,安裝有滑輪(未圖示),捲掛有皮帶65。對於滾動螺旋軸66係形成有外螺紋(未圖示)。滑件67係支持支柱62之構件。對於滑件67,係形成有與滾動螺旋軸66之外螺紋螺合之內螺紋(未圖示)。滑件67係伴隨著滾動螺旋軸66之旋轉,沿著延伸於上下方向的導件(未圖示)而成為可上下移動。經由具有以上構成之驅動機構63,而上下驅動支柱62。經由此,可將在FOUP100內,收容於在上下方向中之個別位置之晶圓W,經由手臂機構70而保持者。 The motor 64 is a general AC motor having a rotating shaft 64a. The motor 64 is controlled via the robot arm control unit 11 (see FIG. 2 ). At the front end of the rotating shaft 64a, a pulley (not shown) is installed, and a Belt 65. The rolling screw shaft 66 extends in the up and down direction. A pulley (not shown) is attached to the lower end of the rolling screw shaft 66, and a belt 65 is wound around it. External threads (not shown) are formed on the rolling screw shaft 66 . The slider 67 is a member supporting the pillar 62 . The slider 67 is formed with an internal thread (not shown) that is screwed with the external thread of the rolling screw shaft 66 . The slider 67 is movable up and down along a guide (not shown) extending in the up-down direction along with the rotation of the rolling screw shaft 66 . The pillar 62 is driven up and down via the drive mechanism 63 having the above configuration. Through this, the wafers W accommodated at individual positions in the vertical direction in the FOUP 100 can be held via the arm mechanism 70 .

如圖6(a)所示,手臂機構70係作為一例,具有3個手臂構件71~73,和2個機械手74。手臂機構70係經由支柱62而自下方加以支持,而由手臂構件71~73旋轉者,使保持晶圓W的機械手74作水平移動。然而,機械手74係僅設置1個亦可。 As shown in FIG. 6( a ), the arm mechanism 70 has three arm members 71 to 73 and two manipulators 74 as an example. The arm mechanism 70 is supported from below via the pillars 62, and when rotated by the arm members 71 to 73, the manipulator 74 holding the wafer W moves horizontally. However, only one robot arm 74 series may be provided.

手臂構件71~73係延伸於特定方向之中空的構件。也就是,對於手臂構件71、72、73係各形成有內部空間71a、72a、73a。然而,內部空間71a、72a、73a係藉由間隙而連通。手臂構件71、72、73係依此順序,自下方加以配置。手臂構件71之一端係可旋轉地連結於支柱62,對於另一端部係可旋轉地連結手臂構件72之一端部。對於手臂構件72之另一端部係可旋轉地連結手臂構件73之一端部。對於手臂構件73之另一端部係可旋轉地連結機械手74。手臂構件71~73及機械手74係各經由未圖示之馬達而旋轉驅動於水平方向。 The arm members 71-73 are hollow members extending in a specific direction. That is, internal spaces 71 a , 72 a , and 73 a are formed for each of the arm members 71 , 72 , and 73 . However, the internal spaces 71a, 72a, and 73a are communicated by gaps. The arm members 71, 72, 73 are arranged in this order from below. One end of the arm member 71 is rotatably connected to the strut 62 , and the other end is rotatably connected to one end of the arm member 72 . One end of the arm member 73 is rotatably connected to the other end of the arm member 72 . A manipulator 74 is rotatably connected to the other end of the arm member 73 . The arm members 71 to 73 and the manipulator 74 are each driven to rotate in the horizontal direction by a motor not shown.

如圖6(b)所示,機械手74係具有:載置構件75,和突起76a~76d,和可動部77(本發明之切換部)。於延伸於機械手74之延伸存在方向(參照圖6(b))之載置構件75上,載置有晶圓W。晶圓W係經由配置於載置構件75之前端側的突起76a、76b,和配置於載置構件75之基端側的突起76c、76d,和設置於可動部77之前端部之按壓部78而加以把持。由如此作為,經由機械手74而保持晶圓W。可動部77係經由內藏於機械手74之套筒79,使其移動於機械手74之延伸存在方向。套筒79的桿(未圖示)係經由來自與上述之供給源111(參照圖3)另外的供給源114的氮之供給,可伸縮於延伸存在方向地加以構成。於套筒79供給氮,而在按壓部78位置於前端側之狀態(參照圖6(b)之實線)中,經由按壓部78而按壓晶圓W而加以保持(保持狀態)。在未供給氮於套筒79,而按壓部78位置於基端側之狀態(參照圖6(b)之二點鎖鏈線)中,解除保持狀態(解除狀態)。 As shown in FIG. 6( b ), the manipulator 74 has a mounting member 75 , protrusions 76 a to 76 d , and a movable portion 77 (switching portion of the present invention). The wafer W is placed on the placement member 75 extending in the direction in which the robot arm 74 extends (see FIG. 6( b )). The wafer W passes through the protrusions 76a, 76b disposed on the front end side of the mounting member 75, the protrusions 76c, 76d disposed on the base end side of the mounting member 75, and the pressing portion 78 disposed on the front end portion of the movable portion 77. And hold on to it. In this way, the wafer W is held via the robot arm 74 . The movable part 77 moves in the extending direction of the manipulator 74 through the sleeve 79 built in the manipulator 74 . The rod (not shown) of the sleeve 79 is configured to be expandable and contractible in the direction in which it extends through the supply of nitrogen from a supply source 114 separate from the above-mentioned supply source 111 (see FIG. 3 ). Nitrogen is supplied to the sleeve 79, and the wafer W is pressed and held via the pressing portion 78 in a state where the pressing portion 78 is positioned at the front end (see the solid line in FIG. 6(b)) (holding state). In the state where nitrogen is not supplied to the sleeve 79 and the pressing portion 78 is positioned on the proximal side (see the two-point chain line in FIG. 6( b ), the holding state (released state) is released.

