KR101266131B1 - Manufacturing apparatus of semiconductor wafer - Google Patents

Manufacturing apparatus of semiconductor wafer Download PDF

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Publication number
KR101266131B1
KR101266131B1 KR1020120026116A KR20120026116A KR101266131B1 KR 101266131 B1 KR101266131 B1 KR 101266131B1 KR 1020120026116 A KR1020120026116 A KR 1020120026116A KR 20120026116 A KR20120026116 A KR 20120026116A KR 101266131 B1 KR101266131 B1 KR 101266131B1
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KR
South Korea
Prior art keywords
wafer
storage space
module
storage room
suction
Prior art date
Application number
KR1020120026116A
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Korean (ko)
Inventor
유정호
Original Assignee
유정호
나노세미콘(주)
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Publication date
Application filed by 유정호, 나노세미콘(주) filed Critical 유정호
Priority to KR1020120026116A priority Critical patent/KR101266131B1/en
Application granted granted Critical
Publication of KR101266131B1 publication Critical patent/KR101266131B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: An apparatus for processing a semiconductor wafer is provided to reduce the frictional force between a slot and a wafer using a slot having a three-point contact point part, and prevent the damages and the contamination of the wafer due to the decrease of the frictional force. CONSTITUTION: A load port module(10) loads or unloads a wafer to a wafer transfer module(30). The load port module includes a plate(11) for mounting an FOUP(13). The wafer transfer module draws out the wafer from the FOUP and supplies the wafer to a process module(20). The wafer transfer module moves the wafer of the process module to the FOUP or the storage room(40) of the load port module. The storage room temporarily stores the wafer before the wafer is transferred.

Description

Manufacturing apparatus of semiconductor wafer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer processing apparatus, and more particularly, to a semiconductor wafer processing apparatus having a storage room for temporarily storing a wafer on which a processing process is performed before transportation.

As the development of semiconductor technology is accelerated, researches on the technology for processing wafers required for semiconductor production are progressing. Wafers are materials used in semiconductor manufacturing, and silicon wafers are supplied to materials that can be used for semiconductor manufacturing through various processing processes.

The silicon wafer is a circular plate in which the ingot in which the type crystal of the material of the silicon semiconductor is grown on the circumference is sliced thinly. In the process of growing a silicon wafer as a crystal, oxygen may combine to cause a phenomenon in which a resistance value controlled through impurities on the silicon wafer is shifted from a desired resistance value.

Therefore, in order to produce high quality wafers by separating oxygen from the wafers, processing processes such as a heat treatment process, a thin film formation process, and a cleaning process are required. The heat treatment process is necessary to reduce wafer processing stress or to reduce defects in the wafer crystal. The thin film formation process uses an chemical vapor deposition (CVD) and physical vapor growth (PVD) to form an insulating film and a silicon film on the wafer. It is.

Prior art related to this is disclosed in Korean Patent Publication No. 10-2004-0022649 (2004.03.16) _ "Wafer processing system for semiconductor device manufacturing".

It is an object of the present invention to temporarily store a wafer on which a processing process has been performed and to perform thermal stabilization and to perform cooling and oxygen removal on one side of a wafer transfer module to remove fumes remaining on the wafer. A semiconductor wafer processing apparatus having a room is provided.

According to a feature of the present invention for achieving the above object, the present invention is arranged between the unloaded load port module for storing a plurality of wafers, the load port module and a process module for processing the wafer And a wafer transfer module which draws out the wafer inside the pool mounted on the load port module and supplies the wafer to the process module, and is disposed on one side of the wafer transfer module, and temporarily stores the wafer processed in the process module before transporting and temporarily cools it. And a storage room that performs the function of removing oxygen.

The storage room may include a storage space having a plurality of slots for loading the wafer, a door member disposed between the storage room and the wafer transfer module to open and close the storage space into the wafer transfer module. And a spray nozzle unit for supplying nitrogen to the storage space, and suction means connected to the storage space, and the suction means has a pressure lower than the pressure of the storage space, and sucks nitrogen and oxygen from the storage space and discharges it to the outside. do.