在將具有以上構成之搬送機器手臂3適用於EFEM1時,產生有以下的課題。首先,在基台部60中,經由驅動機構63而上下驅動支柱62者,於容器構件61之內部產生有灰塵。所產生的灰塵係有穿通開口61a與支柱62之間的間隙而漏出於搬送室41之虞。特別是如圖6(a)之箭頭所示,在經由驅動機構63,支柱62則呈退縮於下方地加以驅動時,容器構件61內的氮則由推出於上方者,含有灰塵的氮則有藉由上述間隙而散布於搬送室41之虞。 When the transfer robot arm 3 having the above configuration is applied to the EFEM1, the following problems arise. First, in the base portion 60 , when the pillar 62 is driven up and down via the drive mechanism 63 , dust is generated inside the container member 61 . The generated dust may leak out of the transfer chamber 41 through the gap between the opening 61 a and the pillar 62 . Especially as shown by the arrow in Fig. 6 (a), when passing through the driving mechanism 63, the support 62 was then retracted and driven below, the nitrogen in the container member 61 was then pushed out to the top, and the nitrogen containing dust then had There is a risk of spreading in the transfer chamber 41 through the above-mentioned gap.

另外,在經由套筒79而驅動機械手74之可動部77時,有產生灰塵於搬送室41內之虞。為了除去此灰塵,而成為進行排氣之構成時,自搬送室41內排出氮之故,其部分,產生必須自供給源111補充氮,而有成本增大之虞。 In addition, when the movable portion 77 of the manipulator 74 is driven through the sleeve 79 , dust may be generated in the transfer chamber 41 . In order to remove the dust, nitrogen is exhausted from the transfer chamber 41 when the exhaust gas is configured. As a result, it is necessary to replenish nitrogen from the supply source 111, which may increase the cost.

另外,在手臂構件71~73之內部空間71a~73a則對於搬送室41而言未完全密閉之構成中,例如,在維護時大氣解放搬送室41之情況,內部空間71a~73a亦被大氣解放,而有氧或水分進入之虞。此情況,維護後之再稼動時,當對於內部空間71a~73a之氮置換花上時間時,而有生產效率下降之虞。因此,EFEM1係為了解決此等之問題,而具有如以下之構成。 In addition, in the structure in which the internal spaces 71a-73a of the arm members 71-73 are not completely sealed with respect to the transfer chamber 41, for example, when the atmosphere is released from the transfer chamber 41 during maintenance, the internal spaces 71a-73a are also released by the atmosphere. , while there is a risk of oxygen or moisture entering. In this case, when it takes time to replace nitrogen in the inner spaces 71 a to 73 a during reoperation after maintenance, there is a possibility that the production efficiency may be lowered. Therefore, EFEM1 has the following configurations in order to solve these problems.

(在搬送機器手臂中的氮之排出路徑等) (Nitrogen discharge path in the transfer robot arm, etc.)

對於在搬送機器手臂3中的氮之排出路徑等,使用圖7及圖8加以說明。 The nitrogen discharge path and the like in the transfer robot arm 3 will be described with reference to FIGS. 7 and 8 .

圖7係顯示對於循環路徑40的氮之供給路徑及排出路徑的模式圖。圖8係顯示在搬送機器手臂3之氮的排出口的圖。 FIG. 7 is a schematic diagram showing a supply path and a discharge path of nitrogen to the circulation path 40 . FIG. 8 is a diagram showing a nitrogen discharge port of the transfer robot arm 3 .

首先,對於為了自搬送機器手臂3之容器構件61內,排出含有灰塵的氮之構成加以說明。如圖7,8所示,對於容器構件61之側部,係形成有為了送出氮於循環路徑40之送出口61b。更且,對於框體2內,係設置有為了自容器構件61內送出氮於循環路徑40之送出部81。送出部 81係具有:經由連接管82而加以形成之連接路徑82a,和風扇83(本發明之風扇),和馬達84(本發明之風扇驅動裝置)。連接路徑82a係連接容器構件61與返還路徑43。連接路徑82a係加以連接於自容器構件61之送出口61b延伸,在氮的流動方向之返還路徑43之上流側端部(更具體而言,係較風扇46為上流側)。換言之,容器構件61與返還路徑43係未藉由搬送室41而直接連接。風扇83係配置於送出口61b之附近,而經由馬達84而以一定的旋轉速度加以旋轉驅動。 First, the configuration for discharging nitrogen including dust from the container member 61 of the transfer robot arm 3 will be described. As shown in FIGS. 7 and 8 , a delivery port 61 b for sending nitrogen to the circulation path 40 is formed on the side of the container member 61 . Furthermore, in the frame body 2, a sending part 81 for sending nitrogen from the inside of the container member 61 to the circulation path 40 is provided. sending department 81 is provided with: a connecting path 82a formed through a connecting pipe 82, a fan 83 (the fan of the present invention), and a motor 84 (the fan driving device of the present invention). The connection path 82 a connects the container member 61 and the return path 43 . The connection path 82a is connected to the upstream side end of the return path 43 (more specifically, the upstream side of the fan 46 ) extending from the delivery port 61b of the container member 61 in the flow direction of nitrogen. In other words, the container member 61 and the return path 43 are not directly connected through the transfer chamber 41 . The fan 83 is arranged in the vicinity of the delivery port 61b, and is rotationally driven at a constant rotational speed via a motor 84 .

經由如以上之構成,藉由送出口61b而送出容器構件61之內部的氮於返還路徑42(參照圖8之箭頭201,202)。經由此,加以抑制經由在容器構件61內所產生之灰塵而污染搬送室41者。另外,容器構件61內的氮係因未直接排出於框體2之外部之故,無須馬上補充自容器構件61排出部分的氮,而加以抑制氮的供給量之增大。另外,因經由風扇83所生成之氣流,確實地將容器構件61內的氮傳送至返還路徑之故,加以抑制容器構件61內的氮則自開口61a(參照圖6(a))與支柱62(參照圖6(a))之間的間隙漏出之情況。 With the above configuration, the nitrogen inside the container member 61 is sent out to the return path 42 through the sending port 61b (see arrows 201 and 202 in FIG. 8 ). Thereby, contamination of the transfer chamber 41 via the dust generated in the container member 61 is suppressed. In addition, since the nitrogen system in the container member 61 is not directly discharged to the outside of the frame body 2, it is not necessary to replenish the nitrogen discharged from the container member 61 immediately, thereby suppressing an increase in the supply amount of nitrogen. In addition, since the nitrogen in the container member 61 is reliably sent to the return path through the airflow generated by the fan 83, the nitrogen in the container member 61 is suppressed from being released from the opening 61a (see FIG. 6(a)) and the pillar 62. (Refer to Figure 6(a)).

接著,對於為了除去在經由套筒79而驅動機械手74之可動部77時所產生之灰塵的構成,加以說明。如圖7所示,EFEM1係具備:吸引除去經由套筒79之動作所產生的灰塵之吸引部86。吸引部86係具有:經由自與上述之供給源111,114(參照圖6(b))另外的供給源115(本發明 之灰塵除去用的非活性氣體供給源)所供給的氮,吸引除去灰塵的噴射器87。噴射器87係具有噴嘴87a,和擴散器87b,和吸引口87c。噴射器87係經由自噴嘴87a朝向擴散器87b而噴出的氮之流動,使負壓產生於吸引口87c。噴嘴87a係與流動有自供給源115所供給的氮之供給路徑88a加以連接。擴散器87b係與為了送出氮於循環路徑40之送出路徑88b。送出路徑88b之下游側端部係連接於連接路徑82a之途中部,而與送出部81合流。吸引口87c係與自套筒79之附近延伸的吸引路徑88c加以連接。 Next, a configuration for removing dust generated when the movable portion 77 of the manipulator 74 is driven through the sleeve 79 will be described. As shown in FIG. 7 , the EFEM 1 is provided with a suction unit 86 that sucks and removes dust generated by the operation of the sleeve 79 . The suction part 86 is provided with: via from the above-mentioned supply source 111,114 (referring to Fig. The nitrogen supplied from the inert gas supply source for dust removal) sucks the ejector 87 for dust removal. The ejector 87 has a nozzle 87a, a diffuser 87b, and a suction port 87c. The injector 87 generates negative pressure at the suction port 87c through the flow of nitrogen ejected from the nozzle 87a toward the diffuser 87b. The nozzle 87a is connected to a supply path 88a through which nitrogen supplied from the supply source 115 flows. The diffuser 87b is connected to the delivery path 88b for sending nitrogen to the circulation path 40 . The downstream side end part of the delivery path 88b is connected to the middle part of the connection path 82a, and merges with the delivery part 81. As shown in FIG. The suction port 87c is connected to a suction path 88c extending from the vicinity of the sleeve 79 .

在具有以上的構成之吸引部86中,由自供給源115供給氮於噴射器87者,藉由吸引路徑88c而吸引經由套筒79之動作所產生之灰塵。更且,所供給之氮係與所吸引之灰塵同時,藉由送出路徑88b而流入至連接路徑82a,再送出於返還路徑43。也就是,氮係未直接排出於框體2之外部空間而暫且流入至循環路徑40內。 In the suction unit 86 having the above configuration, the nitrogen supplied from the supply source 115 to the injector 87 sucks the dust generated by the operation of the sleeve 79 through the suction path 88c. Moreover, the supplied nitrogen system flows into the connection path 82a through the delivery path 88b at the same time as the sucked dust, and then is sent out of the return path 43 . That is, the nitrogen system is not directly discharged to the external space of the housing 2 but flows into the circulation path 40 once.

接著,對於為了氮置換搬送機器手臂3之手臂構件71~73的內部空間71a~73a(參照圖8)之構成加以說明。如圖7及圖8所示,對於搬送機器手臂3,係設置有通過手臂構件71~73的內部之置換路徑91。置換路徑91係具有供給路徑91a,和內部通路91b(參照圖8)。供給路徑91a係自與上述之供給源111、114、115另外的供給源116(本發明之清淨用的非活性氣體供給源)延伸,流動有自供給源116所供給的氮。供給路徑91a係例如,具有可撓性之軟管等而加以形成,通過容器構件61之內部及手臂構件 71~73的內部。供給路徑91a之前端部係配置於最上方之手臂構件73的內部空間73a內。也就是,氮係通過供給路徑91a,首先供給於手臂構件73之內部空間73a內。內部通路91b係成為配置於在氮的流動方向之供給路徑91a的下游側,包含內部空間71a~73a之氮的通路。 Next, the configuration of the internal spaces 71a to 73a (see FIG. 8 ) of the arm members 71 to 73 of the transfer robot arm 3 for nitrogen replacement will be described. As shown in FIGS. 7 and 8 , the transfer robot arm 3 is provided with a replacement path 91 passing through the inside of the arm members 71 to 73 . The replacement path 91 has a supply path 91a and an internal passage 91b (see FIG. 8 ). The supply path 91a extends from a supply source 116 (an inert gas supply source for cleaning in the present invention) separate from the above-mentioned supply sources 111, 114, and 115, and nitrogen supplied from the supply source 116 flows. The supply path 91a is formed, for example, with a flexible hose or the like, and passes through the inside of the container member 61 and the arm member. The interior of 71~73. The front end of the supply path 91a is arranged in the inner space 73a of the uppermost arm member 73 . That is, the nitrogen system is first supplied into the internal space 73a of the arm member 73 through the supply path 91a. The internal passage 91b is arranged on the downstream side of the supply passage 91a in the flow direction of nitrogen, and serves as a nitrogen passage including the internal spaces 71a to 73a.

對於內部通路91b之一例,參照圖8同時而加以說明。對於手臂構件71~73係各形成有為了使氮流入的流入口71b~73b,和為了使氣體流出的流出口71c~73c。更具體而言係如以下。即,於形成於手臂構件73之下部的流入口73b之附近,安裝有供給路徑91a的前端部。手臂構件73之內部空間73a係與供給路徑91a連通。手臂構件72之內部空間72a係藉由流出口73c及流入口72b而與內部空間73a連通。手臂構件71之內部空間71a係藉由流出口72c及流入口71b而與內部空間72a連通。內部空間71a與容器構件61之內部則藉由流出口71c而連通。經由此,自供給源116通過供給路徑91a而供給至內部空間73a的氮係依序通過內部空間73a、72a、71a,而流入至容器構件61之內部,通過送出口61b而傳送至返還路徑42。 An example of the internal passage 91b will be described while referring to FIG. 8 . Inlet ports 71b to 73b for inflow of nitrogen and outflow ports 71c to 73c for outflow of gas are respectively formed in the arm members 71 to 73 . More specifically, it is as follows. That is, near the inlet 73b formed in the lower part of the arm member 73, the front-end|tip part of the supply path 91a is attached. The inner space 73a of the arm member 73 communicates with the supply path 91a. The internal space 72a of the arm member 72 communicates with the internal space 73a through the outflow port 73c and the inflow port 72b. The internal space 71a of the arm member 71 communicates with the internal space 72a through the outflow port 72c and the inflow port 71b. The internal space 71a communicates with the inside of the container member 61 through the outlet 71c. Through this, the nitrogen system supplied from the supply source 116 to the internal space 73a through the supply path 91a sequentially passes through the internal spaces 73a, 72a, and 71a, flows into the container member 61, and is sent to the return path 42 through the delivery port 61b. .