The injection nozzle unit is provided in plurality in the storage space of the storage room.

The suction means includes at least one suction tube having a suction port communicating with the storage space at one side, and a suction pump connected to the other side of the suction tube to apply pressure to the suction tube.

The pressure of the suction means is in the range of 1 to 2000 kpa.

The slot has a contact point portion formed on a contact surface on which the edge of the wafer is supported so that the wafer is in point contact with the slot.

The contact point portion is formed with an insertion groove roundly recessed in the contact surface, and forms a three-point contact point portion by a hemispherical ridge protruding at the same height as both edges of the contact surface in the center of the insertion groove.

The present invention includes a storage room disposed at one side of a wafer transfer module and performing a function of temporarily storing, processing, and removing oxygen by temporarily storing a wafer on which a process has been performed in a process module before transportation.

The storage room is equipped with a plurality of injection nozzles for injecting nitrogen into the storage space, which enables uniform cooling and simultaneously removes high temperature nitrogen gas and oxygen by using suction means, which provides high cooling efficiency, excellent fume removal efficiency, and particle removal. It has an easy effect.

This has the effect of improving the productivity of the semiconductor process by promoting thermal stability of the wafer and preventing damage and contamination.

In particular, since the slot in the storage room has a three-point contact point portion, the present invention has a great effect of preventing wafer damage and contamination by reducing friction between the wafer and the slot.

1 is a perspective view showing a semiconductor wafer processing apparatus according to the present invention.
Figure 2 is a perspective view showing the interior of the storage room provided in the semiconductor wafer processing apparatus.
3 is a perspective view showing a wafer loaded in a slot of a storage room.
4 is a sectional view of the slot of FIG.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, the semiconductor wafer processing apparatus of the present invention includes a load port module (LPM) 10 on which a FOUP 13 storing a plurality of wafers is loaded, and a load. A wafer transfer module (EFEM) 30 disposed between the port module 10 and the process module (PM) 20 and the wafer transfer module 30 is disposed on one side of the wafer transfer module 30. storage room 40 for temporarily storing w).

The load port module 10 is an apparatus for loading or unloading the wafer w for processing into the wafer transfer module 30. The load port module 10 is provided with a plate 11 on which the pull 13 is mounted. The load port module 10 opens the pull 13 and performs a function of carrying out a wafer (not shown) loaded in the pull 13 into the wafer transfer module 30.

Load port module 10 is provided with a plurality, one or more of them are supplied to the process module 20 for processing the unprocessed wafers stored in the pool 13, the rest is processed in the process module 20 The processed wafer w can be stored in the pool 13.

When the transfer 13 transfers the wafer w to the load port module 10 from the outside, and transfers the processed wafer w to another process, the pull 13 blocks contact between the wafer and oxygen and conveniently transfers the wafer w. It is an apparatus for doing so.

The pull 13 forms a case shape and may be opened and closed with a door provided at one surface thereof. A plurality of slots for loading wafers are formed on the inner wall of the pull 13 so that the plurality of wafers are loaded without being in contact with each other.

The wafer transfer module 30 takes out the wafer inside the pull 13 mounted on the load port module 10 and supplies the wafer to the process module 20, or loads the wafer processed in the process module 20 into the load port module ( 10) to loosen or transfer to store in the storage room (40).

The wafer transfer module 30 has a cassette transfer robot (not shown) installed therein. The cassette transfer robot is capable of forward and backward and up and down and left and right movements by a separate driving device, and withdraws the wafer from the pull 13 of the load port module 10 through forward and backward and up and down and left and right movements to process module 20 or storage. It serves to transfer to the room (40).

The process module 20 is an area where an actual process such as heat treatment, thin film, deposition, and etching for processing a wafer is performed. The process module 20 may be disposed in plurality around the wafer transfer module 30.

The storage room 40 is a temporary storage place before storing the wafer w in the pull 13 for thermal stabilization of the wafer in which the actual process is performed.