接著,對於置換搬送機器手臂3之內部的氣體的方法而加以說明。首先,例如在EFEM1之啟動時,自供給源116(參照圖7,本發明之供給源),藉由供給路徑91a,傳送氮於手臂構件73之內部空間73a,再藉由內部空間72a、71a而供給氮於容器構件61的內部(參照圖8)。更且,藉由送出口61b而將容器構件61內之氣體送出於返還 路徑43。經由此,容器構件61內之氣體則迅速地置換為氮。並且,搬送室41內的氮濃度則成為不足特定值(例如,不足100ppm)之後,停止自供給源116之氮的供給。通常,由旋轉驅動風扇83者,藉由開口61a等而自搬送室41導入氣體至容器構件61內。並且,將容器構件61內之氣體送出於返還路徑43。經由此,抑制釋放灰塵至搬送室41內者。 Next, a method for replacing the air inside the transfer robot arm 3 will be described. First, for example, when EFEM1 is activated, nitrogen is delivered from the supply source 116 (refer to FIG. 7 , the supply source of the present invention) through the supply path 91a to the internal space 73a of the arm member 73, and then through the internal spaces 72a, 71a. Nitrogen is supplied inside the container member 61 (see FIG. 8 ). Moreover, the gas in the container member 61 is sent back through the outlet 61b. Path 43. Through this, the gas in the container member 61 is quickly replaced with nitrogen. Then, after the nitrogen concentration in the transfer chamber 41 becomes less than a specific value (for example, less than 100 ppm), the supply of nitrogen from the supply source 116 is stopped. Normally, the fan 83 is rotationally driven to introduce gas from the transfer chamber 41 into the container member 61 through the opening 61 a or the like. And, the gas in the container member 61 is sent to the return path 43 . Thereby, discharge|release of dust into the transfer chamber 41 is suppressed.

如以上,加以設置連接搬送機器手臂3之容器構件61與返還路徑43的連接路徑82a。因此,假設即使在容器構件61之內部空間產生有灰塵,此灰塵係藉由連接路徑82a而排出於返還路徑43之故,可抑制灰塵漏出於搬送室41內。更且,排出於返還路徑43的灰塵係經由配置於返還路徑43的下游側之FFU44而加以除去。隨之,可抑制經由在容器構件61的內部空間所產生的灰塵而污染搬送室41之情況。另外,在如此之構成中,因容器構件61內的氮則未直接排出於外部之故,無須補充自容器構件61內所排出部分的氮,而可抑制氮之供給量的增大之故,可抑制成本的增大。隨之,在使框體2內的氮循環之形式的EFEM1中,可抑制成本的增大同時,抑制釋放灰塵於搬送室41內之情況者。另外,例如在EFEM1之啟動時等,由積極性地自供給源116供給非活性氣體者,可迅速地置換容器構件61內的氣體。另外,搬送室41內之氧濃度則成為不足特定值之後,經由停止來自供給源116之氮的供給者,可抑制成本之增大。 As above, the connection path 82a connecting the container member 61 of the transfer robot arm 3 and the return path 43 is provided. Therefore, even if dust is generated in the inner space of the container member 61, the dust is discharged to the return path 43 through the connection path 82a, so that the leakage of the dust into the transfer chamber 41 can be suppressed. Furthermore, the dust discharged in the return path 43 is removed through the FFU 44 arranged on the downstream side of the return path 43 . Accordingly, contamination of the transfer chamber 41 via the dust generated in the inner space of the container member 61 can be suppressed. In addition, in such a configuration, because the nitrogen in the container member 61 is not directly discharged to the outside, it is not necessary to supplement the nitrogen discharged from the container member 61, and the increase in the supply amount of nitrogen can be suppressed. An increase in cost can be suppressed. Accordingly, in the EFEM 1 in which the nitrogen in the housing 2 is circulated, it is possible to suppress an increase in cost and to suppress release of dust into the transfer chamber 41 . In addition, the gas in the container member 61 can be quickly replaced by actively supplying the inert gas from the supply source 116, for example, when the EFEM 1 is activated. In addition, after the oxygen concentration in the transfer chamber 41 becomes less than a specific value, by stopping the supply of nitrogen from the supply source 116, an increase in cost can be suppressed.

另外,因可經由風扇83所生成之氣流,確實地傳送容器構件61內的氮於返還路徑43之故,抑制容器構件61內的氮自開口61a與支柱62之間的間隙洩漏之情況,而可更確實地抑制釋放灰塵於搬送室41內者。 In addition, since the nitrogen in the container member 61 can be reliably sent to the return path 43 through the air flow generated by the fan 83, the nitrogen in the container member 61 is suppressed from leaking from the gap between the opening 61a and the pillar 62, and Release of dust into the transfer chamber 41 can be more reliably suppressed.

另外,經由噴射器87而吸引產生於套筒79之附近的灰塵,而自供給源115所供給的氮則與灰塵同時排出於返還路徑43之故,該氮係直接進行循環。更且,灰塵係經由FFU44而加以除去。隨之,與進行真空排氣的構成作比較,可抑制經由氮的補充之成本的增大者。 In addition, since the dust generated near the sleeve 79 is sucked through the injector 87, and the nitrogen supplied from the supply source 115 is discharged to the return path 43 at the same time as the dust, the nitrogen is directly circulated. Furthermore, dust is removed through the FFU44. Accordingly, compared with a configuration in which vacuum exhaust is performed, an increase in cost through nitrogen supplementation can be suppressed.

另外,於容器構件71~73,各形成有流入口71b~73b與流出口71c~73c之故,與未形成此等之情況作比較,可縮短花上於手臂構件71~73之內部空間71a~73a的氣體置換的時間,可抑制生產效率的下降。 In addition, since the inlets 71b~73b and the outlets 71c~73c are respectively formed in the container members 71~73, the internal space 71a of the arm members 71~73 can be shortened compared with the case where these are not formed. The gas replacement time of ~73a can suppress the decline of production efficiency.

接著,對於前述實施形態加上變更之變形例,加以說明。但對於具有與前述實施形態同樣的構成者,係附上相同符號而適宜省略其說明。 Next, a modified example with changes to the above-mentioned embodiment will be described. However, those having the same configuration as those of the above-mentioned embodiments are denoted by the same reference numerals, and description thereof is appropriately omitted.

(1)在前述實施形態中,風扇83係作為經由馬達84而以一定的旋轉速度加以旋轉驅動者,但並不限定於此。在容器構件61內中,驅動機構63則在上下驅動支柱62時,而有容易產生灰塵之虞。因此,如圖9所示,搬送機器手臂3a則具有控制馬達84之風扇控制部12(本發明之控制部)亦可。更且,風扇控制部12係在驅動機構63動作時,與驅動機構63未動作時作比較,加速風扇83之旋轉速度亦可。經由此,在驅動機構63動作時,由加速風扇83的 旋轉速度而加速風速者,可確實地將容器構件61內的氮傳送至返還路徑43者。另外,對於驅動機構63未動作時,由減緩風扇83的旋轉速度者,可使馬達84之消耗電力降低。然而,控制裝置5(參照圖1等)或者機器手臂控制部11(參照圖2等)則呈控制風扇83之旋轉速度地加以構成亦可。 (1) In the aforementioned embodiment, the fan 83 is rotationally driven at a constant rotational speed via the motor 84 , but the present invention is not limited thereto. In the container member 61, when the drive mechanism 63 drives the pillar 62 up and down, dust may be easily generated. Therefore, as shown in FIG. 9 , the transfer robot arm 3 a may have a fan control unit 12 (control unit of the present invention) that controls the motor 84 . Furthermore, the fan control unit 12 may increase the rotation speed of the fan 83 when the drive mechanism 63 is in operation compared with when the drive mechanism 63 is not in operation. Through this, when the drive mechanism 63 operates, the speed of the acceleration fan 83 When the wind speed is increased by the rotation speed, the nitrogen in the container member 61 can be reliably sent to the return path 43 . In addition, when the driving mechanism 63 is not in operation, the power consumption of the motor 84 can be reduced by slowing down the rotation speed of the fan 83 . However, the control device 5 (see FIG. 1 etc.) or the robot arm control unit 11 (see FIG. 2 etc.) may be configured to control the rotational speed of the fan 83 .

(2)在至前述為止之實施形態中,搬送機器手臂3之容器構件61與返還路徑43則作為經由連接路徑82a而加以連接(即,搬送機器手臂3則相當於本發明之自動裝置)之構成,但並不限定於此。例如,對於上述之對準器54適用本發明亦可。此情況,對準器54亦相當於本發明之自動裝置。以下,使用圖10而具體地加以說明。圖10(a)係顯示對準器54之構造的部分剖面圖。圖10(b)係對準器54及其周邊之平面圖。 (2) In the above-mentioned embodiments, the container member 61 of the transfer robot arm 3 and the returning path 43 are connected via the connection path 82a (that is, the transfer robot arm 3 corresponds to the automatic device of the present invention). constitute, but are not limited to. For example, the present invention may be applied to the above-mentioned aligner 54 . In this case, the aligner 54 also corresponds to the automatic device of the present invention. Hereinafter, it demonstrates concretely using FIG. 10. FIG. FIG. 10( a ) is a partial cross-sectional view showing the structure of the aligner 54 . Fig. 10(b) is a plan view of the aligner 54 and its surroundings.

對於對準器54之構成簡單地加以說明。如圖10(a)所示,對準器54係具有:容器構件92,和保持部93,和支持部94,和馬達95(本發明之驅動機構),和攝影機96。對於容器構件92係形成有開口92a。於容器構件92之外側,配置有保持晶圓W之保持部93。支持部94係自下方支持保持部93。馬達95係旋轉驅動支持部94。攝影機96係攝影在保持於保持部93之狀態進行旋轉之晶圓W的外緣部。經由此,對準器54係計測晶圓W經由搬送機器手臂3而保持在自目標保持位置偏移多少之位置,將計測結果送訊至機器手臂控制部11。 The configuration of the aligner 54 will be briefly described. As shown in FIG. 10( a ), the aligner 54 has a container member 92 , a holding portion 93 , a supporting portion 94 , a motor 95 (the driving mechanism of the present invention), and a camera 96 . An opening 92a is formed for the container member 92 . On the outside of the container member 92, a holding portion 93 for holding the wafer W is disposed. The supporting portion 94 supports the holding portion 93 from below. The motor 95 rotationally drives the support portion 94 . The camera 96 takes pictures of the outer edge of the wafer W that is rotating while being held by the holding unit 93 . Through this, the aligner 54 measures how much the wafer W is held at a position deviated from the target holding position via the transfer robot 3 , and sends the measurement result to the robot control unit 11 .

由經由馬達95而旋轉驅動支持部94者,會產 生有灰塵於容器構件92內。因此,如圖10(a)所示,對於容器構件92係形成有氮的排出口97。排出口97係連接有經由連接管98所形成之連接路徑98a。如圖10(b)所示,連接路徑98a係連接容器構件92與返還路徑43。更且,對於連接路徑98a配置風扇99亦可。 By rotating the support portion 94 via the motor 95, a Dust is generated in the container member 92 . Therefore, as shown in FIG. 10( a ), a nitrogen discharge port 97 is formed in the container member 92 . The discharge port 97 is connected to a connection path 98 a formed through a connection pipe 98 . As shown in FIG. 10( b ), the connection path 98 a connects the container member 92 and the return path 43 . Furthermore, the fan 99 may be arranged for the connection path 98a.

(3)在至前述為止之實施形態中,形成於柱21~24之內部的空間21a~24a則作為返還路徑43之構成,但並不限定於此。即,返還路徑43係經由其他的構件而形成亦可。 (3) In the above embodiments, the spaces 21a to 24a formed inside the columns 21 to 24 are used as the structure of the return path 43, but the present invention is not limited thereto. That is, the returning path 43 may be formed via another member.

(4)在至前述為止之實施形態中,作為非活性氣體而使用氮之構成,但並不限定於此。例如,作為非活性氣體而使用氬等亦可。 (4) In the above-mentioned embodiments, nitrogen is used as the inert gas, but it is not limited thereto. For example, argon or the like may be used as the inert gas.