The wafer w is subjected to a heat treatment for the purpose of diffusing impurities or annealing. Since the wafer is heat treated, the wafer is contaminated and stored directly in the pool 13 of the load port module 10. The wafer may be contaminated, or the wafer may be fumed due to high temperature, or thermal damage such as wafer damage may occur. Deformation may occur.

Since the pull 13 is made of a plastic material, when the wafer having a heat state is stored inside the pull 13, the wafer may be contaminated in the pool 13 by melting the plastic.

Contaminated or fumed wafers require additional processes such as fume removal and cleaning processes, increasing the number of processes and raising semiconductor prices.

2 and 3, the storage room 40 includes a storage space 41 having a plurality of slots 47 for loading a wafer w, and a storage room 40. And a door member 51 disposed between the wafer transfer module 30 and opening and closing the storage space 41 into the wafer transfer module 30, and an injection nozzle unit supplying nitrogen to the storage space 41 ( 53 and suction means 55 connected to the storage space 41. The suction means 55 has a pressure lower than that of the storage space 41, and sucks nitrogen and oxygen from the storage space 41 and discharges it to the outside.

The storage room 40 is in the shape of a box that is integrally provided on one side of the wafer transfer module 30, and a rear surface of the storage room 40 that is in contact with the wafer transfer module 30 is bored into the wafer transfer module 30. By opening the door member 51, the storage space 41 may be opened into the wafer transfer module 30 to store the wafer w.

The door member 51 is movable up and down by a power source such as a lifting motor (not shown), and opens or shields the storage space 41 into the wafer transfer module 30 through vertical movement.

The storage space 41 is divided into two independent spaces by the separating plate 45, and each space is provided with a plurality of slots 47 for loading the wafer w. Since the storage space 41 is divided into two independent spaces, the slot 47 may be disposed without an empty space, and the wafer w may be stored in the storage space 41 as much as possible. In the present embodiment, the slot can be expanded in the storage space 41 from at least one to a maximum of 100.

The slot 47 is for loading more wafers w into the storage space and is supported by the columnar frame 43. A plurality of slots 47 may be formed in the pillar-shaped frame 43 so that the plurality of wafers w may be loaded without being in contact with each other.

The slot 47 may be made of a heat resistant material, for example, stainless steel.

Preferably, three pillars are formed at intervals of 120 degrees, but the present invention is not limited thereto, and the number of pillars may be different if the number and the intervals can stably support the wafer w.

As shown in FIG. 4, the slot 47 has a contact point portion 49 formed on a contact surface where the edge of the wafer w is supported such that the wafer w is in point contact with the contact surface of the slot 47. The point contact minimizes the friction between the wafer w and the contact surface of the slot 47 to prevent damage and contamination of the wafer loaded into the slot 47.

The contact point portion 49 has an insertion groove 49a roundly recessed in the contact surface, and is formed by a hemispherical ridge 49d protruding at the same height as both edges 49b and 49c of the contact surface in the center of the insertion groove. It forms a three-point contact point. The three-point contact point portion stably supports the wafer w while preventing damage and contamination of the wafer w.

The injection nozzle part 53 injects nitrogen gas into the storage space 41 to cool the hot wafer w loaded in the storage space 41 and removes oxygen from the storage space 41. Nitrogen gas does not react with the wafer (w), the cost is low, and the cost reduction effect is high.

The injection nozzle unit 53 is installed in a plurality of upper and left and right in the storage space 41 of the storage room 40. The plurality of injection nozzle parts 53 provided on the upper side, the left side, and the right side can supply nitrogen gas uniformly to the upper and lower surfaces of the wafer w to rapidly cool the high temperature wafer w.

The injection nozzle part 53 is branched toward the storage space 41 of the storage room 40 from the main pipe 52 of a rectangular frame shape. The main pipe 52 is provided with a valve 52a.

Suction means 55 is one or more suction pipes 57 formed with a suction port communicating with the storage space 41 on one side, and the suction pump 59 is connected to the other side of the suction pipe 57 to apply pressure to the suction pipe (57) It includes. The suction pipe 57 is provided with a valve (not shown).