1‧‧‧EFEM 1‧‧‧EFEM

2‧‧‧框體 2‧‧‧frame

3‧‧‧搬送機器手臂(自動裝置) 3‧‧‧Conveying robot arm (automatic device)

4‧‧‧裝載埠 4‧‧‧Loading port

40‧‧‧循環路徑 40‧‧‧circular path

41‧‧‧搬送室 41‧‧‧Transportation room

43‧‧‧返還路徑 43‧‧‧Return path

44‧‧‧FFU(風扇過濾單元) 44‧‧‧FFU (Fan Filter Unit)

46‧‧‧風扇 46‧‧‧Fan

61‧‧‧容器構件 61‧‧‧Container components

61b‧‧‧送出口 61b‧‧‧Export

70‧‧‧手臂機構(保持部) 70‧‧‧Arm mechanism (holding part)

71、72、73‧‧‧手臂構件 71, 72, 73‧‧‧arm components

74‧‧‧機械手 74‧‧‧Robot

79‧‧‧套筒 79‧‧‧Sleeve

81‧‧‧送出部 81‧‧‧Sending Department

82‧‧‧連接管 82‧‧‧connecting pipe

82a‧‧‧連接路徑 82a‧‧‧connection path

83‧‧‧風扇 83‧‧‧Fan

86‧‧‧吸引部 86‧‧‧Attraction Department

87‧‧‧噴射器 87‧‧‧Injector

87a‧‧‧噴嘴 87a‧‧‧Nozzle

87b‧‧‧擴散器 87b‧‧‧diffuser

87c‧‧‧吸引口 87c‧‧‧Attraction port

88a‧‧‧供給路徑 88a‧‧‧Supply route

88b‧‧‧送出路徑 88b‧‧‧Sending Path

88c‧‧‧吸引路徑 88c‧‧‧attraction path

91‧‧‧置換路徑 91‧‧‧Replacement path

91a‧‧‧供給路徑 91a‧‧‧Supply route

111‧‧‧供給源 111‧‧‧Supply source

115‧‧‧供給源 115‧‧‧Supply source

116‧‧‧供給源 116‧‧‧Supply source

Claims (4)

一種EFEM係具有:經由除去灰塵的風扇過濾單元而加以清淨化之非活性氣體則流動於特定方向之搬送室,和自前述搬送室之前述特定方向的下游側,返回前述非活性氣體至前述風扇過濾單元之返還路徑,前述非活性氣體則呈循環地加以構成之EFEM,其特徵為具備:以配置前述搬送室內,保持基板的狀態而進行特定的動作之自動裝置;前述自動裝置係具有:形成有開口的容器構件,和配置於前述容器構件之外側,保持前述基板之保持部,和支持前述保持部,插通於前述開口的支持部,和收容於前述容器構件,驅動前述支持部的驅動機構,設置有連接前述容器構件與前述返還路徑的連接路徑,作為前述自動裝置,設置有搬送前述基板之搬送機器手臂,前述容器構件係加以固定於前述搬送室內,作為前述保持部,設置有保持前述基板而搬送於水平方向之手臂機構,作為前述支持部,設置有支持前述手臂機構之支柱, 前述支柱係經由前述驅動機構而加以上下驅動前述手臂機構係具備:具有保持前述基板的機械手,和在保持前述基板的保持狀態,與解除前述保持狀態之解除狀態之間,切換前述機械手的狀態之切換部,經由自灰塵除去用的非活性氣體供給源所供給之前述非活性氣體的流動而吸引在前述切換部之動作時所產生的灰塵,更且,將所供給之前述非活性氣體,與灰塵同時排出於前述返還路徑之噴射器者。 An EFEM system has: the inert gas that is purified by the fan filter unit for removing dust flows in the transfer chamber in a specific direction, and returns the inert gas to the fan from the downstream side of the transfer chamber in the specific direction The return path of the filter unit, the EFEM in which the aforementioned inert gas is formed in a circular manner, is characterized by: an automatic device configured to configure the aforementioned transfer chamber to maintain the state of the substrate and perform specific actions; the aforementioned automatic device has: A container member having an opening, a holding portion arranged outside the container member to hold the substrate, a support portion supporting the holding portion and inserted into the opening, and a driver for accommodating the container member and driving the support portion The mechanism is provided with a connection path connecting the container member and the return path, as the automatic device, a transfer robot arm for transferring the substrate is provided, the container member is fixed in the transfer chamber, and as the holding unit, a holding unit is provided. The arm mechanism that transports the aforementioned substrate in the horizontal direction is provided with a pillar supporting the aforementioned arm mechanism as the aforementioned supporting portion, The support is driven up and down via the driving mechanism. The arm mechanism includes a robot arm for holding the substrate, and a mechanism for switching the robot arm between a holding state for holding the substrate and a release state for releasing the holding state. The state switching unit sucks the dust generated during the operation of the switching unit through the flow of the inert gas supplied from the inert gas supply source for dust removal, and furthermore, the supplied inert gas , and the dust is discharged from the injector of the aforementioned return path at the same time. 一種EFEM係具有:經由除去灰塵的風扇過濾單元而加以清淨化之非活性氣體則流動於特定方向之搬送室,和自前述搬送室之前述特定方向的下游側,返回前述非活性氣體至前述風扇過濾單元之返還路徑,前述非活性氣體則呈循環地加以構成之EFEM,其特徵為具備:以配置前述搬送室內,保持基板的狀態而進行特定的動作之自動裝置;前述自動裝置係具有:形成有開口的容器構件,和配置於前述容器構件之外側,保持前述基板之保持部,和支持前述保持部,插通於前述開口的支持部,和收容於前述容器構件,驅動前述支持部的驅動機構, 設置有連接前述容器構件與前述返還路徑的連接路徑,更具備:藉由前述連接路徑而將前述容器構件內的非活性氣體送出至前述返還路徑之風扇,作為前述自動裝置,設置有搬送前述基板之搬送機器手臂,前述容器構件係加以固定於前述搬送室內,作為前述保持部,設置有保持前述基板而搬送於水平方向之手臂機構,作為前述支持部,設置有支持前述手臂機構之支柱,前述支柱係經由前述驅動機構而加以上下驅動前述手臂機構係具備:具有保持前述基板的機械手,和在保持前述基板的保持狀態,與解除前述保持狀態之解除狀態之間,切換前述機械手的狀態之切換部,經由自灰塵除去用的非活性氣體供給源所供給之前述非活性氣體的流動而吸引在前述切換部之動作時所產生的灰塵,更且,將所供給之前述非活性氣體,與灰塵同時排出於前述返還路徑之噴射器者。 An EFEM system has: the inert gas that is purified by the fan filter unit for removing dust flows in the transfer chamber in a specific direction, and returns the inert gas to the fan from the downstream side of the transfer chamber in the specific direction The return path of the filter unit, the EFEM in which the aforementioned inert gas is formed in a circular manner, is characterized by: an automatic device configured to configure the aforementioned transfer chamber to maintain the state of the substrate and perform specific actions; the aforementioned automatic device has: A container member having an opening, and a holding portion arranged outside the container member to hold the substrate, a support portion supporting the holding portion and inserted into the opening, and a driver for accommodating the container member and driving the support portion mechanism, A connection path connecting the container member and the return path is provided, and a fan for sending the inert gas in the container member to the return path through the connection path is provided. As the automatic device, a device for transporting the substrate is provided. According to the transfer robot arm, the container member is fixed in the transfer chamber, the holding part is provided with an arm mechanism for holding the substrate and conveying in the horizontal direction, and the support part is provided with a pillar supporting the arm mechanism. The pillar is driven up and down via the driving mechanism. The arm mechanism includes: a manipulator for holding the substrate; The switching part sucks the dust generated during the operation of the switching part through the flow of the inert gas supplied from the inert gas supply source for dust removal, and furthermore, the supplied inert gas, The ones that are discharged from the injector of the aforementioned return path at the same time as the dust. 一種EFEM係具有:經由除去灰塵的風扇過濾單元而加以清淨化之非活性氣體則流動於特定方向之搬送室,和自前述搬送室之前述特定方向的下游側,返回前述非活性氣體至前述風扇過濾單元之返還路徑,前述非活性氣體則 呈循環地加以構成之EFEM,其特徵為具備:以配置前述搬送室內,保持基板的狀態而進行特定的動作之自動裝置;前述自動裝置係具有:形成有開口的容器構件,和配置於前述容器構件之外側,保持前述基板之保持部,和支持前述保持部,插通於前述開口的支持部,和收容於前述容器構件,驅動前述支持部的驅動機構,設置有連接前述容器構件與前述返還路徑的連接路徑,更具備:藉由前述連接路徑而將前述容器構件內的非活性氣體送出至前述返還路徑之風扇,旋轉驅動前述風扇的風扇驅動裝置,和控制前述風扇驅動裝置之控制部;前述控制部係在前述驅動機構動作時,與前述驅動機構未動作時作比較,加速前述風扇的旋轉速度情況,作為前述自動裝置,設置有搬送前述基板之搬送機器手臂,前述容器構件係加以固定於前述搬送室內,作為前述保持部,設置有保持前述基板而搬送於水平方向之手臂機構,作為前述支持部,設置有支持前述手臂機構之支柱, 前述支柱係經由前述驅動機構而加以上下驅動前述手臂機構係具備:具有保持前述基板的機械手,和在保持前述基板的保持狀態,與解除前述保持狀態之解除狀態之間,切換前述機械手的狀態之切換部,經由自灰塵除去用的非活性氣體供給源所供給之前述非活性氣體的流動而吸引在前述切換部之動作時所產生的灰塵,更且,將所供給之前述非活性氣體,與灰塵同時排出於前述返還路徑之噴射器者。 An EFEM system has: the inert gas that is purified by the fan filter unit for removing dust flows in the transfer chamber in a specific direction, and returns the inert gas to the fan from the downstream side of the transfer chamber in the specific direction The return path of the filter unit, the aforementioned inert gas The EFEM which is constituted cyclically is characterized by having: an automatic device for performing specific actions by arranging the aforementioned transfer chamber and maintaining the state of the substrate; On the outer side of the component, the holding part for holding the aforementioned substrate, and the supporting part for supporting the aforementioned holding part and inserting into the aforementioned opening, and the driving mechanism for accommodating the aforementioned container component and driving the aforementioned supporting part, is provided with a device connecting the aforementioned container component and the aforementioned return The connection path of the path further includes: a fan for sending the inert gas in the container member to the return path through the connection path, a fan driving device for rotationally driving the fan, and a control unit for controlling the fan driving device; The aforementioned control section accelerates the rotation speed of the aforementioned fan when the aforementioned driving mechanism is in operation compared with when the aforementioned driving mechanism is not operating. As the aforementioned automatic device, a transfer robotic arm for transferring the aforementioned substrate is provided, and the aforementioned container member is fixed. In the transfer chamber, as the holding unit, an arm mechanism that holds the substrate and transports it in the horizontal direction is provided, and as the support unit, a pillar that supports the arm mechanism is provided, The support is driven up and down via the driving mechanism. The arm mechanism includes a robot arm for holding the substrate, and a mechanism for switching the robot arm between a holding state for holding the substrate and a release state for releasing the holding state. The state switching unit sucks the dust generated during the operation of the switching unit through the flow of the inert gas supplied from the inert gas supply source for dust removal, and furthermore, the supplied inert gas , and the dust is discharged from the injector of the aforementioned return path at the same time. 如申請專利範圍第1~3項之任一項記載之EFEM,其中,前述手臂機構係具有中空的手臂構件,對於前述手臂構件,係形成有為了使自淨化用之非活性氣體供給源所供給之前述非活性氣體,流入至前述手臂構件之內部空間的流入口,和為了自前述手臂構件之前述內部空間,使氣體流出之流出口者。 Such as the EFEM described in any one of items 1 to 3 of the scope of patent application, wherein the aforementioned arm mechanism has a hollow arm member, and the aforementioned arm member is formed with an inert gas supply source for self-purification. The inlet for the aforementioned inert gas to flow into the inner space of the aforementioned arm member, and the outlet for allowing the gas to flow out of the aforementioned inner space of the aforementioned arm member.
TW107133736A 2018-03-15 2018-09-26 EFEM and EFEM Gas Replacement Method TWI788422B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-048437 2018-03-15
JP2018048437A JP7137047B2 (en) 2018-03-15 2018-03-15 EFEM and gas replacement method in EFEM

Publications (2)

Publication Number Publication Date
TW201939653A TW201939653A (en) 2019-10-01
TWI788422B true TWI788422B (en) 2023-01-01