The suction means 55 allows the residual gas remaining on the wafer w to be completely removed after the processing. If the residual gas is not completely removed, particles may be generated on the wafer w or a pattern defect may occur due to the residual gas, thereby causing a process defect.

The pressure of the suction means 55 is in the range of 1 to 2000 kpa. The pressure of the suction means 55 has a pressure lower than the pressure of the storage space 41 to suck nitrogen and oxygen from the storage space 41 and discharge it to the outside. The suction means 55 generates a flow of nitrogen gas injected from the injection nozzle unit 53 by a pressure difference with the storage space 41 to allow suction of nitrogen and oxygen. In this embodiment, the suction pipes 57 are arranged to be symmetrically disposed on the front and side surfaces of the storage room 40, respectively.

The storage room 40 may be provided with a sensor (not shown) capable of measuring the flow rate and temperature of the nitrogen gas. The sensing sensor may sense the temperature and flow rate of nitrogen gas just before being sucked up after cooling the wafer.

The operation of the present invention will be described below.

The process of taking out the wafer loaded in the load port module, processing it in the process module, storing the processed wafer in the storage room for cooling and oxygen removal, and then storing the wafer in the load port module again. Let's explain.

First, when the inside of the pool 13 of the load port module 10 is opened, the cassette transport robot inside the wafer transport module 30 takes out the wafer loaded in the pool 13 into the wafer transport module 30. do. The unloaded wafer is transferred to the process module 20 to perform an actual process such as heat treatment, thin film, deposition, and etching.

In this case, since the load port module 10, the wafer transfer module 30, and the process module 20 are designed to be compact so that the copper wire of the wafer w is minimized, the process speed of the wafer w may be improved and the wafer w may be processed. Can be prevented from being exposed to the outside, thereby increasing the yield of the process.

The wafer processed in the process module 20 is integrally attached to one side of the wafer transfer module 30 before being taken out of the process module 20 by the semiconductor transfer robot and stored in the pull 13 of the load port module 10. It is stored first in the arranged storage room 40.

In the process of storing the wafer w in the storage room 40, the door member 51 of the storage room 40 moves upward by the operation of the lifting motor, and the storage space 41 of the storage room 40 moves to the wafer. By opening into the transfer module 30.

When the storage space 41 is opened, the wafer transfer robot transfers the processed wafers w and loads them into the slots 47 of the storage space 41 one by one.

At this time, since the slot 47 has a structure in which the three-point contact point portion 49 is formed on the contact surface on which the edge of the wafer w is supported, friction and damage of the wafer w are prevented in loading the wafer w. do.

When the wafer (w) is loaded in the storage space 41 by repeating this operation, the lifting motor is operated to shield the storage space 41 by moving the door member 51 upward.

When the storage space 41 of the storage room 40 is shielded, the suction means 55 is operated to apply pressure by injecting nitrogen gas into the storage space 41 and simultaneously removing oxygen.

The pressure of the suction means 55 is a nitrogen gas flow by the pressure difference in the range of 1 ~ 2000kpa.

The nitrogen gas injection cools the high temperature wafer w loaded in the storage space 41, and the nitrogen gas whose temperature has risen is discharged to the outside by the suction means together with the oxygen. Therefore, the storage space 41 of the storage room 40 is rapidly cooled of the wafer w, the fumes remaining on the wafer w are removed, and particle generation is prevented.

This can reduce the cooling time for the high temperature wafer w, thereby improving the productivity of the semiconductor manufacturing process.

When the cooling of the wafer is completed through the above-described series of processes, after stopping the operation of the nitrogen gas injection and suction means, the lifting motor is operated to move the door member 51 upward to open the storage space 41. .

Whether the cooling of the wafer is completed is determined based on the detection result of the detection sensor provided in the storage room 40.

Then, when the storage space 41 of the storage room 40 is opened, the wafer transfer robot takes the wafer w out of the storage space into the wafer transfer module 30 and stores it in the pull of the load port module 10. Finally, the wafer stored in the pool 13 is conveyed for the next step.