Family

ID=67959019

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111145596A TW202314934A (en) 2018-03-15 2018-09-26 EFEM and EFEM gas replacement method suppressing particle release in a conveyance chamber and suppressing increase of cost
TW107133736A TWI788422B (en) 2018-03-15 2018-09-26 EFEM and EFEM Gas Replacement Method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW111145596A TW202314934A (en) 2018-03-15 2018-09-26 EFEM and EFEM gas replacement method suppressing particle release in a conveyance chamber and suppressing increase of cost

Country Status (4)

Country Link
JP (2) JP7137047B2 (en)
KR (1) KR20190109245A (en)
CN (3) CN117457556A (en)
TW (2) TW202314934A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102278078B1 (en) * 2019-10-17 2021-07-19 세메스 주식회사 Substrate transfer apparatus and substrate treating apparatus
JP7427796B2 (en) * 2020-09-03 2024-02-05 川崎重工業株式会社 Substrate holding hand and substrate transfer robot
US20220297320A1 (en) * 2021-03-18 2022-09-22 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
CN117690857A (en) * 2024-01-31 2024-03-12 北京锐洁机器人科技有限公司 Waterproof type wafer transport manipulator

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09131680A (en) * 1995-11-02 1997-05-20 Tokyo Electron Ltd Conveying device for vacuum chamber
TW200940287A (en) * 2007-11-21 2009-10-01 Yaskawa Denki Seisakusho Kk Conveyance robot, locally cleaned housing with the conveyance robot, and semiconductor manufacturing device with the housing
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP2014116440A (en) * 2012-12-10 2014-06-26 Hitachi High-Tech Manufacturing & Service Corp Mini-engineering system
TW201530680A (en) * 2013-12-13 2015-08-01 Sinfonia Technology Co Ltd Efem
CN106876309A (en) * 2015-12-11 2017-06-20 Tdk株式会社 Front equipment end module

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
JP3671983B2 (en) * 1993-10-22 2005-07-13 東京エレクトロン株式会社 Vacuum processing equipment
JP3376678B2 (en) * 1994-03-11 2003-02-10 株式会社安川電機 Cooling structure of articulated industrial robot
JP2001135702A (en) 1999-11-04 2001-05-18 Canon Inc Substrate transfer apparatus, substrate treatment apparatus, method of manufacturing device
KR20050069777A (en) * 2003-12-31 2005-07-05 동부아남반도체 주식회사 Apparatus for eliminating particles in semiconductor
KR20060081523A (en) * 2005-01-10 2006-07-13 삼성전자주식회사 Apparatus for transferring a wafer
JP5155848B2 (en) 2008-12-18 2013-03-06 日本ケンブリッジフィルター株式会社 N2 purge device for FOUP
JP2012056034A (en) 2010-09-09 2012-03-22 Sinfonia Technology Co Ltd Robot arm device
CN102768977B (en) * 2011-05-06 2015-09-02 北京北方微电子基地设备工艺研究中心有限责任公司 Manipulator, propagation in atmosphere unit and wafer transmission method
JP2015109355A (en) 2013-12-05 2015-06-11 株式会社日立ハイテクマニファクチャ&サービス Local cleaning transfer apparatus
JP6599599B2 (en) * 2014-01-31 2019-10-30 シンフォニアテクノロジー株式会社 EFEM system
JP6349750B2 (en) 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 EFEM
US20150311100A1 (en) * 2014-04-23 2015-10-29 Tdk Corporation Load port unit and efem system
JP6135617B2 (en) * 2014-08-07 2017-05-31 東京エレクトロン株式会社 Substrate processing apparatus, cleaning jig, particle removal method of substrate processing apparatus, and storage medium
JP6459462B2 (en) 2014-12-11 2019-01-30 東京エレクトロン株式会社 Leak determination method, substrate processing apparatus, and storage medium
JP6511858B2 (en) 2015-02-27 2019-05-15 シンフォニアテクノロジー株式会社 Transfer room
JP6604890B2 (en) 2016-04-04 2019-11-13 株式会社荏原製作所 Substrate transport apparatus, substrate processing apparatus, and dew condensation suppressing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09131680A (en) * 1995-11-02 1997-05-20 Tokyo Electron Ltd Conveying device for vacuum chamber
TW200940287A (en) * 2007-11-21 2009-10-01 Yaskawa Denki Seisakusho Kk Conveyance robot, locally cleaned housing with the conveyance robot, and semiconductor manufacturing device with the housing
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP2014116440A (en) * 2012-12-10 2014-06-26 Hitachi High-Tech Manufacturing & Service Corp Mini-engineering system
TW201530680A (en) * 2013-12-13 2015-08-01 Sinfonia Technology Co Ltd Efem
CN106876309A (en) * 2015-12-11 2017-06-20 Tdk株式会社 Front equipment end module

Also Published As

Publication number Publication date
JP7137047B2 (en) 2022-09-14
TW201939653A (en) 2019-10-01
CN117438355A (en) 2024-01-23
CN110277339A (en) 2019-09-24
KR20190109245A (en) 2019-09-25
TW202314934A (en) 2023-04-01
JP2022162002A (en) 2022-10-21
CN117457556A (en) 2024-01-26
CN110277339B (en) 2023-11-28
JP2019161117A (en) 2019-09-19

Similar Documents

Publication Publication Date Title
TWI788422B (en) EFEM and EFEM Gas Replacement Method
US11227784B2 (en) Thin plate substrate-holding device and transfer robot provided with this holding device
KR102474585B1 (en) Fingers for holding thin-plate-like substrates and transfer robots provided with the fingers
JP6963179B2 (en) EFEM
TW201939650A (en) Efem
US11823934B2 (en) Wafer stocker
JP2015076472A (en) Chemical liquid container changing apparatus, container mounting module, and chemical liquid container changing method
JP7136612B2 (en) Conveyor with local purge function
JP6607314B2 (en) Container storage device and container storage method
JP2015076473A (en) Substrate treatment apparatus
JP7277813B2 (en) Conveying system and container opening/closing device
US20230073234A1 (en) Efem
TWI830825B (en) wafer storage
TWI790731B (en) Substrate transfer device
JP5313639B2 (en) Substrate transport method, substrate processing method, and semiconductor device manufacturing method
JP2023083554A (en) Efem
JP2022170477A (en) Efem
JP2023031991A (en) EFEM, inert gas supply control method
JP2009111404A (en) Substrate processor, and manufacturing method of semiconductor device