It is to be understood that the invention is not limited to the disclosed embodiments, but is capable of many modifications and alterations, all of which are within the scope of the appended claims. It is self-evident.

10: Load Port Module 11: Plate
13: Pull 20: Process Module
30: wafer transfer module 40: storage room
41: Storage 43: Frame
45: separator 47: slot
49: contact point 49a: insertion groove
49b, 49c: edge 49d: gynecological
51: door member 53: spray nozzle
55: suction means 57: suction pipe
59: suction pump w: wafer

Claims (7)

Unloaded load port module that stores multiple wafers,
A wafer transfer module disposed between the load port module and a process module for processing the wafer and extracting a wafer inside a pull placed on the load port module and supplying the wafer to the process module;
A storage room disposed at one side of the wafer transfer module and performing a function of temporarily storing a wafer processed in the process module before transportation, cooling and removing oxygen, and removing a fume from the wafer;
The storage room
It has a storage space having a plurality of slots for loading the wafer,
The slot is
A contact point portion is formed on a contact surface on which the edge of the wafer is supported, such that the wafer is in point contact with the slot,
The contact point portion
An insertion groove recessed roundly is formed in the contact surface, and a three-point contact point portion is formed by a hemispherical ridge protruding at the same height as both edges of the contact surface in the center of the insertion groove. The method according to claim 1,
The storage room
A door member disposed between the storage room and the wafer transfer module to open and close the storage space into the wafer transfer module;
An injection nozzle unit for supplying nitrogen to the storage space;
Further comprising suction means connected to the storage space,
The suction means has a pressure lower than the pressure of the storage space, the semiconductor wafer processing apparatus, characterized in that for sucking the nitrogen and oxygen in the storage space to discharge to the outside. The method according to claim 2,
And a plurality of spray nozzle units are installed in a storage space of the storage room. The method according to claim 2,
The suction means
At least one suction tube having a suction port communicating with the storage space at one side thereof;
And a suction pump connected to the other side of the suction pipe to apply pressure to the suction pipe. The method according to claim 2,
The pressure of the suction means is a semiconductor wafer processing apparatus, characterized in that in the range of 1 ~ 2000kpa. delete delete
KR1020120026116A 2012-03-14 2012-03-14 Manufacturing apparatus of semiconductor wafer KR101266131B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101430835B1 (en) 2012-09-20 2014-08-18 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Semiconductor apparatus with inner wafer carrier buffer and method
US9666454B2 (en) 2014-01-22 2017-05-30 Samsung Electronics Co., Ltd. Wafer storage apparatus having gas charging portions and semiconductor manufacturing apparatus using the same
KR102292126B1 (en) 2021-05-20 2021-08-19 김태민 FOUP transfer load port device
KR102359522B1 (en) 2021-05-20 2022-02-08 김태민 FOUP Fixing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128390A (en) * 2002-10-07 2004-04-22 Hitachi Kokusai Electric Inc Substrate processing device
KR100989887B1 (en) * 2010-05-24 2010-10-26 지이에스(주) Apparatus for residual gas of wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128390A (en) * 2002-10-07 2004-04-22 Hitachi Kokusai Electric Inc Substrate processing device
KR100989887B1 (en) * 2010-05-24 2010-10-26 지이에스(주) Apparatus for residual gas of wafer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101430835B1 (en) 2012-09-20 2014-08-18 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Semiconductor apparatus with inner wafer carrier buffer and method
US9666454B2 (en) 2014-01-22 2017-05-30 Samsung Electronics Co., Ltd. Wafer storage apparatus having gas charging portions and semiconductor manufacturing apparatus using the same
KR102292126B1 (en) 2021-05-20 2021-08-19 김태민 FOUP transfer load port device
KR102359522B1 (en) 2021-05-20 2022-02-08 김태민 FOUP Fixing device
KR102394979B1 (en) 2021-05-20 2022-05-04 김태민 FOUP Case Mounting System

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